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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Thermal sterilization effects on mechanical and electrical properties of soldered and welded joints
Soldering titanium alloy with protective coatings of rhenium, rhodium, or silver
This paper reviews selected parts of the current literature relevant to thermo-mechanical fatigue mechanisms in eutectic tin-lead solder, and suggests a general outline to account for some observed failures. The field is found to be complex. One recent experimental study finds some failure modes to be sensitive to joint geometry. Attempts to extrapolate from test environments to service environments have had only limited success. Much work remains to be done before fatigue failures in this material can be considered as under practical control.
Electronics, without requiring heater power or enclosure in a centralized 'warm electronics box,' will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated.
Availability of board level solder joint reliability information is critical to the acceptance of CSPs as alternative packages. This paper will review different CSPs as well as their assembly reliability.
Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.
High permeability semiconductors concentrate magnetic field energy in small areas to allow soldering of small components. This device can be used in microminiature parts in thin-film fabrication.
Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.
Electrochemical milling removes burrs and solder from the cut ends of stainless steel capillary tubing. An electrolyte consisting primarily of a solution of sulfuric and phosphoric acids is used.
Vacuum ultraviolet coatings, microcircuitry welding, metal polishing, absolute spectral response system, parabolic reflectors, and soldering to electrodeposited metals
Cracks in soldered joints on control signal processor
Comparison between cemented and soldered cover glass for radiation protection of silicon solar cells
Handbook gives information on the selection and application of welding, brazing, and soldering techniques for joining various metals. Summary descriptions of processes, criteria for process selection, and advantages of different methods are given.
Highly reliable soldered joints for printed circuit boards
Thermal cycling machines and accelerated test techniques to improve solder joints for Apollo Telescope Mount
Microstructure and void formation in solder connections of components on multilayer boards
Thermofit solder sleeve evaluation tests
Performance test of thermofit solder sleeve on copper and alloy wires