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The purpose of this WJI is to incorporate a standard procedure to prepare, certify, and ship standard NHB 8060.1B and NHB 8060.1C igniters for flammability testing and to update LJI-320-35-18. The operations are divided into five parts as follows: A. Preparing the igniter mix; B. Extruding the igniters; C. Curing, cutting, and weighing the igniters; D. Certifying the igniters and E. Packaging, storing, and shipping the igniters
The requirement for scatterometer-combined transmit-receive gain variation knowledge is typically addressed by sampling a portion of the transmit signal, attenuating it with a known-stable attenuation, and coupling it into the receiver chain. This way, the gain variations of the transmit and receive chains are represented by this loop-back calibration signal, and can be subtracted from the received remote radar echo. Certain challenges are presented by this process, such as transmit and receive components that are outside of this loop-back path and are not included in this calibration, as well as the impracticality for measuring the transmit and receive chains stability and post fabrication separately, without the resulting measurement errors from the test set up exceeding the requirement for the flight instrument. To cover the RF stability design challenge, the portions of the scatterometer that are not calibrated by the loop-back, (e.g., attenuators, switches, diplexers, couplers, and coaxial cables) are tightly thermally controlled, and have been characterized over temperature to contribute less than 0.05 dB of calibration error over worst-case thermal variation. To address the verification challenge, including the components that are not calibrated by the loop-back, a stable fiber optic delay line (FODL) was used to delay the transmitted pulse, and to route it into the receiver. In this way, the internal loopback signal amplitude variations can be compared to the full transmit/receive external path, while the flight hardware is in the worst-case thermal environment. The practical delay for implementing the FODL is 100 s. The scatterometer pulse width is 1 ms so a test mode was incorporated early in the design phase to scale the 1 ms pulse at 100-Hz pulse repetition interval (PRI), by a factor of 18, to be a 55 s pulse with 556 s PRI. This scaling maintains the duty cycle, thus maintaining a representative thermal state for the RF components. The FODL consists of an RF-modulated fiber-optic transmitter, 20 km SMF- 28 standard single-mode fiber, and a photodetector. Thermoelectric cooling and insulating packaging are used to achieve high thermal stability of the FODL components. The chassis was insulated with 1-in. (.2.5-cm) thermal isolation foam. Nylon rods support the Micarta plate, onto which are mounted four 5-km fiber spool boxes. A copper plate heat sink was mounted on top of the fiber boxes (with thermal grease layer) and screwed onto the thermoelectric cooler plate. Another thermal isolation layer in the middle separates the fiberoptics chamber from the RF electronics components, which are also mounted on a copper plate that is screwed onto another thermoelectric cooler. The scatterometer subsystem fs overall stability was successfully verified to be calibratable to within 0.1 dB error in thermal vacuum (TVAC) testing with the fiber-optic delay line, while the scatterometer temperature was ramped from 10 to 30 C, which is a much larger temperature range than the worst-case expected seasonal variations.
Background: Understanding biaxial loading response at the microstructural level is crucial in helping better design sheet manufacturing processes and calibrate/validate material deformation models. Objective: The objective of this work was to develop a low-cost testing apparatus to probe, with sufficient spatial resolution, the micro-mechanical response of a sheet material in-situ under biaxial loading conditions. Methods: The testing apparatus fabricated as a part of this study operates in a similar fashion to a standard bulge test and uses oil pressure to generate biaxial loading conditions. This biaxial testing apparatus was operated within a synchrotron beamline to characterize the mechanical response of a flash-processed steel sheet using in-situ high-energy X-ray diffraction (XRD) measurements. Further, the GSAS-II package was utilized to develop a workflow for the analysis of the large volume of diffraction data acquired. The workflow was then used to extract the peak position, width, and integrated intensity of the XRD peaks corresponding to the major body-centered cubic phase. Results: The equi-biaxial nature of the loading in the measured area was independently corroborated using experimental (XRD) and simulation (finite element analysis) methods. Furthermore, we discuss the evolution of elastic strain in the major body-centered cubic phase as a function of applied oil pressure and location on the steel sheet. Conclusions: A key advantage of the biaxial apparatus fabricated in this synchrotron study is demonstrated using the results obtained for the flash-processed steel sheet – i.e., mapping the lattice plane-dependent response to biaxial loading for a relatively large sample area in a spatially resolved manner.
Microplastic spectral analysis is one of the most time-consuming processes in studying microplastic pollution, often requiring days per sample. Researchers are transitioning to automated batch and hyperspectral image analysis techniques to enhance efficiency. Open Specy, initially aimed at manual single-spectrum analysis, has now integrated automated methods. This updated version, Open Specy 1.0, introduces several new features, including two algorithms for automated processing (smoothing and particle compression), an extensive library containing over 40,000 open-source Raman and FTIR spectra, and two machine learning classifiers (logistic regression and k medoids) developed from this library. Furthermore, it includes a revamped user interface, an R package, and a benchmark data set for testing future advancements in automated techniques. Researchers evaluated various configurations for hyperspectral smoothing, particle identification, compression, and splitting, to achieve combined recovery rates between 50 and 150% particle counts, identities, and sizes with a coefficient of variation (CV) of less than 40% (the accredited standard). Mean absorbance times the standard deviation provided a consistent particle identification. Hyperspectral smoothing led to a 96% combined recovery rate and reduced variability (CV = 38%) compared to the 86% recovery (CV = 83%) of nonsmoothed controls. Additionally, compressing spectra for particles was significantly faster (>3x) and showed similar accuracy but with reduced variability than processing each pixel individually. Key challenges persist in automating spectral analysis, particularly in refining particle splitting algorithms, and improving identification routines to minimize false positives and negatives. In conclusion, new methods in sample preparation for better stabilization and dispersion of particles could overcome some of these issues.
Software provides for control and acquisition of data from optical pyrometer. There are six individual programs in PYROLASER package. Provides quick and easy way to set up, control, and program standard Pyrolaser. Temperature and emisivity measurements either collected as if Pyrolaser in manual operating mode or displayed on real-time strip charts and stored in standard spreadsheet format for posttest analysis. Shell supplied to allow macros, which are test-specific, added to system easily. Written using Labview software for use on Macintosh-series computers running System 6.0.3 or later, Sun Sparc-series computers running Open-Windows 3.0 or MIT's X Window System (X11R4 or X11R5), and IBM PC or compatible computers running Microsoft Windows 3.1 or later.
Several key design upgrades have been recently made to the Iris Deep-Space Transponder baselined to be used on secondary payload missions of the upcoming Space Launch System Exploration Mission One (SLS EM-1). The Iris Transponder is a reconfigurable software-defined radio (SDR) designed for missions requiring interoperability with NASA's Deep Space Network (DSN) on X-band frequencies (7.2 GHz uplink, 8.4 GHz downlink). The transponder provides radiometric tracking support with the DSN to provide navigational products for precise orbit determination while performing standard uplink and downlink communications in a CubeSat/SmallSat-applicable package size. The recent hardware changes include a volume reduction of 30% from previous models, with the main transponder unit weighing less than 1.0 kg, while maintaining total ionizing dose (TID) radiation tolerance of >23 krads (Si) for deep-space missions. Lab tests indicate maximum downlink rates of up to 6.25 Msps can be supported by the transponder in conventional BPSK modulation, but most SLS EM-1 CubeSat missions are link-performance limited to less than 256 kbps. A prototype unit of the flight production units has been assembled and various performance and characterization tests are underway. This talk discusses the key design aspects and specifications of the Iris Transponder and presents preliminary results from early testing of the assembled transponder.
The use of commercial computer technology in specific aerospace mission applications can reduce the cost and project cycle time required for the development of special-purpose computer systems. Additionally, the pace of technological innovation in the commercial market has made new computer capabilities available for demonstrations and flight tests. Three areas of research and development being explored by the Portable Computer Technology Project at NASA Ames Research Center are the application of commercial client/server network computing solutions to crew support and payload operations, the analysis of requirements for portable computing devices, and testing of wireless data communication links as extensions to the wired network. This paper will present computer architectural solutions to portable workstation design including the use of standard interfaces, advanced flat-panel displays and network configurations incorporating both wired and wireless transmission media. It will describe the design tradeoffs used in selecting high-performance processors and memories, interfaces for communication and peripheral control, and high resolution displays. The packaging issues for safe and reliable operation aboard spacecraft and aircraft are presented. The current status of wireless data links for portable computers is discussed from a system design perspective. An end-to-end data flow model for payload science operations from the experiment flight rack to the principal investigator is analyzed using capabilities provided by the new generation of computer products. A future flight experiment on-board the Russian MIR space station will be described in detail including system configuration and function, the characteristics of the spacecraft operating environment, the flight qualification measures needed for safety review, and the specifications of the computing devices to be used in the experiment. The software architecture chosen shall be presented. An analysis of the performance characteristics of wireless data links in the spacecraft environment will be discussed. Network performance and operation will be modeled and preliminary test results presented. A crew support application will be demonstrated in conjunction with the network metrics experiment.
A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.
Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect poor-quality lots and screen out early random failures from use in space flight hardware. However, since it cannot be guaranteed that quality was designed and built into PEMs that are appropriate for space applications, users cannot screen in quality that may not exist. It must be understood that due to the variety of materials, processes, and technologies used to design and produce PEMs, this test process may not accelerate and detect all failure mechanisms. While the tests herein will increase user confidence that PEMs with otherwise unknown reliability can be used in space environments, such testing may not guarantee the same level of reliability offered by military microcircuits. PEMs should only be used where due to performance needs there are no alternatives in the military high-reliability market, and projects are willing to accept higher risk.
Although use of Plastic Encapsulated Microelectronics (PEMs) in space applications is discouraged, their use is mandatory for selected applications involving the need for advanced technology and small packages. Various space systems designers and manufacturers have developed methods to qualify and screen PEMs. In general, each procedure is different. The purpose of this fiscal year’s investigation is to initiate a process to coordinate the efforts at various NASA centers to eventually develop a One NASA method. Part of this activity includes sharing of test data and PEM qualification methodologies. Various experts in the NASA community were identified and contacted to support this effort. We were successful in finding such experts at GSFC, APL and the Constellation office (Orion and Ares). All these experts provided typical qualification program plans. Since funding was severely restricted, it was decided to concentrate on coordination activity with GSFC. GSFC is planning a new version of IEEE-INST-002 section applying to PEMs. The GSFC expert (Dr. Alexander Teverovsky) provided a detailed assessment of the differences between the planned new version of IEEE-INST-002 and the JPL-D-19426 (JPL guideline) as well as a summary rationale for the decisions within the IEEE-INST-002. It should be noted that GSFC’s assessment of IEEE-INST-002 in the area of PEMs is not finalized. JPL is also considering changes in PEM qualification methodologies based on test data from recent qualification testing for their newer Projects (MSL, Grail, Juno). A spreadsheet delineating the differences between the JPL standard and the GSFC standard is presented.
Three load limiting seat concepts for general aviation aircraft designed to lower the deceleration of the occupant in the event of a crash were sled tested and evaluated with reference to a standard seat. Dummy pelvis accelerations were reduced up to 50 percent with one of the concepts. Computer program MSOMLA (Modified Seat Occupant Model for Light Aircraft) was used to simulate the behavior of a dummy passenger in a NASA full-scale crash test of a twin engine light aircraft. A computer graphics package MANPLOT was developed to pictorially represent the occupant and seat motion.
As a continued element in the Telescience Testbed Program (TTP), the University of Arizona Steward Observatory and the Electrical and Computer Engineering Department (ECE) jointly developed a testbed to evaluate the Operations and Science Instrument System (OASIS) software package for remote control of an instrument for the Space Infrared Telescope Facility (SIRTF). SIRTF is a cryogenically-cooled telescope with three focal plane instruments that will be the infrared element of NASA's Great Observatory series. The anticipated launch date for SIRTF is currently 2001. Because of the complexity of the SIRTF mission, it was not expected that the OASIS package would be suitable for instrument control in the flight situation, however, its possible use as a common interface during the early development and ground test phases of the project was considered. The OASIS package, developed at the University of Colorado for control of the Solar Mesosphere Explorer (SME) satellite, serves as an interface between the operator and the remote instrument which is connected via a network. OASIS provides a rudimentary windowing system as well as support for standard spacecraft communications protocols. The experiment performed all of the functions required of the MIPS simulation program. Remote control of the instrument was demonstrated but found to be inappropriate for SIRTF at this time for the following reasons: (1) programming interface is too difficult; (2) significant computer resources were required to run OASIS; (3) the communications interface is too complicated; (4) response time was slow; and (5) quicklook of image data was not possible.
DistOPF is an open-source Python package providing a three-phase, asymmetric optimal power flow (OPF) tool specifically designed for distribution systems. The key inventive features include: - Asymmetrical 3-phase OPF modeling for distribution systems with unbalanced phases - Comprehensive control optimization supporting both active (P) and reactive (Q) power control variables - Built-in visualization and validation tools - Standard test system benchmarking platform for algorithm development and comparison - Modular CSV-based input system using Pandas DataFrames for flexible model specification - Standard power distribution model importer enabling direct conversion from CIM and OpenDSS format to optimization-ready models - Multiple solve interface compatibility (PYOMO, CVXPY, SciPy) with automatic solver selection based on problem type
The FAA restraint system experiments consisted of 24 standard and modified seats, 2 standard galleys and 2 standard overhead compartments. Under the controlled impact demonstration (CID) program, the experimental objective was to demonstrate the effectiveness of individual restraint system designs when exposed to a survivable air-to-ground impact condition. What researchers were looking for was the performance exhibited by standard and modified designs, performance differences resulting from their installed cabin location, and interrelating performance demonstrated by test article and attaching floor and/or fuselage structure. The other restraint system experiment consisted of 2 standard overhead stowage compartments and 2 galley modules. Again, researchers were concerned with the retention of stowed equipment and carry-on articles. The overhead compartments were loaded with test weights up to their maximum capacity, and each of the galleys was filled with test articles: aft with normal galley equipment, forward with hazardous material test packages. A breakdown of instrumentation and distribution is given beginning with 11 instrumented type anthropomorphic dummies and 185 sensors which provided for acceleration and load measurements at the various experiment and associated structure locations. The onboard cameras provided additional coverage of these experiments, including the areas of cabin which were not instrumented. Test results showing the window-side leg forces versus pulse duration are given.
Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.
Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.
Load circuit for testing dc power supplies adjusted without momentary interruptions typical of rheostat loads. Load current passes through power transistor and fixed resistor instead of wire-wound rheostat. In new circuit potentiometer used to adjust bias of power transistor and thereby adjust load. Components are standard, commercially available parts, mounted on transistor heat sink, forming compact package.
Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.