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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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High toughness carbon-nanotube-reinforced ceramics via ion-beam engineering of interfaces
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Rapid microcantilever preparation for conditional fracture toughness evaluation
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Increasing fracture toughness via architected porosity
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Effect of chemical composition on the fracture toughness of bulk metallic glasses
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Functional group activation and coupling agent migration induced by plasma treatment in adhesive for enhanced toughness of metal-composite joints
Commercial adhesive paste was additionally activated using low-power oxygen plasma with different plasma exposure durations to investigate its interfacial bonding contribution in adhesively-bonded Aural-5/CFRP-PA6 double cantilever beam (DCB) joints with plasma-treated adherends. The plasma-treated adhesive showed enhanced functional peak intensities in Fourier transfer infrared spectroscopy (FTIR) as plasma exposure time was increased, and some degree of oxidation was also detected via X-ray photoelectron spectroscopy (XPS). A small molecule, dicyandiamde (coupling agent) in adhesive was migrated to adhesive layer, where double concentration of coupling agent was detected after 10 minutes of plasma treatment. As a result, characterization of the adhesive/CFRP-PA6 interface after DCB fracture showed additional chemical bonds formed through amine-initiated epoxy ring opening polymerization, as well as amide bonds and ester bonds. In conclusion, these additional bonds at the adhesive/CFRP-PA6 interfaces led to significantly increased failure extensions and fracture energies of the joints as the plasma exposure time on the adhesive increased, compared to the joints with plasma-treated adherends but non-plasma-treated adhesive as commonly seen in the literature.
Tough and recyclable carbon-fiber composites with exceptional interfacial adhesion via a tailored vitrimer-fiber interface
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Crazing and Toughness in Diblock Copolymer-Modified Semicrystalline Poly(l-lactide)
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Crystallinity-Independent Toughness in Renewable Poly( l -lactide) Triblock Plastics
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High-performance 2D electronic devices enabled by strong and tough two-dimensional polymer with ultra-low dielectric constant
As the feature size of microelectronic circuits is scaling down to nanometer order, the increasing interconnect crosstalk, resistance-capacitance (RC) delay and power consumption can limit the chip performance and reliability. To address these challenges, new low-k dielectric (k < 2) materials need to be developed to replace current silicon dioxide (k = 3.9) or SiCOH, etc. However, existing low-k dielectric materials, such as organosilicate glass or polymeric dielectrics, suffer from poor thermal and mechanical properties. Two-dimensional polymers (2DPs) are considered promising low-k dielectric materials because of their good thermal and mechanical properties, high porosity and designability. Here, we report a chemical-vapor-deposition (CVD) method for growing fluoride rich 2DP-F films on arbitrary substrates. We show that the grown 2DP-F thin films exhibit ultra-low dielectric constant (in plane k = 1.85 and out-of-plane k = 1.82) and remarkable mechanical properties (Young’s modulus > 15 GPa). We also demonstrated the improved performance of monolayer MoS 2 field-effect-transistors when utilizing 2DP-F thin films as dielectric substrates.
1000 Wh L−1 lithium-ion batteries enabled by crosslink-shrunk tough carbon encapsulated silicon microparticle anodes
Abstract Microparticulate silicon (Si), normally shelled with carbons, features higher tap density and less interfacial side reactions compared to its nanosized counterpart, showing great potential to be applied as high-energy lithium-ion battery anodes. However, localized high stress generated during fabrication and particularly, under operating, could induce cracking of carbon shells and release pulverized nanoparticles, significantly deteriorating its electrochemical performance. Here we design a strong yet ductile carbon cage from an easily processing capillary shrinkage of graphene hydrogel followed by precise tailoring of inner voids. Such a structure, analog to the stable structure of plant cells, presents ‘imperfection-tolerance’ to volume variation of irregular Si microparticles, maintaining the electrode integrity over 1000 cycles with Coulombic efficiency over 99.5%. This design enables the use of a dense and thick (3 mAh cm–2) microparticulate Si anode with an ultra-high volumetric energy density of 1048 Wh L–1 achieved at pouch full-cell level coupled with a LiNi0.8Co0.1Mn0.1O2 cathode.
Grayscale Digital Light Processing Gradient Printing for Stress Concentration Reduction and Material Toughness Enhancement
Avoiding stress concentrations is essential to achieve robust parts since failure tends to originate at such concentrations. With recent advances in multimaterial additive manufacturing, it is possible to alter the stress (or strain) distribution by adjusting the material properties in selected locations. Here, we investigate the use of grayscale digital light processing (g-DLP) 3D printing to create modulus gradients around areas of high stress. These gradients prevent failure by redistributing high stresses (or strains) to the neighboring material. The improved material distributions are calculated using finite element analysis. The much-enhanced properties are demonstrated experimentally for thin plates with circular, triangular, and elliptical holes. In conclusion, this work suggests that multimaterial additive manufacturing techniques like g-DLP printing provide a unique opportunity to create tougher engineering materials and parts.