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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,153 records · Page 64

CHOMPTT (CubeSat Handling of Multisystem Precision Timing Transfer): From Concept to Launch Pad

Here we present the evolution of a student satellite mission: CHOMPTT (CubeSat Handling of Multisystem Precision Time Transfer), from its original concept as a candidate for the University NanoSatellite Program 8 (UNP8), to a spacecraft ready for launch in Fall of 2017 on ELaNa XIX (Educational Launch of Nanosatellites). The 3U CubeSat houses a 1 kg, 1U OPTI (Optical Precision Timing Instrument) payload, designed and built at the University of Florida, and a 1.5U EDSNNODeS-derived bus from NASA Ames Research Center. The OPTI payload comprises of: 1) a supervisor board that handles payload data, power regulation, and mode settings, 2) an optics assembly of six 1 cm retroreflectors and four laser beacon diodes for ground-tracking; and 3) two fully redundant timing channels, each consisting of: a chip-scale atomic clock, a microprocessor with clock counter, a picosecond event timer, and an avalanche photodetector (APD) with band-pass filter. Several iterations of OPTI have been developed, tested, and designed to achieve its current functionality and design a laboratory breadboard design, a 1.5U high altitude balloon design, engineering unit design, and its current flight unit design. In-lab testing of the current OPTI design indicates a short-term precision of 100 ps, equivalent to a range accuracy of 3 cm necessary to achieve our primary objective of 200 ps time transfer error, and a long-term timing accuracy of 20 ns over one orbit (1.5 hours). After the spacecraft reaches its nominal 500 km orbit at a 85 degree inclination, an experimental laser ranging facility at Kennedy Space Center in Florida, will track and emit 1064 nm nanosecond optical pulses at the CHOMPTT spacecraft. The laser pulses will then reflect off the retroreflector array mounted on the nadir face of CHOMPTT, and return the pulse to the laser ranging facility where the laser ranging facility will record the round-trip duration of the laser pulses. At the same time the pulse arrives at the spacecraft and is reflected by the array, an APD will record the arrival time of the pulses at the nanosatellite. By comparing the arrival of the pulse at the CubeSat and the duration of the round-trip of the laser pulse, the clock discrepancy between the ground and CubeSat atomic clocks can be determined, in addition to the CubeSats range from the facility. The design and verification of the flight version of CHOMPTT will be reviewed and an overview of the lifetime development and progression of CHOMPTT from the inception to launch pad will be presented.

CHOMPTT↗

M2020/MSL: TDS (Terminal Descent Sensor) DEA (Digital Electronics Assembly)

TDS is the radar used in MSL mission to land Curiosity rover on Mars. TDS will be used again in M2020 mission. DEA is the brain of the TDS where it serves as the controller and digital signal processor. The DEA commands TDS to cycle through the antenna beams making measurements using one of the 6 antenna beams at a time. DEA uses beam sequences and parameter tables to generate measurements. The most important measurements are velocity and range that are used to guide the landing of Curiosity rover. DEA performs these measurement tasks using radar signal processing FPGA firmware and radar microprocessor ‘s hardware and software.

Ashtijou, Mohammad↗

High Temperature Electronics for Venus Surface Applications: A Summary of Recent Technical Advances

This white paper has a technical focus meant to provide background to those unfamiliar with the challenges of high temperature electronics, and an understanding of why new surface mission concepts are now viable for Venus and other applications. It describes that, for the first time, high temperature electronics have been developed to enable a paradigm change in extended duration Venus surface exploration. This white paper concentrates on the advances made in Silicon Carbide (SiC) integrated circuit (IC) electronics that have matured to a state where a simple long-life scientific probe is feasible for Venus surface operations. These electronics have been demonstrated for more than a year at 500˚C, 60 days in high-fidelity simulated Venus surface conditions chamber, and have been integrated and demonstrated with prototype long-lived scientific observation sensor technology. Continued maturation of these needed high temperature electronics and sensors is ongoing in the Long-Lived In-Situ Solar System Explorer (LLISSE) project to provide an operational system including sensor control and operation, signal processing, power management, and communications in the early part of the 2020’s. A key focus of this work includes increasing the complexity and decreasing the power consumption of the ICs which will pave the way to enhanced capabilities, such as long-duration Venus seismic measurements. Other IC development efforts include high temperature memory, terrestrial based characterization of volcanic magma, and development of a simple microprocessor. This electronics has also shown to have exceptionally high radiation tolerance, and thus have relevance for a broad range of solar system exploration. Although presently at the level of complexity of 1970-1980 silicon-based electronics, such electronics can enable breakthroughs in Venus planetary exploration akin to 1970s-launched planetary exploration successes (such as Viking and Voyager).

High temperature Electronics↗

Automating the Study of Microbial Adaptation Dynamics on and off the ISS

The International Space Station (ISS) not only serves as a unique environment for humans, but also the microorganisms that join alongside. Many microbes present on the spacecraft arrive via humans, and as they interact with different surfaces they begin to inhabit those locations. Much like how human health has shown to be impacted by these extreme environments, microbial viability and response to stress also changes. Experimental evolution (EE) can aid in studying how microbes’ growth and activity changes within the ISS environments by applying controlled stressors to microbial cultures and monitoring their response over generations. EE studies are commonly done manually in laboratories, but, with multiple environmental variables to measure and adjust, it becomes highly labor-intensive, prone to human error, and challenging to scale. A multipurpose automated EE system named the AADEC has been developed to address these problems. This system integrates multiple sensors into a single fluidic chamber using UV-C flux, temperature, and media composition as stressors. AADEC contains five sensors: oxidation-reduction potential, electrical conductivity, pH, dissolved oxygen, and optical density. On their own, each is able to provide certain information on growth rate or metabolism; together, they show in detail how stressors affect life. AADEC studies can be conducted on Earth and repeated aboard the ISS to see how behavior changes when exposed to space mission stressors such as microgravity and radiation. AADEC’s auxiliary systems include peristaltic pumps for media exchange, magnetic rods for agitation, and a Raspberry Pi microprocessor to monitor, store, and adjust stressor levels real-time. This allows researchers to gather information within rapid generations, data and accuracy which is challenging to achieve through manual studies. With further miniaturization and automation, such as a more robust single-piece fluidics card, AADEC has the potential to be developed as a spacecraft payload. Support: NASA Ames CIF Award

Automating↗

A Low-Power High-Speed Smart Sensor Design for Space Exploration Missions

In this paper, an ultra-fast low-power smart vision system-on-a-chip design is proposed to provide effective solutions for real time machine vision applications by taking advantages of advances in integrated sensing/processing designs, electronic neural networks, advanced microprocessors, and sub-micron VLSI systemns-on-a-chip (SOAC) technology.

space↗

Realization of a Faster, Cheaper, Better Star Tracker for the New Millennium

The first Danish satellite, إrsted, will be launched in August of 1997. The scientific objective of إrsted is to perform a precision mapping of the Earth's magnetic field. Attitude data for the payload and the satellite are provided by the Advanced Stellar Compass (ASC) star tracker. The ASC consists of a CCD star camera and a capable microprocessor which operates by comparing the star image frames taken by the camera to its internal star catalogs.

star↗

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗

Open-source Wireless Sensor Network (Wi-Se Net) for Flexible Deployment

Wireless sensors, especially if battery powered, have a number of advantages over wired sensors for flexible or temporary diagnostic deployment in a field or lab setting. Recent advances in wireless technology and microprocessor boards have produced a variety of inexpensive off-the shelf chips which can communicate wirelessly with simple protocols. This paper describes the design and implementation of a highly customizable wireless sensor network (called WiSe Net) using inexpensive open-source hardware components as wireless nodes. These wireless sensor nodes can transmit data at a rate <250 Hz, can be battery powered, and have a small footprint (2x5 cm). In addition, a preliminary over-the-air programming system was developed to allow for simple wireless configuration when active. The network performance was demonstrated by taking distributed and electrically isolated temperature measurements on a high-voltage lab apparatus. Although this test case is in a laboratory setting, this network architecture could be easily repurposed for various other forms of monitoring

Wireless Sensor Network↗

Open-source Wireless Sensor Network (Wi-Se Net) for Flexible Deployment

Wireless sensors, especially if battery powered, have a number of advantages over wired sensors for flexible or temporary diagnostic deployment in a field or lab setting. Recent advances in wireless technology and microprocessor boards have produced a variety of inexpensive off-the shelf chips which can communicate wirelessly with simple protocols. This paper describes the design and implementation of a highly customizable wireless sensor network (called Wi-Se Net) using inexpensive open-source hardware components as wireless nodes. These wireless sensor nodes can transmit data at a rate <250 Hz, can be battery powered, and have a small footprint (2x5 cm). In addition, a preliminary over-the-air programming system was developed to allow for simple wireless configuration when active. The network performance was demonstrated by taking distributed and electrically isolated temperature measurements on a high-voltage lab apparatus. Although this test case is in a laboratory setting, this network architecture could be easily repurposed for various other forms of monitoring.

Wireless Sensor Network↗

Open-source Wireless Sensor Network (Wi-Se Net) for Flexible Deployment

Wireless sensors, especially if battery powered, have a number of advantages over wired sensors for flexible or temporary diagnostic deployment in a field or lab setting. Recent advances in wireless technology and microprocessor boards have produced a variety of inexpensive off-the shelf chips which can communicate wirelessly with simple protocols. This paper describes the design and implementation of a highly customizable wireless sensor network (called WiSe Net) using inexpensive open-source hardware components as wireless nodes. These wireless sensor nodes can transmit data at a rate <250 Hz, can be battery powered, and have a small footprint (2x5 cm). In addition, a preliminary over-the-air programming system was developed to allow for simple wireless configuration when active. The network performance was demonstrated by taking distributed and electrically isolated temperature measurements on a high-voltage lab apparatus. Although this test case is in a laboratory setting, this network architecture could be easily repurposed for various other forms of monitoring.

Wireless Sensor Network↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

AMD Radeon e9173 Low Power PCIE GPU Single Event Effects Test Report

The AMD Radeon Embedded e9170 Graphics Processing Unit (GPU), notably the e9173 Peripheral Component Interconnect Express (PCIE) variant, is of interest to Artemis generation programs with requirements for graphics rendering, compute, artificial intelligence (Ai) with a constraints-requiring piece-part procurement and power consumption of less than 50W. In addition to collecting heavy ion data on this device, a secondary purpose of this test campaign was to validate video capture hardware and software workflows used with GPU, microprocessor and system-on-chip device testing. Five (5) test patterns from the NEPP Processor Enclave (NPE) test suite were used with the e9173. The test patterns covered the operating system’s (OS) idle contribution towards the cross section, matrix math using tensorflow-rocm, two artificial intelligence models developed at NASA GSFC, and an industry standard GPU benchmarking application called Mesa GLXGears.

NASA Technical Memorandum (TM) test report for pos↗

Wireless Sensor Instrumentation for Distributed Sensing in Ground-Test Facilities

Wireless sensors have a number of advantages over wired sensors for flexible or temporary diagnostic deployment in a field or lab setting. Relative to wireless alternatives, traditional wired systems encounter limitations including spatial and weight constraints, maintenance costs, and signal integrity in high-noise environments. Ground-test facilities often face these challenges and cause increase down-time costs and failure of data integrity. This paper describes the development and implementation of flexible wireless sensor boards for applications within ground-test facilities using different network architectures. These boards implement state-of-the- art STM32 microprocessor chips for high-speed data acquisition and computational power. Additionally, the design integrates long-range radio transceivers with power output of +20dBm, easily reaching 2 km range, while maintaining high interference immunity and minimizing current consumption. The wireless sensor boards were implemented to demonstrate performance through benchmark testing and by taking distributed electrically-isolated measurements on a high-voltage lab apparatus while using different network architectures. Although this test case is in a laboratory setting, this network architecture could be easily repurposed for various other forms of monitoring.

Wireless Sensor Network↗

Low SWaP Onboard Satellite Navigation, Guidance, and Control Technology

Onboard autonomy is a necessity for responsive space operations. Autonomous navigation, guidance, and control (NGC) enables space missions to reduce their dependence on high demand ground assets and costly ground personnel. It also allows for in-situ decision making and higher return on mission data. A flight software and hardware system providing this capability, called “autoNGC,” is currently being developed at NASA Goddard Space Flight Center for infusion into multiple future missions. The first build of autoNGC, providing autonomous navigation for lunar orbiting spacecraft, is targeted for completion by Fall 2024. It provides sensor fusion of multiple measurement types including pseudo-range from a weak signal Global Navigation Satellite Service (GNSS) receiver, 1-way and 2-way direct to Earth (DTE) range and Doppler, bearing and range from optical camera sensed images, and an accelerometer. AutoNGC is also being targeted for future missions that involve small body proximity operations, Sun Earth Libration point orbits, and distributed systems missions (DSMs) including those at outer planets. AutoNGC flight software is being built upon the plug-and-play architecture of the core Flight System (cFS) [Ref. 1]. Figure (Slide 7) shows the message-based software bus layout of various software applications (“apps”) consisting of the standard cFS apps and autoNGC interface apps and libraries. Accurate onboard navigation and timing is obtained through the Goddard Enhanced Onboard Navigation System (GEONS) software library [Ref. 2], which fuses different measurement types through an extended Kalman filter (EKF) framework. Optical measurements that are ingested in GEONS are provided by the cFS Goddard Image Analysis and Navigation Tool (cGIANT) app [Ref. 3]. This app processes optical images to extract the bearing angles of the centroid of the imaged body (near or far), the range to the imaged body, and/or of the features on the surface of a body to perform terrain relative navigation (TRN). Measurement of range to the body’s center of mass can also be derived from the detection of the limb. The first build of autoNGC for a lunar orbiting spacecraft is a minimal size, weight, and power (SWaP) hardware design allowing for inclusion into CubeSats and SmallSat-size class buses. Advancements in miniaturized space processors, such as the SpaceCube 3.0 Mini and the SpaceCube Mini-Z [Ref. 4] are utilized for low SWaP while maintaining a high level of performance. Figure (Slide 11) shows the composition of the first autoNGC build. The current enclosure design has dimensions 12 cm x 17 cm x 13.5 cm. The box mass is expected to be less than 2 kg, and the nominal power is 21 W. The hardware interfaces are designed for flexibility with a variety of sensor inputs. The achievable navigation performance depends on the sensors utilized, including the onboard clock for 1-way pseudo-range measurements. Analysis using a configuration that consists of weak signal GPS, TRN, and 1-way DTE has shown position and velocity accuracies of 10 meters and 2 cm/s (3-σ ) RSS, respectively, with onboard time knowledge estimated to better than 13 ns (3-σ ), for a spacecraft in a representative 12-hour eccentric lunar orbit. Other measurement types such as x-rays from known pulsars (called XNAV) and cross-links can also be processed in GEONS. With the plug-and-play architecture of autoNGC, cFS apps can easily be added and replaced, even after launch. Goddard is actively seeking partners to collaborate in the development of additional capabilities for autoNGC, including industry, academia, and others across the US Government. Plans are being formulated to make the autoNGC software platform available for use by any US government organization to leverage the non-recurring engineering associated with the development of onboard autonomous NGC 3 capabilities. As advancements in space qualified sensors, microprocessors, and algorithms are made, the autoNGC platform provides a ready starting point for inclusion of these technologies.

C. J. Gramling↗

Development of a Hybrid Single/Two-Phase Capillary-Based Micro-Cooler Using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application: Preprint

Previously, two-phase capillary-based cooling from narrow (200-1,000 micrometer) heater-bridge copper inverse opal (CIO) wicks with heat flux levels exceeding 1,400 watts per square cm with a low superheat of approximately 10 degrees C was demonstrated. Here, we demonstrate the area scaling of the proposed technology to large-area micro-cooler for the high-heat-flux cooling of microprocessors and power electronics. We developed a hybrid single/two-phase micro-cooler that relies on capillary wicking in 25-micrometer-thick CIOs with an open channel silicon 3D-manifold for liquid delivery and vapor extraction, to achieve a high heat flux of approximately 400 watts per square cm over a heated area of 1 square cm. For the range of inlet water (21 degrees C water temperature) flowrates from 5 to 60 mL per min, we achieved total thermal resistances and vapor qualities of 0.68-0.2 square cm Kelvin per watt and 0.55-0.12, respectively. The high heat flux levels are achieved with flowrates that are 10 times smaller than conventional single- or two-phase microchannel cooling technology. The corresponding two-phase thermal resistances are in the range of 0.05 to 0.02 square cm Kelvin per watt with temperature superheat of 8 to 6 degrees C. While the overall performance of the large-area (10 by 10 square millimeter) capillary-based micro-cooler degraded compared to previous demonstration of the technology for a heated area of 5 by 5 square millimeter, preliminary computational fluid dynamics (CFD) modeling indicates that an improved manifold design will be able to achieve comparable performance.

capillary flow↗