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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
DOE OSTI2023

Correlating viscosity and die swell in 3D printing of polyphenylsulfone: A thermo-mechanical optimization modus operandi

Additive manufacturing (AM) of polyphenylsulfone (PPSU), an amorphous high-performance polymer (HPP), has shown promise in exhibiting structural integrity for many applications. With thermoplastic material extrusion 3D printing, parts consisting of layered melts exhibited voids, where the adhesion quality and void size depend on the processing parameters implemented during printing. However, the structure-process-property (SPP) relationships between the thermal properties and rheological and mechanical behavior of AM PPSU are poorly understood. Here, in this study, a comprehensive analysis of the thermal, thermo-mechanical, and layer-by-layer build-up of PPSU is investigated and correlated with viscosity and extrudate die swell behavior with void fraction volume as confirmed by high-resolution x-ray computed tomography (XCT). Gas chromatography–mass spectrometry (GC–MS) pyrolysis confirmed PPSU composition and degradation at 480 °C, consistent with thermo-gravimetric analysis TGA. A 141% difference in viscosity was observed when processing temperatures increased from 350 °C to 400 °C. Likewise, extrudate die swell decreased with increasing temperatures, resulting in a 17% difference. Tensile and compressive properties confirmed that higher extruding temperatures resulted in lower porosity and higher mechanical strength. In general, higher extruding temperatures lower the viscosity to allow for stronger cohesion between layers; however, increasing the temperature too high results in a below unity extrudate die swell, reducing mechanical properties. Therefore, to optimize the mechanical integrity of 3D printed amorphous PPSU parts, an increase in the viscosity, near unity of the extrudate die swell, and tempered extrusion temperature are needed.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Direct Ink-Write Printing of Ceramic Clay with an Embedded Wireless Temperature and Relative Humidity Sensor

This research presents a simple method to additively manufacture Cone 5 porcelain clay ceramics by using the direct ink-write (DIW) printing technique. DIW has allowed the application of extruding highly viscous ceramic materials with relatively high-quality and good mechanical properties, which additionally allows a freedom of design and the capability of manufacturing complex geometrical shapes. Clay particles were mixed with deionized (DI) water at different ratios, where the most suitable composition for 3D printing was observed at a 1:5 w/c ratio (16.2 wt.%. of DI water). Differential geometrical designs were printed to demonstrate the printing capabilities of the paste. In addition, a clay structure was fabricated with an embedded wireless temperature and relative humidity (RH) sensor during the 3D printing process. The embedded sensor read up to 65% RH and temperatures of up to 85 °F from a maximum distance of 141.7 m. The structural integrity of the selected 3D printed geometries was confirmed through the compressive strength of fired and non-fired clay samples, with strengths of 70 MPa and 90 MPa, respectively. This research demonstrates the feasibility of using the DIW printing of porcelain clay with embedded sensors, with fully functional temperature- and humidity-sensing capabilities.

42 ENGINEERING↗
DOE OSTI2023

System and method for integrated absorber intercooling via rich solvent stream using 3D-printed active packings

The present disclosure relates to an absorber column apparatus for removing a selected component of a gas. The apparatus may have a first zone, a second zone and a third zone, wherein the first and third zones form a first domain through which a first fluid laden with a select gaseous component to be removed therefrom flows along concurrently with a second fluid. The second fluid at least substantially removes the select gaseous component from the first fluid to create a third fluid. The first fluid leaves the absorber column as a fourth fluid with the select gaseous component at least substantially removed therefrom. The second zone forms an active packing zone including a structure which forms an independent second domain in thermal communication with the first domain. The second receives a quantity of the third fluid and channels it through the second zone to help cool at least one of the first and second fluids.

Moore, Thomas Charles Reading↗
DOE OSTI2024

High Precision, High Frequency Printed Antennas

An emerging trend in advanced manufacturing is printed electronics and sensors. The ability to print customized electronics and sensors integrated into functional packages is a growing need within a variety of growing markets such as smart manufacturing, internet of things (IoT), and the small satellite industry. Both Oak Ridge National Laboratory (ORNL) and the MITRE Corporation have seedling research efforts evaluating the potential for future printed electronic systems. High frequency, wide-bandwidth phased array antennas (i.e. >45 GHz) open the door to new applications. However, such sensors require currently prohibitively small feature sizes for commercial 3D printing technologies along with increasing challenges with connecting the driving electronics to such features. An additional finding with related advanced manufacturing challenges is the rapid production of 3D additive connectors for integration with commercial printed circuit boards (PCBs), primarily for advanced in-circuit inspection techniques. This work is developing additive manufacturing processes for producing connected and conductive fine scale 3D features. The primary focus was on aerosol-jet printing (AJP), which has a small minimum resolution (<50 µm) but is traditionally printed flat with small height/width aspect ratios <<1, and developing controls to enable fully 3D, high aspect ratio, and unsupported features. In Phase 1 of this effort, baselines of process performance were characterized, and test coupons produced for both ultra-high frequency antennas and microstructures to support reverse engineering of PCBs. In Phase 2, these efforts will be extended for system demonstration of ultra-high frequency antenna arrays, as well as reverse engineering circuitry for dense PCBs.

42 ENGINEERING↗
DOE OSTI2024

Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing

Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling losses must be low in deployed systems. Previously, we developed the subsurface controllable refractive index via beam exposure (SCRIBE) technique to write accurate 3D gradient refractive index (GRIN) profiles within a mesoporous silica scaffold. Here, we apply SCRIBE to fabricate low loss, broadband, polarization insensitive, fiber-coupled, single-mode volumetric interconnects that include waveguides traversing arbitrary 3D paths. By seamlessly integrating mode-matching subsurface lenses and GRIN waveguide tapers, calibrating for positional writing errors, implementing multipass exposure, automating alignment, and switching to antireflection coated fibers, we reduced the insertion loss for a fiber-PIC-fiber interconnect from 50 to 2.14 dB, or 1.47 dB, excluding the fiber array’s loss. Further, we establish an upper bound of 0.45 dB loss per coupler. We report quality factors of 27,000 and 77,000 and bending losses of 6 and 3 dB/cm for 15 and 30 µm radii microrings, respectively. We also demonstrate Bézier escalators, polarization-rotating and polarization-splitting interconnects, and a seven-channel 25 µm pitch volumetric interconnect. The SCRIBE platform presents a clear path toward realizing 3D PICs with unique functionality.

Optics↗
DOE OSTI2021

Engineered Silicon Carbide Three-Dimensional Frameworks through DNA-Prescribed Assembly

The ability to create nanoengineered silicon carbide (SiC) architectures is important for the diversity of optical, electronic, and mechanical applications. Here, we report a fabrication of periodic three-dimensional (3D) SiC nanoscale architectures using a self-assembled and designed 3D DNA-based framework. The assembly is followed by the templating into silica and subsequent conversion into SiC using a lower temperature pathway (<700 °C) via magnesium reduction. The formed SiC framework lattice has a unit size of about 50 nm and domains over 5 μm, and it preserves the integrity of the original 3D DNA lattice. The spectroscopic and electron microscopy characterizations reveal SiC crystalline morphology of 3D nanoarchitectured lattices, whereas electrical probing shows 2 orders of magnitude enhancements of electrical conductivity over the precursor silica framework. The reported approach offers a versatile methodology toward creating highly structured and spatially prescribed SiC nanoarchitectures through the DNA-programmable assembly and the combination of templating processes.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
DOE OSTI2020

Understanding and mitigating process drift in aerosol jet printing

Aerosol jet printing offers a versatile, high-resolution prototyping capability for flexible and hybrid electronics. Despite its rapid growth in recent years, persistent problems such as process drift hinder the adoption of this technology in production environments. Here we explore underlying causes of process drift during aerosol jet printing and introduce an engineered solution to improve deposition stability. In this work it is shown that the ink level within the cartridge is a critical factor in determining atomization efficiency, such that the reduction in ink volume resulting from printing itself can induce significant and systematic process drift. By integrating a custom 3D-printed cartridge with an ink recirculation system, ink composition and level within the cartridge are better maintained. This strategy allows extended duration printing with improved stability, as evidenced by 30 h of printing over 5 production runs. This provides an important tool for extending the duration and improving reliability for aerosol jet printing, a key factor for integration in practical manufacturing operations.

36 MATERIALS SCIENCE↗
DOE OSTI2022

CityBES v2021

City Buildings, Energy, and Sustainability (CityBES) is a web-based data and computing platform, focusing on energy modeling and analysis of a city's building stock to support district or city-scale building energy efficiency programs. CityBES uses an international open data standard, CityGML, to represent and exchange 3D city models. CityBES employs EnergyPlus to simulate building energy use and savings from energy efficient retrofits. Other CityBES features include energy benchmarking, district heating and cooling system modeling, rooftop PV analysis, building performance visualization, heat resilience modeling, as well as urban scale mapping of microclimate and heat vulnerability at census tract level. Different from other tools, CityBES uses integrated open and standard 3D city building data and models each individual building using EnergyPlus. CityBES can be used by urban planners, city energy managers, building owners, utilities, energy consultants and researchers.

Hong, Tianzhen↗
DOE OSTI2025

Additive manufacturing of high‐density silicon carbide ceramics through post‐processing spark plasma sintering

This research advances the field of additive manufacturing (AM) of silicon carbide (SiC) ceramics by integrating spark plasma sintering (SPS) to enhance material density, mechanical strength, and thermal properties. Traditional AM techniques struggle to achieve the high‐density SiC required for demanding applications, such as aerospace engineering, where high thermal conductivity and mechanical strength are paramount. Here, our study addresses these challenges by incorporating SPS as a post‐processing step, achieving near‐theoretical maximum densities and significantly reducing porosity, thereby resulting in outstanding thermal conductivity in SiC ceramics. We developed a specialized SiC ink optimized for 3D printing, ensuring structural integrity after deposition through tailored rheological properties. The application of SPS facilitates rapid, uniform sintering, essential for attaining superior density, mechanical properties, and thermal performance. Our experimental results, confirmed through scanning electron microscopy analysis, demonstrate significant microstructural properties, mechanical strength, and thermal conductivity, showcasing the effectiveness of integrating SPS in AM processes. This innovative approach not only expands the capabilities of AM in producing complex, high‐density ceramic structures but also broadens the potential applications of SiC in demanding environments.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Deep Convolutional Neural Networks Exploit High-Spatial- and -Temporal-Resolution Aerial Imagery to Phenotype Key Traits in Miscanthus

Miscanthus is one of the most promising perennial crops for bioenergy production, with high yield potential and a low environmental footprint. The increasing interest in this crop requires accelerated selection and the development of new screening techniques. New analytical methods that are more accurate and less labor-intensive are needed to better characterize the effects of genetics and the environment on key traits under field conditions. We used persistent multispectral and photogrammetric UAV time-series imagery collected 10 times over the season, together with ground-truth data for thousands of Miscanthus genotypes, to determine the flowering time, culm length, and biomass yield traits. We compared the performance of convolutional neural network (CNN) architectures that used image data from single dates (2D-spatial) versus the integration of multiple dates by 3D-spatiotemporal architectures. The ability of UAV-based remote sensing to rapidly and non-destructively assess large-scale genetic variation in flowering time, height, and biomass production was improved through the use of 3D-spatiotemporal CNN architectures versus 2D-spatial CNN architectures. The performance gains of the best 3D-spatiotemporal analyses compared to the best 2D-spatial architectures manifested in up to 23% improvements in R2, 17% reductions in RMSE, and 20% reductions in MAE. The integration of photogrammetric and spectral features with 3D architectures was crucial to the improved assessment of all traits. In conclusion, our findings demonstrate that the integration of high-spatiotemporal-resolution UAV imagery with 3D-CNNs enables more accurate monitoring of the dynamics of key phenological and yield-related crop traits. This is especially valuable in highly productive, perennial grass crops such as Miscanthus, where in-field phenotyping is especially challenging and traditionally limits the rate of crop improvement through breeding.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

Single-distance nano-holotomography with coded apertures

High-resolution phase-contrast 3D imaging using nano-holotomography typically requires collecting multiple tomograms at varying sample-to-detector distances, usually 3 to 4. This multi-distance approach limits temporal resolution, making it impractical for operando studies. Moreover, shifting the sample complicates reconstruction, requiring precise alignment, registration, and interpolation to correct for shift-dependent magnification on the detector. In response, we propose and validate through simulations a novel, to the best of our knowledge, single-distance approach that leverages coded apertures to structure beam illumination while the sample rotates. Finally, this approach relies on a joint reconstruction scheme, which integrates phase retrieval with 3D tomography, ensuring data consistency and achieving artifact-free reconstructions from a single distance, unlocking dynamic experiments.

Nikitin, Viktor [Argonne National Laboratory (ANL)↗
DOE OSTI2020

Scalable line and plane relaxation in a parallel structured multigrid solver

The efficient solution of sparse, linear systems that arise through the discretization of partial differential equations remains a key challenge for a range of high performance scientific simulations. One approach for reducing data movement and improving performance is by exposing and exploiting structure in a problem through the use of robust structured multilevel solvers. By choosing coarsening that preserves the structure of the problem, these methods maintain efficient structured computation and communication throughout the multigrid hierarchy. However, when coarsening is not permitted to be dependent on the operator, anisotropy must be addressed by the smoother — producing error compatible for coarse-grid correction with structured coarsening. Here, the components required in a scalable parallel structured solver are described with a focus on memory and communication efficiency of robust smoothers. While the implementation of communication and memory reduction techniques in smoothers integrated in a complete 3D solver present a significant engineering challenge, a novel approach is proposed that addresses these challenges systematically through a change to the solver’s execution model. Enabled by user-level threading paired with a set of data and communication abstractions, this approach permits seamless aggregation of communication in plane smoothers — directly reusing code for a 2D distributed multilevel cycle. Results show an effective reduction in communication costs for coarse-grid problems, and result in a speedup of 8.7x in smoothing routines shown in Fig. 12 using this approach. This produces a significant improvement to strong scalability while maintaining favorable weak scaling behavior. Finally, a parallel scaling study using a series of refined meshes is included that demonstrates the effectiveness of this approach in an application of interest.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2024

Continuous Polymer Synthesis and Manufacturing of Polyurethane Elastomers Enabled by Automation

Connecting polymer synthesis and processing is an important challenge for streamlining the manufacturing of polymeric materials. In this work, the automated synthesis of acrylate-capped polyurethane oligomers is integrated with vat photopolymerization 3D printing. This strategy enabled the rapid manufacturing of a library of polyurethane-based elastomeric materials with differentiated thermal and mechanical properties. The automated semi-continuous batch synthesis approach proved enabling for resins with otherwise short shelf lives because the intimate connection between synthesis, formulation, and processing. Structure-property studies demonstrated the ability to tune properties through systematic alteration of crosslink density and chemical composition.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Constraining the distance to the North Polar Spur with Gaia DR2

ABSTRACT The North Polar Spur (NPS) is one of the largest structures observed in the Milky Way in both the radio and soft X-rays. While several predictions have been made regarding the origin of the NPS, modelling the structure is difficult without precise distance constraints. In this paper, we determine accurate distances to the southern terminus of the NPS and towards latitudes ranging up to 55°. First, we fit for the distance and extinction to stars towards the NPS using optical and near-infrared photometry and Gaia Data Release 2 astrometry. We model these per-star distance–extinction estimates as being caused by dust screens at unknown distances, which we fit for using a nested sampling algorithm. We then compare the extinction to the Spur derived from our 3D dust modelling with integrated independent measures from XMM–Newton X-ray absorption and H i column density measures. We find that we can account for nearly 100 per cent of the total column density of the NPS as lying within 140 pc for latitudes >26° and within 700 pc for latitudes <11°. Based on the results, we conclude that the NPS is not associated with the Galactic Centre or the Fermi bubbles. Instead, it is likely associated, especially at higher latitudes, with the Scorpius–Centaurus association.

Das, Kaustav K.↗
DOE OSTI2023

pySimFrac

pySimFrac is a python library for generating 3D synthetic fracture realizations, integrating with fluid simulators, and performing analysis.

Guiltinan, Eric↗
DOE OSTI2024

PyTrac

SAND2025-00635O PyTrac is a software tool that analyzes and visualizes PTRAC event files generated by MCNP 6.3. It converts these files into a graph network that makes it easier to interpret individual histories. The software includes command line tools for viewing the graph data structure in both 2D and 3D formats. PyTrac also integrates with MCNP to run simulations and manage data files. This provides a streamlined approach to analyzing and understanding the complex data generated by MCNP simulations. Sandia National Laboratories is a multimission laboratory managed and operated by National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.

Nowack, Aaron [Sandia National Lab. (SNL-CA), Live↗
DOE OSTI2024

Physical & Cyber Security Modeling Interfacing Through Dante and ARCADE

Physical security is increasingly facing new threats from cyber attackers, for which there is little research in the way of characterizing this threat. This report discusses the efforts to combine cyber and physical security modeling tools to investigate this novel combinatorial threat space. To accomplish this, the Dante force-on-force modeling and simulation software and the Advanced Reactor Cyber Analysis and Development Environment (ARCADE) were integrated. Dante provides a 3D environment which models the physical world, while ARCADE provides the cyber and control systems world.

42 ENGINEERING↗