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At least 127 records · Page 7

Trinuclear gold chains and octanuclear copper gyrobifastigia stabilized using a fluorinated pyridyl ligand

The fluorinated pyridyl ligand [6-(CF 3 )-2-Py] − with gold( I ) affords trinuclear Au 3 assemblies that further organize into a supramolecular helical column through aurophilic interactions. Its chemistry with copper( I ) is even more remarkable, leading to an unprecedented octanuclear copper–pyridyl cluster complex featuring a central Cu 8 core with an approximate gyrobifastigium geometry. Solid powders of compounds {(6-(CF 3 )-2-Py)Au} 3 and {(6-(CF 3 )-2-Py)Cu} 8 exhibit intense photoluminescence at room temperature, displaying green and yellow colors to the naked eye, respectively. Here, the octanuclear copper complex is also an effective catalyst for azide–alkyne cycloaddition, producing triazoles. Detailed computational analyses confirm the preference for experimental geometries and provide insights into the observed luminescence.

Phan, Vo Quang Huy [University of Texas at Arlingt

Investigating the mechanism of copper–carbon interactions in ultraconductor materials via in situ thermal X-ray and Raman spectroscopy

Improving energy transfer efficiency is critical to advancing technologies for a more sustainable future. Nanoscale materials, specifically metal–carbon composites such as ultraconductors, have shown promise in this field due to their enhanced electrical and thermal conductivities. However, the origin of the enhancement has yet to be determined. Prior research has primarily explored these materials at room temperature in an attempt to explain this phenomenon, but these materials have not yet been examined under enhanced thermal conditions. This study probes ultraconductor materials during the heating process to uncover the origins of their enhanced thermal conductivity. Understanding the mechanism underpinning the enhanced properties of the material could lead to increased property enhancement and therefore improved performance in energy transfer technologies. In this work we employ in situ thermal X-ray absorption near edge spectroscopy (XANES) and Raman spectroscopy to characterize copper-based covetic materials, revealing how thermal conditions influence the bonding environment and interaction between the copper and infused carbon. Our findings suggest that heating the materials does not result in the formation of chemical bonds between the carbon and copper framework of the material but rather points to a primarily physical interaction within the sample. Furthermore, we hypothesize possible mechanisms underlying the nature of the physical interaction leading to enhanced properties. These insights contribute to a deeper understanding of the material's behavior under relevant thermal conditions and highlight its potential for integration into next-generation energy systems.

36 MATERIALS SCIENCE

Thermal Conductivity of Graphene Coated Copper Under Uniaxial Tensile Mechanical Strain

Graphene continues to demonstrate promise as a highly effective barrier coating, even at only one atom thick. The thermal properties of this coating are also promising to allow diffusion of heat across the surface, as the isolated graphene is an intrinsically good thermal conductor, yet this and its behavior under mechanical deformation has been less extensively studied. This report demonstrates that the in-plane thermal conductivity and interfacial thermal conductance of graphene coatings on copper are affected by mechanical strain. By inducing a strain in the copper substrate, the Raman-active 2D peak exhibits a change in position as well as a change in laser power dependence as the copper substrate is uniaxially elongated to a maximum of 0.5%. Non-linear trends in thermal conductivity are observed with tensile strain in samples with differing strain transfer rates from the substrate, indicating the close correlation between intrinsic thermal conduction and interfacial properties in atomically thin coatings transferred onto metals.

36 MATERIALS SCIENCE

Bridging material models across scales: An integrated approach to equation of state and molecular dynamics modeling of copper

New uncertainty-aware equation of state (EOS) and electrical conductivity (EC) models for copper have been developed. The multiphase EOS/EC models are fit to experimental solid/liquid EC isobar measurements as well as density-functional theory molecular dynamics (DFT-MD) EC calculations in both expanded and compressed regimes (0.1–16 g/ cm 3 ⁠). The liquid and solid EOS phases were fit to available experimental data along with additional DFT-MD data over the same range as the EC. Leveraging the DFT-MD data, a corresponding machine-learned interatomic potential (MLIAP) for copper was trained using genetic-algorithm optimization. The copper MLIAP was constrained by EOS shock points at high compressions. The final EOS bounded MLIAP proves to be stable over a large density range (approximately 0.1–20 g/ cm 3 ) with good agreement to an isothermal compression curve, shock Hugoniot, and liquid speed of sound measurements at high pressures (100s of GPa).

Acoustic measurements and instrumentation

Superconductor to exciton condensate transition in a model copper-oxide material

Abstract Superconductivity and exciton condensation are fundamental phenomena in condensed matter physics, associated with the condensation of electron–electron and electron–hole pairs, respectively, into coherent quantum states. In this study, we present evidence of a superconductor to exciton condensate transition within the context of the three-band Hubbard model of copper-oxide-like materials. As the electron–electron repulsion increases, the superconducting phase is superseded by exciton condensation. In support of theoretical predictions—not yet realized experimentally—we observe the coexistence of the two condensates in the vicinity of the transition where the quantum states become a superposition of electron–electron and electron–hole condensates. Coexistence is rigorously computed from large eigenvalues and their eigenvectors in both the two-electron reduced density matrix (2-RDM) and the particle-hole RDM, which we obtain from a direct variational ground-state energy minimization with respect to the 2-RDM by semidefinite programming. We further discern that adjacent d orbitals and intervening p orbitals facilitate electron–electron pairing between copper orbitals, thereby supporting the superexchange mechanism for superconductivity. These observations suggest the feasibility of witnessing a superconductor to exciton condensate transition in copper-oxide analogs, bearing significant implications for identifying materials conducive to efficient transport processes.

Schouten, Anna O. (ORCID:0000000264255219)

Atomic-resolution structural and spectroscopic evidence for the synthetic realization of two-dimensional copper boride

Since the first realization of borophene on Ag(111), two-dimensional (2D) boron nanomaterials have attracted substantial interest because of their polymorphic diversity and potential for hosting solid-state quantum phenomena. Here, we use atomic-resolution scanning tunneling microscopy (STM) and field-emission resonance (FER) spectroscopy to elucidate the structure and properties of atomically thin boron phases grown on Cu(111). Specifically, FER spectroscopy reveals charge transfer and electronic states that strongly differ from the decoupled borophene phases observed on silver, suggesting that the deposition of boron on copper results in strong covalent bonding characteristic of a 2D copper boride. This conclusion is reinforced by detailed STM characterization of line defects that are consistent with density functional theory calculations for atomically thin Cu8B14. This evidence for 2D copper boride is likely to motivate future synthetic efforts aimed at expanding the relatively unexplored family of atomically thin metal boride materials.

Science & Technology - Other Topics

Cysteine Rich Intestinal Protein 2 is a copper-responsive regulator of skeletal muscle differentiation and metal homeostasis

Copper (Cu) is essential for respiration, neurotransmitter synthesis, oxidative stress response, and transcription regulation, with imbalances leading to neurological, cognitive, and muscular disorders. Here we show the role of a novel Cu-binding protein (Cu-BP) in mammalian transcriptional regulation, specifically on skeletal muscle differentiation using murine primary myoblasts. Utilizing synchrotron X-ray fluorescence-mass spectrometry, we identified murine cysteine-rich intestinal protein 2 (mCrip2) as a key Cu-BP abundant in both nuclear and cytosolic fractions. mCrip2 binds two to four Cu + ions with high affinity and presents limited redox potential. CRISPR/Cas9-mediated deletion of mCrip2 impaired myogenesis, likely due to Cu accumulation in cells. CUT&RUN and transcriptome analyses revealed its association with gene promoters, including MyoD1 and metallothioneins, suggesting a novel Cu-responsive regulatory role for mCrip2. Our work describes the significance of mCrip2 in skeletal muscle differentiation and metal homeostasis, expanding understanding of the Cu-network in myoblasts. Copper (Cu) is essential for various cellular processes, including respiration and stress response, but imbalances can cause serious health issues. This study reveals a new Cu-binding protein (Cu-BP) involved in muscle development in primary myoblasts. Using unbiased metalloproteomic techniques and high throughput sequencing, we identified mCrip2 as a key Cu-BP found in cell nuclei and cytoplasm. mCrip2 binds up to four Cu + ions and has a limited redox potential. Deleting mCrip2 using CRISPR/Cas9 disrupted muscle formation due to Cu accumulation. Further analyses showed that mCrip2 regulates the expression of genes like MyoD1, essential for muscle differentiation, and metallothioneins in response to copper supplementation. This research highlights the importance of mCrip2 in muscle development and metal homeostasis, providing new insights into the Cu-network in cells.

59 BASIC BIOLOGICAL SCIENCES

Total Recycling of Copper Cable Scrap and Production of Carbon Using Fast Microwave Technology

The recycling of cable scrap, particularly from discarded electrical wiring, is gaining significant attention due to the rising demand for copper and the need for sustainable management of electronic waste. Traditionally, mechanical and thermal processings have been used to recover copper and plastic from cables. However, these approaches are often energy-intensive, time-consuming, and costly in terms of equipment and labor. In this study, we present a simple and effective method for recovering materials from cable scrap using a domestic microwave oven. Cable pieces (2–2.5 cm long) were exposed to 700 W of microwave irradiation under rotation for 30 s, enabling the rapid and efficient separation of high-quality copper metal from the core wire, and activated carbon from the carbonized plastic sheath. Microwaves facilitate this process through Ohmic heating, which induces electrical resistance in the metal, generating heat that mechanically loosens the metal and carbonized plastic components. The process demonstrates high efficiency, achieving an 80% reduction in energy consumption compared to conventional processings. This fast and energy-efficient method shows strong potential for scaling up to industrial recycling, offering a cost-effective and environmentally friendly way to recover high-quality materials for further use or repurposing.

Bourlinos, Athanasios B. (ORCID:0000000256165993)

Vacancy-Vacancy Interaction in Copper

The binding energy of two vacancies in a static lattice as a function of their separation and the positions of their displaced neighboring atoms has been calculated using a Morse potential function model for copper. It was found that two vacancies attract one another at separation less than about 7 A. At separations greater than 7 A the vacancies do not interact appreciably. The most stable separation was found to be the first nearest- neighbor separation or the divacancy configuration, for which the binding energy was found to be 0.64 ev. Based on these calculations, it is shown that third-stage annealing in irradiated copper may be accounted for by divacancy migration. The role of the divacancy in copper self-diffusion is also explained.

Girifalco, L. A.

Parameters for good welding of copper to nickel

Quality in welding copper leads to nickel bus wires is obtained by the mass of nickel exceeding that of copper. Welding range 2ncreases proportionately with the increase in the nickel-to-copper mass ratio up to 4-to-1.

Hall, L. G.

Friction, wear, and transfer of carbon and graphite to copper, chromium, and aluminum metal surfaces in vacuum

Sliding friction experiments were conducted with amorphous and fully graphitized carbons sliding on copper and on films of chromium and aluminum on copper. Auger emission spectroscopy analysis was used to monitor carbon transfer to the metal surfaces. Friction and wear were also measured. Metal surfaces were examined both in the clean state and with normal oxides present. Results indicate that different metals have an important effect on friction, wear, and transfer characteristics. With amorphous carbon, the least chemically active metal gave the highest wear and amount of carbon transfer. Both forms of carbon gave lower friction and wear and lower transfer rates when in contact with clean, as opposed to oxide-covered, chromium surfaces. With copper, the reverse was true; cleaning was detrimental.

Buckley, D. H.

Adhesion, friction, and wear of a copper bicrystal with (111) and (210) grains

Sliding friction experiments were conducted in air with polycrystalline copper and ruby riders sliding against a copper bicrystal. Friction coefficient was measured across the bicrystal surface, and the initiation of adhesive wear was examined with scanning electron microscopy. Results indicate a marked increase in friction coefficient as the copper rider crossed the grain boundary from the (111) plane to the (210) plane of the bicrystal. Adhesion, friction, and initiation of adhesive wear was notably different in the adjacent grains of differing orientation. A slip-band adhesion-generated fracture mechanism for wear particle formation is proposed.

Brainard, W. A.

Casting copper to tungsten for high power arc lamp cathodes

A method for making 400-kW arc lamp cathodes is described. The cathodes are made by casting a 1.75-in. diameter copper body onto a thoriated tungsten insert. The addition of 0.5-percent nickel to the copper prevents voids from forming at the copper-tungsten interface. Cathodes made by this process have withstood more than 110 hours of operation in a 400-kW arc lamp.

Will, H. A.

Casting copper to tungsten for high-power arc lamp cathodes

Voids forming at interface when copper is cast onto tungsten can be eliminated by adding wetting agent during casting process. Small amount of copper and nickel are cast onto thoriated tungsten insert, insert is recast with more copper to form electrode. Good thermal conductance results in long-lived cathode.

Will, H. A.

Auger electron spectroscopy study of initial stages of oxidation in a copper - 19.6-atomic-percent-aluminum alloy

Auger electron spectroscopy was used to examine the initial stages of oxidation of a polycrystalline copper - 19.6 a/o-aluminum alloy. The growth of the 55-eV aluminum oxide peak and the decay of the 59-, 62-, and 937-eV copper peaks were examined as functions of temperature, exposure, and pressure. Pressures ranged from 1x10 to the minus 7th power to 0.0005 torr of O2. Temperatures ranged from room temperature to 700 C. A completely aluminum oxide surface layer was obtained in all cases. Complete disappearance of the underlying 937-eV copper peak was obtained by heating at 700 C in O2 at 0.0005 torr for 1 hr. Temperature studies indicated that thermally activated diffusion was important to the oxidation studies. The initial stages of oxidation followed a logarithmic growth curve.

Ferrante, J.

Influence of degree of ambient medium rarefaction on deformation of copper and aluminum

The influence of high vacuum 1 x 10 to the minus 9th power torr on the plastic deformation of copper and aluminum was studied. When stretching polycrystalline aluminum and copper specimens in vacuum, it was found that the deformation at failure increases and the ultimate strength decreases. Deformation in vacuum is accompanied by the evolution of hydrogen. For copper, gas evolution is observed only at failure, while for aluminum hydrogen evolution takes place in the initial stage and the gas evolution peaks correspond to small steps on the deformation curve.

Lyubarskiy, I. M.

Characterization of nickel-copper alloy specimens processed as a part of the M553 sphere forming experiment during the Skylab 1 and 2 flight

Both processed nickel-copper alloy specimens apparently completely melted by the electron beam in the Skylab M512 materials processing facility and either floated free in space, but collided with some smooth flat surface before solidifying, or remained attached to its support post during solidification. Both specimens had a smooth flat area on the surface due to this adherence during solidification. The nominal composition of the alloy before processing in space was 70 percent Ni and 30 percent Cu. Tests show that a considerable amount of copper was lost during processing by evaporation. It was further found that less copper was present in the cap areas, particularly at the surface, than was in the remainder of the specimens. The microchemistry of the dendrites and interdendritic regions, however, is in agreement with the phase diagram for this alloy. The measured densities of these specimens were less than the theoretical density of the alloy due to the amount of porosity present, however, no large voids were found by radiographic techniques.

Hubbard, J. L.