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At least 127 records · Page 7

Thick film silicon growth techniques

Thick film silicon ribbons were produced by means of the edge-defined, film-fed growth (EFG) technique. EFG is a process by which single crystals may be grown having a shape controlled by the outside dimensions of a die, the growth taking place from an extremely thin film of liquid fed by capillary action from a crucible below. The principal problem to be overcome in the application of this process to the growth of thick film silicon ribbon relates to the material, such as the shaping die. For the method to operate, this die material must be wet by the liquid silicon. To preserve semiconductor quality, the liquid silicon must not react significantly with the die material. The most promising die material for this application appears to be SiC and SiC-SiO2 admixture. In this case good wetting occurs between the molten silicon and the SiC. C is a relatively unharmful contaminant of Si and additions of quartz to SiC are found to decrease the extent of reaction.

Bates, H. E.↗

Development of a Thick-film Silicon Ribbon Growth Technique for Application to Large-area Solar Cells and Arrays

A new technique is described for growth of large-area silicon ribbons. This technique is an edge-defined, film-fed growth process by which single crystals can be grown having a shape controlled by the outside dimensions of a shaping die, growth taking place from an extremely thin film of liquid fed by capillary action from a crucible below. The material from which the die is fabricated is very critical to the process. The die must be wet by the silicon, but adverse impurities must not be introduced into the silicon, and the die must not become degraded by the molten silicon. A breakthrough in die fabrication that has allowed the growth of silicon ribbons having dimensions of 1 cm by 30 cm with a thickness of 0.7 mm is described. The implications of this significant advancement with respect to development of photovoltaic solar arrays for wide-scale terrestrial solar-to-electric energy conversion systems are discussed.

Berman, P. A.↗

Preparation of eutectic superalloys by EFG

An attempt was made to produce airfoil shaped bars of three different eutectic superalloys by means of the edge-defined, film-fed growth (EFG) method. The alloys used were a gamma + delta Ni-Cb alloy, a gamma/gamma prime + delta Ni-Cb-Al alloy and a Co-TaC alloy containing Ni and Cr. The development of a new die material was essential in the investigation since these alloys are reactive toward known die materials. Tantalum carbide was selected as a die material because it exhibited spontaneous capillary rise and slow rate of degradation in the liquid metals. Eutectic bars up to 1 mm thick and 6 mm wide were grown from TaC dies in order to determine the growth characteristics and the thermal gradient. Large bars of the gamma/gamma prime + delta alloy were grown and tensile tested. A die with a blind central cavity was designed and several hollow, tear-shaped bars were grown.

Hurley, G. F.↗

A sub-cm micromachined electron microscope

A new approach for fabricating macroscopic (approximately 10x10x10 mm(exp 3)) structures with micron accuracy has been developed. This approach combines the precision of semiconductor processing and fiber optic technologies. A (100) silicon wafer is anisotropically etched to create four orthogonal v-grooves and an aperture on each 10x12 mm die. Precision 308 micron optical fibers are sandwiched between the die to align the v-grooves. The fiber is then anodically bonded to the die above and below it. This procedure is repeated to create thick structures and a stack of 5 or 6 die will be used to create a miniature scanning electron microscope (MSEM). Two die in the structure will have a segmented electrode to deflect the beam and correct for astigmatism. The entire structure is UHV compatible. The performance of an SEM improves as its length is reduced and a sub-cm 2 keV MSEM with a field emission source should have approximately 1 nm resolution. A low voltage high resolution MSEM would be useful for the examination of biological specimens and semiconductors with a minimum of damage. The first MSEM will be tested with existing 6 micron thermionic sources. In the future a micromachined field emission source will be used. The stacking technology presented in this paper can produce an array of MSEMs 1 to 30 mm in length with a 1 mm or larger period. A key question being addressed by this research is the optimum size for a low voltage MSEM which will be determined by the required spatial resolution, field of view, and working distance.

Feinerman, A. D.↗

Surveying Dead Trees and CO2-Induced Stressed Trees Using AVIRIS in the Long Valley Caldera

Since 1980 the Long Valley Caldera in the eastern Sierra Nevada (California) has shown signs of renewed volcanic activity. Frequent earthquakes, a re-inflation of the caldera, hydrothermal activity and gas emissions are the outer symptoms of this renewed activity. In 1990 and 1991 several areas of dying trees were found around Mammoth Mountain. The cause of the die off of the trees was first sought in the persistent drought in the preceding years. However, the trees died regardless of age and species. Farrar et al. (1995) started a soil-gas survey in 1994 in the dead-tree areas and found carbon dioxide concentrations ranging from 30 to 96% at soil depths between 30 and 60 cm. CO2 concentrations in the atmosphere are usually around 0.03% and in the soil profile CO2 levels do commonly not exceed 4 to 5%. Although not much is known about the effect of high levels of carbon dioxide in the soil profile on roots, it is most likely that the trees are dying due to oxygen deprivation: the CO2 drives the oxygen out of the soil. So far, four sites of dead trees have been mapped around Mammoth Mountain. The two largest dying trees sites are located near Horseshoe Lake and near Mammoth Mountain Main Lodge covering approximately an area of 10 and 8 ha respectively. Analysis of the gas composition regarding the He-3/He-4 ratio and the percentage biogenic carbon reveals the source of the gas: the magma body beneath the Long Valley Caldera. Until recently it was not known that volcanoes release abundant carbon dioxide from their flanks as diffuse soil emanations. As a result of the magma gas emission around Mammoth Mountain there is an excellent sequence of dead trees, stressed trees, healthy trees and bare soil surfaces. This research site provides excellent opportunities to: (1) Study the capabilities of imaging spectrometry to map stressed (and dead) pine and fir species; (2) Study methods to separate the vivid vegetation, stressed vegetation and dead vegetation from the soil background of glacial deposits and crystalline rocks. The dead tree areas are located on the flanks of Mammoth Mountain (N:37 deg 37' 45" and W:119 deg 02' 05") at an elevation between 2600 and 3000 meters. The area is covered by an open type of Montane Forest. The dominant tree species are Lodgepole Pine (Pinus contorta), the Red Fir (Abies magnifica) and the Jeffrey Pine (Pinus jeffreyi). The soil surface near Horseshoe Lake is generally fairly bright. The surface is covered by glacial deposits (till) consisting mainly of weathered granitic rocks.

deJong, Steven M.↗

CSP Manufacturing Challenges and Assembly Reliability

Although the expression of CSP is widely used by industry from suppliers to users, its implied definition had evolved as the technology has matured. There are "expert definition"- package that is up to 1.5 time die- or "interim definition". CSPs are miniature new packages that industry is starting to implement and there are many unresolved technical issues associated with their implementation. For example, in early 1997, packages with 1 mm pitch and lower were the dominant CSPs, whereas in early 1998 packages with 0.8 mm and lower became the norm for CSPs. Other changes included the use of flip chip die rather than wire bond in CSP. Nonetheless the emerging CSPs are competing with bare die assemblies and are becoming the package of choice for size reduction applications. These packages provide the benefits of small size and performance of the bare die or flip chip, with the advantage of standard die packages. The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. This talk will cover specifically the experience of our consortium on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and the most current environmental thermal cycling test results.

Ghaffarian, Reza↗

Reduktive Eliminierung von Tetraalkylcupraten [Me n Cu(CF 3 ) 4− n ] − ( n =0–4): jenseits einfacher Oxidationsstufen

Abstract In den letzten Jahren haben Organocuprate im Allgemeinen und der Komplex [Cu(CF 3 ) 4 ] − im Besonderen wegen ihrer elektronischen Strukturen erhebliches Interesse auf sich gezogen. Obwohl der Reaktivität dieser Spezies in diesem Zusammenhang eine Schlüsselrolle zukommen dürfte, fand dieser Aspekt bisher nur wenig Beachtung. Wir untersuchen hier systematisch die Reihe der Tetraalkylcuprate [Me n Cu(CF 3 ) 4− n ] − und ihre Gasphasenreaktivität, die sowohl konzertierte reduktive Eliminierungen als auch Radikalverluste umfasst. Mit Hilfe quantenchemischer Rechnungen charakterisieren wir die elektronischen Strukturen der Komplexe und zeigen, wie sie mit der Reaktivität zusammenhängen. Wir finden, dass alle Ionen [Me n Cu(CF 3 ) 4− n ] − invertierte Ligandenfelder aufweisen und dass sich die unterschiedlichen Reaktivitäten der individuellen Komplexe aus dem Zusammenspiel verschiedener Effekte ergeben.

Zimmer, Bastian↗

In-Process Melt Separation of Depolymerized PET in PET/PE Blends for Upcycling via Twin-Screw Extrusion

Our previous work focused on depolymerizing polyethylene terephthalate (PET) in twin-screw extrusion, as part of a broader project to continuously separate PET from polyolefins in the melt. This study focused on linear low-density polyethylene (LLDPE) and PET films and the use of ethylene glycol (EG), diethylene glycol (DEG), triethylene glycol (TEG), and bis(2-hydroxyethyl) terephthalate (BHET) to depolymerize the PET in the extruder to levels above 90% Mw. In this work, the focus will shift to achieving separation of the two polymers in the twin-screw extruder, which is made possible due to a 90% reduction in the Mw of the PET, which caused a decrease of its viscosity by several orders of magnitude. Owing to the viscosity difference and pressure buildup in the die, the low-viscosity PET preferentially exited a degassing vent instead of going through the die. This is because the flow of the PET would travel through a non-pressure vent rather than through a high-pressure die. However, owing to the higher viscosity of the LLDPE, the pressure was too high to pass through such a small diameter vent hole. Supercritical CO 2 (SCCO 2 ) was used to assist in this extraction, but SCCO 2 negatively impacted the overall degree of separation. Through analysis of the separated materials, it was concluded that a high separation of the two materials was achieved. TGA and FTIR confirmed that the material separated from the vent was 100% PET. The material removed from the die was composed of 95% LLDPE and 5% PET.

36 MATERIALS SCIENCE↗

In‐Process Melt Separation of PE/PET Blends for Upcycling via Twin‐Screw Extrusion. Impact of Catalyst Reagents on PET Depolymerization

Part 1 of this work focused on depolymerizing polyethylene terephthalate (PET) in twin-screw extrusion, as part of a broader project to continuously separate PET from polyolefins in the melt. This study focused on linear low-density polyethylene (LLDPE) and PET films and the use of ethylene glycol (EG), diethylene glycol (DEG), triethylene glycol (TEG), and bis(2-hydroxyethyl) terephthalate (BHET) to depolymerize the PET in the extruder to levels above 90% Mw. In part 2, the focus will shift to achieving separation of the two polymers in the twin-screw extruder, which is made possible due to a 90% reduction in the Mw of the PET, which caused a decrease of its viscosity by several orders of magnitude. Owing to the viscosity difference and pressure buildup in the die, the low-viscosity PET preferentially exited a degassing vent instead of going through the die. This is because the flow of the PET would travel through a non-pressure vent rather than through a high-pressure die. However, owing to the higher viscosity of the LLDPE, the pressure was too high to pass through such a small diameter vent hole. Supercritical CO₂ (SCCO₂) was used to assist in this extraction, but SCCO₂ negatively impacted the overall degree of separation. Through analysis of the separated materials, it was concluded that a very high separation of the two materials was achieved. TGA and FTIR confirmed that the material separated from the vent was 100% PET. The material removed from the die was composed of 90% LLDPE and 10% PET.

36 MATERIALS SCIENCE↗

Precision metal molding

Method provides precise alignment for metal-forming dies while permitting minimal thermal expansion without die warpage or cavity space restriction. The interfacing dowel bars and die side facings are arranged so the dies are restrained in one orthogonal angle and permitted to thermally expand in the opposite orthogonal angle.

Townhill, A.↗

Silicon ribbon growth by a capillary action shaping technique

The crystal growth method described is a capillary action shaping technique. Meniscus shaping for the desired ribbon geometry occurs at the vertex of a wettable die. As ribbon growth depletes the melt meniscus, capillary action supplies replacement material. A capillary die is so designed that the bounding edges of the die top are not parallel or concentric with the growing ribbon. The new dies allow a higher melt meniscus with concomitant improvements in surface smoothness and freedom from SiC surface particles, which can degrade perfection.

Schwuttke, G. H.↗

Adjustable Tooling for Bending Brake

Deep metal boxes and other parts easily fabricated. Adjustable tooling jig for bending brake accommodates spacing blocks and either standard male press-brake die or bar die. Holds spacer blocks, press-brake die, bar window die, or combination of three. Typical bending operations include bending of cut metal sheet into box and bending of metal strip into bracket with multiple inward 90 degree bends. By increasing free space available for bending sheet-metal parts jig makes it easier to fabricate such items as deep metal boxes or brackets with right-angle bends.

Ellis, J. M.↗

NASA Ultra-Sensitive Miniature Accelerometer

Using micro-machined silicon technology, an ultra-sensitive miniature acce.,rometer can be constructed which meets the requirements for microgravity experiments in the space environment.Such an accelerometer will have a full scale sensitivity of 1C2 g a resolution of lC8 g, low cross axis sensitivity, and low temperature sensitivity. Mass of the device is approximately five grams and its footprint is 2 cm x 2 cm. Innovative features of the accelerometer, which are patented, are: electrostatic caging to withstand handling shock up to 150 g, in-situ calibration, in situ performance characterization, and both static and dynamic compensation. The transducer operates on a force balance principle wherein the displacement of the proof mass is monitored by measuring tunneling electron current flow between a conductive tip, and a fixed platen. The four major parts of the accelerometer are tip die, incorporating the tunneling tip and four field plates for controlling pitch and roll of the proof mass; two proof mass dies, attached to the surrounding frame by sets of four leg" springs; and a force plate die. The four parts are fuse-bonded into a complete assembly. External electrical connections are made at bond pads on the front surface of the force plate die. Materials and processes used in the construction of the transducer are compatible with volume production.

Zavracky, Paul M.↗

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗

Nuclear Thermal Rocket (NTR) Development Risk Communication

There are clear advantages of development of a Nuclear Thermal Rocket (NTR) for a crewed mission to Mars. NTR for in-space propulsion enables more ambitious space missions by providing high thrust at high specific impulse (approximately 900 sec) that is 2 times the best theoretical performance possible for chemical rockets. Missions can be optimized for maximum payload capability to take more payload with reduced total mass to orbit; saving cost on reduction of the number of launch vehicles needed. Or missions can be optimized to minimize trip time significantly to reduce the deep space radiation exposure to the crew. NTR propulsion technology is a game changer for space exploration. However, "NUCLEAR" is a word that is feared and vilified by some groups and the hostility towards development of any nuclear systems can meet great opposition by the public as well as from national leaders and people in authority. Communication of nuclear safety will be critical to the success of the development of the NTR. Why is there a fear of nuclear? A bomb that can level a city is a scary weapon. The first and only times the Nuclear Bomb was used in a war was on Hiroshima and Nagasaki during World War 2. The "Little Boy" atomic bomb was dropped on Hiroshima on August 6, 1945 and the "Fat Man" on Nagasaki 3 days later on August 9th. Within the first 4 months of bombings, 90- 166 thousand people died in Hiroshima and 60-80 thousand died in Nagasaki. It is important to note for comparison that over 500 thousand people died and 5 million made homeless due to strategic bombing (approximately 150 thousand tons) of Japanese cities and war assets with conventional non-nuclear weapons between 1942- 1945. A major bombing campaign of "firebombing" of Tokyo called "Operation Meetinghouse" on March 9 and 10 consisting of 334 B-29's dropped approximately1,700 tons of bombs around 16 square mile area and over 100 thousand people have been estimated to have died. The declaration of death is very clear for conventional weapons and then the declaration of death due to radiation becomes vague and unclear. This may have been due to people mis-understanding the dangers and effects of radiation when assessing the damage and harm to people initially, but it is also become insidious when expressing opposition to nuclear energy. A nuclear radiation accident can be scary due to the power involved and the fear of radiation release. The International Atomic Energy Agency defines a nuclear and radiation accident a "an event that has led to significant consequences to people, the environment or the facility." There have been 3 commercial nuclear reactor accidents (Chernobyl, Three Mile Island, and Fukushima) that stand out to the public and much of the information about the result and impact to workers, environment, and public can be misleading. Often information is presented without clear correlation with radiation and other pertinent information is left out presenting a very scary situation to affect the emotions of the reader. A very boring but "critically acclaimed" movie was made in 1979 called "The China Syndrome" starring Jane Fonda and Jack Lemmon. The film was released on March 16, 1979, 12 days before the 3-Mile Island nuclear accident in Pennsylvania. The basis from the movie was from a few nuclear plant incidents and in particular, the Brown's Ferry Alabama Power Plant fire. In one scene from the movie, a physicist Dr. Elliott Lowell played by Donald Hotton states that a China Syndrome event would make "an area the size of Pennsylvania" permanently uninhabitable. Real serious nuclear incidents like Chernobyl and Fukushima are often sited to make people fear the consequences of using nuclear power. However, the consequences are at best poorly communicated and at worst fictitiously inflated to instigate social unrest against nuclear power. There is an article being circulated on Facebook with a title "28 Signs that the (US) West Coast is being absolutely fried with nuclear radiation from Fukushima" which focus on mis-information and fear mongering. Nuclear power and NTR are powerful resources that can open many doors for future prosperity and capability. With great power comes great responsibility. Radiation and its effects need to be better understood, quantified, and communicated. A human mission to mars has its own risks of deep space radiation and is considered a considerable risk at 400 milli-Sieverts per year in deep space and 245 milli-Sieverts per year on the surface of Mars as measured by the Mars Curiosity mission. Although these quantities of ionizing radiation are within the astronaut career limit, it exceeds the yearly average amounts of ionizing radiation. Astronaut crews have experienced these levels of radiation before, but for durations shorter than a year, and a mission to Mars could possibly be 3 years in length. There is also evidence that people can comfortably handle higher levels of ionizing radiation where the radiation occurs naturally like Ramsar, Iran when people can experience 270 milli-Sieverts per year. A risk posture that the development, test, and flight of an NTR will meet opposition from groups who oppose nuclear energy must be likely and the impact can be sever to the effort. Active risk mitigation must be taken for an NTR full-scale development project. The NTR design must take into account safety for transport and off nominal conditions. Nuclear fuel element must consider containment of fission products and Low Enriched Uranium (LEU) that may meet less opposition should be considered for safety and security reasons. Even though testing was conducted on Rover/NERVA safely and successfully in the 60's with exhaust sent heavenward in to open air, modern testing of NTR must consider full containment and no release of ionizing radiation to the public and must meet the current requirement of no more than 0.1 milli-Sieverts per year to the public. 0.1 milli-Sieverts is equivalent to eating one banana or a 20 hour plane flight. Good communication with the public and regulatory agencies will be essential to show that all effort is applied toward protection to the public and astronauts. The inspiring endeavor to put humans on Mars to study the planet, search for life, and learn more about this Solar System will be full of risks but it will be worth it. NTR will be worth the development effort if it allows humans to explore our Solar System.

Kim, Tony↗

Performance evaluation of neutron noise analysis in detecting special nuclear materials

Reliable and rapid inspection techniques play a vital role in preventing illicit trafficking of special nuclear materials. Active interrogation systems using neutrons produced by portable, high-flux deuterium-deuterium or deuterium-tritium neutron generators are being actively developed as a secondary scanning tool for this purpose. In this study, a neutron noise analysis-based approach for detecting unshielded and shielded special nuclear materials by using a pulsed deuterium-tritium neutron generator was evaluated. Here, this approach analyzes the fluctuation of neutron counts. Its performance was quantified with regard to time-to-detection to achieve a minimum probability of detection of 99% and a probability of false alarm of less than 1% considering various amounts of special nuclear materials and different shielding configurations. It was demonstrated that this approach could detect 17 uranium slugs in 5 s given a neutron generator yield of 8.1 × 10 7 n/s. These slugs could be detected within a reasonable time frame (200 s) when they were shielded by 10.16 cm of high-density polyethylene. The results obtained using the neutron noise analysis approach were compared with those obtained using the commonly used differential die-away analysis technique, a sensitive technique for detecting the presence of fissile materials by utilizing the prompt fission neutrons produced when the source neutrons from a neutron generator are completely diminished. For example, the time to detect 2 unshielded uranium slugs was 2.1 s when using the differential die-away analysis technique; it increased to 93 s for the neutron noise analysis approach. Although the noise analysis-based approach exhibits an overall performance which is not as good as that of differential die-away, neutron noise provides an alternative method for effective detection of special nuclear materials.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗