Search NASA⌕ Search

SEARCH · Search NASA

Results for “Encapsulation”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1976

Review of world experience and properties of materials for encapsulation of terrestrial photovoltaic arrays

Published and unpublished information relating to encapsulation systems and materials properties was collected by searching the literature and appropriate data bases (over 1,300 documents were selected and reviewed) and by personal contacts including site and company visits. A data tabulation summarizing world experience with terrestrial photovoltaic arrays (50 installations) is presented in the report. Based on criteria of properties, processability, availability, and cost, candidate materials were identified which have potential for use in encapsulation systems for arrays with a lifetime of over 20 years high reliability, an efficiency greater than 10 percent, a total price less than $500/kW, and a production capacity of 500,000 kW/yr. The recommended materials (all commercially available) include, depending upon the device design, various borosilicate and soda-lime glasses and numerous polymerics suitable for specific encapsulation system functions.

Carmichael, D. C.↗
NASA NTRS1977

Evaluation testing of solid encapsulated microcircuits for space applications

Epoxy encapsulated microcircuits were subjected to various thermal, vibration, thermal cycling, and reduced barometric pressure stress tests to obtain electrical, environmental, and failure data. Analyses of the data were employed to derive information on environmental and operating design limits to determine the capability of encapsulated microcircuits to perform in space applications and environments. Seven different part types (four TTL, two CMOS, one linear) from five different manufacturers were subjected to single, multiple, and combinational environmental stress levels to determine: (1) what failure mechanisms are unique to encapsulated microcircuits; (2) how believable are suppliers claims of improved reliability, (3) what stress tests and screens can be used to identify potential early failure, and (4) what stress tests and screens should be avoided to prevent unwanted life degradation.

Robinson, D. D.↗
NASA NTRS1978

Evaluation available encapsulation materials for low-cost long-life silicon photovoltaic arrays

Experimental evaluation of selected encapsulation designs and materials based on an earlier study which have potential for use in low cost, long-life photovoltaic arrays are reported. The performance of candidate materials and encapsulated cells were evaluated principally for three types of encapsulation designs based on their potentially low materials and processing costs: (1) polymeric coatings, transparent conformal coatings over the cell with a structural-support substrate; (2) polymeric film lamination, cells laminated between two films or sheets of polymeric materials; and (3) glass-covered systems, cells adhesively bonded to a glass cover (superstrate) with a polymeric pottant and a glass or other substrate material. Several other design types, including those utilizing polymer sheet and pottant materials, were also included in the investigation.

Carmichael, D. C.↗
NASA NTRS1976

Material and design considerations of encapsulants for photovoltaic arrays in terrestrial applications

Procedures for analyzing cyclic mechanical stresses in encapsulated photovoltaic arrays designed for terrestrial application are discussed. The concept of 'thermal stiffness', the product of alpha and Young's modulus, is presented, and its usefulness for minimizing mechanical stresses is demonstrated. The concept of the 'proportional-limit' helps indicate the upper limit of design stress for plastics. System design is considered with attention to cell dimensions, cell to substrate adhesive, single encapsulant system, double layer encapsulant, and stresses in the interconnects. The permeability of polymeric materials to gases is examined.

Carroll, W.↗
NASA NTRS1979

Integral Glass Encapsulation for Solar Arrays

Work reported was performed during the period from August 1977 to December 1978. The program objective was to continue the development of electrostatic bonding (ESB) as an encapsulation technique for terrestrial cells. Economic analyses shows that this process can be a cost-effective method of producing reliable, long lifetime solar modules. When considered in sufficient volume, both material and equipment costs are competitive with conventional encapsulation systems. In addition, the possibility of integrating cell fabrication into the encapsulation process, as in the case of the preformed cell contacts discussed in this report, offers the potential of significant overall systems cost reduction.

Younger, P. R.↗
NASA NTRS1978

Encapsulant materials for $2/watt terrestrial photovoltaic arrays

Materials properties, cost data, and strawman designs are presented relative to materials for $2/watt terrestrial photovoltaic arrays to meet LSA Project cost goals for 1982. It is shown that encapsulation materials can be categorized in six basic elements: top covers, super-strates, pottants, adhesives, substrates, and bottom covers. The roles of the six basic encapsulant material elements in the encapsulant system are discussed and candidate materials presented.

Maxwell, H.↗
NASA NTRS1978

A life prediction methodology for encapsulated solar cells

This paper presents an approach to the development of a life prediction methodology for encapsulated solar cells which are intended to operate for twenty years or more in a terrestrial environment. Such a methodology, or solar cell life prediction model, requires the development of quantitative intermediate relationships between local environmental stress parameters and the basic chemical mechanisms of encapsulant aging leading to solar cell failures. The use of accelerated/abbreviated testing to develop these intermediate relationships and in revealing failure modes is discussed. Current field and demonstration tests of solar cell arrays and the present laboratory tests to qualify solar module designs provide very little data applicable to predicting the long-term performance of encapsulated solar cells. An approach to enhancing the value of such field tests to provide data for life prediction is described.

Coulbert, C. D.↗
NASA NTRS1980

Hermetic encapsulation technique for solar arrays

A concept is presented for encapsulating solar cells between two layers of glass either individually, in panels, or in a continuous process. The concept yields an integral unit that is hermetically sealed and that is tolerant to high temperature thermal cycling and to particulate radiation. Data are presented on both high temperature solar cells and special glasses that soften at low temperatures for use with the concept. The results of encapsulating experiments are presented which show the successful application of the concept to the special high temperature cells. The mechanical feasibility of encapsulating 2 mil cells between two layers of 2 mil glass is also demonstrated.

Deminet, C.↗
NASA NTRS1980

Development of glass encapsulation techniques for terrestrial photovoltaic arrays

Two parallel development programs for terrestrial solar cell module encapsulation and fabrication are reviewed, including the status of electrostatic bonding as an encapsulation technique. Current designs of electrostatically bonded modules are discussed, fabrication of which is now routine. The design of a high-efficiency module is presented, for which performance reliability features are discussed. This design is compatible with later generation changes such as the introduction of encapsulation by electrostatic bonding. Application of wire mesh contacts by electrostatic bonding has resulted in I-V curve fill factors of 0.74. Cell designs that would allow existing Pyrex glass to be used in electrostatically bonded modules are presented.

Younger, P. R.↗
NASA NTRS1981

Thermal and optical performance of encapsulation systems for flat-plate photovoltaic modules

The electrical power output from a photovoltaic module is strongly influenced by the thermal and optical characteristics of the module encapsulation system. Described are the methodology and computer model for performing fast and accurate thermal and optical evaluations of different encapsulation systems. The computer model is used to evaluate cell temperature, solar energy transmittance through the encapsulation system, and electric power output for operation in a terrestrial environment. Extensive results are presented for both superstrate-module and substrate-module design schemes which include different types of silicon cell materials, pottants, and antireflection coatings.

Minning, C. P.↗
NASA NTRS1983

Applications of ethylene vinyl acetate as an encapsulation material for terrestrial photovoltaic modules

Terrestrial photovoltaic modules must undergo substantial reductions in cost in order to become economically attractive as practical devices for large scale production of electricity. Part of the cost reductions must be realized by the encapsulation materials that are used to package, protect, and support the solar cells, electrical interconnects, and other ancillary components. As many of the encapsulation materials are polymeric, cost reductions necessitate the use of low cost polymers. The performance and status of ethylene vinyl acetate, a low cost polymer that is being investigated as an encapsulation material for terrestrial photovoltaic modules, are described.

Cuddihy, E. F.↗
NASA NTRS1982

Design, analysis and test verification of advanced encapsulation systems

An analytical methodology for advanced encapsulation designs was developed. From these methods design sensitivities are established for the development of photovoltaic module criteria and the definition of needed research tasks. Analytical models were developed to perform optical, thermal, electrical and analyses on candidate encapsulation systems. From these analyses several candidate systems were selected for qualification testing. Additionally, test specimens of various types are constructed and tested to determine the validity of the analysis methodology developed. Identified deficiencies and/or discrepancies between analytical models and relevant test data are corrected. Prediction capability of analytical models is improved. Encapsulation engineering generalities, principles, and design aids for photovoltaic module designers is generated.

Garcia, A., III↗
NASA NTRS1983

Investigation of test methods, material properties, and processes for solar cell encapsulants

A study of potentially useful low cost encapsulation materials for the Flat-Plate Solar Array project is discussed. The goal is to identify, evaluate, test and recommend encapsulant materials and processes for the production of cost-effective, long life solar cell modules. Technical investigations included studies of aging and degradation of candidate encapsulation materials, continued identification of primers for durable bonding of module interfaces, continued evaluation of soil resistant treatments for the sunlit surface of the module and testing of corrosion protective coatings for use low cost mild steel substrates.

Willis, P. B.↗
NASA NTRS1985

Role of GaAs surface clearing in plasma deposition of silicon nitride films for encapsulated annealing

The role of GaAs surface cleaning and plasma reactor cleaning prior to deposition of silicon nitride films for encapsulated annealing has been investigated. X-ray photoelectron spectroscopy was employed to determine the surface characteristics of GaAs treated with HCl, HF, and NH4OH solutions preceded by a degreasing procedure. The HCl clean left the least amount of oxygen on the surface. Fluorine contamination resulting from the CF4 plasma used to clean the reactor was found to be located at the film-substrate interface by Auger electron spectroscopy with argon-ion sputtering. A modified deposition procedure was developed to eliminate the fluorine contamination. Plasma deposition of silicon nitride encapsulating films was found to modify the I-V characteristics of Schottky diodes subsequently formed on GaAs surface. The reverse current of the diodes was slightly reduced. Substrates implanted with Si at 100 keV and a dose of 5 x 10 to the 12th/sq cm showed a peak electron concentration of 1.7 x 10 to the 17th/cu cm at a depth of 0.1-micron with 60 percent activation after encapsulation and annealing at 800 C for 7 min.

Valco, G. J.↗
NASA NTRS1985

Encapsulant selection and durability testing experience

The Flat Plate Solar Array Project (FSA) has established technically challenging cost and service life goals for photovoltaic modules. These goals are a cost of $70 sq m and an expected 30 years of service life in an outdoor weathering environment. out of the cost goal, $14 sq m is allocated for encapsulation materials, which includes the cost of a structural panel. At FSA's inception in 1975, the cumulative cost of encapsulation materials in popular use, such as room temperature vulcanized (RTV) silicones, aluminum panels, etc., greatly exceeded $14/sq m. Accordingly, it became necessary to identify and/or develop new materials and new material technologies to achieve the goals. Many of these new materials are low cost polymers that satisfy module engineering and encapsulation processing requirements but unfortunately are not intrinsically weather stable. This necessitates identifying lifetime and/or weathering deficiencies inherent in these low cost materials and developing specific approaches to enhancing weather stability.

Cuddihy, E. F.↗
NASA NTRS1985

Investigation of test methods, material properties, and processes for solar cell encapsulants

Progress in solar energy technology is reported in the following areas: aging and life prediction methodology and devices for solar cell encapsulation; the function of adhesion chemistry, primers, and a new diagnostic technique for estimations of bond durability; a study of fire retardant formulations for decreasing the potential flammability of solar modules; initial studies of the electrical insulating properties of encapsulation materials and measurement of the intrinsic dielectric strength; antisoiling compounds for the prevention of soil build-up on the outer surface of the module; and low temperature processing encapsulants that permit module fabrication at temperatures less than 100 C. Another area of study has been added to determine the degree to which formulation and processes affect the module quality and manufacturing yield.

Willis, P. B.↗
NASA NTRS1987

Wet Winding Improves Coil Encapsulation

Wet-winding process encapsulates electrical coils more uniformily than conventional processes. Process requires no vacuum pump and adapts easily to existing winding machines. Encapsulant applied to each layer of wire as soon as added to coil. Wet-winding process eliminates voids, giving more uniformly encapsulated coil.

Hill, A. J.↗
NASA NTRS1987

Liquid encapsulated crystal growth

Low-defect crystals are grown in a closed ampoule under a layer of encapsulant. After crystal growth, the crystal is separated from the melt and moved into the layer of encapsulant and cooled to a first temperature at which crystal growth stops. The crystal is then moved into the inert gas ambient in the ampoule and further cooled. The crystal can be separated from the melt by decanting the melt into and adjacent reservoir or by rotating the ampoule to rotate the crystal into the encapsulant layer.

Morrison, Andrew D.↗