Development of polymeric materials for potting and encapsulating electronic assemblies Status report
Potting and conformal coating material testing for protective electronic encapsulation
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Potting and conformal coating material testing for protective electronic encapsulation
Encapsulated contaminants effects on spacecraft sterilization requirements
Thermal stress analysis of epoxy encapsulants using mathematical model for predicting performance in thermal shock
Decontamination, cleaning, coating, and encapsulation procedures for electronic circuit boards of IMP spacecraft
Encapsulation of radioactive source materials for long period space flights
Rocket nozzle throat insert encapsulated in solid tungsten case
Development of inorganic nonflammable potting, encapsulating, and coating compounds for spacecraft
Encapsulating polyurethane foam reactions to specific environmental conditions
Describing metal valve pintle with encapsulated elastomeric body
Method of evaluating moisture barrier properties of materials used in electronics encapsulation
Space radiation environmental effects on reactively encapsulated zinc orthotitanates and paints
Development of materials for encapsulating electronic devices used in biotelemetry is discussed. Chemical resistance of materials to effects of animal fluids is described. Silicone rubber is recommended as basic material with polymers applied to outer surface for protective coating.
The effects of simulated micrometeoroid exposure on the performance of N/P silicon solar cells encapsulated for their protection in fluorinated ethylene propylene were determined in a shock tube. It was found that the short-circuit current decreased after exposure to the simulated micrometeoroid particles. The shape of the curve remained the same and was simply translated downward with a concomitant drop in open-circuit voltage.
The necessity of having nonflammable versions of potting and encapsulating compounds and conformal coatings for space vehicles is discussed. The formulation, EPOCAST 87517 A/B, was found to have the best balance of thermal, electrical, mechanical, physical, and chemical properties of those evaluated. The requirements which this formulation did not meet are listed, and other formulations which were evaluated are summarized. Recommendations for improving EPOCAST 87517 A/B are included.
The NASA-Lewis Research Center program of transferring the FEP-encapsulated solar cell technology developed for the space program to terrestrial applications is presented. The electrical power system design and the array mechanical design are described, and power systems being tested are discussed. The latter are located at NOAA-RAMOS weather stations at Sterling, Va., and Mammoth Mountain, Calif.; on the roof of the Lewis Research Center; on a NOAA-Coast Guard buoy in the Gulf of Mexico; in a U.S. Forest Service mountaintop voice repeater station in the Inyo National Forest, Calif., and in a backpack charger for portable transmitter/receivers being used in the same place. Preliminary results of testing are still incomplete, but show that rime ice can cause cracks in modular cells without damaging the FEP though, which keeps the grid lines intact, and that electrically active elements of the module must be completely sealed from salt water to prevent FEP delamination.
Electrostatic bonding has been used to join silicon solar cells to borosilicate glass without the aid of any organic binders or adhesives. The results of this investigation have been to demonstrate, without question, the feasibility of this process as an encapsulation technique. The potential of ESB for terrestrial solar arrays was clearly shown. The process is fast, reproducible, and produces a permanent bond between glass and silicon that is stronger than the silicon itself. Since this process is a glass sealing technique requiring no organics it makes moisture tight sealing of solar cells possible.
The technical and economic advantages of using air-supported plastic enclosures to protect flat plate photovoltaic arrays are described. Conceptual designs for a fixed, latitude-tilt array and a fully tracking array were defined. Detailed wind loads and strength analyses were performed for the fixed array. Detailed thermal and power output analyses provided array performance for typical seasonal and extreme temperature conditions. Costs of each design as used in a 200 MWe central power station were defined from manufacturing and material cost estimates. The capital cost and cost of energy for the enclosed fixed-tilt array were lower than for the enclosed tracking array. The enclosed fixed-tilt array capital investment was 38% less, and the levelized bus bar energy cost was 26% less than costs for a conventional, glass-encapsulated array design. The predicted energy cost for the enclosed fixed array was 79 mills/kW-h for direct current delivered to the power conditioning units.
The results of a study for Task 3 of the Low Cost Solar Array Project, directed toward the development of a cost effective encapsulation system for photovoltaic modules using silicon based materials, are reported. Results of the following are discussed: (1) weather-ometer stressing vs. weathering history of silicon and silicon modified materials; (2) humidity/temperature cycling exposure; (3) exposure at high humidity/high temperature; (4) outdoor exposure stress; (5) thermal cycling stress; and (6) UV screening agents. The plans for the next quarter are outlined.