High temperature materials study
High temperature operating electronic devices for vapor deposition reactor system
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High temperature operating electronic devices for vapor deposition reactor system
High purity dielectric materials tested in capacitors at high temperatures
High temperature stability and electrical properties of pyrolytic boron nitride capacitors
High-temperature seals on Space Shuttle Orbiter elevons will be improved by a new flexible seal design that increases the number of leak barriers, allows for thermal expansion and cuts weight by more than two-thirds. Improved seal may be useful in applications where it is necessary to seal gaps between moving surfaces.
High temperature processing of a small specimen without a container has been demonstrated in a set of experiments using an acoustic levitation furnace in the microgravity of space. This processing technique includes the positioning, heating, melting, cooling, and solidification of a material supported without physical contact with container or other surface. The specimen is supported in a potential energy well, created by an acoustic field, which is sufficiently strong to position the specimen in the microgravity environment of space. This containerless processing apparatus has been successfully tested on the Space Shuttle during the STS-61A mission. In that experiment, three samples wer successfully levitated and processed at temperatures from 600 to 1500 C. Experiment data and results are presented.
A high-temperature origin of life has been proposed, largely for the reason that the hyperthermophiles are claimed to be the last common ancestor of modern organisms. Even if they are the oldest extant organisms, which is in dispute, their existence can say nothing about the temperatures of the origin of life, the RNA world, and organisms preceding the hyperthermophiles. There is no geological evidence for the physical setting of the origin of life because there are no unmetamorphosed rocks from that period. Prebiotic chemistry points to a low-temperature origin because most biochemicals decompose rather rapidly at temperatures of 100 C (e.g., half-lives are 73 min for ribose, 21 days for cytosine, and 204 days for adenine). Hyperthermophiles may appear at the base of some phylogenetic trees because they outcompeted the mesophiles when they adapted to lower temperatures, possibly due to enhanced production of heat-shock proteins.
A high temperature anemometer includes a pair of substrates. One of the substrates has a plurality of electrodes on a facing surface, while the other of the substrates has a sensor cavity on a facing surface. A sensor is received in the sensor cavity, wherein the sensor has a plurality of bondpads, and wherein the bondpads contact the plurality of electrodes when the facing surfaces are mated with one another. The anemometer further includes a plurality of plug-in pins, wherein the substrate with the cavity has a plurality of trenches with each one receiving a plurality of plug-in pins. The plurality of plug-in pins contact the plurality of electrodes when the substrates are mated with one another. The sensor cavity is at an end of one of the substrates such that the sensor partially extends from the substrate. The sensor and the substrates are preferably made of silicon carbide.
High temperature multilayer insulations have been investigated as an effective component of thermal-protection systems for atmospheric re-entry of reusable launch vehicles. Heat transfer in multilayer insulations consisting of thin, gold-coated, ceramic reflective foils and Saffil(TradeMark) fibrous insulation spacers was studied both numerically and experimentally. A finite volume numerical thermal model using combined conduction (gaseous and solid) and radiation in porous media was developed. A two-flux model with anisotropic scattering was used for radiation heat transfer in the fibrous insulation spacers between the reflective foils. The thermal model was validated by comparison with effective thermal conductivity measurements in an apparatus based on ASTM standard C201. Measurements were performed at environmental pressures in the range from 1x10(exp -4) to 760 torr over the temperature range from 300 to 1300 K. Four multilayer samples with nominal densities of 48 kg/cu m were tested. The first sample was 13.3 mm thick and had four evenly spaced reflective foils. The other three samples were 26.6 mm thick and utilized either one, two, or four reflective foils, located near the hot boundary with nominal foil spacing of 1.7 mm. The validated thermal model was then used to study relevant design parameters, such as reflective foil spacing and location in the stack-up and coating of one or both sides of foils.
A high temperature communications circuit includes a power conductor for concurrently conducting electrical energy for powering circuit components and transmitting a modulated data signal, and a demodulator for demodulating the data signal and generating a serial bit stream based on the data signal. The demodulator includes an absolute value amplifier for conditionally inverting or conditionally passing a signal applied to the absolute value amplifier. The absolute value amplifier utilizes no diodes to control the conditional inversion or passing of the signal applied to the absolute value amplifier.
A high temperature electronics program at NASA Lewis Research Center focuses on dielectric and insulating materials research, development and testing of high temperature power components, and integration of the developed components and devices into a demonstrable 200 C power system, such as inverter. An overview of the program and a description of the in-house high temperature facilities along with experimental data obtained on high temperature materials are presented.
Structural alloys used in high temperature applications exhibit complex thermomechanical behavior that is time dependent and hereditary. Recent attention is being focused on metal matrix composite materials for high temperature applications where they exhibit all the complexities of conventional alloys and their strong anisotropy adds further complexities. Here, a proven constitutive model for isotropic materials in which the inelastic strain rate and internal state are expressible as gradients of a dissipation potential is taken to depend on invariants that reflect local transverse isotropy. Applications illustrate the capability of the theory of representing the time dependent, hereditary, anisotropic behavior typical of these materials at high temperature.
High-cycle fatigue (HCF) behavior of a melt-infiltrated, pre-preg SiC/SiC ceramic matrix composite (CMC) was investigated using dogbone tensile specimens without and with simulated cooling holes at 1500 and 2400 °F. The CMC material used for this study was fabricated by GE Aviation and had a ply configuration of [0/90/0]3. HCF tests were conducted with an R-ratio of 0.6 and a cyclic frequency of 30 Hz. Runout in HCF was defined as 30 million cycles. Monotonic tensile tests were conducted at room temperature (RT) on as-received CMC specimens and on runout HCF specimens to determine residual tensile strengths. Digital image correlation (DIC) and acoustic emission (AE) techniques were used to monitor the initiation and progression of damage in RT tensile tests on specimens with and without holes. Microscopy was performed on the polished edge of specimens without cooling holes and on the polished face of specimens with cooling holes that were tested in HCF and achieved runout. Comparisons were made with baseline specimens. Fractography was performed to examine the fracture surfaces of samples that failed under different loading conditions.
Epitaxial heterojunctions formed between high temperature superconductors and metallic or semiconducting oxide barrier layers are provided. Metallic perovskites such as LaTiO3, CaVO3, and SrVO3 are grown on electron-type high temperature superconductors such as Nd(1.85)Ce(0.15)CuO(4-x). Alternatively, transition metal bronzes of the form A(x)MO(3) are epitaxially grown on electron-type high temperature superconductors. Also, semiconducting oxides of perovskite-related crystal structures such as WO3 are grown on either hole-type or electron-type high temperature superconductors.
A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.
Silicon Carbide Nanotubes (SiCNTs) have high mechanical strength and also have many potential functional applications. In this study, SiCNTs were investigated for use in strengthening high temperature silicate and oxide materials for high performance ceramic nanocomposites and environmental barrier coating bond coats. The high · temperature oxidation behavior of the nanotubes was of particular interest. The SiCNTs were synthesized by a direct reactive conversion process of multiwall carbon nanotubes and silicon at high temperature. Thermogravimetric analysis (TGA) was used to study the oxidation kinetics of SiCNTs at temperatures ranging from 800degC to1300degC. The specific oxidation mechanisms were also investigated.
High Temperature issues in aircraft engines Hot section: Ni and Co based Superalloys Oxidation and Corrosion (Durability) at high temperatures. Thermal protection system (TPS) and RCC (Reinforced Carbon-Carbon) on the Space Shuttle Orbiter. High temperatures in other worlds: Planets close to their stars.
Thermal conductivity of multilayer and mixed powder high temperature insulation systems over wide temperature range and vacuum conditions