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DOE OSTI2023

Radio frequency tuning using a multichip module electrical interconnect structure

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

Young, Barbara Diane↗

DOE OSTI2024

Communication engine for hybrid interconnect technologies

Systems, apparatuses, and methods for dynamically selecting between wired and wireless interconnects for sending packets are disclosed. A system includes at least a hybrid communication engine and a plurality of interconnects for connecting to various end-points. The communication engine dynamically discovers and utilizes the best interconnect technology available in between given end-points. The communication engine dynamically chooses the physical interconnect that is best suited at any given time to send data from one source to one or multiple destinations. This communication can be either on-chip or across nodes. The communication engine makes a decision based on a set of predetermined parameters that can be re-adjusted by the application layer, such as latency of the transmission, message data size, physical distance from source to destination, the energy cost, and the current congestion on the alternative interconnects.

Blagodurov, Sergey↗

DOE OSTI2011

Comparing Germany's and California's Interconnection Processes for PV Systems (White Paper)

Establishing interconnection to the grid is a recognized barrier to the deployment of distributed energy generation. This report compares interconnection processes for photovoltaic projects in California and Germany. This report summarizes the steps of the interconnection process for developers and utilities, the average length of time utilities take to process applications, and paperworkrequired of project developers. Based on a review of the available literature, this report finds that while the interconnection procedures and timelines are similar in California and Germany, differences in the legal and regulatory frameworks are substantial.

14 SOLAR ENERGY↗

DOE OSTI2010

The Relevance of Generation Interconnection Procedures to Feed-in Tariffs in the United States

Feed-in tariffs (FITs) have been used to promote renewable electricity development in over 40 countries throughout the past two decades. These policies generally provide guaranteed prices for the full system output from eligible generators for a fixed time period (typically 15–20 years). Due in part to the success of FIT policies in Europe, some jurisdictions in the United States are considering implementing similar policies, and a few have already put such policies in place. This report is intended to offer some guidance to policymakers and regulators on how generator interconnection procedures may affect the implementation of FITs and how state generator interconnection procedures can be formulated to support state renewable energy objectives. This report is based on a literature review of model interconnection procedures formulated by several organizations, as well as other documents that have reviewed, commented on, and in some cases, ranked state interconnection procedures.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗

DOE OSTI2024

Defining Safe and Efficient Interconnection Policies for Energy Storage and Solar + Storage to Improve Integration and Reduce Costs

Energy storage has a unique and pivotal role to play in the transition to a low-carbon economy because it can help the electric grid accommodate more renewable energy. However, a number of barriers currently impede the process of connecting energy storage systems to the distribution grid. The Toolkit and Guidance for the Interconnection of Energy Storage and Solar-Plus-Storage (the “BATRIES Toolkit”), which is the publication subject to this Final Technical / Scientific Report, provides vetted solutions to eight regulatory and technical barriers to the interconnection of standalone storage and solar-plus-storage systems (referred to as “energy storage”) to the distribution grid. These recommendations are based on over a year of research and analysis by utility and industry experts. The BATRIES Toolkit also includes model language that utilities and utility regulators can use to update state interconnection rules to reduce the costs and time to safely interconnect energy storage and solar-plus-storage systems. The solutions are nationally applicable and can be applied in diverse states and markets across the U.S.

14 SOLAR ENERGY↗

DOE OSTI2010

Relevance of Generation Interconnection Procedures to Feed-in Tariffs in the United States

Feed-in tariffs (FITs) have been used to promote renewable electricity development in over 40 countries throughout the past two decades. These policies generally provide guaranteed prices for the full system output from eligible generators for a fixed time period (typically 15-20 years). Due in part to the success of FIT policies in Europe, some jurisdictions in the United States are consideringimplementing similar policies, and a few have already put such policies in place. This report is intended to offer some guidance to policymakers and regulators on how generator interconnection procedures may affect the implementation of FITs and how state generator interconnection procedures can be formulated to support state renewable energy objectives. This report is based on a literaturereview of model interconnection procedures formulated by several organizations, as well as other documents that have reviewed, commented on, and in some cases, ranked state interconnection procedures.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2020

Evolution of Distributed Energy Resource Grid Interconnection Standards for Integrating Emerging Storage Technologies

Grid interconnection standards facilitate safe and reliable grid integration of distributed energy resources (DERs). Evolution of a standard for DERs is expected to capture and accommodate widely different characteristics of DER and minimize unique grid integration challenges. This makes development of a uniform grid interconnection standard for all types of DERs a challenging and an ever-evolving consideration. This paper presents a detailed timeline of evolution, from the early 2000s to 2018, of DER interconnection standards and the research that informed their development. This is followed by a review of the research topics being considered in the grid integration of Energy Storage Systems (ESSs) which are expected to have the most significant growth amongst all DER types. These help in highlighting the need for a new standard to accommodate the unique characteristics of ESSs, and where the existing DER interconnection standard frameworks may be leveraged.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2024

Evaluating Interconnection Queue Impacts Using Hosting Capacity Analysis

The interconnection queue has been identified as a bottleneck in the efforts to shift the nations generation resources towards renewable sources and meet various state and federal goals. Efforts such as the interconnection innovation e-Xchange (i2X) are therefore trying to come up with ways in which the queue could be altered to make interconnection faster, cheaper, and fairer. This paper proposes using hosting capacity analysis methods to simulate the evolution of a power system as new resources are added. Modeling the interconnection process in this way enables simulation based study of various policy decisions for queue management and cost allocation. Sample results are presented to illustrate how some queue modifications might play out both in distribution and transmission systems.

Distributed Energy Resources, Interconnection↗

DOE OSTI2019

Fit Fly: A Case Study of Interconnect Innovation through Parallel Simulation

To meet the demand for exascale-level performance from high-performance computing (HPC) interconnects, many system architects are turning to simulation results for accurate and reliable predictions of the performance of prospective technologies. Testing full-scale networks with a variety of benchmarking tools, including synthetic workloads and application traces, can give crucial insight into what ideas are most promising without needing to physically construct a test network. While flexible, however, this approach is extremely compute time intensive. We address this time complexity challenge through the use of large-scale, optimistic parallel simulation that ultimately leads to faster HPC network architecture innovations. In this paper we demonstrate this innovation capability through a real-world network design case study. Specifically, we have simulated and compared four extreme-scale interconnects: Dragonfly, Megafly, Slim Fly, and a new dual-rail-dual-plane variation of the Slim Fly network topology. We present this new variant of Slim Fly, dubbed Fit Fly, to show how interconnect innovation and evaluation-beyond what is possible through analytic methods-can be achieved through parallel simulation. We validate and compare the model with various network designs using the CODES interconnect simulation framework. By running large-scale simulations in a parallel environment, we are able to quickly generate reliable performance results that can help network designers break ground on the next generation of high-performance network designs.

High Performance Computing↗

DOE OSTI2016

U.S. Laws and Regulations for Renewable Energy Grid Interconnections

Rapidly declining costs of wind and solar energy technologies, increasing concerns about the environmental and climate change impacts of fossil fuels, and sustained investment in renewable energy projects all point to a not-so-distant future in which renewable energy plays a pivotal role in the electric power system of the 21st century. In light of public pressures and market factors that hasten the transition towards a low-carbon system, power system planners and regulators are preparing to integrate higher levels of variable renewable generation into the grid. Updating the regulations that govern generator interconnections and operations is crucial to ensure system reliability while creating an enabling environment for renewable energy development. This report presents a chronological review of energy laws and regulations concerning grid interconnection procedures in the United States, highlighting the consequences of policies for renewable energy interconnections. Where appropriate, this report places interconnection policies and their impacts on renewable energy within the broader context of power market reform.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗

DOE OSTI2018

Frequency Response Study of a U.S. Western Interconnection under Extra-High Photovoltaic Generation Penetrations: Preprint

Increasing penetration levels of solar photovoltaic (PV) and the reduced inertia of inverter-based generation technologies have caught the attention of the electric power industry and academia in the United States. This paper conducts a comprehensive frequency response study of the Western Interconnection under high penetration levels of PV, which are up to 80% at the interconnection level and 100% at the regional level. Based on the 2022 Light Spring case, PV has been projected by areas for four PV penetration levels based on collected realistic PV distribution information. The overall system frequency response has been analyzed under different scenarios. In particular, the 100% regional PV penetration case has been developed to reveal local frequency issues in the Western Interconnection. The potential of using existing resources to improve frequency response has also been studied. New insights in this paper address the implications of the rapid deployment of solar generation in the Western Interconnection.

14 SOLAR ENERGY↗

DOE OSTI2022

Use of Operating Agreements and Energy Storage to Reduce Photovoltaic Interconnection Costs: Conceptual Framework

This report explores one integrated technical and process concept designed to manage interconnection costs and streamline interconnection timelines to support near-term renewable energy deployment. We describe a new agreement between renewable energy developers and utilities, informed by the technical analysis. The agreement defines the operational parameters for a renewable energy system, with the goal of reducing risk and cost to all parties. This work provides a foundation upon which other states and utilities may build proof of concept. This report is supported by a technical analysis that is detailed in a companion report, "Use of Operating Agreements and Energy Storage to Reduce Photovoltaic Interconnection Costs: Technical and Economic Analysis" (McLaren et al. 2022).

14 SOLAR ENERGY↗

DOE OSTI2019

Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature

Abstract The interconnect half‐pitch size will reach ≈20 nm in the coming sub‐5 nm technology node. Meanwhile, the TaN/Ta (barrier/liner) bilayer stack has to be >4 nm to ensure acceptable liner and diffusion barrier properties. Since TaN/Ta occupy a significant portion of the interconnect cross‐section and they are much more resistive than Cu, the effective conductance of an ultrascaled interconnect will be compromised by the thick bilayer. Therefore, 2D layered materials have been explored as diffusion barrier alternatives. However, many of the proposed 2D barriers are prepared at too high temperatures to be compatible with the back‐end‐of‐line (BEOL) technology. In addition, as important as the diffusion barrier properties, the liner properties of 2D materials must be evaluated, which has not yet been pursued. Here, a 2D layered tantalum sulfide (TaS x ) with ≈1.5 nm thickness is developed to replace the conventional TaN/Ta bilayer. The TaS x ultrathin film is industry‐friendly, BEOL‐compatible, and can be directly prepared on dielectrics. The results show superior barrier/liner properties of TaS x compared to the TaN/Ta bilayer. This single‐stack material, serving as both a liner and a barrier, will enable continued scaling of interconnects beyond 5 nm node.

Lo, Chun‐Li↗

DOE OSTI2026

Regional inertia dynamics of U.S. interconnections: An event-based measurement approach

Power grid inertia plays a vital role in frequency stability following large disturbances, yet its distribution across the U.S. grid is highly uneven. While interconnection-wide inertia benchmarks are useful, they can mask regional variability driven by resource mix, network coupling, and geographic separation. This paper extends event-driven inertia estimation to the regional scale using field measurements from the Frequency Monitoring Network (FNET/GridEye). Starting from balancing authority and independent system operator footprints, candidate regions are refined using a composite coherency score that combines frequency-trajectory shape similarity, timing spread, and lead/lag behavior to ensure dynamic consistency. A filtered sliding difference method (FSDM) is then used to construct regional frequency trajectories, detect disturbance onset, and compute robust regional rate-of-change of frequency (RoCoF). Regional, local, and interconnection inertia are estimated by combining RoCoF with event power imbalance, and additional indicators (regional-to-system inertia ratio and inertial-support arrival time) quantify regional-to-interconnection coupling and relative regional contributions. The method is demonstrated on eleven regions across the Eastern Interconnection (EI) and the Western Electricity Coordinating Council (WECC), with the Electric Reliability Council of Texas (ERCOT) used for validation. In ERCOT, estimates compared against energy management system (EMS) values achieve a mean absolute percentage error of 17.94%. WECC exhibits consistently shorter inertial-support arrival times (0.15–0.3 s) than EI (0.7–1.1 s), highlighting contrasting coupling and disturbance-propagation behavior. Overall, the results reveal pronounced spatial heterogeneity in inertia and coupling, underscoring the value of regional monitoring for both operational decision-making and long-term system planning.

Disturbance events↗

DOE OSTI2013

Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects

The thermomechanical response of Sn-based solder interconnects with differently oriented grains was investigated by electron backscattered diffraction technique under thermal cycling and thermal shock testing in this study. The results showed that deformation and cracking of solder interconnects have a close relationship with the unique characteristics of grain orientation and boundaries in each solder interconnect, and deformation was frequently confined within the high-angle grain boundaries. The micro Vickers hardness testing results showed that the hardness varied significantly depending on the grain orientation and structure, and deformation twins can be induced around the indents by the indentation testing. - Highlights: • Thermomechanical response shows a close relationship with the grain structure. • Deformation was frequently confined within the high-angle grain boundaries. • Different grain orientations exhibit different hardness. • Deformation twins can be induced around the indents in SAC105 solder interconnects.

36 MATERIALS SCIENCE↗

DOE OSTI2014

Three-dimensional interconnected nickel phosphide networks with hollow microstructures and desulfurization performance

Graphical abstract: Three-dimensional interconnected nickel phosphide networks with hollow microstructures and desulfurization performance. - Highlights: • Three-dimensional Ni{sub 2}P has been prepared using foam nickel as a template. • The microstructures interconnected and formed sponge-like porous networks. • Three-dimensional Ni{sub 2}P shows superior hydrodesulfurization activity. - Abstract: Three-dimensional microstructured nickel phosphide (Ni{sub 2}P) was fabricated by the reaction between foam nickel (Ni) and phosphorus red. The as-prepared Ni{sub 2}P samples, as interconnected networks, maintained the original mesh structure of foamed nickel. The crystal structure and morphology of the as-synthesized Ni{sub 2}P were characterized by X-ray diffraction, scanning electron microscopy, automatic mercury porosimetry and X-ray photoelectron spectroscopy. The SEM study showed adjacent hollow branches were mutually interconnected to form sponge-like networks. The investigation on pore structure provided detailed information for the hollow microstructures. The growth mechanism for the three-dimensionally structured Ni{sub 2}P was postulated and discussed in detail. To investigate its catalytic properties, SiO{sub 2} supported three-dimensional Ni{sub 2}P was prepared successfully and evaluated for the hydrodesulfurization (HDS) of dibenzothiophene (DBT). DBT molecules were mostly hydrogenated and then desulfurized by Ni{sub 2}P/SiO{sub 2}.

36 MATERIALS SCIENCE↗

DOE OSTI2018

The dye-sensitized solar cells based on the interconnected ternary cobalt diindium sulfide nanosheet array counter electrode

Highlights: • The ternary CoIn{sub 2}S{sub 4} CE was fabricated by in situ solvothermal synthesis. • The CoIn{sub 2}S{sub 4} CE displays an interconnected nanosheet array structure. • The solvent and In{sub 2.77}S{sub 4} intermediate play key roles on the formation of CoIn{sub 2}S{sub 4}. • DSSC based on the CoIn{sub 2}S{sub 4} CE gives an efficiency of 8.83%. - Abstract: The ternary cobalt diindium sulfide (CoIn{sub 2}S{sub 4}) counter electrode (CE) with interconnected nanosheet array structure is fabricated on the fluorine-doped tin oxide (FTO) substrate by in situ ethanol solvothermal synthesis. The ethanol solvent and In{sub 2.77}S{sub 4} intermediate play important roles on the formation of the interconnected nanosheet array structure. The dye-sensitized solar cell (DSSC) with the optimized ternary CoIn{sub 2}S{sub 4} CE gives an energy conversion efficiency of 8.83%, which is much higher than that of DSSCs based on the binary CoS{sub 2} (6.47%), and In{sub 2.77}S{sub 4} (0.46%) CEs and can be comparable with that of Pt CE (8.19%) under full sunlight illumination (100 mW cm{sup −2}, AM 1.5 G). Except for the intrinsically electrocatalytic activity from the CoIn{sub 2}S{sub 4}, the higher conversion efficiency of CoIn{sub 2}S{sub 4} based DSSC can be attributed to that the interconnected nanosheet array structure provides plentiful catalytic active sites, abundant electron transport channels, and fast electrolyte diffusion.

14 SOLAR ENERGY↗

DOE OSTI2010

Application Of Ti-Based Self-Formation Barrier Layers To Cu Dual-Damascene Interconnects

Cu interconnects have been used extensively in ULSI devices. However, large resistance-capacitance delay and poor device reliability have been critical issues as the device feature size has reduced to nanometer scale. In order to achieve low resistance and high reliability of Cu interconnects, we have applied a thin Ti-based self-formed barrier (SFB) using Cu(Ti) alloy seed to 45nm-node dual damascene interconnects and evaluated its performance. The line resistance and via resistance decreased significantly, compared with those of conventional Ta/TaN barriers. The stress migration performance was also drastically improved using the SFB process. A performance of time dependent dielectric breakdown revealed superior endurance. These results suggest that the Ti-based SFB process is one of the most promising candidates for advanced Cu interconnects. TEM and X-ray photoelectron spectroscopy observations for characterization of the Ti-based SFB structure were also performed. The Ti-based SFB consisted of mainly amorphous Ti oxides. Amorphous or crystalline Ti compounds such as TiC, TiN, and TiSi formed beneath Cu alloy films, and the formation varied with dielectric.

36 MATERIALS SCIENCE↗