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Decreasing LCOE with predictive soiling loss models (using site data to predict annualized energy loss), quantification of different soiling mechanisms (using AFM-based characterization), and developing standards for PV module coatings.
Delamination of encapsulant materials from PV cell surfaces often appears to originate at regions with metallization. Using a fracture mechanics based metrology, the adhesion of EVA encapsulant to screen printed silver metallization was evaluated. At room temperature, the fracture energy, Gc [J/m2], of the EVA/silver interface (952 J/m2) was ~70% lower than that of the EVA/AR coating (>2900 J/m2) and ~60% lower than that of the EVA to the surface of cell (2265 J/m2). After only 300 hours of damp heat aging, the adhesion energy of the silver interface dropped to and plateaued at ~50-60 J/m2, while that of the EVA/AR coating and EVA/cell remained mostly unchanged. Elemental surface analysis showed that the EVA separates from the silver in a purely adhesive manner, indicating that bonds at the interface were likely displaced in the presence of humidity and elevated temperature, and may explain the propensity for delamination to occur at metallized surfaces in the field.
Abstract not provided.
Various common crystalline silicon cell technologies were exposed to UVA radiation (1.24 Wm-2 nm-1 at 340 nm peak) on the front and back faces at 45 degrees Celsius for periods up to 3000 h, representing about 3 y of solar exposure in Phoenix, Arizona, USA. The resulting degradation of the open-circuit voltage and short-circuit current is presented. Of the various cell types examined, significant levels of degradation were seen in all cases. Less degradation was generally found after UV irradiation of cell fronts and older cell types, whereas a bifacial PERC type exposed on the rear showed about 25% degradation in short circuit current, attributable to lack of a diffused surface field. Selected cells were exposed to UV irradiation with the addition of long pass UV filters to replicate UV-absorbers in encapsulants. Modern cell designs are sensitive to UV-ID because of reduced or eliminated front and back surface field and increased dependence on high quality surface passivation. Single transformation of the independent variable (t, kW h/m^2) could be used to achieve a linear model of the data to extrapolate to 50 y. Solar Advisor Model (SAM) shows appropriate filtering of UV-irradiation can improve LCOE and net present value of plant. Some advanced cell types are seen to be UV-resistant (cell level solutions also exist). Solutions therefore exist on the cell, glass, and encapsulant level. Changes over time in each of these would also need to be considered (solarization, encapsulant browning...).
This paper presents a preliminary reliability analysis of field-aged glass/glass (G/G) PV modules. Several characterization tests were performed on more than 60 modules with two different encapsulant types (EVA and ionomer) exposed in hot-dry Arizona (AZ) climate over 10-35 years. The common degradation mode observed in both encapsulant types was the delamination of encapsulant along with encapsulant browning (EVA only), glass cracking (EVA only), and metallic corrosion over junction box area (ionomer only). The EVA encapsulated G/G modules showed the higher median power degradation rate at 0.91-1.99%/yr whereas modules with ionomer showed the lower at 0.21%/yr.
Abstract The cost of photovoltaic (PV) modules has declined by 85% since 2010. To achieve this reduction, manufacturers altered module designs and bill of materials; changes that could affect module durability and reliability. To determine if these changes have affected module durability, we measured the performance degradation of 834 fielded PV modules representing 13 module types from 7 manufacturers in 3 climates over 5 years. Degradation rates ( Rd ) are highly nonlinear over time, and seasonal variations are present in some module types. Mean and median degradation rate values of −0.62%/year and −0.58%/year, respectively, are consistent with rates measured for older modules. Of the 23 systems studied, 6 have degradation rates that will exceed the warranty limits in the future, whereas 13 systems demonstrate the potential of achieving lifetimes beyond 30 years, assuming Rd trends have stabilized.
Terrestrial ultraviolet radiation (UV) radiation is a primary factor contributing to the degradation of photovoltaic (PV) modules' efficiency and reliability over time. Therefore, accurate knowledge of terrestrial UV incident on the surface of the PV materials is essential to understand the degradation of PV modules and provide reliable assessment of their service life. As PV is deployed in various climate zones, it is crucial that terrestrial UV information is available at various locations. However, the availability of terrestrial UV data - measured or modeled - is extremely limited. On the other hand, total solar irradiance (TS) datasets are relatively abundant. In this study, the National Renewable Energy Laboratory, its industry partners, and ASTM's International Subcommittee on Radiometry and Service Life Prediction are developing a simple method to estimate the clear-sky terrestrial UV irradiance (280-400 nm, 295-400 nm, 285-385 nm, or 295-385 nm) from total irradiance data (280-4000 nm). The goal is to provide reliable estimates of the UV received by samples as a function of location, orientation, tilt, and airmass, thus encompassing a variety of conditions. Here, the Simple Model of the Atmospheric Radiative Transfer of Sunshine (SMARTS) model is used to estimate the UV:TS ratio under various scenarios, and examines the influences of atmospheric constituents, such as aerosols, precipitable water vapor or ozone, and of the local surface characteristics (albedo), on the predicted UV.
Photovoltaic modules are designed to operate for decades in terrestrial environments. However, mechanical stress, moisture, and ultraviolet radiation eventually degrade protective materials in modules, particularly their adhesion properties, eventually leading to reduced solar cell performance. Despite the significance of interfacial adhesion to module durability, currently there is no reliable technique for characterizing module adhesion properties. We present a simple and reproducible metrology for characterizing adhesion in photovoltaic modules that is grounded in fundamental concepts of beam and fracture mechanics. Using width-tapered cantilever beam fracture specimens, interfacial adhesion was evaluated on relevant interfaces of encapsulation and backsheet structures of new and 27-year-old historic modules. The adhesion energy, Gc [J/m 2 ], was calculated from the critical value of the strain energy release rate, G, using G = βP 2 , where β (a mechanical and geometric parameter of the fracture specimen) and P (the experimentally measured critical load) are constants. Under some circumstances where testing may result in cracking of brittle layers in the test specimen, measurement of the delamination length in addition to the critical load was necessary to determine G. Relative to new module materials, backsheet adhesion was 95% and 98% lower for historic modules that were exposed (operated in the field) and unexposed (stored on-site, but out of direct sunlight), respectively. Encapsulation adhesion was 87-94% lower in the exposed modules and 31% lower in the unexposed module. As a result, the metrology presented here can be used to improve module materials and assess long-term reliability.
Insulated gate bipolar transistor (IGBT) power modules are devices commonly used for switching of high voltages and currents. Usage and environmental conditions can cause these power modules to degrade over time, and this gradual process may eventually lead to catastrophic failure of the device. This degradation process may cause some early performance symptoms related to the state of health of the power module, making it possible to detect reliability degradation of the IGBT module. Testing can be used to accelerate this process, permitting a rapid determination of whether specific declines in device reliability can be characterized. In this study, thermal cycling was conducted on multiple power modules simultaneously in order to assess the effect of thermal cycling on the degradation of the power module. In-situ monitoring of temperature was performed from inside each power module using high temperature thermocouples. Device imaging and characterization was performed along with temperature data analysis, to assess failure modes and mechanisms within the power modules. While the experiment was aimed to assess the potential damage effects of thermal cycling on die attach, results indicated that wirebond degradation was the life limiting failure mechanism.
Hybrid tandem photovoltaic (PV) technology development has gained momentum in the last few years. This has been motivated by a need to push module efficiencies beyond what is theoretically capable with single-junction technologies to further accelerate total global PV deployment. Significant advances have been made with multiple material systems achieving tandem efficiencies over 30% in the last decade. All of the highest record efficiencies have been from laboratory-scale devices, with areas of 1 cm2 or less. Interestingly, there are multiple material combinations and terminal configurations that have demonstrated promising results. Despite these high laboratory efficiencies, reasonable service lifetimes (a useful operating lifetime of at least 25 years) are needed for tandems to compete with the levelized cost of energy (LCOE) of traditional single junction PV technologies. Existing commercial Si PV products have demonstrated performance in the field with an average of less than 1% relative annual degradation in module and system performance, and many manufacturers now provide 30 year warranties on their products.
Potential induced degradation (PID) is a significant reliability issue for photovoltaic modules in the field. Conventionally, to detect the PID-affected modules, all the modules in a string are individually disconnected and measured using I-V (current–voltage) tracers. It is extremely time-consuming, expensive and unsafe (if the module connectors are field aged) approach. In our approach, we aim detecting the PID-affected modules quickly, inexpensively and safely without disconnecting individual modules in the string. In this study, contactless electrostatic voltmeter’s (ESV) strength was explored to detect the PID-affected cadmium telluride (CdTe) modules in a string. These contactless measurements on high-voltage PV strings could make this technique unique and preferable to detect PID-affected modules in a string compared to the I-V curve method. In this work, a CdTe module was stressed for PID using the Aluminum (Al) foil method in a walk-in environmental chamber, which resulted in a reduction of module's peak current (I max ), peak voltage (Vmax), and fill factor (FF), and hence power (Pmax). Outdoor light I-V, EL, and ESV measurements were performed pre- and post-PID to determine the effectiveness of the non-contact ESV technique. Further, the ESV technique successfully detected the change in V max , and hence Pmax, compared to the pre-and post-PID conditions. A difference of less than 2% was observed in the results of the non-contact and non-interruptive method compared to the conventionally used interruptive voltmeter or I-V tracer method. This technique and the test results demonstrate a significant promise to identify poor-performing modules in PV string without disconnection of individual modules in the string.
The Durable Module Materials Consortium (DuraMAT) launched in November 2016 with five years of funding from the U.S. Department of Energy s (DOE's) Solar Energy Technologies Office (SETO). The program renewed in 2022 for an additional 6 years. DuraMAT is a multi-lab consortium led by the National Renewable Energy Laboratory, with Sandia National Laboratories (Sandia) and Lawrence Berkeley National Laboratory (LBNL) as core research labs. DuraMAT's overarching goal is to accelerate a sustainable, just, and equitable transition to zero-carbon electricity generation by 2035. 2023 has been a wild ride in the solar industry. Photovoltaic (PV) manufacturing is coming back to the United States, and deployment is booming again. DuraMAT has a unique opportunity to support flourishing manufacturing and deployment over the next couple of years.
This paper presents the result of high-temperature durability and thermal cycling testing and analysis for the selected diodes to study the detail of the thermal design and relative long-term reliability of the bypass diodes used to limit the detrimental effects of module hot-spot susceptibility.
In recent years, photovoltaic (PV) encapsulant films marketed as polyolefins (POs), more specifically as PO elastomers (POEs) and thermoplastic POs (TPOs), have gained significant market share and are projected to become the dominant encapsulation films by 2030. Relative to other industries, there are significant misconceptions about the term PO in the PV industry. Both in the scientific literature as well as in sales and advertising, the terms PO, POE, and TPO are often misused to describe the same type of material with comparable properties, while in reality these may each consist of separate material classes. This paper provides a comprehensive literature and market review, to showcase a broad range of PO and other ethylene copolymer encapsulants from recent studies, and discusses the materials' properties to clarify what constitutes a “polyolefin.” In addition, to promote a clearer comparison of encapsulant properties, we propose a two‐dimensional taxonomy to categorize polymers used in module manufacturing, including POs. In terms of improving the reliability of solar PV modules, PO‐based encapsulants have several advantages (including lower water uptake and ion diffusion), but might come with disadvantages too, such as a more complex processing and a higher sensitivity to the storage conditions and shelf life. All this might prospectively impact adhesion properties of the encapsulant to other materials' interfaces (glass, cells etc.) and end‐product quality. Because the track record of field‐deployed PV modules containing PO encapsulants is also limited, we hope to contribute to better material understanding and precision in communication in PV to secure quality.
Photovoltaic module quality has remained high even as module prices have declined.
Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.
Studies of metallization corrosion m photovoltaics have mainly been limited to comparisons of modules placed in accelerated chambers to fielded modules [1]. Damp Heat accelerated tests and phenomenological equations [2] are used to assess metallization corrosion without understanding the effect of UV light and temperature and humidity cycles on encapsulant adhesion degradation. The roles of encapsulant in-and out-diffusions of moisture and encapsulant impurities are important. Furthermore, few photovoltaic metallization corrosion studies included the role of bias and leakage currents, which are crucial in the electrochemical reaction of metallization. Leakage currents can highly accelerate the corrosion mechanism and are important to include in the studies of corrosion. In our research plan, we will address the following gaps in the PV community's understanding of metallization corrosion: (1) metallization corrosion with bias, humidity, and impurities in the encapsulant or metallization; (2) humidity diffusion through fresh and degraded encapsulants; and (3) comparison of model predictions with outdoor field modules and SunPower's extensive data for its back-contact and front-contact fleets [2] along with NREL's store of >20 year old modules. Our goal is to build models and accelerated tests to predict long term degradation of metallization corrosion of photovoltaic modules in the field. Our studies will include metals used in c-Si solar cells (Cu, Ag, and Al) and commonly used encapsulants (EV A (ethylene vinyl acetate), TPO (thermoplastic olefin), and silicone).
Two generations of multiwire modules were studied under dynamic mechanical loading (DML). The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the state-of-the-art module did not demonstrate degradation under DML. The degradation in the earlier module was attributed to damage at the solder-gridline interfaces. Atomic force microscopy scratch testing estimated the wear resistance of each solder alloy to assess susceptibility to degradation. Bi-based alloys appear to be more wear resistant than In-based alloys, consistent with the DML results. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.