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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
DOE OSTI2019

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC) - Cu base plate - Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power and through analytical optimization of geometries, either microchannels, pin fins and jets can be designed to yield a heat transfer coefficients of up to 65000 W m -2 K -1 , which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2018

Wide Band-Gap Semiconductor Based Power Electronics for Energy Efficiency

Recent advances in wide band-gap (WBG) semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN) are enabling a new generation of power semiconductor devices that far exceed the performance of silicon-based devices. Past ARPA-E programs (ADEPT, Solar ADEPT, and SWITCHES) have enabled innovations throughout the power electronics value chain, especially in the area of WBG semiconductors. The two recently launched programs by ARPA-E (CIRCUITS and PNDIODES) continue to investigate the use of WBG semiconductors in power electronics. From materials and devices to modules and circuits to application-ready systems integration, ARPA-E projects have demonstrated the potential of WBG semiconductors to lower the cost of high-efficiency power electronics to enable broad adoption in energy applications.

25 ENERGY STORAGE↗
DOE OSTI2018

Mitigation of Hot-Spots in Photovoltaic Systems Using Distributed Power Electronics

In the presence of partial shading and other mismatch factors, bypass diodes may not offer complete elimination of excessive power dissipation due to cell reverse biasing, commonly referred to as hot-spotting in photovoltaic (PV) systems. As a result, PV systems may experience higher failure rates and accelerated ageing. In this paper, a cell-level simulation model is used to assess occurrence of hot-spotting events in a representative residential rooftop system scenario featuring a moderate shading environment. The approach is further used to examine how well distributed power electronics converters mitigate the effects of partial shading and other sources of mismatch by preventing activation of bypass diodes and thereby reducing the chances of heavy power dissipation and hot-spotting in mismatched cells. The simulation results confirm that the occurrence of heavy power dissipation is reduced in all distributed power electronics architectures, and that submodule-level converters offer nearly 100% mitigation of hot-spotting. In addition, the paper further elaborates on the possibility of hot-spot-induced permanent damage, predicting a lifetime energy loss above 15%. In conclusion, this energy loss is fully recoverable with submodule-level power converters that mitigate hot-spotting and prevent the damage.

14 SOLAR ENERGY↗
DOE OSTI2023

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. The performance (e.g., thermal resistance, pumping power) of the power electronics cooling technologies developed in this project are compared to the performance of current, on-road technology. One of the main challenges to achieving high power densities is associated with packaging high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors).

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2017

A Disruptive Approach to Electric Vehicle Power Electronics Final Report

This project developed and demonstrated a new power electronics technology for electric vehicle drivetrains, that achieved significant improvements in power density and efficiency over standard drive cycles, relative to the commercial state of the art. In particular, the prototype measured loss and efficiency curves demonstrated a reduction in total loss over the US EPA US06 drive cycle by a factor of four. Similar reductions are observed for urban (UDDS) and highway (HWFET) drive cycles. Further, the project demonstrated a significant reduction in the total film capacitor requirements, by over an order of magnitude; this was achieved through fundamental improvements in converter circuit topologies. These nonincremental technology advances can lead to significant improvements in temperature rise, reliability, cost, and cooling system size and weight. These results were achieved through a new proposed composite converter architecture, and were demonstrated in a boost-type system similar to that employed by Toyota, Ford, and Honda. A 30 kW silicon prototype achieved a US06 average efficiency of 97.5%, which represents a reduction in average loss by a factor of approximately four relative to the 92.5% average efficiency of the commercial state of the art. A silicon carbide prototype achieved similar efficiency, while also achieving power densities of 23 kW/L (volumetric) and 20 kW/kg (gravimetric) in a boost dc-dc system including magnetics and film capacitors. This was achieved with a SiC switching frequency of 240 kHz, which allowed employment of planar magnetics. These power densities are roughly four times better than the commercial state of the art, and significantly exceed the DOE APEEM 2020 goals. In addition to the composite boost system, a SiC inverter was demonstrated at the 800 V 30 kW level. This inverter was demonstrated driving a permanent magnet machine over the US 06 drive cycle. The replacement of 1200 V Si IGBTs with 1200 V SiC MOSFETs led to improvement of CAFE average efficiency from 98.7% to 99.5%, which corresponds to a reduction of average loss by a factor of approximately two. The modular nature of the composite converter architecture opens the possibility of reuse of one or more converter modules during charging operations, providing a path for onboard charging capability at significant power levels while significantly reducing the volume and weight of the added charger module. This project demonstrated an integrated Level II charger whose add-on specific weight was approximately four times better than the DOE PHEV charger 2022 targets.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2021

A Review of Current Research Trends in Power-Electronic Innovations in Cyber–Physical Systems

Here, in this article, a broad overview of the current research trends in power-electronic innovations in cyber–physical systems (CPSs) is presented. The recent advances in semiconductor device technologies, control architectures, and communication methodologies have enabled researchers to develop integrated smart CPSs that can cater to the emerging requirements of smart grids, renewable energy, electric vehicles, trains, ships, the Internet of Things (IoT), and so on. The topics presented in this article include novel power-distribution architectures, protection techniques considering large renewable integration in smart grids, wireless charging in electric vehicles, simultaneous power and information transmission, multihop network-based coordination, power technologies for renewable energy and smart transformer, CPS reliability, transactive smart railway grid, and real-time simulation of shipboard power systems. It is anticipated that the research trends presented in this article will provide a timely and useful overview to the power-electronics researchers with broad applications in CPSs.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2018

A Comprehensive Review toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices

This paper discusses various types of failure mechanisms, precursor parameters, and accelerated aging- based procedures to estimate the remaining life of power electronic devices. Special attention has been given to summarize the different techniques typically used for measuring the junction temperature, because it plays a vital role during accelerated aging and condition monitoring. We reviewed more than 250 papers, and the references list 139 of them in order to explain and address the advantages and disadvantages of various techniques towards the reliability prognosis. Thus, this paper can be considered as an expedient reference to conduct future research on lifetime prediction of existing power electronic devices.

42 ENGINEERING↗
DOE OSTI2022

Bonded Interfaces for High-Temperature Power Electronics

Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 degrees C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Furthermore, thermomechanical modeling plays a key role in understanding the degradation behavior of bonded interface materials and for design optimization of power electronics packages.

ADVANCED PROPULSION SYSTEMS,DIRECT ENERGY CONVERSI↗
DOE OSTI2015

Onset of chaos in a single-phase power electronic inverter

Supported by experiments on a power electronic DC/AC converter, this paper considers an unusual transition from the domain of stable periodic dynamics (corresponding to the desired mode of operation) to chaotic dynamics. The behavior of the converter is studied by means of a 1D stroboscopic map derived from a non-autonomous ordinary differential equation with discontinuous right-hand side. By construction, this stroboscopic map has a high number of border points. It is shown that the onset of chaos occurs stepwise, via irregular cascades of different border collisions, some of which lead to bifurcations while others do not.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2021

Modeling and Simulation of Power-Electronic Inverters in Analog Electronic Circuit Simulators

This paper demonstrates how equivalent-circuit representations of grid-following power-electronic inverters can be realized within a SPICE-based development environment using common circuit components and VerilogA code. This facilitates computationally lean simulations of inverter networks leveraging the strengths of SPICE in large-scale simulations. We validate the approach with time-domain simulations for a modified version of the IEEE standard 118-bus system modeled in Virtuoso (a SPICE-based solver). Simulation results are compared-focusing on accuracy and computation speed-with results from a commonly used power-electronics simulation package. We note a significant decrease in simulation time with comparable signal resolution when simulating the network in SPICE.

Billmeyer, Ryan↗
DOE OSTI2016

Power Electronics Thermal Management R&D: Annual Report

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Device- and system-level thermal analyses are conducted to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2017

Power Electronics Thermal Management Research: Annual Progress Report

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Reliable WBG devices are capable of operating at elevated temperatures (≥ 175 °Celsius). However, packaging WBG devices within an automotive inverter and operating them at higher junction temperatures will expose other system components (e.g., capacitors and electrical boards) to temperatures that may exceed their safe operating limits. This creates challenges for thermal management and reliability. In this project, system-level thermal analyses are conducted to determine the effect of elevated device temperatures on inverter components. Thermal modeling work is then conducted to evaluate various thermal management strategies that will enable the use of highly efficient WBG devices with automotive power electronic systems.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2024

Directly Fused Porphyrin‐Tetracyanopentacenequinone Conjugates: Role of the Cross‐Conjugated, Powerful Electron Acceptor in Promoting Highly Efficient Charge Separation

Tetracyanopentacenequinone, a powerful electron acceptor, is fused directly to the porphyrin π-system to create a new class of donor-acceptor conjugates. Owing to the direct fusion and electron-deficient property of tetracyanopentacenequinone, strong intramolecular charge transfer both in the ground and excited states was witnessed. As a control, porphyrin fused with pentacenequinone was also investigated. Upon complete spectral and electrochemical characterization, the excited state properties were initially probed by time-dependent DFT studies, and the occurrence of electron transfer from different excited states was established. Free-energy calculations revealed higher exothermic electron transfer (>600 mV) than the control pentacenequinone-porphyrin systems. Pump-probe studies covering broad spatial and temporal regions revealed efficient excited state charge separation. This was unlike the control pentacenequinone-porphyrin system, where slow charge separation was witnessed only in the case of the zinc derivatives but not the free-base ones, followed by the populating of the triplet excited state. The lifetimes of the charge-separated states ranged between 30–500 ps depending on the solvent and metal ion in the porphyrin cavity. Nanosecond transient absorption studies established the charge recombination path to populate the triplet state of porphyrin or directly to the ground state as a function of solvent polarity and the nature of the conjugate. Furthermore, the significance of cross-conjugated tetracyanopentacenequinone fused directly to the porphyrin π system in promoting highly exothermic and efficient charge separation, irrespective of its cross conjugation, is borne out from this study.

Cross conjugation↗
DOE OSTI2020

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200°C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.

47 OTHER INSTRUMENTATION↗
DOE OSTI2019

Power Electronics Materials and Bonded Interfaces - Reliability and LIfetime

The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200 degrees C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2024

Online Dynamic Cyber-Attack Diagnosis in Power Electronics Systems Based on Few-Shot Learning

With increasing exposure to software-based sensing and control, power electronics systems are facing higher risks of cyber-physical attacks. To ensure system stability and minimize potential economic losses, it is critical to monitor the operating states and detect those attacks at the early stage. However, anomaly detection and diagnosis of attacks are still challenging, especially when labeled anomaly data is difficult or even infeasible to obtain. To overcome this problem, we propose a Few-Shot Learning (FSL) based approach for cyber-attack diagnosis leveraging the waveform data. To the best of our knowledge, this work is the first attempt at leveraging FSL for cyber-attack diagnosis in power electronics systems. Extensive experimental results demonstrate that our proposed approach can achieve comparable diagnosis accuracy with the state-of-the-art data-driven methods using less than 0.04% of the training samples.

Li, Qi↗
DOE OSTI2014

FY2014 Oak Ridge National Laboratory Annual Progress Report for the Power Electronics and Electric Motors Program

The US Department of Energy (DOE) announced in May 2011 a new cooperative research effort comprising DOE, the US Council for Automotive Research (composed of automakers Ford Motor Company, General Motors Company, and Chrysler Group), Tesla Motors, and representatives of the electric utility and petroleum industries. Known as U.S. DRIVE (Driving Research and Innovation for Vehicle efficiency and Energy sustainability), it represents DOE’s commitment to developing public–private partnerships to fund high-risk–high-reward research into advanced automotive technologies. The new partnership replaces and builds upon the partnership known as FreedomCAR (derived from “Freedom” and “Cooperative Automotive Research”) that ran from 2002 through 2010 and the Partnership for a New Generation of Vehicles initiative that ran from 1993 through 2001. Oak Ridge National Laboratory’s (ORNL’s) Advanced Power Electronics and Electric Motors (APEEM) subprogram within the DOE Vehicle Technologies Office (VTO) provides support and guidance for many cutting-edge automotive technologies now under development. Research is focused on developing revolutionary new power electronics (PE), electric motor, and traction drive system (TDS) technologies that will leapfrog current on-the-road technologies, leading to lower cost and better efficiency in transforming battery energy to useful work. The research and development (R&D) is also aimed at achieving a greater understanding of and improvements in the way the various new components of tomorrow’s automobiles will function as a unified system to improve fuel efficiency through research in more efficient TDSs.

33 ADVANCED PROPULSION SYSTEMS↗