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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1983

Viscoelastic study of an adhesively bonded joint

The plane strain problem of two dissimilar orthotropic plates bonded with an isotropic, linearly viscoelastic adhesive is considered. Both the shear and the normal stresses in the adhesive are calculated for various geometries and loading conditions. Transverse shear deformations of the adherends are taken into account, and their effect on the solution is shown in the results. All three inplane strains of the adhesive are included. Attention is given to the effect of temperature, both in the adhesive joint problem and to the heat generation in a viscoelastic material under cyclic loading. This separate study is included because heat generation and or spatially varying temperature are at present too difficult to account for in the analytical solution of the bonded joint, but whose effect can not be ignored in design.

Joseph, P. F.↗
NASA NTRS1983

Fatigue behavior of adhesively bonded joints

The fatigue damage mechanism of composite to composite adhesively bonded joints was characterized. The mechanics of the possible modes of fatigue damage propagation in these joints when subjected to constant amplitude cyclic mechanical loading were investigated. The possible failure modes in composite bonded joints may be cyclic debonding (i.e., progressive separation of the adhesive), interlaminar damage (delamination), adherend fatigue or a combination of these. Two composite systems - graphite/epoxy adhesively bonded to graphite/epoxy and Kevlar 49/epoxy adhesively bonded to Kevlar 49/epoxy were investigated. Both composite systems consisted of quasi-isotropic lay-ups, i.e., 0 deg/-45 deg/+45 deg/90 degs. The two adhesives, employed in the study were (1) EC 3445 with cure temperature of 250 F for secondary bonding and (2) FM 300 with cure temperature of 350 F for co-cure bonding.

Mall, S.↗
NASA NTRS1983

A fracture mechanics approach for designing adhesively bonded joints

An analytical and experimental investigation was undertaken to determine if the adhesive debond initiation stress could be predicted for arbitrary joint geometries. The analysis was based upon a threshold total strain-energy-release rate (Gth) concept. Two bonded systems were tested: T300/5208 graphite/epoxy adherends bonded with either EC-3445 or FM-300 adhesive. The Gth for each adhesive was determined from cracked-lap-shear (CLS) specimens by initiation tests. Finite-element analyses of various tapered CLS specimen geometries predicted the specimen stress at which the total strain-energy-release rate (GT) equaled Gth at the joint tip. Experiments verified the predictions. The approach described herein predicts the maximum stress at which an adhesive joint can be cycled yet not debond. Furthermore, total strain-energy-release rate appeared to be the driving parameter for cyclic debonding and debond initiation in structural adhesives. In addition, debond initiation and growth were found to occur with virtually no peel stress present.

Johnson, W. S.↗
NASA NTRS1982

Surface characterization and failure analysis of thermally aged, polyimide bonded titanium

This study of high temperature stable adhesive systems using 6Al-4V titanium adherends found that certain adhesive/adherends exhibit a change from cohesive to adhesive failure mode during long term 450 F thermal aging. Lap-shear specimens which exhibited adhesive failures were subjected to failure analysis using scanning transmission electron microscopy (STEM) and surface analysis techniques. Data is presented which supports the conclusion of interfacial failures for these samples.

Peters, P. D.↗
NASA NTRS1983

A critical study of the role of the surface oxide layer in titanium bonding

Scanning electron microscope/X-ray photoelectron spectroscopy (SEM/XPS) analysis of fractured adhesively bonded Ti 6-4 samples is discussed. The text adhesives incuded NR 056X polyimide, polypheylquinoxaline (PPQ), and LARC-13 polyimide. Differentiation between cohesive and interfacial failure was based on the absence of presence of a Ti 2p XPS photopeak. In addition, the surface oxide layer on Ti-(6A1-4V) adherends is characterized and bond strength and durability are addressed. Bond durability in various environmental conditions is discussed.

Dias, S.↗
NASA NTRS1983

Material characterization of structural adhesives in the lap shear mode

A general method for characterizing structural adhesives in the bonded lap shear mode is proposed. Two approaches in the form of semi-empirical and theoretical approaches are used. The semi-empirical approach includes Ludwik's and Zhurkov's equations to describe respectively, the failure stresses in the constant strain rate and constant stress loading modes with the inclusion of the temperature effects. The theoretical approach is used to describe adhesive shear stress-strain behavior with the use of viscoelastic or nonlinear elastic constitutive equations. Three different model adhesives are used in the simple lap shear mode with titanium adherends. These adhesives (one of which was developed at NASA Langley Research Center) are currently considered by NASA for possible aerospace applications. Use of different model adhesives helps in assessment of the generality of the method.

Schenck, S. C.↗
NASA NTRS1984

Processing study of a polyimidesulfone adhesive

An adhesive bonding process cycle study was performed for a polyimidesulfone (PISO2) recently developed as a promising structural adhesive. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are detailed. These include the tape preparation, the use of a primer, and press and simulated autoclave processing conditions. The polymer was characterized using Fourier Transform Infrared Spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The adhesive's strength determined by lap shear strength tests was used to evaluate the effects of the bonding process variations. Higher lap shear strengths were obtained at room temperature when a primer (PISO2) was used; however, the results were the same at 232 C (450 F) with or without a primer. The use of a vacuum (simulated autoclave cycle) during titanium bonding produced similar lap shear strengths to those specimens bonded without a vacuum.

Progar, D. J.↗
NASA NTRS1984

Repeatability of mixed-mode adhesive debonding

The repeatability of debond growth rates in adhesively bonded subjected to constant-amplitude cyclic loading was studied. Debond growth rates were compared from two sets of cracked-lap-shear specimens that were fabricated by two different manufacturers and tested in different laboratories. The fabrication method and testing procedures were identical for both sets of specimens. The specimens consisted of aluminum adherends bonded with FM-73 adhesive. Critical values of strain-energy-release rate were also determined from specimens that were monotonically loaded to failure. The test results showed that the debond growth rates for the two sets of specimens were within a scatter band which is similar to that observed in fatigue crack growth in metals. Cyclic debonding occurred at strain-energy-release rates that were more than an order of magnitude less than the critical strain-energy-release rate in static tests.

Everett, R. A., Jr.↗
NASA NTRS1984

Processing study of a high temperature adhesive

An adhesive-bonding process cycle study was performed for a polyimidesulphone. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are presented. These include the tape preparation, the use of a primer and press and simulated autoclave processing conditions. The polymer was characterized using Fourier transform infrared spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The lap shear strength of the adhesive was used to evaluate the effects of the bonding process variations.

Progar, D. J.↗
NASA NTRS1984

Strain measurement within a single-lap joint using embedded strain gages

An experimental method used to measure the in-plane normal-axial strains produced within a single-lap joint is described in which a resistance-foil strain gage is embedded within the joint prior to curing of the adhesive. Nominal dimensions of the titanium Ti-6-4 adherends were 0.13 x 2.5 x 12.7 cm and an overlap of 2.5 cm was used. The joint was bonded with FM-300 structural adhesive. The average ultimate shear strength of the gaged specimens and control specimens was 16.1 MPa and 14.1 MPa. A significant advantage of the proposed method is that strains internal to the joint are measured, rather than strains at an external edge. The presence of the gage was found to be not detrimental to bond performance.

Tuttle, M. E.↗
NASA NTRS1984

Deformations and strains in adhesive joints by moire interferometry

Displacement fields in a thick adherend lap joint and a cracked lap shear specimen were measured by high sensitivity moire interferometry. Contour maps of in-plane U and V displacements were obtained across adhesive and adherent surfaces. Loading sequences ranged from modest loads to near-failure loads. Quantitative results are given for displacements and certain strains in the adhesive and along the adhesive/adherend boundary lines. The results show nonlinear displacements and strains as a function of loads or stresses and they show viscoelastic or time-dependent response. Moire interferometry is an excellent method for experimental studies of adhesive joint performance. Subwavelength displacement resolution of a few micro-inches, and spatial resolution corresponding to 1600 fringes/inch (64 fringes/mm), were obtained in these studies. The whole-field contour maps offer insights not available from local measurements made by high sensitivity gages.

Post, D.↗
NASA NTRS1985

Adhesive evaluation of LARC-TPI and a water-soluble version of LARC-TPI

The results of a study to evaluate two Langley Research Center thermoplastic polimide (TPI) materials, identified as TPI/MTC for the material from Mitsui Toatsu Chemicals Inc. and TPI/H2O for the material from United Technologies Research Center, as high temperature thermoplastic adhesives and primers for bonding titanium (6AL-4V) adherends are discussed. A limited characterization of the materials was performed using a Diffuse Reflectance-Fourier Transform Infrared Spectroscopy (DR-FTIR) technique. Thermomechanical Analysis (TMA) and torsional braid techniques were used to determine glass transition temperature. The adhesive's strength, as determined by simple lap shear tests, as used to evaluate the effects of long term thermal exposure (up to 1000 hrs) at 204 deg C and a 72-hour water-boil.

Progar, D. J.↗
NASA NTRS1985

A cracked orthotropic sheet stiffened by a semi-infinite orthotropic sheet

The stress intensity factor is determined for a cracked orthotropic sheet adhesively bonded to an orthotropic stringer. Since the stringer is modeled as a semiinfinite sheet, the solution is most appropriate for a crack tip located near a stringer edge. Both adherends are treated as homogeneous, orthotropic media. It is assumed they are in plane stress and the adhesive is in pure shear. From Green's functions and the complex variable theory of orthotropic elasticity developed by Lekhnitskiy, a set of integral equations is obtained. The integral equations are replaced by an equivalent set of algebraic equations which is solved to obtain the shear stress distribution in the adhesive layer. With these stresses, equations for the stress intensity factors at both crack tips are found. A parametric study is conducted to determine the sensitivity of the system to material properties and specimen configuration. Unless the crack tip is very close to or under the stringer the stress intensity factor is approximately that of an unstiffened sheet. However, as the crack propagates beneath the stringer, the stress intensity factor decreases significantly. Increasing the stiffness of the stringer or the adhesive also results in a decrease in the stress intensity factor.

Bigelow, C. A.↗
NASA NTRS1984

Evaluation of high temperature structural adhesives for extended service

High temperature stable adhesive systems were evaluated for potential Supersonic Cruise Research (SCR) vehicle applications. The program was divided into two major phases: Phase I 'Adhesive Screening' evaluated eleven selected polyimide (PI) and polyphenylquinoxaline (PPQ) adhesive resins using eight different titanium (6Al-4V) adherend surface preparations; Phase II 'Adhesive Optimization and Characterization' extensively evaluated two adhesive systems, selected from Phase I studies, for chemical characterization and environmental durability. The adhesive systems which exhibited superior thermal and environmental bond properties were LARC-TPI polyimide and polyphenylquinoxaline both developed at NASA Langley. The latter adhesive system did develop bond failures at extended thermal aging due primarily to incompatibility between the surface preparation and the polymer. However, this study did demonstrate that suitable adhesive systems are available for extended supersonic cruise vehicle design applications.

Hendricks, C. L.↗
NASA NTRS1984

Fracture of composite-adhesive-composite systems

This program was undertaken to initiate the development of a test method for testing adhesive joints in metal-adhesive-composite systems. The uniform double cantilever beam (UDCB) and the width tapered beam (WTB) specimen geometries were evaluated for measuring Mode I fracture toughness in these systems. The WTB specimen is the preferred geometry in spite of the fact that it is more costly to machine than the UDCB specimen. The use of loading tabs attached to thin sheets of composites proved to be experimentally unsatisfactory. Consequently, a new system was developed to load thin sheets of adherends. This system allows for the direct measurement of displacement along the load line. In well made joints separation occurred between the plies rather than in the adhesive.

Ripling, E. J.↗
NASA NTRS1984

Rapid adhesive bonding concepts for specimen and panel fabrication and field repair

The NASA Langley Research Center has developed bonding concepts for aerospace composite materials which employ induction heating to directly apply heat to the bond line and/or adherends without simultaneously heating the entire structure, supports, and fixtures of a bonding assembly. These methods have demonstrated bonding process time reductions of two to three orders of magnitude, by comparison with conventional press molding. Attention is presently given to rapid adhesive bonding for lap shear specimens for aerospace panel bonding or field repair, as well as for the field repair requirements of metallic and advanced polymeric matrix composite structures.

Stein, B. A.↗
NASA NTRS1985

Factors Affecting the Processing of Epoxy Film Adhesives

The increasing awareness that adhesive performance is controlled not only by the condition of the adherend surface but also the condition or state of the adhesive and the process parameters used during fabrication is expected to result in improved reliability, as well as bond performance. The critical process variables which have been found to control adhesive bond formation and ultimate bond strength in 250F and 350F curing epoxy adhesives are described in terms of fabrication parameters and adhesive characteristics. These include the heat-up rate and cure temperature during processing and the adhesive moisture content and age condition (degree of advancement). The diagnostic methods used to delineate the effects of these process variables on adhesive performance are illustrated. These are dielectric, thermomechanical (TMA) and dynamic mechanical (DMA) analyses. Correlation of test results with measured mechanical tensile lap shear strengths of bonded joints is presented and the results briefly discussed in terms of the additives and hardeners used in the adhesive systems.

Pike, R. A.↗
NASA NTRS1985

Interaction of mixed mode loading on cyclic debonding in adhesively bonded composite joints

A combined experimental and analytical investigation of an adhesively-bonded composite joint was conducted to characterize the fracture mode dependence of cyclic debonding. The system studied consisted of graphite/epoxy adherends bonded with EC 3445 adhesive. Several types of specimens are tested which provide the cyclic debond growth rate measurements under various load conditions: mode 1, mixed mode 1 to 2, and mostly mode 2. This study shows that the total strain-energy-release rate is the governing factor for cyclic debonding.

Mall, S.↗