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At least 127 records · Page 7

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NASA NTRS1984

Evaluation of high temperature structural adhesives for extended service

High temperature stable adhesive systems were evaluated for potential Supersonic Cruise Research (SCR) vehicle applications. The program was divided into two major phases: Phase I 'Adhesive Screening' evaluated eleven selected polyimide (PI) and polyphenylquinoxaline (PPQ) adhesive resins using eight different titanium (6Al-4V) adherend surface preparations; Phase II 'Adhesive Optimization and Characterization' extensively evaluated two adhesive systems, selected from Phase I studies, for chemical characterization and environmental durability. The adhesive systems which exhibited superior thermal and environmental bond properties were LARC-TPI polyimide and polyphenylquinoxaline both developed at NASA Langley. The latter adhesive system did develop bond failures at extended thermal aging due primarily to incompatibility between the surface preparation and the polymer. However, this study did demonstrate that suitable adhesive systems are available for extended supersonic cruise vehicle design applications.

Hendricks, C. L.↗

NASA NTRS1984

Fracture of composite-adhesive-composite systems

This program was undertaken to initiate the development of a test method for testing adhesive joints in metal-adhesive-composite systems. The uniform double cantilever beam (UDCB) and the width tapered beam (WTB) specimen geometries were evaluated for measuring Mode I fracture toughness in these systems. The WTB specimen is the preferred geometry in spite of the fact that it is more costly to machine than the UDCB specimen. The use of loading tabs attached to thin sheets of composites proved to be experimentally unsatisfactory. Consequently, a new system was developed to load thin sheets of adherends. This system allows for the direct measurement of displacement along the load line. In well made joints separation occurred between the plies rather than in the adhesive.

Ripling, E. J.↗

NASA NTRS1984

Rapid adhesive bonding concepts for specimen and panel fabrication and field repair

The NASA Langley Research Center has developed bonding concepts for aerospace composite materials which employ induction heating to directly apply heat to the bond line and/or adherends without simultaneously heating the entire structure, supports, and fixtures of a bonding assembly. These methods have demonstrated bonding process time reductions of two to three orders of magnitude, by comparison with conventional press molding. Attention is presently given to rapid adhesive bonding for lap shear specimens for aerospace panel bonding or field repair, as well as for the field repair requirements of metallic and advanced polymeric matrix composite structures.

Stein, B. A.↗

NASA NTRS1985

Factors Affecting the Processing of Epoxy Film Adhesives

The increasing awareness that adhesive performance is controlled not only by the condition of the adherend surface but also the condition or state of the adhesive and the process parameters used during fabrication is expected to result in improved reliability, as well as bond performance. The critical process variables which have been found to control adhesive bond formation and ultimate bond strength in 250F and 350F curing epoxy adhesives are described in terms of fabrication parameters and adhesive characteristics. These include the heat-up rate and cure temperature during processing and the adhesive moisture content and age condition (degree of advancement). The diagnostic methods used to delineate the effects of these process variables on adhesive performance are illustrated. These are dielectric, thermomechanical (TMA) and dynamic mechanical (DMA) analyses. Correlation of test results with measured mechanical tensile lap shear strengths of bonded joints is presented and the results briefly discussed in terms of the additives and hardeners used in the adhesive systems.

Pike, R. A.↗

NASA NTRS1985

Interaction of mixed mode loading on cyclic debonding in adhesively bonded composite joints

A combined experimental and analytical investigation of an adhesively-bonded composite joint was conducted to characterize the fracture mode dependence of cyclic debonding. The system studied consisted of graphite/epoxy adherends bonded with EC 3445 adhesive. Several types of specimens are tested which provide the cyclic debond growth rate measurements under various load conditions: mode 1, mixed mode 1 to 2, and mostly mode 2. This study shows that the total strain-energy-release rate is the governing factor for cyclic debonding.

Mall, S.↗

NASA NTRS1985

Mixed-mode cyclic debonding of adhesively bonded composite joints

A combined experimental-analytical investigation to characterize the cyclic failure mechanism of a simple composite-to-composite bonded joint is conducted. The cracked lap shear (CLS) specimens of graphite/epoxy adherend bonded with EC-3445 adhesive are tested under combined mode 1 and 2 loading. In all specimens tested, fatigue failure occurs in the form of cyclic debonding. The cyclic debond growth rates are measured. The finite element analysis is employed to compute the mode 1, mode 2, and total strain energy release rates (i.e., GI, GII, and GT). A wide range of mixed-mode loading, i.e., GI/GII ranging from 0.03 to 0.38, is obtained. The total strain energy release rate, G sub T, appeared to be the driving parameter for cyclic debonding in the tested composite bonded system.

Rezaizadeh, M. A.↗

NASA NTRS1986

Criterion for mixed mode fracture in composite bonded joints

A study was undertaken to characterize the debond growth mechanism of adhesively bonded composite joints under mode I, mixed mode I-II, and mode II static loadings. The bonded system consisted of graphite-epoxy composite adherends bonded with a toughened epoxy adhesive. The mode I, mode II and mixed mode I-II fracture energies of the tested adhesives were found to be equal to each other. The criterion for mixed mode fracture in composite bonded joints was found.

Mall, S.↗

NASA NTRS1985

A fracture mechanics approach for designing adhesively bonded joints

An analytical and experimental investigation was undertaken to determine if the adhesive debond initiation stress could be predicted for arbitrary joint geometries. The analysis was based upon a threshold total strain-energy-release rate (Gth) concept. Two bonded systems were tested: T300/5208 graphite/epoxy adherends bonded with either EC-3445 or FM-300 adhesive. The Gth for each adhesive was determined from cracked-lap-shear (CLS) specimens by initiation tests. Finite-element analyses of various tapered CLS specimen geometries predicted the specimen stress at which the total strain-energy-release rate (GT) equaled Gth at the joint tip. Experiments verified the predictions. The approach described herein predicts the maximum stress at which an adhesive joint can be cycled yet not debond. Furthermore, total strain-energy-release rate appeared to be the driving parameter for cyclic debonding and debond initiation in structural adhesives. In addition, debond initiation and growth were found to occur with virtually no peel stress present.

Johnson, W. S.↗

NASA NTRS1985

Repeatability of mixed-mode adhesive debonding

The repeatability of debond growth rates in adhesively bonded subjected to constant-amplitude cyclic loading was studied. Debond growth rates were compared from two sets of cracked-lap-shear specimens that were fabricated by two different manufacturers and tested in different laboratories. The fabrication method and testing procedures were identical or both sets of specimens. The specimens consisted of aluminum adherends bonded with FM-73 adhesive. Critical values of strain-energy-release rate were also determined from specimens that were monotonically loaded to failure. The test results showed that the debond growth rates for the two sets of specimens were within a scatter band which is similar to that observed in fatigue crack growth in metals. Cyclic debonding occurred at strain-energy-release rates that were more than an order of magnitude less than the critical strain-energy-release rate in static tests.

Everett, R. A., Jr.↗

NASA NTRS1986

Adhesive evaluation of LARC-TPI and a water-soluble version of LARC-TPI

The results of a study to evaluate two Langley Research Center thermoplastic polimide (TPI) materials, identified as TPI/MTC for the material from Mitsui Toatsu Chemicals Inc. and TPI/H2O for the material from United Technologies Research Center, as high temperature thermoplastic adhesives and primers for bonding titanium (6AL-4V) adherends are discussed. A limited characterization of the materials was performed using a Diffuse Reflectance-Fourier Transform Infrared Spectroscopy (DR-FTIR) technique. Thermomechanical Analysis (TMA) and torsional braid techniques were used to determine glass transition temperature. The adhesive's strength, as determined by simple lap shear tests, was used to evaluate the effects of long term thermal exposure (up to 1000 hrs) at 204 deg C and a 72-hour water-boil.

Progar, D. J.↗

NASA NTRS1985

Relative displacement measurements for two-body problems

While high-sensitivity moire interferometry is very effective for displacement measurements in continuous bodies, special difficulties arise with two-body problems. Fringes may become discontinuous at the boundary between the bodies and as a result the relative displacements cannot be extracted from the fringe patterns. In this work, flexible bridges are used between the bodies to provide a continuous path for fringe counting. The bridges are made of relatively low modulus material and have a low stiffness geometry, such that they deform under minimal load. The experimental methods used for obtaining relative displacement measurements in two-body problems are described for the two cases; dovetail joint in turbo-machinery, and thick adherend lap joint.

Post, D.↗

NASA NTRS1985

Interaction of mixed mode loading on cyclic debonding in adhesively bonded composite joints

Mall, S.↗

NASA NTRS1985

Parametric study of stress-intensity factors in bonded composite stringer panels

Stress-intensity factors are determined for an infinite cracked orthotropic sheet adhesively bonded to an orthotropic stringer. Since the stringer is modeled as a semi-infinite sheet, the solution is most appropriate for a crack tip located near a stringer edge. Both adherends are treated as homogeneous, orthotropic media which are representative of many fiber-reinforced composite materials. The complex variable theory of elasticity was used to obtain a set of integral equations describing the problem. The integral equations are replaced by an equivalent sheet of algebraic equations, which are solved to obtain the shear stress distribution in the adhesive layer. From these adhesive stresses, the stress-intensity factors are found. A parametric study is conducted to determine the sensitivity of the system to material properties and specimen configuration. Unless the crack tip is very close to or under the stringer, the stress-intensity factor is approximately that of the unstiffened sheet. However, as the crack propagates beneath the stringer, the stress-intensity factor decreases significantly. Increasing the stringer stiffness or the adhesive stiffness also decreases the stress-intensity factor.

Bigelow, C. A.↗

NASA NTRS1986

Evaluation of Ti-6Al-4V surface treatments for use with a polyphenylquinoxaline adhesive

Three surface treatments for Ti-6Al-4V adherends were evaluated using a thermoplastic polymer monoether polyphenylquinoxaline, MEPPQ, which had been shown in previous studies to have good potential as a high temperature adhesive for aerospace applications. Initial results based on long term thermal exposure at 232 C (450 F) using the phosphate-fluoride (PF) and chromic acid anodized (CAA) treatments with MEPPQ adhesive were not encouraging. A significant improvement in strength retention and a change in failure mode (cohesive) at 232 C (450F) was found for the SHA treated specimens compared to the PF and CAA treatments. Although an improvement in long term thermal durability was obtained with the SHA treatment of Ti-6Al-4V, an improved surface treatment with better long term durability is still required for aerospace applications.

Progar, D. J.↗

NASA NTRS1986

Criterion for mixed mode fracture in composite bonded joints

A study was undertaken to characterize the debond growth mechanism of adhesively bonded composite joints under mode I, mixed mode I-II, and mode II static loadings. The bonded system consisted of graphite/epoxy (T300/5208) composite adherends bonded with a toughened epoxy (EC 3445) adhesive. The mode I, mode II and mixed-mode I-II fracture energies of the tested adhesive were found to be equal to each other. Furthermore, the criterion for mixed mode fracture in composite bonded joints was determined.

Mall, S.↗

NASA NTRS1987

Stress ratio effect on cyclic debonding in adhesively bonded composite joints

A study was conducted to investigate the stress ratio effect on cyclic debond growth behavior in adhesively bonded composite joints. The system studied consisted of graphite/epoxy adherends bonded with a toughened epoxy adhesive. This study showed that the strain energy release rate range was the driving factor for cyclic debonding of the tested bonded system when subjected to cyclic loads with different stress ratios for both mode I and mixed mode I-II loadings.

Mall, S.↗

NASA NTRS1988

Additives Improve Processing Of Polyimides

Melt-processable polyimides maintain desirable polymer properties prepared by adding small amounts of certain low-molecular-weight, thermally stable additives. Useful in preparing void-free polyimide composites from higher flow resins that wet out fibers at lower processing temperatures. Applied to preparing high-temperature polyimide adhesives allowing enhanced wetting of adherends and ultimately better adhesion. Improvement to processing polyimides and potential application for production of films, coatings, adhesives, and composites.

St. Clair, Terry L.↗

NASA NTRS1988

Evaluation of a thermoplastic polyimide (422) for bonding GR/PI composite

A hot-melt processable copolyimide previously studied and characterized as an adhesive for bonding Ti-6Al-4V was used to bond Celion 6000/LARC-160 composite. Comparisons are made for the two adherend systems. A bonding cycle was determined for the composite bonding and lap shear specimens were prepared which were thermally exposed in a forced-air oven for up to 5000 h at 204 C. The lap shear strengths (LSSs) were determined at RT, 177, and 204 C. After thermal exposure at RT, 177, and 204 C the LSS decreased significantly; however, a slight increase was noted for the 204 C tests. Initially the LSS values are higher for the bonded Ti-6Al-4V than for the bonded composite, however, the LSS decreases dramatically between 5000 and 10,000 h of 204 C thermal exposure. Longer periods of thermal exposure up to 20,000 h results in further decreases in the LSSs. Although the bonded composite retained useful strengths for exposures up to 5000 h, based on the poor results of the bonded Ti-6Al-4V beyond 5000 h, the 422 adhesive bonded composites would most likely also produce poor strengths beyond 5000 h exposure. Adhesive bonded composite lap shear specimens exposed to boiling water for 72 h exhibited greatly reduced strengths at all test temperatures. The percent retained after water boil for each test temperature was essentially the same for both systems.

Progar, Donald J.↗