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Results for “assembly reliability”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Modulation and Modeling of Three-Dimensional Nanowire Assemblies Targeting Gas Sensors with High Response and Reliability

Despite improved sensitivity, simple downsizing of gas-sensing components to randomly arranged nanostructures often faces challenges associated with unpredictable electrical conduction pathways. In the present study, controlled fabrication of three-dimensional (3D) metal oxide nanowire networks is demonstrated that can greatly improve both signal stability and sensor response compared to random nanowire arrays. For example, the highest ever reported H 2 S gas response value, and a 5 times lower relative standard deviation of baseline resistance than that of random nanowires assemblies, are achieved with the ordered 3D nanowire network. Systematic engineering of 3D geometries and their modeling, utilizing equivalent circuit components, provide additional insights into the electrical conduction and gas-sensing response of 3D assemblies, revealing the critical importance of wire-to-wire junction points and their arrangement. Here these findings suggest new design rules for both enhanced performance and reliability of chemical sensors, which may also be extended to other devices based on nanoscale building blocks.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Understanding structure-processing relationships in metal additive manufacturing via featurization of microstructural images

Understanding and predicting accurate property-structure-processing relationships for additively manufactured components is important for both forward and inverse design of robust, reliable parts and assemblies. While direct mapping of process parameters to properties is sometimes plausible, it is often rendered difficult due to poor microstructural control. Exploring the direct relationship between processing conditions and microstructural features can thus provide significant physical insights and aid the overall design process. Here, in this study, we develop an automated high-throughput framework to simulate an uncertainty-aware additive manufacturing (AM) process, characterize microstructural images, and extract meaningful features/descriptors. A kinetic Monte Carlo (KMC) based model of the AM process is used to simulate microstructural evolution for a diverse set of experimentally relevant processing conditions. We perform a parametric study to explore the relationship between microstructural features and processing conditions. Our results indicate that a many-to-one mapping can exist between processing conditions and typical descriptors; therefore, multiple descriptors are thus necessary to unambiguously represent microstructural images. Our work provides crucial quantitative and qualitative in-formation that would aid in the selection of features for microstructural images. Featurized microstructures could then be utilized to build data-driven models for predictive control of microstructures and thereby properties of additively manufactured components.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Benchmarking Monte Carlo codes for the modelling of low-energy neutron production target reactions

The increasing adoption of accelerator-based neutron sources (ABNS) for applications including neutron capture therapy (NCT) research has highlighted the need for accurate simulation tools. Precise modelling of the neutron production target is crucial to ensure that simulated predictions of neutron beam characteristics used for subsequent beam shaping assembly design are reliable. This work presents a comprehensive benchmarking of four widely-used Monte Carlo codes - Geant4, PHITS, FLUKA (CERN), and MCNP - for modelling low-energy neutron production target reactions. Using their recommended physics models and cross-section libraries, we evaluate each code’s performance in simulating four beam-target reactions: 7 Li(p,n) 7 Be, 9 Be(p,n) 9 B, 9 Be(d,n) 10 B, and C(d,n)N. Predictions of neutron yield, angular distributions, and energy spectra are compared against available thick target experimental data. Results show varying levels of agreement between the codes depending on the reaction type, energy range, and beam characteristics. Geant4, MCNP and PHITS are the overall best performing codes for the simulation of total neutron yield and yield in the forward direction across most reactions. Across energies where experimental benchmarks exist, inter-code discrepancies in total and forward-directed yield are typically 10 to 30%, with larger deviations at near-threshold incident ion energies. PHITS provides the best overall reproduction of experimental spectra, particularly for the 9 Be(p,n) 9 B reaction. Additionally, PHITS demonstrates superior computational performance for most reactions. These findings provide valuable guidance for ABNS design, highlighting the strengths and limitations of each code for the simulation of low-energy neutron production reactions.

43 PARTICLE ACCELERATORS↗
NASA NTRS1972

Preliminary design of a Primary Loop Pump Assembly (PLPA), using electromagnetic pumps

A preliminary design study of flight-type dc conduction-permanent magnetic, ac helical induction, and ac linear induction pumps for circulating 883 K (1130 F) NaK at 9.1 kg/sec (20 lb/sec) is described. Various electromagnetic pump geometrics are evaluated against hydraulic performance, and the effects of multiple windings and numbers of pumps per assembly on overall reliability were determined. The methods used in the electrical-hydraulic, stress, and thermal analysis are discussed, and the high temperature electrical materials selected for the application are listed.

Moss, T. A.↗
NASA NTRS1986

Laser Holder Aids Centering of X-Ray Head

Laser holder used when alining X-ray head makes procedure safer and more reliable. Laser holder assembly attached to X-ray head to enable head to be alined optically before X-ray exposure. When laser in operating position laser beam shines on spot later illuminated with X-rays. New holder grips laser securely, maintains alinement, does not interfere with head placement, and requires only one 110-V power cord.

Bulthuis, D. V.↗
NASA NTRS2006

Thermal Cycle Reliability of PBGA/CCGA 717 I/Os

Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version. both having 560 I/Os. were presented in last year's conference. Test results included environmental data for three different thermal cycle regimes (-55 C/125 C, -55 C/100 C, and -50 C /75 C). Update information on these - especially failure type for assemblies with high and low solder volumes-were presented. The thermal cycle test procedure followed those recommended IPC-9701 for tin-lead solder joint assemblies. Revision A of this specification covers guideline thermal cycle requirements for Pb-free solder joints. Some background information discussed during release of this specification with its current guideline recommendations were also presented. In a recent reliability investigation a fully populated CCGA with 717 I/Os was also considered for assembly reliability. evaluation. The functional package is a field-programmable gate array that has much higher processing power than its previous version. This new package is smaller in dimension, has no interposer, and has a thinner column wrapped with copper for reliability improvement. This paper will also present thermal cycle test results for this package assembly and its plastic version with 728 I/Os. both of which were exposed to three different cycle regimes. Two cycle profiles were those specified by IPC- 9701A for tin-lead, i.e. -55 to 100 C and -55 to 125 C and one was a cycle profile specified by Mil-Std-883, i.e.. -65 C/150 C which is generally used for ceramic hybrid packages. Per IPC-9701 A, test vehicles were built using daisy chain packages and were continuously monitored. The effects of many process and assembly variables-including corner staking commonly used for improving resistance to mechanical loading such as drop and vibration loads--were also considered as part of the test matrix. Optical photomicrographs were taken at various thermal cycle intervals to document damage progress and behavior. Representative samples of these along with cross-sectional photomicrographs at higher magnification taken by scanning electron microscopy (SEM) to determine crack propagation and failure analyses for packages are also presented.

staking↗
DOE OSTI2019

Porous Enzymatic Membrane for Nanotextured Glucose Sweat Sensors with High Stability toward Reliable Noninvasive Health Monitoring

Development of reliable glucose sensors for noninvasive monitoring without interruption or limiting users' mobility is highly desirable, especially for diabetes diagnostics, which requires routine/long-term monitoring. However, their applications are largely limited by the relatively poor stability. In this paper, a porous membrane is synthesized for effective enzyme immobilization and it is robustly anchored to the modified nanotextured electrode solid contacts, so as to realize glucose sensors with significantly enhanced sensing stability and mechanical robustness. To the best of our knowledge, this is the first report of utilizing such nanoporous membranes for electrochemical sensor applications, which eliminates enzyme escape and provides a sufficient surface area for molecular/ion diffusion and interactions, thus ensuring the sustainable catalytic activities of the sensors and generating reliable measureable signals during noninvasive monitoring. The as-assembled nanostructured glucose sensors demonstrate reliable long-term stable monitoring with a minimal response drift for up to 20 h, which delivers a remarkable enhancement. Moreover, they can be integrated into a microfluidic sensing patch for noninvasive sweat glucose monitoring. The as-synthesized nanostructured glucose sensors with remarkable stability can inspire developments of various enzymatic biosensors for reliable noninvasive composition analysis and their ultimate applications in predictive clinical diagnostics, personalized health-care monitoring, and chronic diseases management.

36 MATERIALS SCIENCE↗
NASA NTRS2005

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗
NASA NTRS2016

System Design and Implementation of the Detector Assembly of the Astro-H Soft X-Ray Spectrometer

The soft x-ray spectrometer (SXS) onboard Astro-H presents to the science community unprecedented capability (less than 7 eV at 6 keV) for high-resolution spectral measurements in the range of 0.5-12 keV to study extended celestial sources. At the heart of this SXS is the x-ray calorimeter spectrometer (XCS) where detectors (calorimeter array and anticoincidence detector) operate at 50 mK, the bias circuit operates at nominal 1.3 K, and the first stage amplifiers operateat 130 K, all within a nominal 20 cm envelope. The design of the detector assembly in this XCS originates from the Astro-E x-ray spectrometer (XRS) and lessons learned from Astro-E and Suzaku. After the production of our engineering model, additional changes were made in order to improve our flight assembly process for better reliability and overall performance. In this poster, we present the final design and implementation of the flight detector assembly, show comparison of parameters and performance to Suzakus XRS, and list susceptibilities to other subsystems as well as our lessons learned.

soft x-ray spectrometer↗
NASA NTRS2005

Autonomous Assembly of Modular Structures in Space and on Extraterrestrial Locations

The new U.S. National Vision for Space Exploration requires many new enabling technologies to accomplish the goals of space commercialization and returning humans to the moon and extraterrestrial environments. Traditionally, flight elements are complete subsystems requiring humans to complete the integration and assembly. These bulky structures also require the use of heavy launch vehicles to send the units to a desired location. This philosophy necessitates a high degree of safety, numerous space walks at a significant cost. Future space mission costs must be reduced and safety increased to reasonably achieve exploration goals. One proposed concept is the autonomous assembly of space structures. This concept is an affordable, reliable solution to in-space and extraterrestrial assembly. Assembly is autonomously performed when two components join after determining that specifications are correct. Local sensors continue monitor joint integrity post assembly, which is critical for safety and structural reliability. Achieving this concept requires a change in space structure design philosophy and the development of innovative technologies to perform autonomous assembly. Assembly of large space structures will require significant numbers of integrity sensors. Thus simple, low-cost sensors are integral to the success of this concept. This paper addresses these issues and proposes a novel concept for assembling space structures autonomously. Core technologies required to achieve in space assembly are presented. These core technologies are critical to the goal of utilizing space in a cost efficient and safe manner. Additionally, these novel technologies can be applied to other systems both on earth and extraterrestrial environments.

Alhorn, Dean C.↗
NASA NTRS1974

High reliability sheathed, beryllia insulated, tungsten-rhenium alloy thermocouple assemblies; their fabrication and EMF stability

Tantalum sheathed, BeO insulated, W-3% Re/W-25% Re thermocouple assemblies were fabricated and their emf drift determined during 2059 hours of exposure at 2073 K in a gaseous helium environment. The sheathed thermocouple assemblies were constructed from aged thermoelements, specially heat-treated BeO insulators, and specially cleaned and etched tantalum sheaths. Their thermal emf drifts ranged from the equivalent of only -0.3 to -0.8 K drift per 1000 hours of exposure at 2073 K. No evidence of any gross chemical attack or degradation of the component materials was found. The emf drift and material behavior of some unsheathed, BeO insulated, W-3% Re/W-25% Re thermocouples at 2250 and 2400 K were also determined. Unsheathed thermocouples tested in an argon environment at 2250 K for 1100 hours and at 2400 K for 307 hours exhibited changes in thermal emf that typically ranged from the equivalent of a few degrees K to as much as +11 K. Post-test examinations of these thermocouples revealed some undesirable material degradation and interaction which included erosion of the BeO insulators and contamination of the thermoelements by tantalum from the tantalum blackbody enclosure in which the thermocouples were contained.

Burns, G. W.↗
NASA NTRS2013

Silicon Heat Pipe Array

Improved methods of heat dissipation are required for modern, high-power density electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology. Heat pipes offer a solution to this problem. Heat pipes are passive, self-contained, two-phase heat dissipation devices. Heat conducted into the device through a wick structure converts the working fluid into a vapor, which then releases the heat via condensation after being transported away from the heat source. Heat pipes have high thermal conductivities, are inexpensive, and have been utilized in previous space missions. However, the cylindrical geometry of commercial heat pipes is a poor fit to the planar geometries of microelectronic assemblies, the copper that commercial heat pipes are typically constructed of is a poor CTE (coefficient of thermal expansion) match to the semiconductor die utilized in these assemblies, and the functionality and reliability of heat pipes in general is strongly dependent on the orientation of the assembly with respect to the gravity vector. What is needed is a planar, semiconductor-based heat pipe array that can be used for cooling of generic MCM (multichip module) assemblies that can also function in all orientations. Such a structure would not only have applications in the cooling of space electronics, but would have commercial applications as well (e.g. cooling of microprocessors and high-power laser diodes). This technology is an improvement over existing heat pipe designs due to the finer porosity of the wick, which enhances capillary pumping pressure, resulting in greater effective thermal conductivity and performance in any orientation with respect to the gravity vector. In addition, it is constructed of silicon, and thus is better suited for the cooling of semiconductor devices.

Yee, Karl Y.↗
DOE OSTI2021

Deeplasmid: deep learning accurately separates plasmids from bacterial chromosomes

Plasmids are mobile genetic elements that play a key role in microbial ecology and evolution by mediating horizontal transfer of important genes, such as antimicrobial resistance genes. Many microbial genomes have been sequenced by short read sequencers and have resulted in a mix of contigs that derive from plasmids or chromosomes. New tools that accurately identify plasmids are needed to elucidate new plasmid-borne genes of high biological importance. We have developed Deeplasmid, a deep learning tool for distinguishing plasmids from bacterial chromosomes based on the DNA sequence and its encoded biological data. It requires as input only assembled sequences generated by any sequencing platform and assembly algorithm and its runtime scales linearly with the number of assembled sequences. Deeplasmid achieves an AUC–ROC of over 89%, and it was more accurate than five other plasmid classification methods. Finally, as a proof of concept, we used Deeplasmid to predict new plasmids in the fish pathogen Yersinia ruckeri ATCC 29473 that has no annotated plasmids. Deeplasmid predicted with high reliability that a long assembled contig is part of a plasmid. Using long read sequencing we indeed validated the existence of a 102 kb long plasmid, demonstrating Deeplasmid's ability to detect novel plasmids.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2026

Building the Eyes of Discovery

My presentation focuses on the development and enhancement of sensor modules that help particle detectors “see” particles invisible to the human eye, specifically the Compact Muon Shield detector, which is part of the High-Luminosity Large Hadron Collider. As a CCI intern at Fermilab’s Silicon Detector Facility, I worked on testing and visual inspection of different module parts before assembly and on testing the modules after assembly. My talk highlights how small sensors carry the capability to collect tiny particle signals within the detector and the reliability of control checks pre-assembly for scientists to produce reliable data for future discoveries.

Siddiqui, Hooriya [Fermilab] (ORCID:00090001510973↗
NASA NTRS1975

SEPS solar array design and technology evaluation

The solar array system considered is composed of two wings. Each wing consists of a solar array blanket, a blanket launch storage container, an extension/retraction mast assembly, a blanket tensioning system, and an array electrical harness. A technology evaluation is performed to assess the applicable solar array state-of-the-art and to define the supporting effort necessary to achieve technology readiness for meeting the Solar Electric Propulsion Stage (SEPS) solar array design requirements. Details of mechanical design are discussed along with questions of electrical design, operational reliability advantages, and array assembly advantages.

Elms, R. V., Jr.↗
NASA NTRS1972

Studies of the performance of W-Re type thermocouples.

The effect of exposure of bare-wire and BeO-insulated commercial W-Re thermocouple materials to high temperatures in gaseous environments was investigated. The temperature range of interest was primarily 2000 to 2400 K, and the investigations were confined to thermocouple wires of 0.25 mm diameter. Thermoelements were examined for metallurgical structural changes and chemical changes by conventional methods. In the temperature range of interest, grain growth was inhibited in the chemically doped W-3% Re alloy, and excellent room-temperature ductility was retained subsequent to the exposure. The compatibility of high purity (in excess of 99.8%), sintered BeO insulators with the thermoelements differed, depending upon whether the BeO-insulated thermoelement assemblies were self-heated electrically or heated in a furnace; in tests in argon environments, highly reliable performance occurred when the assemblies were heated in a furnace. BeO-insulated W-3% Re vs W-25% Re thermocouples, constructed with degassed and aged materials, exhibited drifts equivalent to about 3 mK/hr during 1000 hours of exposure at 2073 K in argon while in the presence of tantalum.

Burns, G. W.↗