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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Active control of interior noise in model aircraft fuselages using piezoceramic actuators

Active control of interior noise in model aircraft fuselages using piezoceramic actuators is experimentally studied. The actuators are bonded directly to the structure and error information is taken from up to two microphones located in the interior acoustic field. The results demonstrate that global attenuation of the order of 10 to 15 dB of interior noise can be achieved with piezoceramic actuators, irrespective of whether the shell system is vibrating at an acoustic or structural resonant frequency. The work also proves that active control using vibration (moment) inputs works well when a floor simulating that of an aircraft is installed in the model. This result suggests that the technique will be successful in controlling interior noise in realistic aircraft structures.

Fuller, C. R.↗
NASA NTRS1993

Thermal protection systems for aerobrakes

In summary, advantages of the ablative thermal protection system (TPS) for aerobrakes are: (1) proven reliable TPS systems; (2) well characterized (thermally) with good, existing thermal analysis capability; (3) good candidate materials are available; (4) not sensitive to defects and more difficult to damage then RSI or C-C; (5) design program which demonstrated simple (direct bond) application of large panels; (6) thermal excursions not catastrophic; and (7) no SIP required.

Tompkins, Stephen S.↗
NASA NTRS1993

A ceramic matrix composite thermal protection system for hypersonic vehicles

The next generation of hypersonic vehicles (NASP, SSTO) that require reusable thermal protection systems will experience acreage surface temperatures in excess of 1100 C. More important, they will experience a more severe physical environment than the Space Shuttle due to non-pristine launching and landing conditions. As a result, maintenance, inspection, and replacement factors must be more thoroughly incorporated into the design of the TPS. To meet these requirements, an advanced thermal protection system was conceived, designated 'TOPHAT'. This system consists of a toughened outer ceramic matrix composite (CMC) attached to a rigid reusable surface insulator (RSI) which is directly bonded to the surface. The objective of this effort was to evaluate this concept in an aeroconvective environment, to determine the effect of impacts to the CMC material, and to compare the results with existing thermal protection systems.

Riccitiello, Salvatore R.↗
NASA NTRS1994

Milestone 5 test report. Task 5, subtask 5.2: Tile to foam strength tests

This report summarizes work that has been performed to date on the strength of a cryotank insulation system using Rohacell foam and TUFI-coated AETB-12 ceramic tiles directly bonded to a simulated graphite-epoxy tank wall. Testing utilized a custom specimen design which consists of a long tensile specimen with eccentric loading to induce curvature similar to the curvature expected due to 'pillowing' of the tank when pressurized. A finite element model was constructed to predict the specific element strains in the test article, and to assist with design of the test specimen to meet the specific goals of curvature and laminate strain. The results indicate that the heat treated 3.25-pcf density Rohacell foam does not provide sufficient strength for the induced stresses due to curvature and stress concentration at the RTV bondline to the TUFI tile. The test was repeated using higher density non-heat treated Rohacell foam (6.9 pcf) without foam failure. The finite element model was shown to predict specimen behavior, and validation of the model was successful. It is pertinent to mention that the analyses described herein accurately predicted the failure of the heat treated foams and based on this analysis method it is expected that the untreated 3.25 pcf Rohacell foam will be successful.

Greenberg, H. S.↗
NASA NTRS2001

A Model for Macromolecular Crystallization

Macromolecular crystallization is a complex process. involving a system which typically has 5 or more components (macromolecule, water, buffer + counter ion, and precipitant). Whereas small molecules have only several well defined contacts in the crystal lattice, macromolecules generally have 10's or even 100's of contacts between molecules. These can range from hydrogen bonds (direct or water-mediated), through van der Waals, hydrophobic, salt bridges, and ion-mediated contacts. The latter interactions are stronger and require some specificity in the molecular alignment, while the others are weaker, more prevalent, and more promiscuous, i.e., can often be readily broken and reformed between other sites. Formation of a consistent, ordered, 3D structure may be impossible in the absence of any or presence of too many strong interactions. Further complicating the process is the inherent structural asymmetry of monomeric single chain macromolecules. The process of crystal nucleation and growth involves the ordered assembly of growth units into a defined 3D lattice. We suggest that for many macromolecules, particularly those that are monomeric, this involves a preliminary solution-phase assembly process into a growth unit having some symmetry prior to addition to the lattice, recapitulating the initial stages of the nucleation process. If this model is correct then fluids and crystal growth models assuming a strictly monodisperse nutrient solution need to be revised. Experimental evidence, based upon face growth rate, AFM, and fluorescence energy transfer data, for a postulated model of the nucleation of tetragonal lysozyme crystals and how it transitions into crystal growth will be presented.

Pusey, Marc L.↗
NASA NTRS2001

Surface Evaluation by XPS of High Performance Foams After Exposure to Oxygen Plasma

This report will present the results of a study done during a 10-week summer faculty fellowship during the summer of 2001 working with Ms. Martha Williams of the Testbeds Group at Kennedy Space Center. The work was in a new area for this faculty and was both interesting and enjoyable. An imide is a compound in which nitrogen is bonded directly to an R group and to two other R groups through carbonyls. Polyimides have a number of properties that make them highly desirable materials for use on structures that are exposed to extreme conditions. They are strong, fire resistant, minimally outgasing, stable over a large temperature range, resistant to chemical attack, transparent to infrared and microwaves, and have a low density. One polyimide, solimide, commercially available as a foam, retains resiliency from -300 F to +500 F, is highly flame retardant, and decomposes with virtually no smoke or toxic byproduct formation. The density of this product is such that its use in place of fiberglass in the lower lobe of a 747 saves 400 lb. Shipboard applications have resulted in literally tons of weight reduction. While polyimide films have been used in structures to be placed in low earth orbit (LEO) for many years, polyimide foams have found only minimal application in this realm. NASA Langley Research Center has developed new technology that allows for the processing of new polyimide foams. The resulting increased availability of these materials, along with their highly desirable properties, has prompted a study to determine the suitability of these materials for use in structures to be placed in LEO.

Hampton, Michael D.↗
NASA NTRS2001

A Cool Tool for Deicing Planes

Nicknamed the "ice zapper," the Electro Expulsive Separation System (EESS) is an aircraft ice removal system that "pulverizes ice and removes layers of ice as thin as frost or as thick as an inch of glaze," according to the principle inventor of the technology. Patented by NASA's Ames Research Center, the EESS consists of layers of conductors encased in materials that are bonded directly to the airframe structure. When ice accumulates on the aircraft, an electric current is sent through the conductors, causing them to pulse. Even though the conductors move less than a twenty-thousandth of an inch in just a millisecond, the movement is sufficient to pulverize the ice. It is this highly accelerated motion that shatters the ice into particles the size of table salt; too small to be harmful to the aircraft. When compared with other systems in use, such as thermal deicers and pneumatic boots, the ice zapper does very well. Thermal deicers are fairly common, although they use an enormous amount of energy and present the possibility of ice refreezing. Pneumatic boots are not always effective because they require an inflation device that is unable to work until a quarter inch of ice has accumulated. With both systems, the ice that is loosened may still be large enough to cause problems for the plane once dislodged.

Source record↗
NASA NTRS1989

Lubricant Coating Process

"Peen Plating," a NASA developed process for applying molybdenum disulfide, is the key element of Techniblast Co.'s SURFGUARD process for applying high strength solid lubricants. The process requires two machines -- one for cleaning and one for coating. The cleaning step allows the coating to be bonded directly to the substrate to provide a better "anchor." The coating machine applies a half a micron thick coating. Then, a blast gun, using various pressures to vary peening intensities for different applications, fires high velocity "media" -- peening hammers -- ranging from plastic pellets to steel shot. Techniblast was assisted by Rural Enterprises, Inc. Coating service can be performed at either Techniblast's or a customer's facility.

Source record↗
NASA NTRS2002

A Model for Tetragonal Lysozyme Crystal Nucleation and Growth

Macromolecular crystallization is a complex process, involving a system that typically has 5 or more components (macromolecule, water, buffer + counter ion, and precipitant). Whereas small molecules have only a few contacts in the crystal lattice, macromolecules generally have 10's or even 100's of contacts between molecules. These can range from hydrogen bonds (direct or water-mediated), through van der Waals, hydrophobic, salt bridges, and ion-mediated contacts. The latter interactions are stronger and require some specificity in the molecular alignment, while the others are weaker, more prevalent, and more promiscuous, i.e., can be readily broken and reformed between other sites. Formation of a consistent, ordered, 3D structure may be difficult or impossible in the absence of any or presence of too many strong interactions. Further complicating the process is the inherent structural asymmetry of monomeric (single chain) macromolecules. The process of crystal nucleation and growth involves the ordered assembly of growth units into a defined 3D lattice. We suggest that for many macromolecules, particularly those that are monomeric, this involves a preliminary solution-phase assembly process into a growth unit having some symmetry prior to addition to the lattice, recapitulating the initial stages of the nucleation process. If this model is correct then fluids and crystal growth models assuming a strictly monodisperse nutrient solution need to be revised. This model has been developed from experimental evidence based upon face growth rate, AFM, and fluorescence energy transfer data for the nucleation and growth of tetragonal lysozyme crystals.

Pusey, Marc L.↗
NASA NTRS2003

Advanced Sensor Systems for Biotelemetry

The present invention relates to telemetry-based sensing systems that continuously measures physical, chemical and biological parameters. More specifically, these sensing systems comprise a small, modular, low-power implantable biotelemetry system capable of continuously sensing physiological characteristics using implantable transmitters, a receiver, and a data acquisition system to analyze and record the transmitted signal over several months. The preferred embodiment is a preterm labor and fetal monitoring system. Key features of the invention include Pulse Interval Modulation (PIM) that is used to send temperature and pressure information out of the biological environment. The RF carrier frequency is 174-216 MHz and a pair of RF bursts (pulses) is transmitted at a frequency of about 1-2 Hz. The transmission range is 3 to 10 feet, depending on the position of the transmitter in the body and its biological environment. The entire transmitter is encapsulated in biocompatible silicone rubber. Power is supplied by on-board silver-oxide batteries. The average power consumption of the current design is less than 30 microW, which yields a lifetime of approximately 6 - 9 months. Chip-on-Board technology (COB) drastically reduces the size of the printed circuit board from 38 x 28 mm to 22 x 8 mm. Unpackaged dies are flip-chip bonded directly onto the printed circuit board, along with surface mount resistors and capacitors. The invention can monitor additional physiological parameters including, but not limited to, ECG, blood gases, glucose, and ions such as calcium, potassium, and sodium.

Hines, John W.↗
NASA NTRS1997

High-Temperature Adhesive Strain Gage Developed

Researchers at the NASA Lewis Research Center have developed a unique strain gage and adhesive system for measuring the mechanical properties of polymers and polymer composites at elevated temperatures. This system overcomes some of the problems encountered in using commercial strain gages and adhesives. For example, typical commercial strain gage adhesives require a postcure at temperatures substantially higher than the maximum test temperature. The exposure of the specimen to this temperature may affect subsequent results, and in some cases may be higher than the glass-transition temperature of the polymer. In addition, although typical commercial strain gages can be used for short times at temperatures up to 370 C, their long-term use is limited to 230 C. This precludes their use for testing some high-temperature polyimides near their maximum temperature capability. Lewis' strain gage and adhesive system consists of a nonencapsulated, unbacked gage grid that is bonded directly to the polymer after the specimen has been cured but prior to the normal postcure cycle. The gage is applied with an adhesive specially formulated to cure under the specimen postcure conditions. Special handling, mounting, and electrical connection procedures were developed, and a fixture was designed to calibrate each strain gage after it was applied to a specimen. A variety of tests was conducted to determine the performance characteristics of the gages at elevated temperatures on PMR-15 neat resin and titanium specimens. For these tests, which included static tension, thermal exposure, and creep tests, the gage and adhesive system performed within normal strain gage specifications at 315 C. An example of the performance characteristics of the gage can be seen in the figure, which compares the strain gage measurement on a polyimide specimen at 315 C with an extensometer measurement.

Pereira, J. Michael↗
NASA NTRS2003

Advanced sensor systems for biotelemetry

The present invention relates to telemetry-based sensing systems that continuously measures physical, chemical and biological parameters. More specifically, these sensing systems comprise a small, modular, low-power implantable biotelemetry system capable of continuously sensing physiological characteristics using implantable transmitters, a receiver, and a data acquisition system to analyze and record the transmitted signal over several months. The preferred embodiment is a preterm labor and fetal monitoring system. Key features of the invention include Pulse Interval Modulation (PIM) that is used to send temperature and pressure information out of the biological environment. The RF carrier frequency is 174-216 MHz and a pair of RF bursts (pulses) is transmitted at a frequency of about 1-2 Hz. The transmission range is 3 to 10 feet, depending on the position of the transmitter in the body and its biological environment. The entire transmitter is encapsulated in biocompatible silicone rubber. Power is supplied by on-board silver-oxide batteries. The average power consumption of the current design is less than 30 .mu.W., which yields a lifetime of approximately 6-9 months. Chip-on-Board technology (COB) drastically reduces the size of the printed circuit board from 38.times.28 mm to 22.times.8 mm. Unpackaged dies are flip-chip bonded directly onto the printed circuit board, along with surface mount resistors and capacitors. The invention can monitor additional physiological parameters including, but not limited to, ECG, blood gases, glucose, and ions such as calcium, potassium, and sodium.

Hines, John W.↗
NASA NTRS2004

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗
NASA NTRS2013

Nickel-Graphite Composite Compliant Interface and/or Hot Shoe Material

Next-generation high-temperature thermoelectric-power-generating devices will employ segmented architectures and will have to reliably withstand thermally induced mechanical stresses produced during component fabrication, device assembly, and operation. Thermoelectric materials have typically poor mechanical strength, exhibit brittle behavior, and possess a wide range of coefficient of thermal expansion (CTE) values. As a result, the direct bonding at elevated temperatures of these materials to each other to produce segmented leg components is difficult, and often results in localized microcracking at interfaces and mec hanical failure due to the stresses that arise from the CTE mismatch between the various materials. Even in the absence of full mechanical failure, degraded interfaces can lead to increased electrical and thermal resistances, which adversely impact conversion efficiency and power output. The proposed solution is the insertion of a mechanically compliant layer, with high electrical and thermal conductivity, between the low- and high-temperature segments to relieve thermomechanical stresses during device fabrication and operation. This composite material can be used as a stress-relieving layer between the thermoelectric segments and/or between a thermoelectric segment and a hot- or cold-side interconnect material. The material also can be used as a compliant hot shoe. Nickel-coated graphite powders were hot-pressed to form a nickel-graphite composite material. A freestanding thermoelectric segmented leg was fabricated by brazing the compliant pad layer between the high-temperature p- Zintl and low-temperature p-SKD TE segments using Cu-Ag braze foils. The segmented leg stack was heated in vacuum under a compressive load to achieve bonding. The novelty of the innovation is the use of composite material that re duces the thermomechanical stresses en - countered in the construction of high-efficiency, high-temperature therm - o-electric devices. The compliant pad enables the bonding of dissimilar thermoelectric materials while maintaining the desired electrical and thermal properties essential for efficient device operation. The modulus, CTE, electrical, and thermal conductances of the composite can be controlled by varying the ratio of nickel to graphite.

Firdosy, Samad A.↗
NASA NTRS2015

Conformal Ablative Thermal Protection System for Small and Large Scale Missions: Approaching TRL 6 for Planetary and Human Exploration Missions and TRL 9 for Small Probe Missions

In 2011, NASAs Aeronautics Research Mission Directorate (ARMD) funded an effort to develop an ablative thermal protection system (TPS) material that would have improved properties when compared to Phenolic Impregnated Carbon Ablator (PICA) and AVCOAT. Their goal was a conformal material, processed with a flexible reinforcement that would result in similar or better thermal characteristics and higher strain-to-failure characteristics that would allow for easier integration on flight aeroshells than then-current rigid ablative TPS materials. In 2012, NASAs Space Technology Mission Directorate (STMD) began funding the maturation of the best formulation of the game changing conformal ablator, C-PICA. Progress has been reported at IPPW over the past three years, describing C-PICA with a density and recession rates similar to PICA, but with a higher strain-to-failure which allows for direct bonding and no gap fillers, and even more important, with thermal characteristics resulting in half the temperature rise of PICA. Overall, C-PICA should be able to replace PICA with a thinner, lighter weight, less complicated design. These characteristics should be particularly attractive for use as backshell TPS on high energy planetary entry vehicles. At the end of this year, the material should be ready for missions to consider including in their design, in fact, NASAs Science Mission Directorate (SMD) is considering incentivizing the use of C-PICA in the next Discovery Proposal call. This year both scale up of the material to large (1-m) sized pieces and the design and build of small probe heatshields for flight tests will be completed. NASA, with an industry partner, will build a 1-m long manufacturing demonstration unit (MDU) with a shape based on a mid LD lifting body. In addition, in an effort to fly as you test and test as you fly, NASA, with a second industry partner, will build a small probe to test in the Interactive Heating Facility (IHF) arc jet and, using nearly the same design, build the aeroshell and TPS, with instrumentation, for a small probe flight test article, due to fly in 2017. At the end of the year, the C-PICA will be at TRL 5+, and with the flight data in 2017, it will be at TRL 9 for missions needs with C-PICA at a small scale (12 diameter). The scale-up and small probe efforts will be de-scribed in this presentation.

Conformal Ablative↗
NASA NTRS2016

Conformal Ablative Thermal Protection Systems (CA-TPS) for Venus and Saturn Backshells

This poster provides an overview of the work performed to date on the Conformal Ablative TPS (CA-TPS) element of the TPSM project out of GCDP. Under this element, NASA is developing improved ablative TPS materials based on flexible felt for reinforcement rather than rigid reinforcements. By replacing the reinforcements with felt, the resulting materials have much higher strain-to-failure and are much lower in thermal conductivity than their rigid counterparts. These characteristics should allow for larger tile sizes, direct bonding to aeroshells and even lower weight TPS. The conformal phenolic impregnated carbon felt (C-PICA) is a candidate for backshell TPS for both Venus and Saturn entry vehicles.

Saturn↗
NASA NTRSDate not supplied

Toward Large Field-of-view X-ray Spectrometers with Magnetic Microcalorimeters

A future X-ray telescope mission like Lynx, a X-ray flagship mission concept, requires a large field of view, high energy resolution, and high spatial resolution. The Magnetic Microcalorimeter (MMC) detectors we are developing for such a mission feature a 5-arcminute field of view, approximately 100,000 pixels, each spanning 0.5–1 arcsecond. These detectors require the readout of 8,000 sensors. Three different array types have been designed to meet scientific goals, two of which utilize thermal multiplexing to reduce the number of readout channels in a scheme called “Hydra.” We are currently fabricating detectors on a recently completed buried wiring wafer with connections to every sensor. The sensors are read out using a microwave multiplexer (μMUX) with flux ramp modulation. A single μMUX can read out approximately 1,000 sensors with only two feed lines. We will report on the test of the first two-dimensional μMUX chip, consisting of 78 resonators. μMUX chips that pass screening will be directly bonded to MMC array chips using indium bump bonding. In parallel, we have tested a kinetic inductance traveling wave parametric amplifier (KI-TWPA) to amplify signals at low temperatures. The KI-TWPA exhibits extremely low internal noise, approaching the standard quantum limit. Since the energy resolution of an MMC is primarily limited by the readout system, the KI-TWPA is an ideal amplifier for MMCs with μMUX readout. We recently measured the readout noise of a μMUX with a KI-TWPA, demonstrating its capability for reading out MMC arrays. We present the design and fabrication of the latest MMC detectors, along with its readout performance.

Magntic Microcalorimeters↗