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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit patbs by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabric.ted parts were hybridized using a Suss FCI50 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Miller, Timothy M.↗
NASA NTRS2015

Standardized Modular Power Interfaces for Future Space Explorations Missions

Earlier studies show that future human explorations missions are composed of multi-vehicle assemblies with interconnected electric power systems. Some vehicles are often intended to serve as flexible multi-purpose or multi-mission platforms. This drives the need for power architectures that can be reconfigured to support this level of flexibility. Power system developmental costs can be reduced, program wide, by utilizing a common set of modular building blocks. Further, there are mission operational and logistics cost benefits of using a common set of modular spares. These benefits are the goals of the Advanced Exploration Systems (AES) Modular Power System (AMPS) project. A common set of modular blocks requires a substantial level of standardization in terms of the Electrical, Data System, and Mechanical interfaces. The AMPS project is developing a set of proposed interface standards that will provide useful guidance for modular hardware developers but not needlessly constrain technology options, or limit future growth in capability. In 2015 the AMPS project focused on standardizing the interfaces between the elements of spacecraft power distribution and energy storage. The development of the modular power standard starts with establishing mission assumptions and ground rules to define design application space. The standards are defined in terms of AMPS objectives including Commonality, Reliability-Availability, Flexibility-Configurability and Supportability-Reusability. The proposed standards are aimed at assembly and sub-assembly level building blocks. AMPS plans to adopt existing standards for spacecraft command and data, software, network interfaces, and electrical power interfaces where applicable. Other standards including structural encapsulation, heat transfer, and fluid transfer, are governed by launch and spacecraft environments and bound by practical limitations of weight and volume. Developing these mechanical interface standards is more difficult but an essential part of defining physical building blocks of modular power. This presentation describes the AMPS projects progress towards standardized modular power interfaces.

Spacecraft Power↗
NASA NTRS2016

Modular Power Standard for Space Explorations Missions

Future human space exploration will most likely be composed of assemblies of multiple modular spacecraft elements with interconnected electrical power systems. An electrical system composed of a standardized set modular building blocks provides significant development, integration, and operational cost advantages. The modular approach can also provide the flexibility to configure power systems to meet the mission needs. A primary goal of the Advanced Exploration Systems (AES) Modular Power System (AMPS) project is to establish a Modular Power Standard that is needed to realize these benefits. This paper is intended to give the space exploration community a "first look" at the evolving Modular Power Standard and invite their comments and technical contributions.

Exploration↗
NASA NTRS2018

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.

Printed circuit boards↗
NASA NTRS2018

Building Reliable Printed Circuit Boards - the Lessons Learned

"Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. This one day workshop will discuss a variety of failure mechanisms that effect the functionality of PCBs. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. With the help of examples and case studies, a wide range of failure mechanisms will be discussed, case studies are focused on digital circuits, however some failures in analog, double sided boards are also presented. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues."

Sood, Bhanu↗
DOE OSTI2017

Self-similar and fractal design for stretchable electronics

The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications.

36 MATERIALS SCIENCE↗
DOE OSTI2017

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

36 MATERIALS SCIENCE↗
DOE OSTI2017

Converter topologies for common mode voltage reduction

An inverter includes a three-winding transformer, a DC-AC inverter electrically coupled to the first winding of the transformer, a cycloconverter electrically coupled to the second winding of the transformer, and an active filter electrically coupled to the third winding of the transformer. The DC-AC inverter is adapted to convert the input DC waveform to an AC waveform delivered to the transformer at the first winding. The cycloconverter is adapted to convert an AC waveform received at the second winding of the transformer to the output AC waveform having a grid frequency of the AC grid. The active filter is adapted to sink and source power with one or more energy storage devices based on a mismatch in power between the DC source and the AC grid. At least two of the DC-AC inverter, the cycloconverter, or the active filter are electrically coupled via a common reference electrical interconnect.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2018

Photovoltaic module and laminate

A photovoltaic module is disclosed. The photovoltaic module has a first side directed toward the sun during normal operation and a second, lower side. The photovoltaic module comprises a perimeter frame and a photovoltaic laminate at least partially enclosed by and supported by the perimeter frame. The photovoltaic laminate comprises a transparent cover layer positioned toward the first side of the photovoltaic module, an upper encapsulant layer beneath and adhering to the cover layer, a plurality of photovoltaic solar cells beneath the upper encapsulant layer, the photovoltaic solar cells electrically interconnected, a lower encapsulant layer beneath the plurality of photovoltaic solar cells, the upper and lower encapsulant layers enclosing the plurality of photovoltaic solar cells, and a homogenous rear environmental protection layer, the rear environmental protection layer adhering to the lower encapsulant layer, the rear environmental protection layer exposed to the ambient environment on the second side of the photovoltaic module.

14 SOLAR ENERGY↗
DOE OSTI2019

Self-similar and fractal design for stretchable electronics

The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications.

Rogers, John A.↗
DOE OSTI2019

Ga2O3 Packaging and Thermal Management Challenges and Opportunities

This project addresses the early-stage research and development to design and build packages that enable practical utilization of Ga2O3 semiconductor devices in power electronic circuits. The project will encompass electrical, thermal, thermomechanical and reliability aspects in the package design. As compared to silicon (Si), SiC or GaN-based packaging, using a Ga2O3 device will require significant research and innovations in the attachment of the oxide device to substrates, attachment of the substrate to the baseplate/heat exchanger, appropriate electrical interconnections, as well as the type and location of the thermal management solutions. A thorough understanding and characterization of the thermal transport properties of the Ga2O3 device layer is also essential to understand and quantify the package performance. Addressing all these aspects will result in a high-performance, low-cost and reliable package.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2019

Materials for thermoelectric energy conversion

A thermoelectric power generation (TEG) unit configured to be integrated into the exhaust system of a vehicle includes a plurality of thermoelectric power generator modules, each comprising an electrically interconnected plurality of p-type and n-type thermoelectric material legs, each leg extending between a substrate on a hot side and a substrate on a cold side of the module, wherein the thermoelectric materials for the legs are half-Heusler compounds having a thermoelectric figure of merit (ZT) greater than 1.0.

Samsonidze, Georgy↗
DOE OSTI2020

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

42 ENGINEERING↗
DOE OSTI2022

Scaffolding matrix with internal nanoparticles

A battery electrode composition is provided comprising composite particles, with each composite particle comprising active material and a scaffolding matrix. The active material is provided to store and release ions during battery operation. For certain active materials of interest, the storing and releasing of the ions causes a substantial change in volume of the active material. The scaffolding matrix is provided as a porous, electrically-conductive scaffolding matrix within which the active material is disposed. In this way, the scaffolding matrix structurally supports the active material, electrically interconnects the active material, and accommodates the changes in volume of the active material.

Yushin, Gleb↗
DOE OSTI2022

Scaffolding matrix with internal nanoparticles

A battery electrode composition is provided comprising composite particles, with each composite particle comprising active material and a scaffolding matrix. The active material is provided to store and release ions during battery operation. For certain active materials of interest, the storing and releasing of the ions causes a substantial change in volume of the active material. The scaffolding matrix is provided as a porous, electrically-conductive scaffolding matrix within which the active material is disposed. In this way, the scaffolding matrix structurally supports the active material, electrically interconnects the active material, and accommodates the changes in volume of the active material.

25 ENERGY STORAGE↗
DOE OSTI2024

Scaffolding matrix with internal nanoparticles

A battery electrode composition is provided comprising composite particles, with each composite particle comprising active material and a scaffolding matrix. The active material is provided to store and release ions during battery operation. For certain active materials of interest, the storing and releasing of the ions causes a substantial change in volume of the active material. The scaffolding matrix is provided as a porous, electrically-conductive scaffolding matrix within which the active material is disposed. In this way, the scaffolding matrix structurally supports the active material, electrically interconnects the active material, and accommodates the changes in volume of the active material.

Yushin, Gleb↗
DOE OSTI2024

Fitness-for-Service Analysis of Reactor Components under Flexible Load-Following Operating Conditions

Conventional power-generation plants, including nuclear plants, have been traditionally designed to provide a steady baseload energy capacity, optimizing output efficiency while minimizing variable costs. However, the growing adoption of large-scale renewable energy-generation systems, which rely on intermittent sources such as solar and wind, has introduced more variability into the energy supply in interconnected electricity grids. As a result, the next generation of power plants needs to operate in what is known as the load-following mode, requiring flexible adjustments in electricity production to align with the energy demand on the grid. This transition from the steady baseload operation to load-following operating conditions can significantly increase the number of times various plant components are exposed to transient stresses. This increased thermo-mechanical cycling can lead to accelerated material degradation, thereby elevating the risk of premature failure of a component. It becomes imperative to conduct a comprehensive analysis of fatigue, creep-fatigue, and stress corrosion cracking life, to assess the resilience of the various engineering components under these flexible load-following operating conditions. This study aims to develop a comprehensive numerical model of a light-water reactor pressure vessel (RPV) to investigate its degradation under various operating scenarios. This coupled thermo-mechanical finite element analysis evaluated the stress response of the RPV caused by considering fluctuations in thermal and mechanical loads caused by the varying pressure and temperature occurring during the load-following operation. Critical locations on the RPV are subsequently identified based on the stress response. The stress intensity factors for the postulated flaws at those locations are then calculated, followed by an evaluation of the reactor's life in accordance with the ASME Boiler and Pressure Vessel Code Section XI. This comprehensive life assessment covers a number of transients expected during the flexible load-following operation, providing invaluable insights into the RPV's structural integrity. Moreover, the development methodology can be adapted to other reactor components, as well as components of conventional power stations that are affected by varying operating conditions.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗