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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7

The internal plasma state of the high speed solar wind at 1 AU

The character of particle velocity distributions in the high speed solar wind is described. It is found that electron distribution shapes differ from simple bi-Maxwellians in that a hot strongly beamed high energy electron component is always present, and is observed to move relative to a distinct low energy electron component along the magnetic field direction away from the sun. The velocity difference between hot and cold electron components appears, at times, to be strongly correlated with the local Alfven speed. Proton velocity distributions are also best represented by two relatively convecting unresolved components. Evidence is presented which supports the idea that the two-component proton structure observed in high speed regions is intimately related to fine scale velocity variations at 1 AU, and probably to prominent spatial and/or temporal structures present throughout that part of the corona from which the solar wind evolves.

Feldman, W. C.↗

Electronics for Low-Temperature Space Operation Being Evaluated

Electronic components and systems capable of low-temperature operation are needed for many future NASA missions where it is desirable to have smaller, lighter, and cheaper (unheated) spacecraft. These missions include Mars (-20 to -120 C) orbiters, landers, and rovers; Europa (-150 C) oceanic exploratory probes and instrumentation; Saturn (-183 C) and Pluto (-229 C) interplanetary probes. At the present, most electronic equipment can operate down to only -55 C. It would be very desirable to have electronic components that expand the operating temperature range down to -233 C. The successful development of these low-temperature components will eventually allow space probes and onboard electronics to operate in very cold environments (out as far as the planet Pluto). As a result, radioisotope heating units, which are used presently to keep space electronics near room temperature, will be reduced in number or eliminated. The new cold electronics will make spacecraft design and operation simpler, more flexible, more reliable, lighter, and cheaper. Researchers at the NASA Glenn Research Center are evaluating potential commercial off-the- shelf devices and are developing new electronic components that will tolerate operation at low temperatures down to -233 C. This work is being carried out mainly inhouse and also through university grants and commercial contracts. The components include analog-to-digital converters, semiconductor switches, capacitors, dielectric and packaging material, and batteries. For example, the effect of low temperature on the capacitance of three different types of capacitors is shown in the graph. Using these advanced components, system products will be developed, including dc/dc converters, battery charge/discharge management systems, digital control electronics, transducers, and sensor instrumentation.

Patterson, Richard L.↗

Challenges with Electrical, Electronics, and Electromechanical Parts for James Webb Space Telescope

James Webb Space Telescope (JWST) is the space-based observatory that will extend the knowledge gained by the Hubble Space Telescope (HST). Hubble focuses on optical and ultraviolet wavelengths while JWST focuses on the infrared portion of the electromagnetic spectrum, to see the earliest stars and galaxies that formed in the Universe and to look deep into nearby dust clouds to study the formation of stars and planets. JWST, which commenced creation in 1996, is scheduled to launch in 2018. It includes a suite of four instruments, the spacecraft bus, optical telescope element, Integrated Science Instrument Module (ISIM, the platform to hold the instruments), and a sunshield. The mass of JWST is approximately 6200 kg, including observatory, on-orbit consumables and launch vehicle adaptor. Many challenges were overcome while providing the electrical and electronic components for the Goddard Space Flight Center hardware builds. Other difficulties encountered included developing components to work at cryogenic temperatures, failures of electronic components during development and flight builds, Integration and Test electronic parts problems, and managing technical issues with international partners. This paper will present the context of JWST from a EEE (electrical, electronic, and electromechanical) perspective with examples of challenges and lessons learned throughout the design, development, and fabrication of JWST in cooperation with our associated partners including the Canadian Space Agency (CSA), the European Space Agency (ESA), Lockheed Martin and their respective associated partners. Technical challenges and lessons learned will be discussed.

EEE Parts↗

Method of mounting a PC board to a hybrid

A system for mounting a hybrid electronic component to a PC board is disclosed. The system includes a set of brackets for mutually engaging a first surface of the PC board and a cover surface of the hybrid electronic component, wherein the cover surface has an arcuate shape when in a vacuum environment. The brackets are designed with legs having lengths and thicknesses for providing clearance between the cover surface of the hybrid and the first surface of the PC board for use when the hybrid electronic component is in a vacuum environment.

O'Coin, James R.↗

Recommendations for Enabling Manual Component Level Electronic Repair for Future Space Missions

Long duration missions to the Moon and Mars pose a number of challenges to mission designers, controllers, and the crews. Among these challenges are planning for corrective maintenance actions which often require a repair. Current repair strategies on the International Space Station (ISS) rely primarily on the use of Orbital Replacement Units (ORUs), where a faulty unit is replaced with a spare, and the faulty unit typically returns to Earth for analysis and possible repair. The strategy of replace to repair has posed challenges even for the ISS program. Repairing faulty hardware at lower levels such as the component level can help maintain system availability in situations where no spares exist and potentially reduce logistic resupply mass.This report provides recommendations to help enable manual replacement of electronics at the component-level for future manned space missions. The recommendations include hardware, tools, containment options, and crew training. The recommendations are based on the work of the Component Level Electronics Assembly Repair (CLEAR) task of the Exploration Technology Development Program from 2006 to 2009. The recommendations are derived based on the experience of two experiments conducted by the CLEAR team aboard the International Space Station as well as a group of experienced Miniature/Microminiature (2M) electronics repair technicians and instructors from the U.S. Navy 2M Project Office. The emphasis of the recommendations is the physical repair. Fault diagnostics and post-repair functional test are discussed in other CLEAR reports.

Struk, Peter M.↗

Polymeric Applications in Electronics

Training manual shows how to use polymeric materials in fabrication electronic components. Report discusses polymeric applications in fabrication of electronic components and equipment. Intended as training manual for 6-day quality assurance and technician certification course in use of polymeric materials.

Read, W. S.↗

Survey of current component reliability problems and methods for prevention.

The current reliability problems related to electronic components and microcircuits are presented in this paper. Specific process controls, design, materials, application constraints, destructive testing, electrical tests, and procedures for implementation are recommended to improve the reliability of selected electronic components.

Hamiter, L.↗

Magnetospheric multiharmonic instabilities

The paper discusses linear convective growth rates of instabilities of electrostatic multiple electron cyclotron harmonic waves in a plasma consisting of a hot electron component with a loss-cone type of free energy source and a cold electron component of presumably ionospheric origin. When the ratio of cold to hot electron temperature is small, the cold upper hybrid frequency controls the harmonic bands that can be nonconvectively stable. When this ratio increases above a few times 0.01, nonconvective instability disappears simultaneously for each harmonic band, when the density ratio is less than unity. A consistent interpretation of the spatial localization and harmonic frequency bandwidths of the observed waves can be made assuming linear convective saturation, provided that the cold electrons have temperatures considerably in excess of those in the ionosphere.

Ashour-Abdalla, M.↗

NASA Tech Briefs Index, 1976

Abstracts of new technology derived from the research and development activities of the National Aeronautics and Space Administration are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electronic systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences.

Source record↗

NASA Tech Briefs Index, 1978

Approximately 601 announcements of new technology derived from the research and development activities of the National Aeronautics and Space Administration are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electron systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences.

Source record↗

NASA Tech Briefs Index, 1979

Approximately 593 announcements of new technology derived from the research and development activities of NASA are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electronic systems; physical sciences; materials; life sciences' mechanics; machinery; fabrication technology; and mathematics and information sciences.

Source record↗

NASA Tech Briefs Index, 1980, vol. 5 nos. 1-4

Approximately 558 announcements of new technology derived from the research and development activities of NASA are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electronic systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences.

Source record↗

Index to 1981 NASA Tech Briefs, volume 6, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1981 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences.

Source record↗

Index to 1982 NASA Tech Briefs, volume 7, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1982 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences.

Source record↗