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At least 127 records · Page 7

Sinterless contacts to shallow junction InP solar cells

In the past, the achievement of good electrical contact to InP has inevitably been accompanied by mechanical degradation of the InP itself. Most contact systems require heat treatment after metal deposition that results in the dissolution of substantial amounts of InP into the metallization. Devices such as the solar cell, where shallow junctions are the rule, can be severely degraded if the damage to the semiconductor substrate is not precisely controlled. Two contact systems are described that provide low contact resistance to InP solar cells that do not require subjecting the current carrying metallization to a post deposition sintering process. It is shown that these two systems, one nickel based and the other silver based, provide contact resistivity values in the low 10(exp -6) ohm sq cm range, as fabricated, without the need for sintering.

Weizer, V. G.↗

Development of economical improved thick film solar cell contact

Materials were surveyed to provide candidates for an all metal electrode paste system. These consisted of a major constituent metal powder, a low melting metal powder suitable for a liquid phase sintering medium, and a powder material suitable as an etchant for silicon dioxide at sintering temperatures. By means of thermal gravimetric analysis a suitable binder was identified for low temperature fired inks. The all metal ink concept was first demonstrated with the silver system to avoid the problems of limited process windows encountered with base metal systems. A number of solid materials capable of selectively etching silicon dioxide at modest temperatures were identified. A paste with silver fluoride was screened onto N-type silicon with 5 ohm cm resistivity. The resulting contact pads had excellent adhesion but were not electrically ohmic. Metallurgically, these contacts have equal or better grain structure as commercial inks fired at the same temperatures.

Ross, B.↗

Dislocation generation during early stage sintering.

Discussion of the effects of capillarity-induced stresses on dislocations during early stage sintering. A special version of Hirth's (1963) theoretical calculation procedures modified to describe dislocation nucleation on planes meeting the sintering body's neck surface obliquely is shown to predict plastic flow at stress levels know to exist between micron size metal particles in the early stages of sintering.

Sheehan, J. E.↗

Low resistance silver contacts to indium phosphide - Electrical and metallurgical considerations

The electrical and metallurgical behavior of the Ag-InP contact system has been investigated. Specific contact resistivity (Rc) values in the low 10 exp -6 Ohm sq cm range are readily achieved on n-InP (Si: 1.7 x 10 exp 18/cu cm) after sintering at 400 C for several minutes. The low Rc values, however, are shown to be accompanied by dissolution of InP into the metallization, resulting in device degradation. An analysis of the sinter-induced metallurgical interactions shows this system to be similar to the well-characterized Au-InP system, albeit with fundamental differences. The similarities include the dissociative diffusion of In, the reaction-suppressing effect of SiO2 capping, and especially, the formation of a phosphide layer at the metal-InP interface. The low post-sinter Rc values in the Ag-InP system may be due to the presence of a AgP2 layer at the metal-InP interface; low values of Rc can be achieved without incurring device degrading metallurgical interactions by introducing a thin AgP2 layer between the InP and the current carrying metallization.

Weizer, Victor G.↗

Composite fiber structures for catalysts and electrodes

We have recently envisioned a process wherein fibers of various metals in the 0.5 to 15 micron diameter range are slurried in concert with cellulose fibers and various other materials in the form of particulates and/or fibers. The resulting slurry is cast via a wet-lay process into a sheet and dried to produce a free-standing sheet of 'composite paper.' When the 'preform' sheet is sintered in hydrogen, the bulk of the cellulose is removed with the secondary fibers and/or particulates being entrapped by the sinter-locked network provided by the metal fibers. The resulting material is unique, in that it allows the intimate contacting and combination of heretofore mutually exclusive materials and properties. Moreover, due to the ease of paper manufacture and processing, the resulting materials are relatively inexpensive and can be fabricated into a wide range of three-dimensional structures. Also, because cellulose is both a binder and a pore-former, structures combining high levels of active surface area and high void volume (i.e., low pressure drop) can be prepared as freestanding flow through monoliths.

Marrion, Christopher J.↗

High temperature resistant cermet and ceramic compositions

High temperature oxidation resistance, high hardness and high abrasion and wear resistance are properties of cermet compositions particularly to provide high temperature resistant refractory coatings on metal substrates, for use as electrical insulation seals for thermionic converters. The compositions comprise a sintered body of particles of a high temperature resistant metal or metal alloy, preferably molybdenum or tungsten particles, dispersed in and bonded to a solid solution formed of aluminum oxide and silicon nitride, and particularly a ternary solid solution formed of a mixture of aluminum oxide, silicon nitride and aluminum nitride. Ceramic compositions comprising a sintered solid solution of aluminum oxide, silicon nitride and aluminum nitride are also described.

Phillips, W. M.↗

Array Automated Assembly Task for the Low Cost Solar Array Project, Phase 2

Using silk screened evaporated and sputtered Al as the metal source, the formation of Al back surface fields was studied. The most satisfactory results were those obtained with the sputtered A1 and in which open circuit voltages (V sub oc) of 0.585 v (12 ohm cm FZ silicon) were achieved. The ultrasonic interconnect process is discussed. The process is shown to be satisfactory, but increased pull-strength may be obtained if some form of sintering is carried out on the metallized contacts. Plasma etching is shown to be feasible as a replacement for wet chemical cleaning prior to diffusion. Initial results on cells prepared by using electroless Pd/Ni plus either electroplated Ag or Cu show slightly poor performance than cells with the baseline evaporated Ti/Pd/Ag system. A mask designed for the 1.6 x 7.0 cm and 2.0 x 7.0 cm cells is described. This mask has a lower area coverage and total lower resistive loss than the previous mask design. It is also shown that the cell width should not exceed 2.0 - 3.0 cm for optimum efficiency.

Campbell, R. B.↗

Non-destructive, ultra-low resistance, thermally stable contacts for use on shallow junction InP solar cells

Contact formation to InP is plagued by violent metal-semiconductor intermixing that takes place during the contact sintering process. Because of this the InP solar cell cannot be sintered after contact deposition. This results in cell contact resistances that are orders of magnitude higher than those that could be achieved if sintering could be performed in a non-destructive manner. We report here on a truly unique contact system involving Au and Ge, which is easily fabricated, which exhibits extremely low values of contact resistivity, and in which there is virtually no metal-semiconductor interdiffusion, even after extended sintering. We present a description of this contact system and suggest possible mechanisms to explain the observed behavior.

Weizer, V. G.↗

Design, fabrication, and evaluation of charge-coupled devices with aluminum-anodized-aluminum gates

A 4-phase, 49 1/2 bit CCD shift register was designed and fabricated using two levels of aluminum metallization with anodic Al2O3 insulation separating the layers. Test circuitry was also designed and constructed. A numerical analysis of an MOS-RC transmission line was made and results are given to characterize performance for various conductivities. The electrical design of the CCD included a low-noise dual-gate input and a balanced floating diffusion output circuit. Metallization was accomplished both by low voltage DC sputtering and thermal evaporation. The audization was according to published procedures using a buffered tartaric acid bath. Approximately 20 wafers were processed with 50 complete chips per wafer. All devices failed by shorting between the metal levels at some point. Experimental procedures eliminated temperature effects from sintering and drying, anodic oxide thickness, edge effects, photoresist stripping procedures, and metallization techniques as the primary causes of failure. It was believed from a study of SEM images that protuberances (hillocks) grow up from the first level metal through the oxide either causing a direct short or producing a weak, highly stressed insulation point which fails at low voltage. The cause of these hillocks is unknown; however, they have been observed to grow during temperature excursions to 470 C.

Gassaway, J. D.↗

Preparation and evaluation of thin-film sodium tungsten bronzes

Thin films of sodium tungsten bronze (NaxWO3) were investigated as reversible sodium ion electrodes for solid electrolytes. The films were made by electron beam evaporation of the three phases, W metal, Na2WO4, and WO3, followed by sintering. The substrates were sodium beta alumina disks and glass slides. X-ray diffraction analyses of the films showed that sintering in dry nitrogen with prior exposure to air lead to mixed phases. Sintering in vacuum with no air exposure produced tetragonal I bronze with a nominal composition of Na0.31WO3, single phase within the limits of X-ray diffraction detectability. The films were uniform and adherent on sodium beta alumina substrates. The ac and dc conductivities of the beta alumina were measured with the sodium tungsten bronze films as electrodes. These experiments indicated that the tetragonal I bronze electrodes were not completely reversible. This may have resulted from sodium ion blocking within the bronze film or at the bronze beta alumina interface. Methods for attempting to make more completely reversible electrodes are suggested.

Kautz, H. E.↗

Study on the mechanism of liquid phase sintering (M-12)

The objectives were to (1) obtain the data representing the growth rate of solid particles in a liquid matrix without the effect of gravity; and (2) reveal the growth behavior of solid particles during liquid phase sintering using the data obtained. Nickel and tungsten are used as the constituent materials in liquid phase sintering. The properties of the constituent metals are given. When a compact of the mixture of tungsten and nickel powders is heated and kept at 1550 C, nickel melts down but tungsten stays solid. As the density of tungsten is much greater than that of nickel, the sedimentation of tungsten particles occurs in the experiment on Earth. The difference between the experiments on Earth and in space is illustrated. The tungsten particles sink to the bottom and are brought into contact with each other. The resulting pressure at the contact point causes the accelerated dissolution of tungsten. Consequently, flat surfaces are formed at the contact sites. As a result of dissolution and reprecipitation of tungsten, the shape of particles changes to a polygon. This phenomenon is called 'flattening.' An example of flattening of tungsten particles is shown. Thus, the data obtained by the experiment on Earth may not represent the exact growth behavior of the solid particles in a liquid matrix. If the experiments were done in a microgravity environment, the data corresponding to the theoretical growth behavior of solid particles could be achieved.

Kohara, S.↗

Method of forming a relatively stable slip of silicon metal particles and yttrium containing particles

The method concerns forming a relatively stable slip of silicon metal particles and yttrium containing particles. In one embodiment, a casting slip of silicon metal particles is formed in water. Particles of a yttrium containing sintering aid are added to the casting slip. The yttrium containing sintering aid is a compound which has at least some solubility in water to form Y.sup.+3 ions which have a high potential for totally flocculating the silicon metal particles into a semiporous solid. A small amount of a fluoride salt is added to the casting slip which contains the yttrium containing sintering aid. The fluoride salt is one which will produce fluoride anions when dissolved in water. The small amount of the fluoride anions produced are effective to suppress the flocculation of the silicon metal particles by the Y.sup.+3 ions so that all particles remain in suspension in the casting slip and the casting slip has both an increased shelf life and can be used to cast articles having a relatively thick cross-section. The pH of the casting slip is maintained in a range from 7.5 to 9. Preferably, the fluoride salt used is one which is based on a monovalent cation such as sodium or ammonia. The steps of adding the yttrium containing sintering aid and the fluoride salt may be interchanged if desired, and the salt may be added to a solution containing the sintering aid prior to addition of the silicon metal particles.

Dickie, Ray A.↗

Radiant heating tests of several liquid metal heat-pipe sandwich panels

Integral heat pipe sandwich panels, which synergistically combine the thermal efficiency of heat pipes and the structural efficiency of honeycomb sandwich construction, were conceived as a means of alleviating thermal stress problems in the Langley Scramjet Engine. Test panels which utilized two different wickable honeycomb cores, facesheets with screen mesh sintered to the internal surfaces, and a liquid metal working fluid (either sodium or potassium) were tested by radiant heating at various heat load levels. The heat pipe panels reduced maximum temperature differences by 31 percent with sodium working fluid and 45 percent with potassium working fluid. Results indicate that a heat pipe sandwich panel is a potential, simple solution to the engine thermal stress problem. Other interesting applications of the concept include: cold plates for electronic component and circuit card cooling, radiators for large space platforms, low distortion large area structures (e.g., space antennas) and laser mirrors.

Camarda, C. J.↗

Radiant heating tests of several liquid metal heat-pipe sandwich panels

Integral heat-pipe sandwich panels, which synergistically combine the thermal efficiency of heat pipes and the structural efficiency of honeycomb sandwich construction, were conceived as a means of alleviating thermal stress problems in the Langley Scramjet Engine. Test panels which utilized two different wickable honeycomb cores, facesheets with screen mesh sintered to the internal surfaces, and a liquid metal working fluid (either sodium or potassium) were tested by radiant heating at various heat-load levels. The heat-pipe panels reduced maximum temperature differences by 31 percent with sodium working fluid and 45 percent with potassium working fluid. Results indicate that a heat-pipe sandwich panel is a potential, simple solution to the engine thermal stress problem. Other interesting applications of the concept include: cold plates for electronic component and circuit card cooling, radiators for large space platforms, low-distortion large area structures (e.g., space antennas) and laser mirrors.

Camarda, C. J.↗

Development of Economical Improved Thick Film Solar Cell Contact

Materials were surveyed to provide candidates for an all metal electrode paste system. These consisted of a major constituent metal powder, a low melting metal powder suitable for a liquid phase sintering medium, and a powder material suitable as an etchant for silicon dioxide at sintering temperatures. By means of thermal gravimetric analysis a suitable binder was identified for low temperature fired inks.

Ross, B.↗

The effect of different alkali metal hydroxides on nickel electrode life

An accelerated cycle-life test (100-percent depth of discharge) of a sintered-type Ni electrode has been carried out in a flooded cell containing different alkali metal hydroxide electrolytes such as LiOH, NaOH, KOH, RbOH, and CsOH. Decrease in Ni electrode capacity with cycling was reduced as the radius of the alkali metal ions, with possible exception of CsOH.

Lim, H. S.↗

Laboratory studies on cometary crust formation: The importance of sintering

It is demonstrated by experiments and theoretical considerations that sintering processes, so far used to describe the densification of metal and ceramic powders, are relevant for icy materials and therefore probably also for comets. A theoretical model is presented which describes the evolution of so called sinter necks, the contact zone between ice particles. With this model the strength increase of a porous, loosley packed icy body is calculated in which the sinter necks grow by evaporation and condensation of water vapor at a constant temperature. Experiments with ice powders validate the model qualitatively. An increase in strength up to a factor of four is observed during isothermal sintering. In order to check the relevance of the experimental results and the basic theoretical ideas with respect to real comets, more exact theories and improved experiments taking into account additional mass transport mechanisms are needed.

Ratke, L.↗