Search NASA⌕ Search

SEARCH · Search NASA

Results for “on-chip”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Supercomputing systems - A projection to 2000

Advances in computer architecture, computer science, computational methods, and constituent technologies are expected to lead to significant advances in the performance of scientific supercomputing system capabilities over the next decade. By the year 2000, single 1-in-sq dies are projected to incorporate four processors, each of which would be operating faster than 750 million instructions per second (MIPS) for a total on-chip processing performance in excess of 2000 MIPS. Scalable parallel processors can be expected to contain thousands of such multiple processor chips. In general, semiconductor performance advances appear to change about one order of magnitude every five years. Rotating magnetic memory and communications technology are not advancing as rapidly, with the result that the allocation of functions within the system configurations fo future supercomputer systems will require important changes. Availability of massively parallel heterogeneous processing capabilities should be a catalyst leading to new approaches for applications.

Lundstrom, S. F.↗
NASA NTRS1991

Non-volatile, high density, high speed, Micromagnet-Hall effect Random Access Memory (MHRAM)

The micromagnetic Hall effect random access memory (MHRAM) has the potential of replacing ROMs, EPROMs, EEPROMs, and SRAMs because of its ability to achieve non-volatility, radiation hardness, high density, and fast access times, simultaneously. Information is stored magnetically in small magnetic elements (micromagnets), allowing unlimited data retention time, unlimited numbers of rewrite cycles, and inherent radiation hardness and SEU immunity, making the MHRAM suitable for ground based as well as spaceflight applications. The MHRAM device design is not affected by areal property fluctuations in the micromagnet, so high operating margins and high yield can be achieved in large scale integrated circuit (IC) fabrication. The MHRAM has short access times (less than 100 nsec). Write access time is short because on-chip transistors are used to gate current quickly, and magnetization reversal in the micromagnet can occur in a matter of a few nanoseconds. Read access time is short because the high electron mobility sensor (InAs or InSb) produces a large signal voltage in response to the fringing magnetic field from the micromagnet. High storage density is achieved since a unit cell consists only of two transistors and one micromagnet Hall effect element. By comparison, a DRAM unit cell has one transistor and one capacitor, and a SRAM unit cell has six transistors.

Wu, Jiin C.↗
NASA NTRS1992

Dynamically-allocated multi-queue buffers for VLSI communication switches

Several buffer structures are discussed and compared in terms of implementation complexity, interswitch handshaking requirements, and their ability to deal with variations in traffic patterns and message lengths. A new design of buffers is presented that provide non-FIFO message handling and efficient storage allocation for variable size packets using linked lists managed by a simple on-chip controller. The new buffer design is evaluated by comparing it to several alternative designs in the context of a multistage interconnection network. The present modeling and simulations show that the new buffer outperforms alternative buffers and can thus be used to improve the performance of a wide variety of systems currently using less efficient buffers.

Tamir, Yuval↗
NASA NTRS1992

Double dipole antenna SIS receivers at 100 and 400 GHz

Antenna patterns were measured between 95 and 120 GHz for a double dipole antenna / ellipsoidal lens combination. The structure produces a non-astigmatic beam with low side lobe levels over that whole band. A heterodyne SIS receiver based on this concept gave a best noise temperature of 145 K DSB at 98 GHz. Measurements were also made with a 400 GHz heterodyne SIS receiver, using a double dipole antenna in conjunction with a hyperhemispherical lens. The best noise temperature was 220 K DSB at 402 GHz. On-chip stubs were used to tune out the SIS junction capacitance.

Skalare, A.↗
NASA NTRS1989

Comparisons between Intel 386 and i486 microprecessors

A quick and preliminary comparison is made between the Intel 386 and i486 microprocessors. The following topics are discussed: the i486 key elements, comparison of instruction set architecture, the i486 on-chip cache characteristics, the i486 multiprocessor support, comparison of performance, comparison of power consumption, comparison of radiation hardening potential, and recommendations for the Space Station Freedom (SSF) Data Management System (DMS).

Liu, Yuan-Kwei↗
NASA NTRS1991

Performance of defect-tolerant set-associative cache memories

The increased use of on-chip cache memories has led researchers to investigate their performance in the presence of manufacturing defects. Several techniques for yield improvement are discussed and results are presented which indicate that set-associativity may be used to provide defect tolerance as well as improve the cache performance. Tradeoffs between several cache organizations and replacement strategies are investigated and it is shown that token-based replacement may be a suitable alternative to the widely-used LRU strategy.

Frenzel, J. F.↗
NASA NTRS1991

SPROC: A multiple-processor DSP IC

A large, single-chip, multiple-processor, digital signal processing (DSP) integrated circuit (IC) fabricated in HP-Cmos34 is presented. The innovative architecture is best suited for analog and real-time systems characterized by both parallel signal data flows and concurrent logic processing. The IC is supported by a powerful development system that transforms graphical signal flow graphs into production-ready systems in minutes. Automatic compiler partitioning of tasks among four on-chip processors gives the IC the signal processing power of several conventional DSP chips.

Davis, R.↗
NASA NTRS1988

Ku-band high efficiency GaAs MMIC power amplifiers

The development of Ku-band high efficiency GaAs MMIC power amplifiers is examined. Three amplifier modules operating over the 13 to 15 GHz frequency range are to be developed. The first MMIC is a 1 W variable power amplifier (VPA) with 35 percent efficiency. On-chip digital gain control is to be provided. The second MMIC is a medium power amplifier (MPA) with an output power goal of 1 W and 40 percent power-added efficiency. The third MMIC is a high power amplifier (HPA) with 4 W output power goal and 40 percent power-added efficiency. An output power of 0.36 W/mm with 49 percent efficiency was obtained on an ion implanted single gate MESFET at 15 GHz. On a dual gate MESFET, an output power of 0.42 W/mm with 27 percent efficiency was obtained. A mask set was designed that includes single stage, two stage, and three stage single gate amplifiers. A single stage 600 micron amplifier produced 0.4 W/mm output power with 40 percent efficiency at 14 GHz. A four stage dual gate amplifier generated 500 mW of output power with 20 dB gain at 17 GHz. A four-bit digital-to-analog converter was designed and fabricated which has an output swing of -3 V to +/- 1 V.

Tserng, H. Q.↗
NASA NTRS1992

Fault detection and bypass in a sequence information signal processor

The invention comprises a plurality of scan registers, each such register respectively associated with a processor element; an on-chip comparator, encoder and fault bypass register. Each scan register generates a unitary signal the logic state of which depends on the correctness of the input from the previous processor in the systolic array. These unitary signals are input to a common comparator which generates an output indicating whether or not an error has occurred. These unitary signals are also input to an encoder which identifies the location of any fault detected so that an appropriate multiplexer can be switched to bypass the faulty processor element. Input scan data can be readily programmed to fully exercise all of the processor elements so that no fault can remain undetected.

Peterson, John C.↗
NASA NTRS1977

Bubble domain circuit organization

An on-chip bubble domain circuit organization. One or more storage registers are connected to a propagation path whereby data in the form of magnetic bubble domains (bubbles) may be transferred into and out of the storage registers. The propagation path includes a generator for producing the initial bubbles which are expanded into any desired number of new bubbles by a unique multiple output replicator. A unique input decoder is utilized to determine to which storage register the bubbles from the replicator will be directed along the propagation path. Those bubbles not selected may be annihilated. An output decoder utilizing essentially the same decoding scheme as the input decoder, selectively receives bubbles from the storage register. A transfer and replicate switch is utilized between the storage register and output decoder to selectively transfer bubbles to the output decoder. The output decoder may collapse all of the bubbles from certain storage registers so that only the information from the selected storage register reaches the detector. The detectors in turn produce the chip output signal. External control electronics are utilized to control the selective operation of the various devices utilized in the propagation path.

Chen, Thomas T.↗
DOE OSTI2025

A Synthesis Methodology for Intelligent Memory Interfaces in Accelerator Systems

Domain-specific systems improve the performance of a specific set of applications compared to general-purpose processing systems by deploying custom hardware accelerators. These hardware accelerators are generated using high-level synthesis (HLS) tools. The HLS tools enable a comprehensive design space exploration to optimize the compute performance of the generated accelerators. However, they often ignore the challenges of implementing the accelerators in a system-on-chip, particularly how the accelerators access memory. Our work introduces a buffering system design that improves accelerators' memory accesses by intelligently employing burst transactions to prefetch useful data from external memory to on-chip local buffers. Our design is dynamic, parametric, and transparent to the accelerators generated by HLS tools. We derive the buffering system parameters using appropriate compiler-based analysis passes and memory channel latency constraints. The proposed buffering system design results in, on average, 8.8x performance improvements while lowering memory channel utilization on average by 53.2% for a set of PolyBench kernels.

Limaye, Ankur M. (ORCID:0000000194062584)↗
DOE OSTI2025

Design and Performance of the SPT-SLIM Receiver Cryostat

The South Pole Telescope Shirokoff Line Intensity Mapper (SPT-SLIM) is a millimeter-wavelength line-intensity mapping experiment, which was deployed on the South Pole Telescope (SPT) during the 2024-2025 Austral summer season. This pathfinder experiment serves to demonstrate the on-sky operation of multi-pixel on-chip spectrometer technology. We report on the cryogenic performance of the SPT-SLIM receiver for the first year of commissioning observations. The SPT-SLIM receiver utilizes an Adiabatic Demagnetization Refrigerator (ADR) for cooling the focal plane of superconducting filterbank spectrometers to a temperature of 150 mK. We demonstrate stable thermal performance of the focal plane module during observations consistent with thermal modeling, enabling a cryogenic operating efficiency above 80%. We also report on the receiver control system design utilizing the Observatory Control System (OCS) platform for automated cryogenic operation on the SPT.

Young, M. R. [Fermilab; Chicago U., KICP]↗
DOE OSTI2025

An On-Sky Atmospheric Calibration of SPT-SLIM

We present the methodology and results of the on-sky responsivity calibration of the South Pole Telescope Shirokoff Line Intensity Mapper (SPT-SLIM). SPT-SLIM is a pathfinder line intensity mapping experiment utilizing the on-chip spectrometer technology, and was first deployed during the 2024-2025 Austral Summer season on the South Pole Telescope. During the two-week on-sky operation of SPT-SLIM, we performed periodic measurements of the detector response as a function of the telescope elevation angle. Combining these data with atmospheric opacity measurements from an on-site atmospheric tipping radiometer, simulated South Pole atmospheric spectra, and measured detector spectral responses, we construct estimates for the responsivity of SPT-SLIM detectors to sky loading. We then use this model to calibrate observations of the moon taken by SPT-SLIM, cross-checking the result against the known brightness temperature of the Moon as a function of its phase.

Dibert, K. R. [Chicago U., Astron. Astrophys. Ctr.↗
DOE OSTI2025

Obsidian

Obsidian A35 is a compact FPGA carrier board designed to interface with ADCs, DACs or other devices, either stand-alone or as an I/O expansion board. The connectivity includes 1 GigE, 4 SFP, 6 PMOD, FTDI USB and Arduino shield compatible header. The board features also a FPGA boot SPI Flash, on-chip DDR3 memory, VCXO and White Rabbit compatibility.

Moore, Victoria [Lawrence Berkeley National Labora↗
DOE OSTI2026

A Sub-electron-noise Skipper-CCD Readout ASIC with Improved Channel-to-channel Isolation and an Integrated Cryogenic Voltage Reference

The MIDNA application specific integrated circuits (ASICs) are a series of skipper-CCD readout chips fabricated in a 65 nm low-power CMOS process that implement a correlated double sampling signal processing chain based on dual-slope integrators. They are capable of working from room to cryogenic temperatures, down to 84 K. The present iteration of the ASIC has been fabricated including several design updates and the addition of an on-chip voltage reference, resulting in improved performance. This work presents the main vulnerabilities solved, the changes carried out, and the resulting performance benefits. Measurements with a skipper-CCD and the ASIC at 140 K showed that the single-electron resolution can be reached by averaging the measured charge in the analog domain using the analog pile-up technique with a readout noise as low as 0.11 erms of equivalent charge for 1200 samples. The channel-to-channel crosstalk was also characterized showing values better than -62 dB.

Alcalde Bessia, Fabricio↗
DOE OSTI2026

A Sub-electron-noise Skipper-CCD Readout ASIC with Improved Channel-to-channel Isolation and an Integrated Cryogenic Voltage Reference

The MIDNA application specific integrated circuits (ASICs) are a series of skipper-CCD readout chips fabricated in a 65 nm low-power CMOS process that implement a correlated double sampling signal processing chain based on dual-slope integrators. They are capable of working from room to cryogenic temperatures, down to 84 K. The present iteration of the ASIC has been fabricated including several design updates and the addition of an on-chip voltage reference, resulting in improved performance. This work presents the main vulnerabilities solved, the changes carried out, and the resulting performance benefits. Measurements with a skipper-CCD and the ASIC at 140 K showed that the single-electron resolution can be reached by averaging the measured charge in the analog domain using the analog pile-up technique with a readout noise as low as 0.11 erms of equivalent charge for 1200 samples. The channel-to-channel crosstalk was also characterized showing values better than -62 dB.

Alcalde Bessia, Fabricio↗
DOE OSTI2026

A 3D-Printed Millimeter-Wave Inline Waveguide-to-Coplanar-Waveguide Transition to Enable Dense Spectrometer Arrays for Intensity Mapping Surveys

We present a 3D-printed millimeter-wave, octave-bandwidth, in-line waveguide-to-coplanar-waveguide transition designed to enable focal planes with dense arrays of on-chip spectrometers. These arrays will enable compelling surveys of the large-scale structure of the universe through millimeter-wave intensity mapping. The transition consists of a four-step ridge-waveguide transformer that couples light from a rectangular waveguide onto a coplanar waveguide via an electrical connection made with indium bump bonds. We develop a tolerance-aware optimization approach to identify high-performance transition geometries that are robust to manufacturing variations; the same formulation can be applied to other tolerance-sensitive design problems. We also describe the implementation of a custom apparatus and procedure for bump-bonding a silicon chip to a metallized 3D-printed component. We detail the fabrication of the coplanar waveguide chip and three-dimensional waveguide structure, simulations and metrology of a test device, and room temperature reflectance measurements of this device. The room temperature metrology and reflection measurements are consistent with a model that predicts a coupling efficiency of $\mathord{\sim} 95\%$ at cryogenic temperatures in the 85-170 GHz frequency range.

Stover, Austin [Chicago U.; Chicago U., KICP] (ORC↗