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Controlled wetting and spreading of metals on substrates using porous interlayers and related articles
The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.
Gratings Fabricated on Flat Surfaces and Reproduced on Non-Flat Substrates
A method has been developed for fabricating gratings on flat substrates, and then reproducing the groove pattern on a curved (concave or convex) substrate and a corresponding grating device. First, surface relief diffraction grating grooves are formed on flat substrates. For example, they may be fabricated using photolithography and reactive ion etching, maskless lithography, holography, or mechanical ruling. Then, an imprint of the grating is made on a deformable substrate, such as plastic, polymer, or other materials using thermoforming, hot or cold embossing, or other methods. Interim stamps using electroforming, or other methods, may be produced for the imprinting process or if the same polarity of the grating image is required. The imprinted, deformable substrate is then attached to a curved, rigid substrate using epoxy or other suitable adhesives. The imprinted surface is facing away from the curved rigid substrate. As an alternative fabrication method, after grating is imprinted on the deformable substrate as described above, the grating may be coated with thin conformal conductive layer (for example, using vacuum deposition of gold). Then the membrane may be mounted over an opening in a pressured vessel in a manner of a membrane on a drum, grating side out. The pressure inside of the vessel may be changed with respect to the ambient pressure to produce concave or convex membrane surface. The shape of the opening may control the type of the surface curvature (for example, a circular opening would create spherical surface, oval opening would create toroidal surface, etc.). After that, well-known electroforming methods may be used to create a replica of the grating on the concave or convex membrane. For example, the pressure vessel assembly may be submerged into an electro-forming solution and negative electric potential applied to the metal coated membrane using an insulated wire. Positive electric potential may be then applied to a nickel or other metal plate submerged into the same solution. Metal ions would transfer from the plate through the solution into the membrane, producing high fidelity metal replica of the grating on the membrane. In one variation, an adhesive may be deposited on the deformable substrate, and then cured without touching the rigid, curved substrate. Edges of the deformable substrate may be attached to the rigid substrate to ensure uniform deformation of the deformable substrate. The assembly may be performed in vacuum, and then taken out to atmospheric pressure conditions to ensure that no air is trapped between the deformable and rigid substrates. Alternatively, a rigid surface with complementary curvature to the rigid substrate may be used to ensure uniform adhesion of the deformable substrate to the rigid substrate. Liquid may be applied to the surface of the deformable substrate to uniformly distribute pressure across its surface during the curing or hardening of the adhesive, or the film may be pressed into the surface using a deformable object or surface. After the attachment is complete, the grooves may be coated with reflective or dielectric layers to improve diffraction efficiency.
CRADA Number NFE-18-07342 with Lux Semiconductors, LLC (CRADA Final Report)
Lux Semiconductors is a flexible microelectronics startup developing a new class of Systemon-Foil electronics for rapidly emerging Internet-of-Things (IoT) markets. By leveraging its patent pending breakthrough in thin-film recrystallization, Lux is able to produce highly crystalline and flexible silicon substrates on a thin metal backing. This novel platform allows for high-speed silicon circuitry to be patterned directly into the substrate alongside low-cost printed electronics. The System-on-Foil approach has potential to enable the fabrication and integration of all core IoT functionality, including microprocessors, sensors, antennas, interconnects, and power supplies, required to enable highly durable, low profile, flexible electronics.
Screen printed interdigitated back contact solar cell
Interdigitated back contact solar cells are made by screen printing dopant materials onto the back surface of a semiconductor substrate in a pair of interdigitated patterns. These dopant materials are then diffused into the substrate to form junctions having configurations corresponding to these patterns. Contacts having configurations which match the patterns are then applied over the junctions.
General technique for the integration of MIC/MMIC'S with waveguides
A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.
Growth And Patterning Of High-Tc Superconducting Films
Superconducting films of YBa(2)Cu(3)O(7-delta), having high superconducting-transition temperatures (Tc's), deposited on LaAlO3 substrates and etched into patterns representative of passive microwave devices, with no deterioration of superconducting properties.
Three-dimensional imaging using coherent x rays at grazing incidence geometry
We have developed a three-dimensional coherent diffraction imaging algorithm to retrieve phases of diffraction patterns of samples in grazing incidence small angle x-ray scattering experiments. The algorithm interprets the diffraction patterns using the distorted-wave Born approximation instead of the Born approximation, as in this case, the existence of a reflected beam from the substrate causes the diffraction pattern to deviate significantly from the simple Fourier transform of the object. Detailed computer simulations show that the algorithm works. Verification with real experiments is planned.
Nanostructured layer for graded index freeform optics
The present disclosure relates to a method for creating an optical component having a spatially controlled refractive index. The method may involve applying a thin metal material layer to a substrate. The thin metal material layer may then be heated to create a mask having a spatially varying nano-particle distribution. The substrate may then be etched, using the mask, to imprint a spatially patterned nanostructure pattern on a surface the substrate.
System and method for repeated metal deposition-dewetting steps to form a nano-particle etching mask producing thicker layer of engraved metasurface
A method and system is disclosed for creating an optical component having a spatially controlled refractive index and uniform anti-reflective layer. The method may involve alternately depositing and dewetting two or more thin metal material layers on the substrate to form a mask having a spatially varying nano-particle distribution, and with an increased thickness beyond what could be achieved using a single, thick layer of the same material. The substrate may then be etched, using the mask, to imprint a spatially patterned nanostructure pattern on a surface the substrate in accordance with the mask.
Distributed Capacitive Sensor for Sample Mass Measurement
Previous robotic sample return missions lacked in situ sample verification/ quantity measurement instruments. Therefore, the outcome of the mission remained unclear until spacecraft return. In situ sample verification systems such as this Distributed Capacitive (DisC) sensor would enable an unmanned spacecraft system to re-attempt the sample acquisition procedures until the capture of desired sample quantity is positively confirmed, thereby maximizing the prospect for scientific reward. The DisC device contains a 10-cm-diameter pressure-sensitive elastic membrane placed at the bottom of a sample canister. The membrane deforms under the weight of accumulating planetary sample. The membrane is positioned in close proximity to an opposing rigid substrate with a narrow gap. The deformation of the membrane makes the gap narrower, resulting in increased capacitance between the two parallel plates (elastic membrane and rigid substrate). C-V conversion circuits on a nearby PCB (printed circuit board) provide capacitance readout via LVDS (low-voltage differential signaling) interface. The capacitance method was chosen over other potential approaches such as the piezoelectric method because of its inherent temperature stability advantage. A reference capacitor and temperature sensor are embedded in the system to compensate for temperature effects. The pressure-sensitive membranes are aluminum 6061, stainless steel (SUS) 403, and metal-coated polyimide plates. The thicknesses of these membranes range from 250 to 500 m. The rigid substrate is made with a 1- to 2-mm-thick wafer of one of the following materials depending on the application requirements glass, silicon, polyimide, PCB substrate. The glass substrate is fabricated by a microelectromechanical systems (MEMS) fabrication approach. Several concentric electrode patterns are printed on the substrate. The initial gap between the two plates, 100 m, is defined by a silicon spacer ring that is anodically bonded to the glass substrate. The fabricated proof-of-concept devices have successfully demonstrated tens to hundreds of picofarads of capacitance change when a simulated sample (100 g to 500 g) is placed on the membrane.
Space environmental effects on LDEF composites: A leading edge coated graphite epoxy panel
The electronics module cover for the leading edge (Row D 9) experiment M0003-8 was fabricated from T300 graphite/934 epoxy unidirectional prepreg tape in a (O(sub 2), +/- 45, O(sub 2), +/- 45, 90, 0)(sub s) layup. This 11.75 in x 16.75 in panel was covered with thermal control coatings in three of the four quadrants with the fourth quadrant uncoated. The composite panel experienced different thermal cycling extremes in each quadrant due to the different optical properties of the coatings and bare composite. The panel also experienced ultraviolet (UV) and atomic oxygen (AO) attack as well as micrometeoroid and space debris impacts. An AO reactivity of 0.99 x 10(exp -24) cm(sup 3)/atom was calculated for the bare composite based on thickness loss. The white urethane thermal control coatings (A276 and BMS 1060) prevented AO attack of the composite substrate. However, the black urethane thermal control coating (Z306) was severely eroded by AO, allowing some AO attack of the composite substrate. An interesting banding pattern on the AO eroded bare composite surface was investigated and found to match the dimensions of the graphite fiber tow widths as prepregged. Also, erosion depths were greater in the darker bands. Five micrometeoroid/space debris impacts were cross sectioned to investigate possible structural damage as well as impact/AO interactions. Local crushing and delaminations were found to some extent in all of the impacts. No signs of coating undercutting were observed despite the extensive AO erosion patterns seen in the exposed composite material at the impact sites. An extensive microcrack study was performed on the panel along with modeling of the thermal environment to estimate temperature extremes and thermal shock. The white coated composite substrate displayed almost no microcracking while the black coated and bare composite showed extensive microcracking. Significant AO erosion was seen in many of the cracks in the bare composite.
Joining of Silicon Carbide: Diffusion Bond Optimization and Characterization
Joining and integration methods are critically needed as enabling technologies for the full utilization of advanced ceramic components in aerospace and aeronautics applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. In the application, several SiC substrates with different hole patterns to form fuel and combustion air channels are bonded to form the injector. Diffusion bonding is a joining approach that offers uniform bonds with high temperature capability, chemical stability, and high strength. Diffusion bonding was investigated with the aid of titanium foils and coatings as the interlayer between SiC substrates to aid bonding. The influence of such variables as interlayer type, interlayer thickness, substrate finish, and processing time were investigated. Optical microscopy, scanning electron microscopy, and electron microprobe analysis were used to characterize the bonds and to identify the reaction formed phases.
Methodology to determine printability criteria of highly concentrated pastes through rheological characterization
Material extrusion is an additive manufacturing technique that enables the creation of reproducible and complex hardware by depositing a viscous, shear-thinning ink onto a substrate in a custom-pattern via extrusion through a syringe. Here, the ability of an ink to be extruded onto a substrate in many layers, and maintain the desired shape is what defines the printability. Printability is often investigated by formulating, printing, and postmortem analysis of final parts in an iterative manner. Investigations of printability through rheological characterization have often been concerned with inks that straddle the line between printable and too thin, leaving out an entire class of inks that are highly-filled pastes, where extrudability is the limiting factor. Highly-filled pastes continue to pose issues for researchers as the effect of filler morphology, size, loading, and packing fraction on the ink rheology and corresponding printability is not understood. While traditional rheological characterizations may be useful for some inks, we show that protocols utilizing steady-shear, or large-amplitude oscillatory shear are difficult and unreliable for highly-filled pastes. Through transient rheology paired with real-time images we show that each traditional protocol produces inhomogeneous deformations that violate the assumptions that underly common rheological definitions. Instead, we demonstrate metrics measured with small-amplitude oscillatory shear that are correlated to the printability of various ink formulations ranging in loading. The rheological measures that accurately predict the printability of the inks are the axial stress measured at small amplitudes, and the critical stress amplitude above which rheological characterizations become impossible. In addition, we estimate the maximum packing fraction for each filler, based on the exponent common to hard sphere models, and show that the printability of each ink can be predicted by the ratio of the packing fraction to the theoretical maximum. We show how small-amplitude oscillatory shear allows users to develop printability criteria for any ink to enhance the workflow in the development of new inks, increase the performance of material extrusion printing, and improve the stability of printed parts, with less wasted time and materials.
Fabrication of low blaze angle gratings by replication and plasma etch
We suggest a new method of making ultra-low blaze angle gratings for synchrotron application. The method is based on reduction of the blaze angle of a master grating by replication followed by a plasma etch. A master blazed grating with a relatively large blaze angle is fabricated by anisotropic wet etching of a Si single crystal substrate. The surface of the master grating is replicated by a polymer material on top of a quartz substrate by nanoimprinting and then transferred into quartz by a plasma etch. Then a 2nd nanoimprint step is applied to transfer the saw-tooth surface into a resist layer on top of a Si grating substrate. The plasma etch through the patterned resist layer provides transfer of the grooves into the Si substrate and results in reduction of the blaze angle due to the difference in etch rates of the resist and Si. We investigated the impact of the replication process on the groove shape, facet surface roughness, and diffraction efficiency of the fabricated 200 lines/mm low blaze angle grating.
High registration particles-transferring system
Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
High registration particles-transferring system
Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.