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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS2024

Direct Ink Write 3D Printing of Fully Dense and Functionally Graded Liquid Metal Elastomer Foams

Liquid metal (LM) elastomer composites offer promising potential in soft robotics, wearable electronics, and human-machine interfaces. Direct ink write (DIW) 3D printing offers a versatile manufacturing technique capable of precise control over LM microstructures, yet challenges such as interfilament void formation in multilayer structures impact material performance. Here, a DIW strategy is introduced to control both LM microstructure and material architecture. Investigating three key process parameters–nozzle height, extrusion rate, and nondimensionalized nozzle velocity–it is found that nozzle height and velocity predominantly influence filament geometry. The nozzle height primarily dictates the aspect ratio of the filament and the formation of voids. A threshold print height based on filament geometry is identified; below the height, significant surface roughness occurs, and above the ink fractures, which facilitates the creation of porous structures with tunable stiffness and programmable LM microstructure. These porous architectures exhibit reduced density and enhanced thermal conductivity compared to cast samples. When used as a dielectric in a soft capacitive sensor, they display high sensitivity (gauge factor = 9.0), as permittivity increases with compressive strain. These results demonstrate the capability to simultaneously manipulate LM microstructure and geometric architecture in LM elastomer composites through precise control of print parameters, while maintaining geometric fidelity in the printed design.

Spencer Pak↗
NASA NTRS2016

3D Printing in Zero G Technology Demonstration Mission: Summary of On-Orbit Operations, Material Testing, and Future Work

Human space exploration to date has been limited to low Earth orbit and the moon. The International Space Station (ISS), an orbiting laboratory 200 miles above the earth, provides a unique and incredible opportunity for researchers to prove out the technologies that will enable humans to safely live and work in space for longer periods of time and venture farther into the solar system. The ability to manufacture parts in-space rather than launch them from earth represents a fundamental shift in the current risk and logistics paradigm for human spaceflight. In particularly, additive manufacturing (or 3D printing) techniques can potentially be deployed in the space environment to enhance crew safety (by providing an on-demand part replacement capability) and decrease launch mass by reducing the number of spare components that must be launched for missions where cargo resupply is not a near-term option. In September 2014, NASA launched the 3D Printing in Zero G technology demonstration mission to the ISS to explore the potential of additive manufacturing for in-space applications and demonstrate the capability to manufacture parts and tools on-orbit. The printer for this mission was designed and operated by the company Made In Space under a NASA SBIR (Small Business Innovation Research) phase III contract. The overarching objectives of the 3D print mission were to use ISS as a testbed to further maturation of enhancing technologies needed for long duration human exploration missions, introduce new materials and methods to fabricate structure in space, enable cost-effective manufacturing for structures and mechanisms made in low-unit production, and enable physical components to be manufactured in space on long duration missions if necessary. The 3D print unit for fused deposition modeling (FDM) of acrylonitrile butadiene styrene (ABS) was integrated into the ISS Microgravity Science Glovebox (MSG) in November 2014 and phase I printing operations took place from November through December of that year. Phase I flight operations yielded 14 unique parts (21 total specimens) that could be directly compared against ground-based prints of identical geometry manufactured using the printer prior to its launch to ISS. The 3DP unit functioned safely and produced specimens necessary to advance the understanding of the critical design and operational parameters for the FDM process as affected by the microgravity environment. From the standpoint of operations, 3DP demonstrated the ability to remove parts from the build-tray on-orbit, teleoperate the printer from the ground, perform critical maintenance functions within defined human factors limits, produce a functional tool that could be evaluated for form/fit/function, and uplink a new part file from the ground and produce it on the printer. The flight parts arrived at NASA Marshall Space Flight Center in Huntsville, Alabama in April 2015, where they underwent months of testing in the materials and processes laboratory. Ground and flight prints completed the following phases of testing: photographic/visual inspection, mass and density evaluation, structured light scanning, XRay and CT, mechanical testing, optical microscopy, scanning electron microscopy, and chemical analysis. This presentation will discuss the results of this testing as well as phase II operations for the printer, which took place in June and July of 2016. Lessons learned from the tech demo and their impacts on the design and development of the second generation 3D printer for ISS, the Additive Manufacturing Facility (AMF) by Made In Space will also be presented. In addition, progress in other elements of NASA's In Space Manufacturing (ISM) initiative such as the on-demand ISM utilization catalog, in-space Recycler ISS Technology Demonstration development, launch packaging recycling, in-space printable electronics, development of higher strength polymeric materials for 3D printing and Additive Construction by Mobile Emplacement (ACME) will also be addressed.

Prater, Tracie↗
NASA NTRS1978

Safe venting for electronic components

Vented enclosure is made from lightweight metal. Printed-circuit boards are attached to bottom and end bulkheads and to top cover. Airflow cools components indirectly through walls of inner compartment. Flammability and smoke tests demonstrate safety of enclosure.

Currin, R., Jr.↗
NASA NTRS2010

RF Device for Acquiring Images of the Human Body

A safe, non-invasive method for forming images through clothing of large groups of people, in order to search for concealed weapons either made of metal or not, has been developed. A millimeter wavelength scanner designed in a unique, ring-shaped configuration can obtain a full 360 image of the body with a resolution of less than a millimeter in only a few seconds. Millimeter waves readily penetrate normal clothing, but are highly reflected by the human body and concealed objects. Millimeter wave signals are nonionizing and are harmless to human tissues when used at low power levels. The imager (see figure) consists of a thin base that supports a small-diameter vertical post about 7 ft (=2.13 m) tall. Attached to the post is a square-shaped ring 2 in. (=5 cm) wide and 3 ft (=91 cm) on a side. The ring is oriented horizontally, and is supported halfway along one side by a connection to a linear bearing on the vertical post. A planar RF circuit board is mounted to the inside of each side of the ring. Each circuit board contains an array of 30 receivers, one transmitter, and digitization electronics. Each array element has a printed-circuit patch antenna coupled to a pair of mixers by a 90 coupler. The mixers receive a reference local oscillator signal to a subharmonic of the transmitter frequency. A single local oscillator line feeds all 30 receivers on the board. The resulting MHz IF signals are amplified and carried to the edge of the board where they are demodulated and digitized. The transmitted signal is derived from the local oscillator at a frequency offset determined by a crystal oscillator. One antenna centrally located on each side of the square ring provides the source illumination power. The total transmitted power is less than 100 mW, resulting in an exposure level that is completely safe to humans. The output signals from all four circuit boards are fed via serial connection to a data processing computer. The computer processes the approximately 1-MB data set into a three-dimensional image in a matter of seconds. The innovation is to configure the receiver array in a ring topology surrounding the scanned object. The ring is then scanned vertically to cover the necessary two-dimensional surface. This fabrication of the ring is made possible by using planar antenna and circuit technology. A planar circuit board serves as a medium for both antennas and signal processing components. Using this technique, parts counts are kept low, and the cost per element is a small fraction of a waveguide-based system.

Gaier, Todd C.↗
NASA NTRS2017

Printed Circuit Board Assembly for Use in Space Missions

An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.

Petrick, David J.↗
NASA NTRSDate not supplied

Design and Assembly Process Implementation for Embedding Passive and Active Components Introduction to IPC-7092

"This presentation describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and be made from organic, inorganic (ceramic) or both types of material."

embedded circuitry↗
NASA NTRS2013

Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗
NASA NTRS2015

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

High temperature↗
NASA NTRS2018

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.

Printed circuit boards↗
NASA NTRS1993

An application protocol for CAD to CAD transfer of electronic information

The exchange of Computer Aided Design (CAD) information between dissimilar CAD systems is a problem. This is especially true for transferring electronics CAD information such as multi-chip module (MCM), hybrid microcircuit assembly (HMA), and printed circuit board (PCB) designs. Currently, there exists several neutral data formats for transferring electronics CAD information. These include IGES, EDIF, and DXF formats. All these formats have limitations for use in exchanging electronic data. In an attempt to overcome these limitations, the Navy's MicroCIM program implemented a project to transfer hybrid microcircuit design information between dissimilar CAD systems. The IGES (Initial Graphics Exchange Specification) format is used since it is well established within the CAD industry. The goal of the project is to have a complete transfer of microelectronic CAD information, using IGES, without any data loss. An Application Protocol (AP) is being developed to specify how hybrid microcircuit CAD information will be represented by IGES entity constructs. The AP defines which IGES data items are appropriate for describing HMA geometry, connectivity, and processing as well as HMA material characteristics.

Azu, Charles C., Jr.↗
NASA NTRS2016

Green Monopropellant Status at Marshall Space Flight Center

NASA Marshall Space Flight Center is continuing investigations into the use of green monopropellants as a replacement for hydrazine in spacecraft propulsion systems. Work to date has been to push technology development through multiple activities designed to understand the capabilities of these technologies. Future work will begin to transition to mission pull as these technologies are mature while still keeping a solid goal of pushing technology development as opportunities become available. The AF-M315E activities began with hot-fire demonstration testing of a 1N monopropellant thruster in FY 14 and FY15. Following successful completion of the preliminary campaign, changes to the test stand to accommodate propellant conditioning capability and better control of propellant operations was incorporated to make testing more streamlined. The goal is to conduct hot-fire testing with warm and cold propellants using the existing feed system and original thruster design. Following the 1N testing, a NASA owned 100 mN thruster will be hot-fire tested in the same facility to show feasibility of scaling to smaller thrusters for cubesat applications. The end goal is to conduct a hot-fire test of an integrated cubesat propulsion system using an SLM printed propellant tank, an MSFC designed propulsion system electronic controller and the 100 mN thruster. In addition to the AF-M315E testing, MSFC is pursuing hot-fire testing with LMP-103S. Following our successful hot-fire testing of the 22N thruster in April 2015, a test campaign was proposed for a 440N LMP-103S thruster with Orbital ATK and Plasma Processes. This activity was funded through the Space Technology Mission Directorate (STMD) ACO funding call in the last quarter of CY15. Under the same funding source a test activity with Busek and Glenn Research Center for testing of 5N AF-M315E thrusters was proposed and awarded. Both activities are in-work with expected completion of hot-fire testing by the end of FY17. MSFC is continuing to coordinate with the AF and academia on understanding the chemical reactions that occur in AF-M315E. An on-going investigation of the catalyst bed species using Raman Spectroscopy through the NASA Technology Research Fellowship Program (NSTRF) is looking for ways to minimize the amount of computation required by understanding the intermediate species created in the catalyst bed. The MSFC team is also working with commercial partners through Cooperative Agreement Notices (CAN's). Partnerships with commercial and academia include work in non-catalytic ignition of AF-M315, spark ignition of hybrid cubesat systems, printed SLM tanks, and dual-mode (electric and chemical) propulsion systems is continuing.

Burnside, Christopher G.↗
NASA NTRS2019

Aerosol Jet Printing on Rigid and Flexible Substrates for Space Applications

Aerosol Jet Printing (AJP) will enable new detector assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument and electronics concepts by reducing trace widths down to 10 microns, printing on complex geometries, and allowing new concept production. This presentation summarizes efforts developing AJP for detectors and circuitry for space applications.

Aerosol Jet Printing↗
NASA NTRS2005

3-D Packaging: A Technology Review

Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

Strickland, Mark↗
NASA NTRS2012

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Chen, Liang-Yu↗
NASA NTRS1989

Graphite Fluoride Fiber Composites For Heat Sinking

Graphite fluoride fiber/polymer composite materials consist of graphite fluoride fibers in epoxy, polytetrafluoroethylene, or polyimide resin. Combines high electrical resistivity with high thermal conductivity and solves heat-transfer problems of many electrical systems. Commercially available in powder form, for use as dry lubricant or cathode material in lithium batteries. Produced by direct fluorination of graphite powder at temperature of 400 to 650 degree C. Applications include printed-circuit boards for high-density power electronics, insulators for magnetic-field cores like those found in alternators and transformers, substrates for thin-film resistors, and electrical-protection layers in aircraft de-icers.

Hung, Ching-Cheh↗
NASA NTRS2007

Optically Transparent Split-Ring Antennas for 1 to 10 GHz

Split-ring antennas made from optically transparent, electrically conductive films have been invented for applications in which there are requirements for compact antennas capable of operation over much or all of the frequency band from 1 to 10 GHz. Primary examples of such applications include wireless local-area networks and industrial, scientific, and medical (ISM) applications. These antennas can be conveniently located on such surfaces as those of automobile windows and display screens of diverse hand-held electronic units. They are fabricated by conventional printed-circuit techniques and can easily be integrated with solid-state amplifier circuits to enhance gain. The structure of an antenna of this type includes an antenna/feed layer supported on the top or outer face of a dielectric (e.g., glass) and, optionally, a ground layer on the bottom or inner face of the substrate. The ring can be in the form of either a conductive strip or a slot in the antenna/feed layer. The ring can be of rectangular, square, circular, elliptical, or other suitable shape and can be excited by means of a microstrip, slot line, or coplanar waveguide. For example, the antenna shown in the figure features a square conductive-strip split ring with a microstrip feed. In general, an antenna fed at its external boundary in the manner of this invention presents very high impedance, thereby creating an impedance-matching problem. Splitting the ring . that is, cutting a notch through the ring . offers a solution to the problem in that the notch fixes the location of maximum electric field, which location is directly related to the impedance. Thus, an excellent impedance match can be achieved through proper choice of the location of the notch. In geometric layout, such a ring antenna structure is typically between 1.4 and 1.3 the size of a patch antenna capable of operating in the same frequency range. This miniaturization of the antenna is desirable, not only because it contributes to overall miniaturization of equipment, but also because minimization of the extent of the optically transparent, electrically conductive film helps to minimize the electrical loss associated with the surface resistance ( 5 ohms per square) of the transparent, electrically conductive film material. Incidentally, even at 5 ohms per square, this surface resistance is significantly less than that of indium tin oxide film (typically > 25 ohms per square), which, heretofore has been the transparent, electrically conductive film material of choice. At the time of writing this article, information on the composition of the lower-resistance film used in the antennas of this invention was not available.

Lee, Richard Q.↗
NASA NTRS2004

Stroboscope Controller for Imaging Helicopter Rotors

A versatile electronic timing-and-control unit, denoted a rotorcraft strobe controller, has been developed for use in controlling stroboscopes, lasers, video cameras, and other instruments for capturing still images of rotating machine parts especially helicopter rotors. This unit is designed to be compatible with a variety of sources of input shaftangle or timing signals and to be capable of generating a variety of output signals suitable for triggering instruments characterized by different input-signal specifications. It is also designed to be flexible and reconfigurable in that it can be modified and updated through changes in its control software, without need to change its hardware. Figure 1 is a block diagram of the rotorcraft strobe controller. The control processor is a high-density complementary metal oxide semiconductor, singlechip 8-bit microcontroller. It is connected to a 32K x 8 nonvolatile static random-access memory (RAM) module. Also connected to the control processor is a 32K 8 electrically programmable read-only-memory (EPROM) module, which is used to store the control software. Digital logic support circuitry is implemented in a field-programmable gate array (FPGA). A 240 x 128-dot, 40- character 16-line liquid-crystal display (LCD) module serves as a graphical user interface; the user provides input through a 16-key keypad mounted next to the LCD. A 12-bit digital-to-analog converter (DAC) generates a 0-to-10-V ramp output signal used as part of a rotor-blade monitoring system, while the control processor generates all the appropriate strobing signals. Optocouplers are used to isolate all input and output digital signals, and optoisolators are used to isolate all analog signals. The unit is designed to fit inside a 19-in. (.48-cm) rack-mount enclosure. Electronic components are mounted on a custom printed-circuit board (see Figure 2). Two power-conversion modules on the printedcircuit board convert AC power to +5 VDC and 15 VDC, respectively.

Jensen, Scott↗
NASA NTRS2018

Building Reliable Printed Circuit Boards - the Lessons Learned

"Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. This one day workshop will discuss a variety of failure mechanisms that effect the functionality of PCBs. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. With the help of examples and case studies, a wide range of failure mechanisms will be discussed, case studies are focused on digital circuits, however some failures in analog, double sided boards are also presented. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues."

Sood, Bhanu↗