Search NASA⌕ Search

SEARCH · Search NASA

Results for “silicon pixel detector”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

124 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1989

A space qualified thermal imaging system using a Pt Si detector array

EDO Corporation, Barnes Engineering Division designed and constructed a high resolution thermal imaging system on contract to Lockheed for use in the SDI Star Lab. This employs a Pt Si CCD array which is sensitive in the spectral range of 3 to 5 microns. Star Lab will be flown in the Shuttle bay and consists basically of a large, reflecting, tracking telescope with associated sensors and electronics. The thermal imaging system is designed to operate in the focal plane of this telescope. The configuration of the system is illustrated. The telescope provides a collimated beam output which is focussed onto the detector array by a silicon objective lens. The detector array subtends a field of view of 1.6 degrees x 1.22 degrees. A beam switching mirror permits bypassing the large telescope to give a field of 4 degrees x 3 degrees. Two 8 position filter wheels are provided, and background radiation is minimized by Narcissus mirrors. The detector is cooled with a Joule-Thompson cryostat fed from a high pressure supply tank. This was selected instead of a more convenient closed-cycle system because of concern with vibration. The latter may couple into the extremely critical Starlab tracking telescope. The electronics produce a digitized video signal for recording. Offset and responsivity correction factors are stored for all pixels and these corrections are made to the digitized output in real time.

Astheimer, Robert W.↗
NASA NTRS2011

Characterization of Photon-Counting Detector Responsivity for Non-Linear Two-Photon Absorption Process

Sub-band absorption at 1550 nm has been demonstrated and characterized on silicon Geiger mode detectors which normally would be expected to have no response at this wavelength. We compare responsivity measurements to singlephoton absorption for wavelengths slightly above the bandgap wavelength of silicon (approx. 1100 microns). One application for this low efficiency sub-band absorption is in deep space optical communication systems where it is desirable to track a 1030 nm uplink beacon on the same flight terminal detector array that monitors a 1550 nm downlink signal for pointingcontrol. The currently observed absorption at 1550 nm provides 60-70 dB of isolation compared to the response at 1064 nm, which is desirable to avoid saturation of the detector by scattered light from the downlink laser.

Geiger mode detector↗
NASA NTRS1985

Lightning mapper and the future

A trade-off analysis was completed that reveals how the lightning mapper detection efficiency will change as a function of interference filter bandwidth, pixel field of view, and telescope aperture. It is shown that the critical parameter on which we have minimum flexibility is filter band-width. The problem is that too narrow a filter bandwidth is incompatible with wide areal coverage. The trade-off analysis demonstrates that an 80 percent lightning detection efficiency will technically be relatively straight-forward, while a 90 percent detection efficiency will apparently be difficult to achieve. Three focal plane designs are currently under consideration. One would use a single large, solid state silicon integrating array with multiple output channels and off-the-focal-plane analog, time domain, background removing fibers. A second design would use the same technology, but the sensor would consist of up to four virtually independent focal plane arrays. This design reduces the areal coverage of each detector. Thus narrower interference filters could be utilized. Superior performance would be realized at a probable increase in cost. The final design would use a three-dimensional focal plane in order to perform background removal at the focal plane. Superior performance would be achieved along with reduced weight and power requirements. Unfortunately, this focal plane technology is still under development.

Christian, H. J.↗
NASA NTRS2013

Future Development Trajectories for Imaging X-rays Spectrometers Based on Microcalorimeters

Future development trajectories for imaging x-ray spectrometers based on microcalorimeters. Since their invention 30 years ago, the capability of X-ray microcalorimeters has increased steadily, with continual improvements in energy resolution, speed, and array size. Arrays of up to 1024 pixels have been produced, and resolution better than 1 eV at 1.5 keV has been achieved. These detectors can be optimized for the highest priority science, such as designing for the highest resolving power at low energies at the expense of dynamic range, or the greatest focal-plane coverage at the expense of speed. Three types of X-ray microcalorimeters presently dominate the field, each characterized by the thermometer technology. The first two types use temperature-sensitive resistors: semiconductors in the metal-insulator transition and superconductors operated in the superconducting-normal transition. The third type uses a magnetically coupled thermometer, and is at an earlier stage of development than the other two. The Soft X-ray Spectrometer (SXS) on Astro-H, expected to launch in 2015, will use an array of silicon thermistors with HgTe X-ray absorbers that will operate at 50 mK. Both the semiconductor and superconductor calorimeters have been implemented in small arrays. Kilopixel arrays of the superconducting calorimeters are being produced, and much larger arrays may require the non-dissipative advantage of magnetically coupled thermometers. I will project the development trajectories of these detectors and their read-out technologies and assess what their capabilities and limitations will be 10 - 20 years from now.

Kilbourne, Caroline A.↗
NASA NTRS1982

An evaluation of an ICCD imager of dynamic range expansion technique and application of insitu procedures for life-time extension

Research toward practical implementation of the Intensified Charge Coupled Device (ICCD) as a photon-counting array detector for astronomy is reported. The first area of concentration was to determine the rate and extent of the lifetime limiting damage to the CCD caused by the impact of high energy electrons, and to find whether various methods of annealing the damage were productive. The second effort was to determine the performance of the ICCD in a photon-counting mode to produce extended dynamic range measurements. There are two main effects that appear as the practical results of the electron damage to the CCD. One is an increase in the leakage current, i.e., the normal thermal generation of charge carriers in the silicon that provides a background dark signal that adds to the light produced image. In an undamaged CCD, the leakage current is usually fairly uniform across the photosensitive area of the silicon chip, with the exception of various bright pixels which have an anomalous leakage current well above the overall level.

Currie, D. G.↗
NASA NTRS2011

CMOS Imager Has Better Cross-Talk and Full-Well Performance

A complementary metal oxide/semiconductor (CMOS) image detector now undergoing development is designed to exhibit less cross-talk and greater full-well capacity than do prior CMOS image detectors of the same type. Imagers of the type in question are designed to operate from low-voltage power supplies and are fabricated by processes that yield device features having dimensions in the deep submicron range. Because of the use of low supply potentials, maximum internal electric fields and depletion widths are correspondingly limited. In turn, these limitations are responsible for increases in cross-talk and decreases in charge-handling capacities. Moreover, for small pixels, lateral depletion cannot be extended. These adverse effects are even more accentuated in a back-illuminated CMOS imager, in which photogenerated charge carriers must travel across the entire thickness of the device. The figure shows a partial cross section of the structure in the device layer of the present developmental CMOS imager. (In a practical imager, the device layer would sit atop either a heavily doped silicon substrate or a thin silicon oxide layer on a silicon substrate, not shown here.) The imager chip is divided into two areas: area C, which contains readout circuits and other electronic circuits; and area I, which contains the imaging (photodetector and photogenerated-charge-collecting) pixel structures. Areas C and I are electrically isolated from each other by means of a trench filled with silicon oxide. The electrical isolation between areas C and I makes it possible to apply different supply potentials to these areas, thereby enabling optimization of the supply potential and associated design features for each area. More specifically, metal oxide semiconductor field-effect transistors (MOSFETs) that are typically included in CMOS imagers now reside in area C and can remain unchanged from established designs and operated at supply potentials prescribed for those designs, while the dopings and the lower supply potentials in area I can be tailored to optimize imager performance. In area I, the device layer includes an n+ -doped silicon layer on which is grown an n-doped silicon layer. A p-doped silicon layer is grown on top of the n -doped layer. The total imaging device thickness is the sum of the thickness of the n+, n, and p layers. A pixel photodiode is formed between a surface n+ implant, a p implant underneath it, the aforementioned p layer, and the n and n+ layers. Adjacent to the diode is a gate for transferring photogenerated charges out of the photodiode and into a floating diffusion formed by an implanted p+ layer on an implanted n-doped region. Metal contact pads are added to the back-side for providing back-side bias.

Pain, Bedabrata↗
NASA NTRS1982

Charge-coupled device (CCD) television camera for NASA's Galileo mission to Jupiter

The CCD detector under construction for use in the slow-scan television camera for the NASA Galileo Jupiter orbiter to be launched in 1985 is presented. The science objectives and the design constraints imposed by the earth telemetry link, platform residual motion, and the Jovian radiation environment are discussed. Camera optics are inherited from Voyager; filter wavelengths are chosen to enable discrimination of Galilean-satellite surface chemical composition. The CCO design, an 800 by 800-element 'virtual-phase' solid-state silicon image-sensor array with supporting electronics, is described with detailed discussion of the thermally generated dark current, quantum efficiency, signal-to-noise ratio, and resolution. Tests of the effect of ionizing radiation were performed and are analyzed statistically. An imaging mode using a 2-1/3-sec frame time and on-chip summation of the signal in 2 x 2 blocks of adjacent pixels is designed to limit the effects of the most extreme Jovian radiation. Smearing due to spacecraft/target relative velocity and platform instability will be corrected for via an algorithm maximizing spacial resolution at a given signal-to-noise level. The camera is expected to produce 40,000 images of Jupiter and its satellites during the 20-month mission.

Klaasen, K. P.↗
NASA NTRS2006

X-Ray Detector Research at MSFC for Space Applications

NASA's Vision for Space Exploration has specific goals aimed at exploring the Solar System. This vision, under presidential mandate includes landing humans on the moon before the end of the next decade, paving the way for eventual journeys to Mars and beyond. The first missions to the moon will be in the form of both Orbiters and Landers, with the goal of paving the way for human return. One of the instruments we are currently working on,in collaboration with Brookhaven National Laboratory, is a lunar orbiter fluorescent x-ray spectrometer to finely map the light elements (down to Carbon) on surface of the moon. Funded NASA s Planetary Instrument Definition and Development Program the instrument is based on silicon drift detector arrays read out by custom ASICs. These offer the promise of high spectral resolution, necessary for resolving weak lines against a strong background continuum, and very low power requirements, necessary for large areas (greater than 500 square centimeters) required for future lunar missions. Further, the inherent radiation hardness of these detectors makes them ideal candidates for exploring the Jovian system, where the harsh radiation environment from Jupiter s radiation belts creates unfavorable detector conditions. Looking beyond our solar system, in the hard x-ray regime (20-80keV.), we are studying Cadmium-Zinc-Telluride pixilated detectors as feasible candidates for focal plane detectors of a hard x-ray telescope. This energy region bridges the gap between thermal and non-thermal x-ray emission from astronomical sources, will allow us to better understand supernovae nucleosynthesis (such as through the Ti-44 lines at 68keV and 78keV), Active Galactic Nuclei and other compact objects, more completely. The detectors that we are characterizing are 2mm in thickness and are pixilated with a 16x16 array of 300 micrometer pitch pixels (50micometer gap). These detectors are designed at Rutherford Appleton Laboratory, material is from eV Products, and polymer flip-chip assembly was performed by a commercial vendor. An energy resolution of 2.0% at 60keV (or better) should allow us to sufficiently distinguish lines of interest from background continuum, and the detector spatial resolution should be fine enough to over-sample the focal spot from the x-ray focusing optics by about a factor of two. Full technical details of these developments will be presented.

Gaskin, Jessica↗
NASA NTRS2012

Development of Thermal Infrared Sensor to Supplement Operational Land Imager

The thermal infrared sensor (TIRS) is a quantum well infrared photodetector (QWIP)-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 m. The focal plane will contain three 640 ~512 QWIP arrays mounted onto a silicon substrate. The readout integrated circuit (ROIC) addresses each pixel on the QWIP arrays and reads out the pixel value (signal). The ROIC is controlled by the focal plane electronics (FPE) by means of clock signals and bias voltage value. The means of how the FPE is designed to control and interact with the TIRS focal plane assembly (FPA) is the basis for this work. The technology developed under the FPE is for the TIRS focal plane assembly (FPA). The FPE must interact with the FPA to command and control the FPA, extract analog signals from the FPA, and then convert the analog signals to digital format and send them via a serial link (USB) to a computer. The FPE accomplishes the described functions by converting electrical power from generic power supplies to the required bias power that is needed by the FPA. The FPE also generates digital clocking signals and shifts the typical transistor-to-transistor logic (TTL) to }5 V required by the FPA. The FPE also uses an application- specific integrated circuit (ASIC) named System Image, Digitizing, Enhancing, Controlling, And Retrieving (SIDECAR) from Teledyne Corp. to generate the clocking patterns commanded by the user. The uniqueness of the FPE for TIRS lies in that the TIRS FPA has three QWIP detector arrays, and all three detector arrays must be in synchronization while in operation. This is to avoid data skewing while observing Earth flying in space. The observing scenario may be customized by uploading new control software to the SIDECAR.

Shu, Peter↗
NASA NTRS2018

Physics of the Cosmos (PCOS) Program Technology Development 2018

We present a final report on our program to raise the Technology Readiness Level (TRL) of enhanced charge‐coupled‐device (CCD) detectors capable of meeting the requirements of X‐ray grating spectrometers (XGS) and wide‐field X‐ray imaging instruments for small, medium, and large missions. Because they are made of silicon, all X‐ray CCDs require blocking filters to prevent corruption of the Xray signal by out‐of‐band, mainly optical and near‐infrared (near‐IR) radiation. Our primary objective is to demonstrate technology that can replace the fragile, extremely thin, free‐standing blocking filter that has been standard practice with a much more robust filter deposited directly on the detector surface. High‐performance, back‐illuminated CCDs have flown with free‐standing filters (e.g., one of our detectors on Suzaku), and other relatively low‐performance CCDs with directly deposited filters have flown (e.g., on the X‐ray Multi‐mirror Mission‐Newton, XMM‐Newton Reflection Grating Spectrometer, RGS). At the inception of our program, a high‐performance, back‐illuminated CCD with a directly deposited filter has not been demonstrated. Our effort will be the first to show such a filter can be deposited on an X‐ray CCD that meets the requirements of a variety of contemplated future instruments. Our principal results are as follows: i) we have demonstrated a process for direct deposition of aluminum optical blocking filters on back‐illuminated MIT Lincoln Laboratory CCDs. Filters ranging in thickness from 70 nm to 220 nm exhibit expected bulk visible‐band and X‐ray transmission properties except in a small number (affecting ≲ 1% of detector area) of isolated detector pixels ("pinholes"), which show higher‐than‐expected visible‐band transmission; ii) these filters produce no measurable degradation in soft‐X‐ray spectral resolution, demonstrating that direct filter deposition is compatible with the MIT Lincoln Laboratory back‐illumination process; iii) we have shown that under sufficiently intense visible and near‐IR illumination, out‐of‐band light can enter the detector through its sidewalls and mounting surfaces, compromising detector performance. This 'sidewall leakage' has been observed, for example, by a previous experiment on the International Space Station during its orbit‐day operations. We have developed effective countermeasures for this sidewall leakage; iv) we developed an exceptionally productive collaboration with the Regolith X‐ray Imaging Spectrometer (REXIS) team. REXIS is a student instrument now flying on the Origins Spectral Interpretation Resource Identification Security - Regolith Explorer (OSIRIS‐REx) mission. REXIS students participated in our filter development program, adopted our technology for their flight instrument, and raised the TRL of this technology beyond our initial goals. This Strategic Astrophysics Technology (SAT) project, a collaboration between the MKI and MIT Lincoln Laboratory, began July 1, 2012, and ended on June 30, 2018.

PCOS↗
NASA NTRS2012

Multicolor Detectors for Ultrasensitive Long-Wave Imaging Cameras

A document describes a zeptobolometer for ultrasensitive, long-wavelength sensors. GSFC is developing pixels based on the zeptobolometer design that sense three THz wavelengths simultaneously. Two innovations are described in the document: (1) a quasiparticle (QO) filter arrangement that enables a compact multicolor spectrum at the focal plane, and (2) a THz antenna readout by up to three bolometers. The innovations enable high efficiency by greatly reducing high, frequency-dependent microstrip losses, and pixel compactness by eliminating the need for bulky filters in the focal plane. The zeptobolometer is a small TES bolometer, on the scale of a few microns, which can be readily coupled through an impedance-matching resistor to a metal or dielectric antenna. The bolometer is voltage-biased in its superconducting transition, allowing the use of superconducting RF multiplexers to read out large arrays. The antenna is geometrically tapped at three locations so as to efficiently couple radiation of three distinct wavelengths to the individual TESs. The transition edge hot electrons in metals offer a simple, compact arrangement for antenna readout, which can be crucial in the THz where line losses at high frequencies can be substantial. A metallic grill filter acts as a high-pass filter and directs the low-frequency components to a location where they will be absorbed. The absorption spectrum shows that three well-separated THz bands are feasible. The filters can be made from high-purity dielectrics such as float zone silicon or sapphire.

Brown, Ari↗
NASA NTRS2010

NASA Tech Briefs, January 2010

Topics covered include: Cryogenic Flow Sensor; Multi-Sensor Mud Detection; Gas Flow Detection System; Mapping Capacitive Coupling Among Pixels in a Sensor Array; Fiber-Based Laser Transmitter for Oxygen A-Band Spectroscopy and Remote Sensing; Low-Profile, Dual-Wavelength, Dual-Polarized Antenna; Time-Separating Heating and Sensor Functions of Thermistors in Precision Thermal Control Applications; Cellular Reflectarray Antenna; A One-Dimensional Synthetic-Aperture Microwave Radiometer; Electrical Switching of Perovskite Thin-Film Resistors; Two-Dimensional Synthetic-Aperture Radiometer; Ethernet-Enabled Power and Communication Module for Embedded Processors; Electrically Variable Resistive Memory Devices; Improved Attachment in a Hybrid Inflatable Pressure Vessel; Electrostatic Separator for Beneficiation of Lunar Soil; Amorphous Rover; Space-Frame Antenna; Gear-Driven Turnbuckle Actuator; In-Situ Focusing Inside a Thermal Vacuum Chamber; Space-Frame Lunar Lander; Wider-Opening Dewar Flasks for Cryogenic Storage; Silicon Oxycarbide Aerogels for High-Temperature Thermal Insulation; Supercapacitor Electrolyte Solvents with Liquid Range Below -80 C; Designs and Materials for Better Coronagraph Occulting Masks; Fuel-Cell-Powered Vehicle with Hybrid Power Management; Fine-Water-Mist Multiple-Orientation-Discharge Fire Extinguisher; Fuel-Cell Water Separator; Turbulence and the Stabilization Principle; Improved Cloud Condensation Nucleus Spectrometer; Better Modeling of Electrostatic Discharge in an Insulator; Sub-Aperture Interferometers; Terahertz Mapping of Microstructure and Thickness Variations; Multiparallel Three-Dimensional Optical Microscopy; Stabilization of Phase of a Sinusoidal Signal Transmitted Over Optical Fiber; Vacuum-Compatible Wideband White Light and Laser Combiner Source System; Optical Tapers as White-Light WGM Resonators; EPR Imaging at a Few Megahertz Using SQUID Detectors; Reducing Field Distortion in Magnetic Resonance Imaging; Fluorogenic Cell-Based Biosensors for Monitoring Microbes; A Constant-Force Resistive Exercise Unit; GUI to Facilitate Research on Biological Damage from Radiation; On-Demand Urine Analyzer; More-Realistic Digital Modeling of a Human Body; and Advanced Liquid-Cooling Garment Using Highly Thermally Conductive Sheets.

Source record↗
NASA NTRS2011

Multiple-Event, Single-Photon Counting Imaging Sensor

The single-photon counting imaging sensor is typically an array of silicon Geiger-mode avalanche photodiodes that are monolithically integrated with CMOS (complementary metal oxide semiconductor) readout, signal processing, and addressing circuits located in each pixel and the peripheral area of the chip. The major problem is its single-event method for photon count number registration. A single-event single-photon counting imaging array only allows registration of up to one photon count in each of its pixels during a frame time, i.e., the interval between two successive pixel reset operations. Since the frame time can t be too short, this will lead to very low dynamic range and make the sensor merely useful for very low flux environments. The second problem of the prior technique is a limited fill factor resulting from consumption of chip area by the monolithically integrated CMOS readout in pixels. The resulting low photon collection efficiency will substantially ruin any benefit gained from the very sensitive single-photon counting detection. The single-photon counting imaging sensor developed in this work has a novel multiple-event architecture, which allows each of its pixels to register as more than one million (or more) photon-counting events during a frame time. Because of a consequently boosted dynamic range, the imaging array of the invention is capable of performing single-photon counting under ultra-low light through high-flux environments. On the other hand, since the multiple-event architecture is implemented in a hybrid structure, back-illumination and close-to-unity fill factor can be realized, and maximized quantum efficiency can also be achieved in the detector array.

Zheng, Xinyu↗
NASA NTRS2013

Compact Focal Plane Assembly for Planetary Science

A compact radiometric focal plane assembly (FPA) has been designed in which the filters are individually co-registered over compact thermopile pixels. This allows for construction of an ultralightweight and compact radiometric instrument. The FPA also incorporates micromachined baffles in order to mitigate crosstalk and low-pass filter windows in order to eliminate high-frequency radiation. Compact metal mesh bandpass filters were fabricated for the far infrared (FIR) spectral range (17 to 100 microns), a game-changing technology for future planetary FIR instruments. This fabrication approach allows the dimensions of individual metal mesh filters to be tailored with better than 10- micron precision. In contrast, conventional compact filters employed in recent missions and in near-term instruments consist of large filter sheets manually cut into much smaller pieces, which is a much less precise and much more labor-intensive, expensive, and difficult process. Filter performance was validated by integrating them with thermopile arrays. Demonstration of the FPA will require the integration of two technologies. The first technology is compact, lightweight, robust against cryogenic thermal cycling, and radiation-hard micromachined bandpass filters. They consist of a copper mesh supported on a deep reactive ion-etched silicon frame. This design architecture is advantageous when constructing a lightweight and compact instrument because (1) the frame acts like a jig and facilitates filter integration with the FPA, (2) the frame can be designed so as to maximize the FPA field of view, (3) the frame can be simultaneously used as a baffle for mitigating crosstalk, and (4) micron-scale alignment features can be patterned so as to permit high-precision filter stacking and, consequently, increase the filter bandwidth and sharpen the out-of-band rolloff. The second technology consists of leveraging, from another project, compact and lightweight Bi0.87Sb0.13/Sb arrayed thermopiles. These detectors consist of 30-layer thermopiles deposited in series upon a silicon nitride membrane. At 300 K, the thermopile arrays are highly linear over many orders of magnitude of incident IR power, and have a reported specific detectivity that exceeds the requirements imposed on future mission concepts. The bandpass filter array board is integrated with a thermopile array board by mounting both boards on a machined aluminum jig.

Brown, Ari↗
NASA NTRSDate not supplied

Applicability of Micro X-Ray Fluorescence Spectroscopy to Astromaterials Curation and Research

Introduction: The Astromaterials Acquisition and Curation Office at NASA’s Johnson Space Center (JSC) curates NASA’s astromaterial sample collections which includes: Apollo samples, Luna samples, Ant-arctic meteorites, cosmic dust particles, microparticle impacts into space-flown materials, Genesis solar wind atoms, Stardust comet Wild-2 particles, Stardust inter-stellar particles, Hayabusa asteroid Itokawa particles, Hayabusa 2 asteroid Ryugu particles, and future OSIRIS-Rex asteroid Bennu particles (landing in Sep-tember, 2023) [1–3]. To enhance JSC’s advanced cu-ration capabilities, we have recently installed a high-performance micro-X-ray fluorescence (µXRF) spec-trometer to assist in sample characterization through rapid, non-destructive, in-situ elemental analyses that do not require the sample preparation protocols (i.e., polishing and carbon-coating) commonly needed for electron beam analyses. With this new instrument, we are capable of detecting all elements down to carbon in a variable-pressure or He-purged chamber for anal-ysis of a wide range of sample types. Here we describe the instrumental set-up, capabilities, and applicability of µXRF analysis to astromaterials curation and re-search. Instrumentation and Methodology: The X-ray fluorescence and computed tomography lab (X-FaCT) lab at JSC is now equipped with a Bruker M4 Tornado Plus µXRF (Fig. 1). This system is an energy-dispersive x-ray spectrometer equipped with two 60 mm2 silicon drift detectors (SDD) that are able to be used simulta-neously for output count rates ~500,000 cps. New light element windows allow detecting and analyzing the entire elemental range from carbon to americium. Two x-ray tubes (micro-focus Rh with polycapillary lenses and W with collimators of 0.5, 1.0, 2.0, and 4.5 mm) with max excitation parameters of 50 kV, 30 W and 50 kV, 40 W, respectively, allow for more flexibility of the analysis of high energy lines. The motorized X-Y-Z stage has a mapping range of 190 x 160 mm and can support samples up to 7 kg (~15.5 lbs) and a height of 120 mm [4]. Analytical modes include elemental analysis (down to ~20 µm spot size) via point, line, or area of bulk materials (rock surfaces, thin sections, thick sections, etc.) as well as coating analysis (determination of thickness and composition) of samples. This system has a variable vacuum chamber (1 mbar to 1 atm) that is also equipped with a He-purge system which accommodates vacuum sensitive samples while still allowing detection of light elements at atmospheric pressure. Utility and Applicability of µXRF in Astro-materials research and exploration science (ARES): Elemental analysis using µXRF is commonly em-ployed for both terrestrial and planetary geological science disciplines [5]. It is especially useful for analy-sis of astromaterials given the limited sample prepara-tion required, which is not feasible for certain materi-als. Here we show select applications of µXRF anal-yses of astromaterials that can, have, and will be done at JSC’s X-FaCT lab. Point analysis: In-situ spot analyses (~20 µm spot size) on a cut slab of Martian meteorite NWA 10922 allowed for the discovery, qualitative elemental analy-sis and determination of different feldspar minerals [6]. These point analyses served as an effective prelim-inary step for subsequent quantitative analyses. Ana-lytical standards can be employed for more accurate quantification of µXRF spot analyses. Area analysis: This analytical mode measures all detectable elements (from C to Am) at each pixel (>5 µm pixel size) in a user-defined area. The results are shown as elemental maps which can be extracted as 16-bit TIFF’s for further data processing. In Fig. 2. we show elemental distribution maps of the high-Ti basalt 73001,531 that have been processed using ImageJ software. From these maps you can accurately and quickly (this map took ~50 mins.) identify mineral components, such as pyroxene, plagioclase, oxides, and phosphates, compositional zoning, and mineral textures. Detection of high-Z phases: µXRF techniques are es-pecially effective at analyzing trace minerals with high-atomic-number (high-Z) elements because the high-energy characteristic X-rays used (relative to SEM EDS) allow for mapping of K lines in elements up to La (typically SEM maps use L X-ray lines for elements >Zn, and these can often have interferences). Thus, µXRF is especially suited for identifying minerals like zircon, baddeleyite, REE-rich phosphates, Fe-rich met-als, oxides, sulfides, and phosphides [4]. In Fig. 3 we show elemental distribution maps for 73001,530 where we are able to correlate the original video image with, Zr, Si, Y and Hf elemental maps together identi-fying the location of a zircon. In this location you would expect lower Si compared to surrounding mate-rial, as well as higher Zr, Y, and Hf content compared to surrounding material, all of which is confirmed by our XRF ele-mental distribution maps (Figure 2.) Conclusions: The new M4 Tornado Plus µXRF within the Astromaterials Acquisition and Curation office at NASA JSC allows for rapid and non-destructive elemental analysis of astromaterials with limited or no sample preparation. µXRF analyses pro-vide crucial compositional knowledge for the prelimi-nary examination and curation of astromaterials. This instrument enhances the advanced curation capabili-ties in the X-FaCT laboratory at JSC by allowing pro-ductive, cohesive, and non-destructive multi-modal x-ray analyses on astromaterial samples, which is neces-sary for the comprehensive curation and study of our current and future astromaterial collections. Addition-ally, µXRF can provide complimentary information to researchers for studies on astromaterials. References: [1] Allen, C. et al., (2011). Chemie De Erde Geochemistry, 71, 1-20. [2] McCubbin, F. M. et al., (2016) 47th LPSC, abstract #2668 [3] Zeigler, R. A. et al., (2017) 48th LPSC, abstract #2772 [4] Bruker User Manual [5] Young et al., (2016) Appl. Geochemistry, 72, 77-87 [6] Mor-ris, R. V. et al., (2023) 54th LPSC.

E W O'Neal↗
NASA NTRS2008

MEMS Microshutter Array System for James Webb Space Telescope

A complex MEMS microshutter array system has been developed at NASA Goddard Space Flight Center (GSFC) for use as a multi-object aperture array for a Near-Infrared Spectrometer (NIRSpec). The NIRSpec is one of the four major instruments carried by the James Webb Space Telescope (JWST), the next generation of space telescope after the Hubble Space Telescope retires. The microshutter arrays (MSAs) are designed for the selective transmission of light with high efficiency and high contrast. It is demonstrated in Figure 1 how a MSA is used as a multiple object selector in deep space. The MSAs empower the NIRSpec instrument simultaneously collect spectra from more than 100 targets therefore increases the instrument efficiency 100 times or more. The MSA assembly is one of three major innovations on JWST and the first major MEMS devices serving observation missions in space. The MSA system developed at NASA GSFC is assembled with four quadrant fully addressable 365x171 shutter arrays that are actuated magnetically, latched and addressed electrostatically. As shown in Figure 2, each MSA is fabricated out of a 4' silicon-on-insulator (SOI) wafer using MEMS bulk-micromachining technology. Individual shutters are close-packed silicon nitride membranes with a pixel size close to 100x200 pm (Figure 3). Shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. In order to prevent light leak, light shields are made on to the surrounding frame of each shutter to cover the gaps between the shutters and the Game (Figure 4). Micro-ribs and sub-micron bumps are tailored on hack walls and light shields, respectively, to prevent sticktion, shown in Figures 4 and 5. JWST instruments are required to operate at cryogenic temperatures as low as 35K, though they are to be subjected to various levels of ground tests at room temperature. The shutters should therefore maintain nearly flat in the entire temperature range between 35K and 300K. Through intensive numerical simulations and experimental studies, an optically opaque and electrically conductive metal-nitride thin film was selected as a coating material deposited on the shutters with the best thermal-expansion match to silicon nitride - the shutter blade thin film material. A shutter image shown in Figure 6 was taken at room temperature, presenting shutters slightly bowing down as expected. Shutters become flat when the temperature decreases to 35K. The MSAs are then bonded to silicon substrates that are fabricated out of 6" single-silicon wafers in the thickness of 2mm. The bonding is conducted using a novel single-sided indium flip-chip bonding technology. Indium bumps fabricated on a substrate are shown in Figure 7. There are 180,000 indium bumps for bonding a flight format MSA array to its substrate. Besides a MSA, each substrate houses five customer-designed ASIC (Application Specific Integrated Circuit) multiplexer/address chips for 2-dimensional addressing, twenty capacitors, two temperature sensors, numbers of resistors and all necessary interconnects, as shown in Figure 8. Complete MSA quadrant assemblies have been successfully manufactured and fully functionally tested. The assemblies have passed a series of critical reviews required by JWST in satisfying all the design specifications. The qualification tests cover programmable 2-D addressing, life tests, optical contrast tests, and environmental tests including radiation, vibration, and acoustic tests. A 2-D addressing pattern with 'ESA' letters programmed in a MSA is shown in Figure 9. The MSAs passed 1 million cycle life tests and achieved high optical contrast over 10,000. MSA teams are now making progress in final fabrication, testing and assembly (Figure 10). The delivery of flight-format MSA system is scheduled at the end of 2008 for being integrated to the focal plane of the NIRSpec detectors.

Li, Mary J.↗