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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

The effects of some polyamine biosynthetic inhibitors on growth and morphology of phytopathogenic fungi

We have studied the effects of two polyamine biosynthetic inhibitors, alpha-difluoromethylornithine (DFMO) and alpha-difluoromethylarginine (DFMA), and of polyamines (PAs), alone and in combination, on mycelial growth and morphology of four phytopathogenic fungi: Botrytis sp, B. cinerea, Rhizoctonia solani and Monilinia fructicola. The inhibitors were added to a Czapek agar medium to get final concentrations of 0.1, 0.5 and 1.0 mM. DFMO and DFMA, suicide inhibitors of ornithine decarboxylase (ODC) and arginine decarboxylase (ADC) respectively, inhibited mycelial growth strongly; the effect was generally more pronounced with DFMA than with DFMO, but each fungus had its own response pattern. The addition of the PAs putrescine (Put) and spermidine (Spd) to the culture medium resulted in a promotion of growth. In Botrytis sp and Monilinia fructicola exposed to inhibitors plus PAs, mycelial growth was actually increased above control values. Mycelial morphology was altered and cell size dramatically reduced in plates containing inhibitors alone, whereas with PAs alone, or in combination with inhibitors, morphology was normal, but cell length and diameters increased considerably. These results suggest that PAs are essential for growth in fungal mycelia. The inhibition caused by DFMA may be due to its arginase-mediated conversion to DFMO.

NASA Discipline Plant Biology↗
NASA NTRS2006

Design and Testing of Space Telemetry SCA Waveform

A Software Communications Architecture (SCA) Waveform for space telemetry is being developed at the NASA Glenn Research Center (GRC). The space telemetry waveform is implemented in a laboratory testbed consisting of general purpose processors, field programmable gate arrays (FPGAs), analog-to-digital converters (ADCs), and digital-to-analog converters (DACs). The radio hardware is integrated with an SCA Core Framework and other software development tools. The waveform design is described from both the bottom-up signal processing and top-down software component perspectives. Simulations and model-based design techniques used for signal processing subsystems are presented. Testing with legacy hardware-based modems verifies proper design implementation and dynamic waveform operations. The waveform development is part of an effort by NASA to define an open architecture for space based reconfigurable transceivers. Use of the SCA as a reference has increased understanding of software defined radio architectures. However, since space requirements put a premium on size, mass, and power, the SCA may be impractical for today s space ready technology. Specific requirements for an SCA waveform and other lessons learned from this development are discussed.

Mortensen, Dale J.↗
NASA NTRS1994

Development of CMOS Active Pixel Image Sensors for Low Cost Commercial Applications

This paper describes ongoing research and development of CMOS active pixel image sensors for low cost commercial applications. A number of sensor designs have been fabricated and tested in both p-well and n-well technologies. Major elements in the development of the sensor include on-chip analog signal processing circuits for the reduction of fixed pattern noise, on-chip timing and control circuits and on-chip analog-to-digital conversion (ADC). Recent results and continuing efforts in these areas will be presented.

active pixel image sensors CMOS signal processing ↗
NASA NTRS1994

NbN A/D Conversion of IR Focal Plane Sensor Signal at 10 K

We are implementing a 12 bit SFQ counting ADC with parallel-to-serial readout using our established 10 K NbN capability. This circuit provides a key element of the analog signal processor (ASP) used in large infrared focal plane arrays. The circuit processes the signal data stream from a Si:As BIB detector array. A 10 mega samples per second (MSPS) pixel data stream flows from the chip at a 120 megabit bit rate in a format that is compatible with other superconductive time dependent processor (TDP) circuits being developed. We will discuss our planned ASP demonstration, the circuit design, and test results.

conversion↗
NASA NTRS2007

An IEEE 1451.1 Architecture for ISHM Applications

The IEEE 1451.1 Standard for a Smart Transducer Interface defines a common network information model for connecting and managing smart elements in control and data acquisition networks using network-capable application processors (NCAPs). The Standard is a network-neutral design model that is easily ported across operating systems and physical networks for implementing complex acquisition and control applications by simply plugging in the appropriate network level drivers. To simplify configuration and tracking of transducer and actuator details, the family of 1451 standards defines a Transducer Electronic Data Sheet (TEDS) that is associated with each physical element. The TEDS contains all of the pertinent information about the physical operations of a transducer (such as operating regions, calibration tables, and manufacturer information), which the NCAP uses to configure the system to support a specific transducer. The Integrated Systems Health Management (ISHM) group at NASA's John C. Stennis Space Center (SSC) has been developing an ISHM architecture that utilizes IEEE 1451.1 as the primary configuration and data acquisition mechanism for managing and collecting information from a network of distributed intelligent sensing elements. This work has involved collaboration with other NASA centers, universities and aerospace industries to develop IEEE 1451.1 compliant sensors and interfaces tailored to support health assessment of complex systems. This paper and presentation describe the development and implementation of an interface for the configuration, management and communication of data, information and knowledge generated by a distributed system of IEEE 1451.1 intelligent elements monitoring a rocket engine test system. In this context, an intelligent element is defined as one incorporating support for the IEEE 1451.x standards and additional ISHM functions. Our implementation supports real-time collection of both measurement data (raw ADC counts and converted engineering units) and health statistics produced by each intelligent element. The handling of configuration, calibration and health information is automated by using the TEDS in combination with other electronic data sheets extensions to convey health parameters. By integrating the IEEE 1451.1 Standard for a Smart Transducer Interface with ISHM technologies, each element within a complex system becomes a highly flexible computation engine capable of self-validation and performing other measures of the quality of information it is producing.

Morris, Jon A.↗
NASA NTRS2004

THz Hot-Electron Photon Counter

We present a concept for the hot-electron transition-edge sensor capable of counting THz photons. The main need for such a sensor is a spectroscopy on future space telescopes where a background limited NEP approx. 10(exp -20) W/H(exp 1/2) is expected at around 1 THz. Under these conditions, the rate of photon arrival is very low and any currently imaginable detector with sufficient sensitivity will operate in the photon counting mode. The Hot-Electron Photon Counter based on a submicron-size Ti bridge has a very low heat capacity which provides a high enough energy resolution (approx.140 GHz) at 0.3 K. With the sensor time constant of a few microseconds, the dynamic range would be approx. 30 dB. The sensor couples to radiation via a planar antenna and is read by a SQUID amplifier or by a 1-bit RSFQ ADC. A compact array of the antenna-coupled counters can be fabricated on a silicon wafer without membranes.

radiation detectors↗
NASA NTRS2005

Event-driven charge-coupled device design and applications therefor

An event-driven X-ray CCD imager device uses a floating-gate amplifier or other non-destructive readout device to non-destructively sense a charge level in a charge packet associated with a pixel. The output of the floating-gate amplifier is used to identify each pixel that has a charge level above a predetermined threshold. If the charge level is above a predetermined threshold the charge in the triggering charge packet and in the charge packets from neighboring pixels need to be measured accurately. A charge delay register is included in the event-driven X-ray CCD imager device to enable recovery of the charge packets from neighboring pixels for accurate measurement. When a charge packet reaches the end of the charge delay register, control logic either dumps the charge packet, or steers the charge packet to a charge FIFO to preserve it if the charge packet is determined to be a packet that needs accurate measurement. A floating-diffusion amplifier or other low-noise output stage device, which converts charge level to a voltage level with high precision, provides final measurement of the charge packets. The voltage level is eventually digitized by a high linearity ADC.

Doty, John P.↗
NASA NTRS2008

Are Current SEE Test Procedures Adequate for Modern Devices and Electronics Technologies?

Believe it or not, this has been a simplistic look at starting a checklist for SEE testing. Given a memory that has 68 operating modes, when a SEU occurs that changes the mode, just how do you determine what's going on? Laser and microbeam tests can help, but not easily for modern packaged devices. Expanding this approach to other more complex devices such as ADCs or processors as well as analog devices should be considered. The recommendation is to use the existing text standards as the starting point. Just make your own checklist for the device/technology/issues being considered. At HEART 2007, we presented some of the burgeoning challenges associated with single event effect(SEE) testing of modern commercial memories: a) Package, device complexity, test fixture, and data analysis issues were discussed; b) "Complete" SEE Characterization would take 15 years; c) Qualification test costs have a greater than 4 times increase over the last decade. In this talk, we continue to explore the roles of technology with an emphasis on the existing SEE Test Procedures and some of the concerns related to modern devices. The primary objective of the briefing is to provide some overarching guidance concerning the many considerations involved in the formulation of a SEE test plan provided in a " Checklist" format.we note that there is no such thing as a complete check list and that the best approach is to develop a flexible test plan that takes into account the device type and functions, the device technology, circuit and package design, and, of course, test facility and beam characteristics.

LaBel, Kenneth A.↗
NASA NTRS2009

Performance of the THS4302 and the Class V Radiation-Tolerant THS4304-SP Silicon Germanium Wideband Amplifiers at Extreme Temperatures

This report discusses the performance of silicon germanium, wideband gain amplifiers under extreme temperatures. The investigated devices include Texas Instruments THS4304-SP and THS4302 amplifiers. Both chips are manufactured using the BiCom3 process based on silicon germanium technology along with silicon-on-insulator (SOI) buried oxide layers. The THS4304-SP device was chosen because it is a Class V radiation-tolerant (150 kRad, TID silicon), voltage-feedback operational amplifier designed for use in high-speed analog signal applications and is very desirable for NASA missions. It operates with a single 5 V power supply [1]. It comes in a 10-pin ceramic flatpack package, and it provides balanced inputs, low offset voltage and offset current, and high common mode rejection ratio. The fixed-gain THS4302 chip, which comes in a 16-pin leadless package, offers high bandwidth, high slew rate, low noise, and low distortion [2]. Such features have made the amplifier useful in a number of applications such as wideband signal processing, wireless transceivers, intermediate frequency (IF) amplifier, analog-to-digital converter (ADC) preamplifier, digital-to-analog converter (DAC) output buffer, measurement instrumentation, and medical and industrial imaging.

Patterson, Richard L.↗
NASA NTRS2008

Instrumentation System Diagnoses a Thermocouple

An improved self-validating thermocouple (SVT) instrumentation system not only acquires readings from a thermocouple but is also capable of detecting deterioration and a variety of discrete faults in the thermocouple and its lead wires. Prime examples of detectable discrete faults and deterioration include open- and short-circuit conditions and debonding of the thermocouple junction from the object, the temperature of which one seeks to measure. Debonding is the most common cause of errors in thermocouple measurements, but most prior SVT instrumentation systems have not been capable of detecting debonding. The improved SVT instrumentation system includes power circuitry, a cold-junction compensator, signal-conditioning circuitry, pulse-width-modulation (PWM) thermocouple-excitation circuitry, an analog-to-digital converter (ADC), a digital data processor, and a universal serial bus (USB) interface. The system can operate in any of the following three modes: temperature measurement, thermocouple validation, and bonding/debonding detection. The software running in the processor includes components that implement statistical algorithms to evaluate the state of the thermocouple and the instrumentation system. When the power is first turned on, the user can elect to start a diagnosis/ monitoring sequence, in which the PWM is used to estimate the characteristic times corresponding to the correct configuration. The user also has the option of using previous diagnostic values, which are stored in an electrically erasable, programmable read-only memory so that they are available every time the power is turned on.

Perotti, Jose↗
NASA NTRS2004

Application of Atmospheric Infrared Sounder (AIRS) Data to Climate Research

The application of hyper spectral radiometric data to climate research requires very high absolute radiometric accuracy and stability. We use cloud-free tropical ocean data from the Atmospheric InfraRed Sounder (AIR) Calibration Data Subset (ADCS) to show that the radiometric precision and stability required climate applications has been achieved. The sea surface skin temperatures derived from the AIRS 2616cm-1 super window channel are stable relative to the RTG.SST at the better than 8 mK/year level, and the spectral calibration is stable at the 1 ppm/year level. The excellent stability and accuracy are the result of the implementation of AIRS as a grating array spectrometer, which is cooled and stabilized within 10 mK at 155 K. Analysis of daily measurements of the temperature gradient between the surface and 7 km altitude show that the AIRS Calibration Data Subset has applications which extend its original intent for calibration support to climate research. The Atmospheric Infrared Sounder (AIRS) on the EOS Aqua satellite was launched into polar orbit in May 2002. AIRS covers the spectral region from 640 to 2700 cm-1 with 2378 independent channels and represents the first of a new generation of hyper spectral resolution sounders in support of global sounding data for weather forecasting and climate research.

infrared↗