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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

JACC.shared: Leveraging HPC Metaprogramming and Performance Portability for Computations That Use Shared Memory GPUs

In this work, we present JACC.shared, a new feature of Julia for ACCelerators (JACC), which is the performanceportable and metaprogramming model of the just-in-time and LLVM-based Julia language. This new feature allows JACC applications to leverage the high-performance computing (HPC) capabilities of high-bandwidth, on-chip GPU memory. Historically, exploiting high-bandwidth, shared-memory GPUs has not been a priority for high-level programming solutions. JACC.shared covers that gap for the first time, thereby providing a highlevel, portable, and easy-to-use solution for programmers to exploit this memory and supporting all current major accelerator architectures. Well-known HPC and AI workloads, such as multi/hyperspectral imaging and AI convolutions, have been used to evaluate JACC.shared on two exascale GPU architectures hosted by some of the most powerful US Department of Energy supercomputers: Perlmutter (NVIDIA A100) and Frontier (AMD MI250X). The performance evaluation reports speedup of up to 3.5× by adding only one line of code to the base codes, thus providing important accelerators in a simple, portable, and transparent way and elevating the programming productivity and performance-portability capabilities for Julia/JACC HPC, AI, and scientific applications.

Valero Lara, Pedro [ORNL] (ORCID:0000000214794310)↗
DOE OSTI2025

ETROC2 as the Final Version for CMS MTD Endcap Timing Layer (ETL) Upgrade

The ETROC2 is the first full-size full-functionality prototype design fully compatible with the final chip specifications for CMS ETL. The ETROC2 chips have been extensively tested and the results have been presented at IEEE NSS MIC RTSD 2024. We will present here new results including the bump bonding yield improvement study, the time walk correction (TWC) generality study with single pixel TWC applied to all pixels, the final SEU testing results using both heavy ion and proton beam, more beam test studies including different sensors and irradiated sensors, and readiness for the ETROC2 production for CMS ETL upgrade.

Liu, Tie Hui [Fermilab] (ORCID:0009000765225605)↗
DOE OSTI2026

Versatile High-Gain Low-Noise Readout ASIC for Silicon Microstrip Tracking Detectors

This work presents Turpial, a custom-designed low- power front-end readout ASIC for microstrip silicon sensors. Implemented in 130 nm CMOS technology, the chip integrates 64 identical readout channels, each including a configurable charge-sensitive amplifier, a bipolar pulse shaper, a 32-sample 50 Msps analog memory, and a 12-bit RC-hybrid SAR ADC operating at 1 Msps. To satisfy the target power budget of 5 mW per channel, the architecture employs a time-decoupled readout scheme in which fast transient signals are first captured in the analog memory and subsequently digitized at a lower rate. Turpial supports a wide dynamic range from 1 kℎ+ to 1 Mℎ+ while maintaining low noise performance, targeting an equivalent noise charge (ENC) below 200 𝑒−including the sensor, and providing a maximum gain of 1500 mV/fC. A digital block manages slow control, data acquisition, and data serialization through dual CML 300 Mb/s serializers. In addition, an on-chip reference circuit, based on a sub-1 V bandgap reference and an integrated LDO regulator, eliminates the need for external reference circuitry. Experimental results demonstrate that both the individual building blocks and the fully integrated ASIC meet the design specifications.

Hernandez, Hugo [Stanford University] (ORCID:00000↗
DOE OSTI2025

A Modified DBC Substrate Improving Thermal Performance for Confined Space Applications

High-power modules use substrates to house the semiconductor device and for electrical insulation. These substrates are constructed with thermally conductive dielectric material sandwiched between two metals to extract heat from semiconductor chips. Thus, the required cooling performance of a power module is linked to the substrate’s thermal performance and can vary based on the substrate technologies. Here, in this study, five substrate technologies were evaluated for space-restricted applications: direct-bonded copper (DBC), an insulated metal substrate (IMS), a thermally annealed pyrolytic graphite (TPG)-based IMS, DBC-based double-sided cooling, and direct-bonded aluminum (DBA) where the heat sink is directly attached without thermal interface materials (TIMs). The finite element (FE) analysis results suggest that the popular DBC substrate has thermal performance better than that of the other substrates for space-constrained applications. To further improve the thermal performance, a modified DBC substrate was proposed where a copper block was added between the semiconductor and the DBC substrate to achieve heat spreading underneath the chip. The modified DBC performance was then compared with the aforementioned substrates and the results showed significant thermal performance improvement. The results were verified with experimental results where the proposed substrate showed 20% more loss handling capability compared to an identical DBC substrate.

42 ENGINEERING↗
DOE OSTI2024

Mixed domain coherent link with electrically reconfigurable IMDD and coherent modes for O-band data center applications

We report the first O-band link with electrically reconfigurable intensity-modulation direct-detection (IMDD) and coherent operation using custom silicon photonic chips packaged with commercial electronic chips. Transmission below the KP4-FEC threshold is shown using commercial 53 Gbaud PAM4 digital signal processing (DSP) for 16QAM (200 Gbps/ λ ) and PAM4 (100 Gbps/ λ ). Efficient operation of the packaged full link at 12 and 11.2 pJ/bit is achieved for the PAM4 and 16QAM modes, respectively.

Misak, Stephen (ORCID:0000000154973084)↗
DOE OSTI2025

Beam combining of high-power terahertz lasers with semiconductor metasurface gratings

Spectral beam combining (SBC) of an array of single-mode lasers has the potential for realizing a chip-scale electrically tunable multispectral laser source without any moving parts and with emission at closely spaced discrete frequencies. Here, we demonstrate SBC of an array of single-mode THz quantum-cascade lasers (QCLs) with small frequency spacing. Semiconductor-based metasurface THz blazed gratings are developed for integration with QCLs in a compact cryocooler setup. Single-lobed beams of four QCLs emitting around 3.2 THz and spectrally separated by ~14 GHz are combined to achieve collinear propagation of spatially overlapped and collimated beams in the far field with ≲ 0.1° of pointing error. Peak optical power in the range 50–100 mW is detected from each of the QCLs after combining. The dense frequency spacing in our method provides a pathway to incorporate tens of QCLs on a chip to realize a high-power discretely tunable THz laser source for applications in THz spectroscopy.

Jia, Fei [Lehigh Univ., Bethlehem, PA (United Stat↗
DOE OSTI2025

Integrated photonic Galton board and its application for photon counting

The Galton board is a desktop probability machine traditionally used to visualize the principles of statistical physics from classical particles. Here, we demonstrate a photonic Galton board that enables on-chip observation of statistics from single-photon interference. The photonic Galton board consists of a directional coupler matrix terminated by an array of superconducting nanowire detectors to provide spatiotemporal resolution. This design also allows for photon-number-resolving capability, making it suitable for high-speed photon counting. Our results demonstrate the compatibility between single-photon detector array and photonic integrated circuits, paving the way for implementing on-chip large-scale quantum optics experiments and photonic quantum computing.

Qin, Hezheng (ORCID:0009000139348800)↗
DOE OSTI2025

Resonant metasurface‐enabled quantum light sources for single‐photon emission and entangled photon‐pair generation

Light encodes information in multiple degrees of freedom (e.g., frequency, amplitude, and phase), enabling high‐speed, high‐bandwidth communication through fiber optics. Unlike classical light, quantum light (single or entangled photons) can transmit quantum states over long distances without loss of coherence, thereby coherently interconnecting quantum nodes for distributed quantum entanglement. Quantum light sources are critical for developing scalable quantum networks aimed at distributed quantum computing, quantum teleportation, and secure quantum communications. However, existing quantum light sources suffer from limited integrability, insufficient spectral and spatial tunability, and inefficiencies in achieving mass‐produced, deterministic, on‐demand quantum light generation. These limitations significantly hinder progress toward direct, on‐chip integration with quantum processing units and detectors – an essential step toward scalable quantum networks. Resonant metasurfaces that leverage photonic modes – such as Mie resonances, guided‐mode resonances, or symmetry‐protected bound states in the continuum – offer strong spatial and temporal confinement of electromagnetic fields, characterized by high quality factors and small mode volumes. These metasurfaces greatly enhance linear and nonlinear light‐matter interactions, making them ideal for efficient on‐chip quantum light generation and manipulation. Here, we describe recent advances in nanoscale quantum light sources and quantum photonic state manipulation enabled by resonant metasurfaces. We also provide an outlook on next‐generation miniaturized quantum light sources achievable through materials innovations in quantum emitters, the co‐design of resonant metasurfaces, and ultimately, the heterogeneous integration of emerging layered van der Waals materials with resonant metasurfaces.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2024

Test Beam Results of Planar Pixel Sensor for the CMS Phase 2 Inner Tracker Upgrade

Results of the test beam measurements that characterise the performance of CMS Readout Chip (CROC) sensors to be used in the High Luminosity era of the Large Hadron Collider (HL-LHC) are presented. The HL-LHC peak instantaneous luminosity of $7.5 \times 10^{34} \ \text{cm}^{-2} s^{-1}$ corresponds to an average of around 200 inelastic proton-proton collisions per beam-crossing every 25 ns. In order to efficiently reconstruct and track particles in this extreme and challenging conditions, the present CMS tracking detector will be completely replaced. The new tracking detector consists of an Inner Tracker closest to the beamline and an Outer Tracker surrounding it. These are populated with modules that comprise of readout chips and silicon sensors. The test beam measurements of these modules are vital to understand the performance of the related technologies. Using a primary 120 GeV proton beam from the Main Injector at Fermilab, data was collected at the Fermilab Test Beam Facility (FTBF) using the silicon tracker telescope that provides a precision position measurement of the track impact point with less than 5 $\mu$m uncertainty. The proton beam was incident on a 1x2 planar CROC module developed by Hamamatsu. The sensor has 100x25 $\mu m^2$ standard pixels and also a smaller number of 225x25 $\mu m^2$ longer pixels at the boundary between the two ROCs. We present characterization of these modules that includes pixel efficiency, resolution, cluster size and charge distributions.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2024

Internship Work Report

I worked on two projects during my summer internship at Sandia. My official title was “Intern - Mission Tech Electrical Eng./Computer Eng.- R&D Undergraduate Summer.” I worked at the central location, which is Albuquerque, New Mexico. The department you are placed in at Sandia doesn’t always correspond to the people you will be working with. For example, I only directly worked with one person from my department this summer. On one of my projects, I worked with a diverse team of engineers from many different departments. On my other project, I mainly worked with two departments, as the project had two distinct parts. As mentioned earlier, I worked on two projects during my summer at Sandia. The first project focused on a lightweight embedded controller in an advanced FPGA System-on-Chip for radar signal processing applications. The term “controller” refers to a hardware device that directs the flow of data between two entities. An FPGA is a reprogrammable integrated circuit (as opposed to an integrated circuit with one purpose). An FPGA was used on this project so in order to protype various ideas for our System-on-Chip. My role on the project was to implement designs on the fabric of the FPGA and design a state machine (written in C) for the processor. My second project was also heavily involved with embedded systems but had a different application. It focused on using a Newton-Raphson control algorithm to stabilize an inverted pendulum using a novel microcontroller. The pendulum dynamics were derived, and it was successfully simulated in MATLAB. I worked on integrating the microcontroller with the inverted pendulum machinery, and converting the Newton-Raphson control algorithm from MATLAB into C. The inverted pendulum was successfully stabilized using a simple PID controller and industry-standard microcontroller. The project is still ongoing, and the team is gearing up for more tests using the novel Newton-Raphson control algorithm and novel microcontroller

42 ENGINEERING↗
DOE OSTI2024

Device and Method for Parallel Measurement of Phosphoproteome and Proteome from Single Cells

We present the development of an immobilized metal affinity chromatography (IMAC) chip designed to enable nanoscale phosphopeptide enrichment within microfabricated nanowells. This novel platform leverages surface chemistry to immobilize high-density Nickel-Nitrilotriacetic Acid (Ni-NTA) molecules on nanowells, followed by applying Fe 3+ . The nanowell surface serves as a capture media to enrich phosphopeptides based on IMAC. The system's efficiency was validated using ß-casein as a model protein, demonstrating the chip’s capability to significantly enrich phosphopeptides. Future applications of this technology are anticipated to enable the detection of over 100 phosphopeptides from individual cells and more than 500 phosphopeptides from pools of 100 cells, offering exciting potential for single-cell phosphoproteomics. We will next apply an integrated proteomics workflow to perform multi-omics measurements, including single-cell isolation, protein digestion, and phosphopeptide enrichment, followed by LC-MS analysis of both the global proteome and phosphoproteome. Future research will explore the use of this technology to study phosphorylation dynamics in cancer cells, enhancing our understanding of cellular signaling and disease mechanisms.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2024

Recycling of Titanium Scrap by Shear Assisted Processing and Extrusion (ShAPE)

Titanium and its alloys are used in the aviation and automobile industries due to their remarkable strength to weight ratio, but, commonly, machining loss is high with ~90 wt.% of the material being converted to scrap. Recycling post-consumer Ti scrap directly into solid bulk products is a potential solution for repurposing valuable material. Further, reducing or even eliminating fresh Ti sponge during recycling might lead to lower energy and greenhouse gas emissions. In this study, a solid-phase process known as friction extrusion was utilized to recycle Ti-6Al-4V machining chips into solid wires which could be used as feedstock in additive manufacturing. The friction consolidation technique was first used to convert chips with varying degrees of oxygen content into solid billets for its use as feedstock material in subsequent friction extrusion. The extrudates were fabricated above the beta transition temperature, which was achieved by selecting rotation rate and feed rate, to process the billets near 1000°C using a tungsten-lanthana extrusion die. This work presents the first occurrence of friction extruded titanium alloy wires. The effect of friction extrusion on microstructural features, tensile properties, and texture are reported. Overall, the friction extrusion method is capable of recycling Ti-6Al-4V scrap directly into extruded wire.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Integrated Coulomb Blockade Thermometry for Quantum Computing

In our work we present on-chip thermometry concept aimed at improving temperature control during quantum measurements. The key issue addressed is lack of precise temperature monitoring, especially considering the unavoidable thermal resistance between the qubits’ chip and mixing plate of dilution refrigerator. The suggested solution includes a Coulomb Blockade Thermometer (CBT) based on an array of intrinsically normal-conducting tunnel junctions, currently developed at Aalto University. This is a practical solution for superconducting qubit systems.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2025

Superconducting Qubits Underground

Superconducting qubit devices are highly sensitive to cosmic ray induced quasiparticle poisoning—a challenge for quantum computing. At Fermilab, we utilize an underground testbed called QUIET that significantly decreases the rate of such events. We employ an open-source toolchain, including Qiskit Metal and the SQuADDs library, for device design and simulation prior to fabrication. We then test these chips in QUIET, which is capable of housing many chips, enabling tests of scalability. This presentation will cover our qubit design approach, fabrication capabilities, and first measurements from qubits deployed in QUIET, benchmarking the new facility.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2025

Developing tools and process controls to manufacture energy-efficient powders for additive manufacturing feedstocks: Computational analysis of metal powder manufacturing via machining

Traditionally, metal powders have been produced through methods such as grinding, atomization, and electrolysis. In contrast to these techniques, Metal Powder Works, Inc. has pioneered a methodology based on metal cutting. This innovative approach utilizes a vibrating cutting tool to machine metal particles, in the form of chips, from a workpiece. This technique allows for control of powder particle size, morphology, and avoids any thermally induced material changes. This collaboration aims to elucidate metal cutting characteristics and assess performance on tough materials like Inconel alloys. Computational models, using FEA and SPH techniques, will be developed initially, focusing on aluminum alloy (Al 7075-T6) for studying mesh sensitivity, cutting forces, and chip morphology.

99 GENERAL AND MISCELLANEOUS↗
DOE OSTI2025

Developing tools and process controls to manufacture energy-efficient powders for additive manufacturing feedstocks

Traditionally, metal powders have been produced through methods such as grinding, atomization, and electrolysis. In contrast to these techniques, Metal Powder Works, Inc. has pioneered a methodology based on metal cutting. This innovative approach utilizes a vibrating cutting tool to machine metal particles, in the form of chips, from a workpiece. This technique allows for control of powder particle size, morphology, and avoids any thermally induced material changes. This collaboration aims to elucidate metal cutting characteristics and assess performance on tough materials like Inconel alloys. Computational models, using FEA and SPH techniques, will be developed initially, focusing on aluminum alloy (Al 7075- T6) for studying mesh sensitivity, cutting forces, and chip morphology.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Increasing Radon Daughter Plate-out onto Superconducting Qubits

Radon daughter plate-out may pose a fundamental limitation to realizing large-scale superconducting quantum computers. Radon daughters plated-out onto a superconducting qubit chip can decay, releasing energy into the substrate, producing phonons. Phonon induced quasiparticles generate bit flip errors and reduce coherence times. We seek to increase plate-out on chips to enable future study of the impact of Radon on coherence times. In this project, we utilize COMSOL Multiphysics simulations to finalize design for a device to increase radon plate-out.

Kay, Dax [Northwestern U.]↗
DOE OSTI2025

Frequency and time multiplexing for multiphoton state generation

One of the primary challenges with photonic quantum information processing is that single-photon states are created and heralded probabilistically, rather than being created on demand. One solution to this problem is multiplexing , which is attempting probabilistic generation of a single photon at multiple locations, times, or frequencies, and switching one successfully generated photon into an output mode. Motivated by the development of frequency-based photonic quantum information processing, we consider multiplexing using frequency and time as our options to use to get many photon generation opportunities. We devise an approach for generating multiphoton states, with photons populating multiple frequency modes in the same spatiotemporal mode. This method uses a variable-length optical delays to manipulate the temporal mode of the photons, and spaced fiber Bragg grating (FBG) reflectors to jointly manipulate the frequency and temporal modes of the photons. Experimental progress toward implementing this multiplexing scheme is proceeding along 2 fronts, each with different ways to achieve the variable-length optical delay. First, we will implement this scheme using a free-space optical quantum memory with multiple discretely adjustable free-space delays. For this implementation method, I calculate multiphoton generation rates, accounting for loss, that are realistically achievable with commercially available hardware. This work will appear in a theory paper, currently in preparation. Second, we will implement this multiplexing scheme in an integrated manner: the variable-length optical delay will happen on-chip using a long-lifetime Q-switchable Fabry-Perot cavity. The joint manipulation of the frequency and temporal modes of the photons will still happen off-chip in fiber with FBG reflectors. I report on experimental progress in constructing integrated Q-switchable Fabry-Perot cavities.

97 MATHEMATICS AND COMPUTING↗