Search NASA⌕ Search

SEARCH · Search NASA

Results for “COTS electronics”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

Evaluation of Fairchild's Gate Drive Optocoupler, Type FOD3150, Under Wide Temperature Operation

An optocoupler is a semiconductor device that is used to transfer a signal between different parts of a circuit that need to be electrically isolated from one another - for example, where a high voltage is to be switched with a low voltage control signal. Optocouplers often can be used in place of relays. These optocouplers utilize an infrared LED (light emitting diode) and a photodetector such as a silicon controlled rectifier or photosensitive silicon diode for the transfer of the electronic signal between components of a circuit by means of a short optical transmission channel. For maximum coupling, the wave-length responses of the LED and the detector should be very similar. In switch-mode power supply applications, optocouplers offer advantages over transformers by virtue of simpler circuit design, reduced weight, and DC coupling capability. The effects of extreme temperature exposure and thermal cycling on the performance of a commercial-off-the-shelf (COTS) optocoupler, Fairchild FOD3150, were evaluated in this work. This 1.0 A output current, high noise immunity gate drive optocoupler utilizes an aluminum gallium arsenide (AlGaAs) LED, is capable of driving most 800V/20A IGBT/MOSFETs, and is suited for fast switching in motor control inverter applications and high performance power systems. Some of the specifications of the isolator chip are listed. The device was evaluated in terms of output response, output rise (t(sub r)) and fall times (t(sub f)), and propagation delays (using a 50% level between input and output during low to high (t(sub PLH)) and high to low (t(sub PLH)) transitions). The output supply current was also obtained. These parameters were recorded at various test temperatures between -190 C and +110 C.

Patterson, Richard↗
NASA NTRS2020

Select Electronic Parts Operation at Extreme Low Temperature

The purpose of the study presented in this paper is to extend the test period of a selected set of electronics parts at cryogenic condition to dwell period of about 24 hours to demonstrate extreme cold operational capability of these components. The parts tested are tantalum polymer, BX and P90 type ceramic capacitors, thick film resistors, analog multiplexers, a digital inverter, and a D-flip-flop. These parts were tested to assist identifying candidate components that can be used for development of a cold capable telemetry board. There are several past investigations that have shown that COTS (commercial-off-the-shelf) capacitors and resistors tested at cryogenic temperatures and frequencies up to 10MHz did not exhibit significant changes in capacitance and resistance values. Also, there are several test results for active parts. These past tests collected measurements during a temperature sweep from room temperature down to cryogenic temperature with very short dwell time at cryogenic temperature, and back to room temperature. This study extends the operational dwell time to at least 24 hours and returning to room temperature operation without significant degradation in performance, thus, demonstrating the potential for longer dwell time in actual operation in these extreme cold temperatures and a method for identifying the cold operability.

Ashtijou, Mohammad↗
NASA NTRSDate not supplied

Windform® XT 2.0 Use as 3U CubeSat Primary Structure

CubeSats provide a platform for small-scale space research and technology demonstration at reduced complexity, cost, and development time. These advantages drove the NASA Langley Research Center (LaRC) to develop and launch the GPX2 3U CubeSat to explore the viability of using Commercial Off-The-Shelf (COTS) differential GPS (dGPS) in low earth orbit. To reduce manufacturing costs and increase design flexibility, the project chose additive manufactured Windform® XT 2.0 as the primary bus material rather than traditional subtractive manufactured (milled) metal. The bus is a two-part, Selective Laser Sintered, 3D-print structure consisting of a single-piece, five-walled chassis and single-walled cover. The bus was specially designed to allow the project to accommodate the payload electronics stack as well as antennas, receivers, and deployable mechanisms. By using an additive manufactured solution, LaRC was able to design in features unrealizable through traditional milling, with a lead-time of roughly two weeks. In comparison, traditional subtractive manufacturing limits geometry options due to toolpath reach and bus construction would have required multiple components for each wall. This would have resulted in a more costly, longer lead-time article with more joints, fasteners, and complexity with a commensurate increase in overall mass. A number of lessons-learned were captured during the design, analysis, and testing of the GPX2 CubeSat covering thermal and structural analysis, vibration modeling, and geometric tolerancing. Additionally, a variety of material testing and verification were performed before and during spacecraft design and integration to assure the suitability of Windform® XT 2.0 for the launch and mission environments. This article provides the highlights of designing and testing the GPX2 bus.

CubeSat↗
NASA NTRS2008

Disturb testing in flash memories

Non-volatile memory technology as defined by NAND architecture flash memory continues to lead the process scaling and device shrinking efforts of the entire integrated circuit industry. 45- nm technology nodes are now producing commercial 32Gb devices. These latest 32Gb devices are pioneering new charge trapping memory cell technologies using metal gates and high-k dielectric materials. These cells are called TANOS and consist of tantalum-nitride, aluminum oxide (high k material), nitride, oxide, and silicon. Such high-density memories continue to revolutionize commercial electronics in terms of new high-speed data architectures and significant reductions in overall power and weight consumption. In stark contrast, nearly all science-based interplanetary and earth-orbiting NASA spacecraft are still designing in and around mid-1980s-level non-volatile technology with 1Mb Electrically Erasable Read-Only Memory (EEPROM) devices. NASA has typically shunned the use of modern flash devices because of radiation and reliability concerns due to the commercial-offthe– shelf (COTS) nature of the NAND flash technology. Given the significant potential increases in overall system capability these modern flash devices could bring to NASA missions, it is important to continue to investigate these devices. This report will investigate certain portions of the reliability performance of NAND flash devices, specifically the disturb properties. Understanding the possible limitations such new non-volatile memory technology presents to NASA is the goal of this report.

Freie, Michael↗
NASA NTRS2010

Evaluation of a High Temperature SOI Half-Bridge MOSFET Driver, Type CHT-HYPERION

Silicon-On-Insulator (SOI) technology utilizes the addition of an insulation layer in its structure to reduce leakage currents and to minimize parasitic junctions. As a result, SOIbased devices exhibit reduced internal heating as compared to the conventional silicon devices, consume less power, and can withstand higher operating temperatures. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a commercial-off-the-shelf (COTS) SOI half-bridge driver integrated circuit was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to establish a baseline on the functionality and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Patterson, Richard↗
NASA NTRSDate not supplied

Comparison of a Probabilistic TID Hardness Assurance Method to Military Standards

The rapid evolution of electronics has heralded countless benefits to humanity, enabling increases in computing power while decreasing costs. However, the constantly changing semiconductor device landscape proves to be an immense challenge for the reliability community, especially for those concerned with radiation effects on microelectronics. Changes in device manufacturing, from device structure to processing steps, may and often do change the way the device responds to radiation. While radiation hardened parts are not as much of a reliability concern, they also lag behind commercial off-the-shelf, or COTS, parts in terms of computing capabilities, some by over a decade. Many missions may have no choice but to utilize COTS. As such, these missions need to ensure their parts are reliable in the face of total ionizing dose (TID). However, part and testing facility costs limit the amount of testing possible.

Chloe Champagne↗
NASA NTRS2020

An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduced Board Size for Space Based Electronics

This paper presents our work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuit (ASIC) applications. FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry. Our Interposer focuses on the needs of Micro Semi’s RTG4 FPGA. We developed the interposer using COTS embedded foil capacitors. The Interposer is customized to the capacitance requirements for each of the FPGA banks. We evaluated three foil manufactures Oak Mitsui, 3M and TDK. The three different designs were evaluated, but we will focus on the Oak-Mitsui based Interposer that we constructed and tested. Through simulations, we validate the horizontal and vertical interconnect inductances, that FPGA decoupling requirements are met. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.

Hunter, Don J↗
NASA NTRS2009

Commercial off-the-Shelf (COTS) Refractory Material Evaluation

Fondu Fyre (FF) is currently the only refractory material qualified for use in the flame trench at KSC's Shuttle Launch Pads 39A and 39B. However, the material is not used as it was qualified and has undergone increasingly frequent and severe degradation due to the launch blasts. This degradation is costly as well as dangerous for launch infrastructure, crew and vehicle. FF is applied at the pad via the gunnite process, where wetted refractory material is sprayed onto a steel grid mounted on a support structure. The water content in this process can be manually adjusted by operators, causing distinct visual and physical discrepancies among repair areas. Since the application process is unlikely to change for new refractory materials, it is important to understand the effects of water content on commercial off-the-shelf (COTS) refractory materials. The purpose of this study was to evaluate the performance of the FF with respect to various water contents as well as heat treatments, to simulate aging and exposure to the blast. Initial results indicated that different water contents and heat treatments result in distinct differences in crushing strength, apparent porosity and bulk density. However, water content became an insignificant factor in both crush strength and porosity when FF was cured to at least 1500 deg. Additionally, inspection of the material's surface microstructure by scanning electron microscopy indicated distinguishable characteristics for different heat treatment levels. Results from this study will help guide future studies on the development and identification of new refractory materials.

Calle, Luz Marina↗
NASA NTRS2011

Cryogenic Behavior of the High Temperature Crystal Oscillator PX-570

Microprocessors, data-acquisition systems, and electronic controllers usually require timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that utilize crystal oscillators due to availability, cost, ease of operation, and accuracy. Stability of these oscillators, i.e. crystal characteristics, is usually governed, amongst other things, by the ambient temperature. Operation of these devices under extreme temperatures requires, therefore, the implementation of some temperature-compensation mechanism either through the manufacturing process of the oscillator part or in the design of the circuit to maintain stability as well as accuracy. NASA future missions into deep space and planetary exploration necessitate operation of electronic instruments and systems in environments where extreme temperatures along with wide-range thermal swings are countered. Most of the commercial devices are very limited in terms of their specified operational temperature while very few custom-made and military-grade parts have the ability to operate in a slightly wider range of temperature. Thus, it is becomes mandatory to design and develop circuits that are capable of operation efficiently and reliably under the space harsh conditions. This report presents the results obtained on the evaluation of a new (COTS) commercial-off-the-shelf crystal oscillator under extreme temperatures. The device selected for evaluation comprised of a 10 MHz, PX-570-series crystal oscillator. This type of device was recently introduced by Vectron International and is designed as high temperature oscillator [1]. These parts are fabricated using proprietary manufacturing processes designed specifically for high temperature and harsh environment applications [1]. The oscillators have a wide continuous operating temperature range; making them ideal for use in military and aerospace industry, industrial process control, geophysical fields, avionics, and engine control. They exhibit low jitter and phase noise, consume little power, and are suited for high shock and vibration applications. The unique package design of these crystal oscillators offers a small ceramic package footprint, as well as providing both through-hole mounting and surface mount options.

Patterson, Richard↗
NASA NTRS2015

Shields-1, A SmallSat Radiation Shielding Technology Demonstration

The NASA Langley Research Center Shields CubeSat initiative is to develop a configurable platform that would allow lower cost access to Space for materials durability experiments, and to foster a pathway for both emerging and commercial-off-the-shelf (COTS) radiation shielding technologies to gain spaceflight heritage in a relevant environment. The Shields-1 will be Langleys' first CubeSat platform to carry out this mission. Radiation shielding tests on Shields-1 are planned for the expected severe radiation environment in a geotransfer orbit (GTO), where advertised commercial rideshare opportunities and CubeSat missions exist, such as Exploration Mission 1 (EM-1). To meet this objective, atomic number (Z) graded radiation shields (Zshields) have been developed. The Z-shield properties have been estimated, using the Space Environment Information System (SPENVIS) radiation shielding computational modeling, to have ~30% increased shielding effectiveness of electrons, at half the thickness of a corresponding single layer of aluminum. The Shields-1 research payload will be made with the Z-graded radiation shields of varying thicknesses to create dose-depth curves to be compared with baseline materials. Additionally, Shields-1 demonstrates an engineered Z-grade radiation shielding vault protecting the systems' electronic boards. The radiation shielding materials' performances will be characterized using total ionizing dose sensors. Completion of these experiments is expected to raise the technology readiness levels (TRLs) of the tested atomic number (Z) graded materials. The most significant contribution of the Z-shields for the SmallSat community will be that it enables cost effective shielding for small satellite systems, with significant volume constraints, while increasing the operational lifetime of ionizing radiation sensitive components. These results are anticipated to increase the development of CubeSat hardware design for increased mission lifetimes, and enable out of low earth orbit (LEO) missions by using these tested material concepts as shielding for sensitive components and new spaceflight hardware

Thomsen, D. Laurence, III↗
NASA NTRS2021

NASA Engineering and Safety Center Technical Bulletin No. 19-01-1: Mitigating Risks of Single-Event Effects in Space Applications

Since most Electrical, Electronic, and Electromechanical (EEE) parts are intended for terrestrial applications, they are susceptible to a range of radiation threats in the space environment if the resulting effects are not properly characterized and mitigated. Even specially designed radiation-hardened parts may not be tolerant to all types of radiation effects. Radiation hardness is a multi-dimensional property of any part that describes intrinsic abilities to tolerate various radiation environments [1,2]. Effects to be concerned with include total ionizing dose, total non-ionizing dose, and single-event effects (SEE) – all of which depend on the mission, environment, application, and lifetime. Radiation effects concerns may be the same whether a EEE part is Commercial-Off-The-Shelf (COTS), MIL-SPEC, or some other variant, all of which are susceptible to the same radiation threats [3]. SEE consequences range from recoverable faults to catastrophic failure. Like other random faults, SEE can be mitigated with informed circuit design practices at the device, card, and/or system level.

Single-event effects↗
NASA NTRS2004

COTS MEMS Flow-Measurement Probes

As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at Glenn Research Center have been fabricating packaging components and assembling a set of unique probes that contain commercial off-the-shelf (COTS) microelectromechanical systems (MEMS) sensor chips. MEMS sensor chips offer some compelling advantages over standard macroscopic measurement devices. MEMS sensor technology has matured through mass production and use in the automotive and aircraft industries. At present, MEMS are the devices of choice for sensors in such applications as tire-pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Compactness, minimality of power demand, rugged construction, and moderate cost all contribute to making MEMS sensors attractive for instrumentation for future research. Conventional macroscopic flow-measurement instrumentation includes tubes buried beneath the aerodynamic surfaces of wind-tunnel models or in wind-tunnel walls. Pressure is introduced at the opening of each such tube. The pressure must then travel along the tube before reaching a transducer that generates an electronic signal. The lengths of such tubes typically range from 20 ft (approx.= 6 m) to hundreds of feet (of the order of 100 m). The propagation of pressure signals in the tubes damps the signals considerably and makes it necessary to delay measurements until after test rigs have reached steady-state operation. In contrast, a MEMS pressure sensor that generates electronic output can take readings continuously under dynamic conditions in nearly real time. In order to use stainless-steel tubing for pressure measurements, it is necessary to clean many tubes, cut them to length, carefully install them, delicately deburr them, and splice them. A cluster of a few hundred 1/16-in.- (approx.=1.6-mm-) diameter tubes (such clusters are common in research testing facilities) can be several inches (of the order of 10 cm) in diameter and could weigh enough that two technicians are needed to handle it. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of a 1/16-in. tube with room to spare. The Lucas NovaSensor P592 piezoresistive silicon pressure sensor was chosen for this project because of its cost, availability, and tolerance to extreme ambient conditions. The sensor chip is 1 mm square by 0.6 mm thick (about 0.039 by 0.039 by 0.024 in.) and includes 0.12-mm (approx.=0.005-in.) wire connection tabs. The figure shows a flow-angularity probe that was built by use of three such MEMS chips. It is planned to demonstrate this MEMS probe as an alternative to a standard tube-type "Cobra" probe now used routinely in wind tunnels and aeronautical hardware. This MEMS probe could be translated across a flow field by use of a suitable actuator, so that its accuracy and the shortness of its response time could be exploited to obtain precise dynamic measurements of a sort that cannot be made by use of conventional tubing-based instrumentation.

Redding, Chip↗
NASA NTRS2011

High Voltage EEE Parts for EMA/EHA Applications on Manned Launch Vehicles

The objective of this paper is an assessment of high voltage electronic components required for high horsepower electric thrust vector control (TVC) systems for human spaceflight launch critical application. The scope consists of creating of a database of available Grade 1 electrical, electronic and electromechanical (EEE) parts suited to this application, a qualification path for potential non-Grade 1 EEE parts that could be used in these designs, and pathfinder testing to validate aspects of the proposed qualification plan. Advances in the state of the art in high power electric power systems enable high horsepower electric actuators, such as the electromechnical actuator (EMA) and the electro-hydrostatic actuator (EHA), to be used in launch vehicle TVC systems, dramaticly reducing weight, complexity and operating costs. Designs typically use high voltage insulated gate bipolar transistors (HV-IGBT). However, no Grade 1 HV-IGBT exists and it is unlikely that market factors alone will produce such high quality parts. Furthermore, the perception of risk, the lack of qualification methodoloy, the absence of manned space flight heritage and other barriers impede the adoption of commercial grade parts onto the critical path. The method of approach is to identify high voltage electronic component types and key parameters for parts currently used in high horsepower EMA/EHA applications, to search for higher quality substitutes and custom manufacturers, to create a database for these parts, and then to explore ways to qualify these parts for use in human spaceflight launch critical application, including grossly derating and possibly treating hybrid parts as modules. This effort is ongoing, but results thus far include identification of over 60 HV-IGBT from four manufacturers, including some with a high reliability process flow. Voltage ranges for HV-IGBT have been identified, as has screening tests used to characterize HV-IGBT. BSI BS ISO 21350 Space systems Off-the-shelf item utilization, developed from Marshall Work Instruction MWI8060.1 OFF-THE-SHELF HARDWARE UTILIZATION IN FLIGHT HARDWARE DEVELOPMENTwas found to provide guidance for including commercial off-the-shelf (COTS) hardware for use in critical applications.

Griffin, Trent↗
NASA NTRS2013

High-Speed Data Recorder for Space, Geodesy, and Other High-Speed Recording Applications

A high-speed data recorder and replay equipment has been developed for reliable high-data-rate recording to disk media. It solves problems with slow or faulty disks, multiple disk insertions, high-altitude operation, reliable performance using COTS hardware, and long-term maintenance and upgrade path challenges. The current generation data recor - ders used within the VLBI community are aging, special-purpose machines that are both slow (do not meet today's requirements) and are very expensive to maintain and operate. Furthermore, they are not easily upgraded to take advantage of commercial technology development, and are not scalable to multiple 10s of Gbit/s data rates required by new applications. The innovation provides a softwaredefined, high-speed data recorder that is scalable with technology advances in the commercial space. It maximally utilizes current technologies without being locked to a particular hardware platform. The innovation also provides a cost-effective way of streaming large amounts of data from sensors to disk, enabling many applications to store raw sensor data and perform post and signal processing offline. This recording system will be applicable to many applications needing realworld, high-speed data collection, including electronic warfare, softwaredefined radar, signal history storage of multispectral sensors, development of autonomous vehicles, and more.

Taveniku, Mikael↗
NASA NTRS2014

Flight Avionics Hardware Roadmap

The Avionics Technology Roadmap takes an 80% approach to technology investment in spacecraft avionics. It delineates a suite of technologies covering foundational, component, and subsystem-levels, which directly support 80% of future NASA space mission needs. The roadmap eschews high cost, limited utility technologies in favor of lower cost, and broadly applicable technologies with high return on investment. The roadmap is also phased to support future NASA mission needs and desires, with a view towards creating an optimized investment portfolio that matures specific, high impact technologies on a schedule that matches optimum insertion points of these technologies into NASA missions. The roadmap looks out over 15+ years and covers some 114 technologies, 58 of which are targeted for TRL6 within 5 years, with 23 additional technologies to be at TRL6 by 2020. Of that number, only a few are recommended for near term investment: 1. Rad Hard High Performance Computing 2. Extreme temperature capable electronics and packaging 3. RFID/SAW-based spacecraft sensors and instruments 4. Lightweight, low power 2D displays suitable for crewed missions 5. Radiation tolerant Graphics Processing Unit to drive crew displays 6. Distributed/reconfigurable, extreme temperature and radiation tolerant, spacecraft sensor controller and sensor modules 7. Spacecraft to spacecraft, long link data communication protocols 8. High performance and extreme temperature capable C&DH subsystem In addition, the roadmap team recommends several other activities that it believes are necessary to advance avionics technology across NASA: center dot Engage the OCT roadmap teams to coordinate avionics technology advances and infusion into these roadmaps and their mission set center dot Charter a team to develop a set of use cases for future avionics capabilities in order to decouple this roadmap from specific missions center dot Partner with the Software Steering Committee to coordinate computing hardware and software technology roadmaps and investment recommendations center dot Continue monitoring foundational technologies upon which future avionics technologies will be dependent, e.g., RHBD and COTS semiconductor technologies

Some, Raphael↗
NASA NTRS2003

Past, Present and Future Trends for NASA's EEE Parts Program

The foundation of NASA's Electrical, Electronic and Electromechanical (EEE) parts program is standardization. Standardization helps to reduce the number of unknown variables present as a project or program progresses; unknown variables equate to unknown risk. NASA spacecraft are usually 'one-offs' or at least part of a very short run, and every new part that is used represents a risk that has to be understood and mitigated as necessary. This equates directly to time and cost. Standardization of component parts is used to provide a foundation of known, dependable, qualified parts upon which a safe, reliable system can be built. In addition, the evaluation and selection of parts for the standard parts list unifies the activity under one group of experts rather than having engineers on each project overlapping and duplicating efforts. Thus, the project support engineers are able to concentrate on understanding and mitigating the risks for the non standard parts required to meet specific requirements of their project. Rapid technology change is producing conditions that make any form of parts-based standardization increasingly difficult, particularly the use of Commercial Off The Shelf (COTS) parts and assemblies. There are many complications to COTS-based standardization. COTS parts change rapidly and unpredictably, often have different characteristics fiom manufacturer to manufacturer, frequently are only available through distribution, have no universal specification and have variable and unpredictable radiation characteristics. This presentation will discuss some potential approaches to COTS parts standardization. Further into the future, in three to five years perhaps, the use of COTS boards and boxes will be extensive and standardization at these levels of assembly will be necessary. In five to ten years, most major spacecraft functions will probably be performed by COTS boards. How will this be achieved? What role will the parts engineer play, if any? This presentation will borrow from the lessons of the past to suggest some scenarios for the future.

Sampson, Michael J.↗
NASA NTRS2010

Web Design for Space Operations: An Overview of the Challenges and New Technologies Used in Developing and Operating Web-Based Applications in Real-Time Operational Support Onboard the International Space Station, in Astronaut Mission Planning and Mission Control Operations

The International Space Station (ISS) Operations Planning Team, Mission Control Centre and Mission Automation Support Network (MAS) have all evolved over the years to use commercial web-based technologies to create a configurable electronic infrastructure to manage the complex network of real-time planning, crew scheduling, resource and activity management as well as onboard document and procedure management required to co-ordinate ISS assembly, daily operations and mission support. While these Web technologies are classified as non-critical in nature, their use is part of an essential backbone of daily operations on the ISS and allows the crew to operate the ISS as a functioning science laboratory. The rapid evolution of the internet from 1998 (when ISS assembly began) to today, along with the nature of continuous manned operations in space, have presented a unique challenge in terms of software engineering and system development. In addition, the use of a wide array of competing internet technologies (including commercial technologies such as .NET and JAVA ) and the special requirements of having to support this network, both nationally among various control centres for International Partners (IPs), as well as onboard the station itself, have created special challenges for the MCC Web Tools Development Team, software engineers and flight controllers, who implement and maintain this system. This paper presents an overview of some of these operational challenges, and the evolving nature of the solutions and the future use of COTS based rich internet technologies in manned space flight operations. In particular this paper will focus on the use of Microsoft.s .NET API to develop Web-Based Operational tools, the use of XML based service oriented architectures (SOA) that needed to be customized to support Mission operations, the maintenance of a Microsoft IIS web server onboard the ISS, The OpsLan, functional-oriented Web Design with AJAX

Khan, Ahmed↗
NASA NTRS2004

NASA Tech Briefs, June 2004

Topics covered include: COTS MEMS Flow-Measurement Probes; Measurement of an Evaporating Drop on a Reflective Substrate; Airplane Ice Detector Based on a Microwave Transmission Line; Microwave/Sonic Apparatus Measures Flow and Density in Pipe; Reducing Errors by Use of Redundancy in Gravity Measurements; Membrane-Based Water Evaporator for a Space Suit; Compact Microscope Imaging System with Intelligent Controls; Chirped-Superlattice, Blocked-Intersubband QWIP; Charge-Dissipative Electrical Cables; Deep-Sea Video Cameras Without Pressure Housings; RFID and Memory Devices Fabricated Integrally on Substrates; Analyzing Dynamics of Cooperating Spacecraft; Spacecraft Attitude Maneuver Planning Using Genetic Algorithms; Forensic Analysis of Compromised Computers; Document Concurrence System; Managing an Archive of Images; MPT Prediction of Aircraft-Engine Fan Noise; Improving Control of Two Motor Controllers; Electro-deionization Using Micro-separated Bipolar Membranes; Safer Electrolytes for Lithium-Ion Cells; Rotating Reverse-Osmosis for Water Purification; Making Precise Resonators for Mesoscale Vibratory Gyroscopes; Robotic End Effectors for Hard-Rock Climbing; Improved Nutation Damper for a Spin-Stabilized Spacecraft; Exhaust Nozzle for a Multitube Detonative Combustion Engine; Arc-Second Pointer for Balloon-Borne Astronomical Instrument; Compact, Automated Centrifugal Slide-Staining System; Two-Armed, Mobile, Sensate Research Robot; Compensating for Effects of Humidity on Electronic Noses; Brush/Fin Thermal Interfaces; Multispectral Scanner for Monitoring Plants; Coding for Communication Channels with Dead-Time Constraints; System for Better Spacing of Airplanes En Route; Algorithm for Training a Recurrent Multilayer Perceptron; Orbiter Interface Unit and Early Communication System; White-Light Nulling Interferometers for Detecting Planets; and Development of Methodology for Programming Autonomous Agents.

Source record↗