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At least 145 records · Page 8

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NASA NTRS2017

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗

NASA NTRS2018

NASA's Changing Electronics Landscape: NEPP Focus, Agency Alignment, and Technology Development

This presentation will cover NASA Electrical, Electronic, and Electromechanical (EEE) Parts Landscape and 2018 Activities.

Parts assurance↗

NASA NTRS2018

NASA and COTS Electronics: Past Approach and Successes - Future Considerations

NASA has a long history of using commercial grade electronics in space. In this talk, a brief history of NASAâ's trends and approaches to commercial grade electronics focusing on processing and memory systems will be presented. This will include providing summary information on the space hazards to electronics as well as NASA mission trade space. We will also discuss developing recommendations for risk management approaches to Electrical, Electronic and Electromechanical (EEE) parts and reliability in space. The final portion of the talk will discuss emerging aerospace trends and the future for Commercial Off The Shelf (COTS) usage.

LaBel, Kenneth A.↗

NASA NTRS2019

NASA Electronic Parts and Packaging (NEPP) Program Focus, Strategic Collaborations, and Our Path to the Future

NASA Electronic Parts and Packaging (NEPP) Program Overview Mission Statement: Provide NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of EEE parts by NASA, in collaboration with other government agencies and industry. The NASA Electronic Parts Assurance Group (NEPAG) is a core portion of NEPP.

NASA Electronic Parts and Packaging (NEPP) Program↗

NASA NTRS2019

Radiation Single Event Effects (SEE) Impact on Complex Avionics Architecture Reliability

The NASA Engineering and Safety Center (NESC) has an urgent need to understand how system-level reliability of an avionics architecture is compromised when portions of the architecture are temporarily unavailable due to single event effects (SEE). The proposed activity parametrically evaluated these SEE impacts on system reliability based on mission duration, upset rate and recovery times for a representative redundant architecture. The key stakeholders for this study are NASA programs and projects that expect to use avionics architectures with electrical, electronic and electromechanical (EEE) parts susceptible to SEE when exposed to the mission expected radiation environment.

Hodson, Robert F.↗

NASA NTRSDate not supplied

TPSAS-NF1676L-30470-DND

Outside NASA: Single Agency document that can be referenced in NASA contracts (e.g. CCP) and used in NASA-ESA-JAXA Mutual Recognition of SMA Standards Within NASA: - Lists requirements from Center documents that must be addressed by Programs and Projects in their EEE Parts Management and Control Plan (EPMCP) - Tailor-able by Center/Project Technical Authority - Standardize requirements for “Low Risk” projects -not to overburden “Higher Risk” projects with excessive requirements

Peter J Majewicz↗

NASA NTRS2020

NEPP Processor Enclave: Testing Artificial Intelligence & Machine Learning

Computational device families are converging and multiple EEE components are required for a complete HPC subsystem. The components of this “processor enclave” are sensitive to radiation effects and therefore must be characterized for mission assurance. NEPP’s standardized approach to testing the Processor Enclave includes math, graphics, and AI and Machine Learning test vectors and device hardware capable of these applications.

Radiation testing↗

NASA NTRSDate not supplied

The State of NEPP NASA Electronic Parts & Packaging Program

The presentation is about the NASA Electronic Parts & Packaging (NEPP) Program. The mission statement of NEPP, “Provide NASA’s leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of EEE parts by NASA, in collaboration with other government agencies and industry” is dissected and explained using examples.

manufacturing↗

NASA NTRSDate not supplied

R-Gentic-SEAM Interface and Harmonization

SEAM is a useful resource for model-based radiation hardness assurance but can be technically challenging for new users. R-Gentic is a NASA developed website that aims at assisting engineers better understand the radiation concerns in their EEE parts. This work aims at providing an update on an ongoing effort to interface R-Gentic with SEAM. Once integration is completed, R-Gentic can be used to seed new SEAM projects, making project creation easier and more accessible.

Procedures↗

NASA NTRS2022

A Discussion of the Failure of a Quad Diode Module and Efforts to Assure the Flight Spares

In 2019 the International Space Station (ISS) experienced an on on-orbit failure that affected 1 of 28 Battery Charge Discharge Units (BCDUs). Telemetry pointed to a short circuit failure of a Power Rectifier Quad Diode Module. Astronauts removed the failed unit from service which was then returned to Earth for failure analysis. The failure analysis confirmed that the quad diode module had failed short circuit. The investigation identified silver dendrites had grown on the insulated, sloped edge of the mesa semiconductor die of the failed diode and also a 2nd diode in the same quad diode module. Voids between the diode’s protective encapsulating ring and the die provided space within which dendrites were able to form and cause catastrophic failure. The NASA Engineering & Safety Center (NESC) convened a EEE Parts Sub-Team to investigate root cause and to assist with risk assessment for all of the flight diode modules (4 distinct production lots) and the flight spares (from a 5th lot). Analysis of the original diode manufacturer’s read and record screening test data identified some lots which contained diodes with parametric instabilities that could signal conditions suited for silver dendrite formation. Computed Tomography (CT) X-ray screening inspection was performed on flight spare modules to identify diodes that do not exhibit voids between the edge of die and encapsulating ring as a mitigation against dendrite formation.

Jay Brusse↗

NASA NTRSDate not supplied

Numerical Study of Combustor-Turbine Interactions Considering a Two-Stage High-Pressure Turbine

In this study, preliminary results are presented from the Open National Combustion Code (OpenNCC) applied to the two-stage high-pressure turbine (HTP) from the energy efficient engine (E3) program. Although the combustor is designed for efficient fuel–air mixing and a relatively uniform exit temperature profile, temporal and spatial variation in combustor exit conditions inevitably lead to hot-streaks in the HPT. These hot streaks can cause local hot spots on the HPT blade surfaces that reduce blade life. To improve understanding of these effects and the overall design of combustor and HPT, we are developing a fully-coupled combustor-turbine computational fluid dynamics (CFD) capability. Previous work has simulated the E^3 combustor at the simulated Sea-Level Take-off (SLTO) condition (P(41) = 2.4 [atm]) with and without the first-stage HPT stator included. This work addresses HPT simulations using inflow conditions based on previous simulation results of the E^3 combustor, as well as investigating the effects of spatial and temporal temperature non-uniformity of the combustor-exit flow on the HPT performance for a more realistic SLTO (P(41) = 27.4 [atm])). First, we analyze existing results from the combustor and the HPT 1st-stage stator simulation, where the unsteady hot gas coming out of the combustor exit travels between the stationary stators and then directly exits the computational domain (i.e., no effect from the rotors). Second, we simulate the HPT including the 1st and 2nd stage stators and rotors with the time-averaged, spatially-nonuniform inflow to the HPT taken from the combustor (with HPT 1st-stage stators) solution. Differences in simulations results for the flow field in the 1st-stage stator region are presented. The results of these two simulations (combustor and HPT simulated in a sequential manner) will be compared to a fully-coupled EEE combustor/HPT simulation to understand the impacts of fully-coupled simulations on combustor and HPT performance for two different operating conditions.

LES↗

NASA NTRSDate not supplied

Numerical Study of Combustor-Turbine Interactions Considering a Two-Stage High-Pressure Turbine

In this study, preliminary results are presented from the Open National Combustion Code (OpenNCC) applied to the two-stage high-pressure turbine (HTP) from the energy efficient engine (E3) program. Although the combustor is designed for efficient fuel–air mixing and a relatively uniform exit temperature profile, temporal and spatial variation in combustor exit conditions inevitably lead to hot-streaks in the HPT. These hot streaks can cause local hot spots on the HPT blade surfaces that reduce blade life. To improve understanding of these effects and the overall design of combustor and HPT, we are developing a fully-coupled combustor-turbine computational fluid dynamics (CFD) capability. Previous work has simulated the E3 combustor at the simulated Sea-Level Take-off (SLTO) condition (P41 = 2.4 [atm]) with and without the first-stage HPT stator included. This work addresses HPT simulations using inflow conditions based on previous simulation results of the E3 combustor, as well as investigating the effects of spatial and temporal temperature non-uniformity of the combustor-exit flow on the HPT performance for a more realistic SLTO (P41 = 27.4 [atm])). First, we analyze existing results from the combustor and the HPT 1st-stage stator simulation, where the unsteady hot gas coming out of the combustor exit travels between the stationary stators and then directly exits the computational domain (i.e., no effect from the rotors). Second, we simulate the HPT including the 1st and 2nd stage stators and rotors with the time-averaged, spatially-nonuniform inflow to the HPT taken from the combustor (with HPT 1st-stage stators) solution. Differences in simulations results for the flow field in the 1st-stage stator region are presented. The results of these two simulations (combustor and HPT simulated in a sequential manner) will be compared to a fully-coupled EEE combustor/HPT simulation to understand the impacts of fully-coupled simulations on combustor and HPT performance for two different operating conditions.

LES↗

NASA NTRSDate not supplied

Microbes Share Rides Too: Updating Encapsulated Bioburden Estimate Values in Electronic Parts Common to Class D Missions

As NASA develops more planetary protection missions that are Category III and in the Class D/rideshare mission platform, there is an increasing reliance on estimation of prelaunch bioburden to understand needs for burn up and breakup analyses or other methods to meet pre-launch bioburden levels. Current levels estimated for the encapsulated bioburden of semiconductor parts cited by NASA have been based on estimates of semiconductor manufacturing approaches from the 1970s that do not incorporate the evolving cleanliness of semiconductor manufacturing since that time. This investigation will focus on direct sampling of semiconductor parts for encapsulated bioburden values, drawing upon Goddard’s strength in EEE parts, supply chain management, destructive parts analysis and existing local planetary protection lab facilities to prepare and measure encapsulated bioburden at a statistically significant level for standard electronics parts common to known Class D/rideshare platforms.

planetary protection↗

NASA NTRSDate not supplied

Computational Study of Modeling Fully-Coupled Combustor-Turbine Interactions by the Open National Combustion Code (OpenNCC)

LES↗

NASA NTRSDate not supplied

Design and Optimization of a 3-Stage Axial Supercritical CO2 Compressor

This paper presents the detailed design and optimization of a three-stage axial supercritical carbon dioxide (sCO2) compressor to support the advancement of sCO 2 power cycles, recognized for their efficiency and compactness in energy conversion. The three-stage design is a scaled model of the original nine-stage 100 MW design. The aerodynamic design and structural analysis were performed at the University of Cincinnati, and the results are presented. The first stage of the design has been meticulously manufactured and experimentally tested at University of Notre Dame Turbomachinery Laboratory. The design process starts with the preliminary design process, considering the required operating boundary conditions and geometrical constraints for full stage design. The design is then scaled down to 3-stage based on the power limitation. The definition for design parameters has been inspired from the EEE HPC design and tweaked to fit the sCO 2 operation. Axisymmetric analysis is performed next and the parametric geometry modeler -Tblade3 has been used to create 3D blade geometry from the results which can then be exported for the 3D CFD analysis and optimization. An efficiency of 89.85% is predicted for the final design at the design point.

Compressor↗

NASA NTRS2022

Assurance of Electronic Parts for Aerospace System Reliability: Past, Present, and Future

Over the last two to three decades, the balance of influence within the electronics industry has shifted decisively towards the consumer electronics and information technology products, away from the defense or aerospace markets. This shift towards the commercial markets has changed certain ground rules in the electronics industry. Reliance of the aerospace industry, in particular, on components from supply chains dedicated to other products, or cross-vertical product integration, creates a supply web and introduces significant risks that are not necessarily present for volume-driven electronic products. Many of the unique risks in the aerospace industry emanate from the key characteristics of this industry. Although selection and usage of commercial electronics in NASA flight hardware is possible at a comparable (and in many cases lower) level of risk to that of employing parts that are screened to military or NASA specifications, for a large majority of flight projects it is difficult to distinguish the difference in on-orbit performance or reliability for parts screened at any level, or commercial parts that have no additional screening performed by the government. This paper identifies several bases for establishing context and developing unique or alternative approaches for successful parts selection and application within NASA and across the commercial space community.

electronic parts↗

NASA NTRS2010

NEPAG Developments to Improve Component Engineering and Reliability for Space

No abstract available

space↗

NASA NTRS2012

NASA Electronic Parts and Packaging (NEPP) Program

Recent Findings from Audits, New Technology Data Reviews a) Disabled Chip Burn-ins A recent audit for a QML device discovered that the chip was disabled during the static burn-in, thus it was not drawing any current. Recommendation: For new SMDs add a statement within the burn-in paragraphs stating that the parts shall be kept in their enabled state during the burn-in. b) Class Q 160-hr/125oC Burn-in This is being interpreted as a static burn-in (even for CMOS technology). Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. c) At Frequency (Dynamic) Burn-ins Test equipment limitation is being cited for not doing burn-ins at the application frequency. Recommendation: The burn-in task group to discuss and provide guidance. When the SMD says that the part can be used at 200 MHz, then doing burn-in at 6 MHz (cited as burn-in equipment limitation frequency) is not going to be meaningful! d) Two Static Burn-ins Some manufacturers are doing electrical testing between the two static burn-ins, whereas others do electricals after completing both static burn-ins. Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. e) Thermal Imaging For a device with hot spots, the thermal resistance, junction-to-case, would be much higher than the guidelines given in MIL-STD-1835. One of the suppliers used thermal imaging to find hot spots on the die. Recommendation: Assign a task group to evaluate the effectiveness of thermal imaging at the product development stage.

Class Y↗