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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS1979

Array Automated Assembly Task for the Low Cost Solar Array Project, Phase 2

Using silk screened evaporated and sputtered Al as the metal source, the formation of Al back surface fields was studied. The most satisfactory results were those obtained with the sputtered A1 and in which open circuit voltages (V sub oc) of 0.585 v (12 ohm cm FZ silicon) were achieved. The ultrasonic interconnect process is discussed. The process is shown to be satisfactory, but increased pull-strength may be obtained if some form of sintering is carried out on the metallized contacts. Plasma etching is shown to be feasible as a replacement for wet chemical cleaning prior to diffusion. Initial results on cells prepared by using electroless Pd/Ni plus either electroplated Ag or Cu show slightly poor performance than cells with the baseline evaporated Ti/Pd/Ag system. A mask designed for the 1.6 x 7.0 cm and 2.0 x 7.0 cm cells is described. This mask has a lower area coverage and total lower resistive loss than the previous mask design. It is also shown that the cell width should not exceed 2.0 - 3.0 cm for optimum efficiency.

Campbell, R. B.↗
NASA NTRS1979

Silicon Ingot Casting - Heat Exchanger Method Multi-wire Slicing - Fixed Abrasive Slicing Technique. Phase 3 Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-cost Solar Array Project

Several 20 cm diameter silicon ingots, up to 6.3 kg. were cast with good crystallinity. The graphite heat zone can be purified by heating it to high temperatures in vacuum. This is important in reducing costs and purification of large parts. Electroplated wires with 45 um synthetic diamonds and 30 um natural diamonds showed good cutting efficiency and lifetime. During slicing of a 10 cm x 10 cm workpiece, jerky motion occurred in the feed and rocking mechanisms. This problem is corrected and modifications were made to reduce the weight of the bladeheat by 50%.

Schmid, F.↗
NASA NTRS1979

Development of Low Cost Contacts to Silicon Solar Cells

Different electroless plating systems were evaluated in conjunction with copper electroplating. All tests involved simultaneous deposition of front and back contacts using a standard cell materials. Cells with good adhesion and good curve fill factors were obtained using a palladium-chromium-copper metallization system. The final copper contact system was evaluated to determine if the copper would migrate at elevated temperatures. The copper migrated at elevated temperatures causing cell output degradation.

Iles, P. A.↗
NASA NTRS1979

Phase 2 of the array automated assembly task for the low cost solar array project

The process sequence for the fabrication of dendritic web silicon into solar panels was modified to include aluminum back surface field formation. Plasma etching was found to be a feasible technique for pre-diffusion cleaning of the web. Several contacting systems were studied. The total plated Pd-Ni system was not compatible with the process sequence; however, the evaporated TiPd-electroplated Cu system was shown stable under life testing. Ultrasonic bonding parameters were determined for various interconnect and contact metals but the yield of the process was not sufficiently high to use for module fabrication at this time. Over 400 solar cells were fabricated according to the modified sequence. No sub-process incompatibility was seen. These cells were used to fabricate four demonstration modules. A cost analysis of the modified process sequence resulted in a selling price of $0.75/peak watt.

Campbell, R. B.↗
NASA NTRS1979

Wolter-Schwarzschild optics for the extreme-ultraviolet - The Berkeley stellar spectrometer and the EUV Explorer

The design, fabrication and performance of two Wolter-Schwarzschild grazing incidence optics are described. Both telescopes have been figured by single point diamond turning and have achieved better than 15-arcsec on-axis imaging. The telescope for the stellar spectrometer is an f/10 Type II system with an effective area of 225 sq cm at 250 A and 300 cm2 at 500 A. The primary has a maximum diameter of 38 cm and was fabricated in three elements. The copper-plated aluminum substrate was diamond turned; following nickel plating, the surface was polished and coated with evaporated gold. The performance during a sounding rocket flight is discussed. The prototype telescope for the Extreme Ultraviolet Explorer is an f/1.24 Type I system with an effective field of view of 5.0-deg diameter. The telescope has a maximum diameter of 40 cm and was fabricated as a single element. The aluminum substrate is to be diamond turned; the nickel plated surface will be polished and electroplated with gold. The design choice and defocusing optimization aimed at maximizing the field of view and number of image pixels is examined.

Malina, R. F.↗
NASA NTRS1982

Effects of High Temperature on Collector Coatings

Report reveals electroplated black chrome is good coating for concentrating collectors in which temperatures are in the 650 degrees-800 degrees F (340 degrees - 430 degrees C) range. Black chrome thermal emittance is low and solar-absorption properties are not seriously degraded at high temperatures. Black coatings are used to increase absorption of solar energy by base metal while decreasing emission of infrared energy. Coatings are intended to improve efficiency of solar collectors.

Lowery, J. R.↗
NASA NTRS1980

Short-circuit current improvement in thin cells with a gridded back contact

The use of gridded back contact on thin silicon solar cells 50 micrometers was investigated. An unexpected increase in short circuit current of almost 10 percent was experienced for 2 cm x 2 cm cells. Control cells with the standard continuous contact metallization were fabricated at the same time as the gridded back cells with all processes identical up to the formation of the back contact. The gridded back contact pattern was delineated by evaporation of Ti-Pd over a photo-resist mask applied to the back of the wafer; the Ti-Pd film on the controls was applied in the standard fashion in a continuous layer over the back of the cell. The Ti-Pd contacts were similarly applied to the front of the wafer, and the grid pattern on both sides of the cell was electroplated with 8-10 micrometers of silver.

Giuliano, M.↗
NASA NTRS1980

Investigation of contact metallization systems for solar cells

In conventional solar cells, evaporated Ti-Pd-Ag metallization system has been found reliable. However, for low cost terrestrial applications, its cost effectiveness may be questioned. Electroplated Ag and Cu have been investigated as replacements for evaporated Ag and have given results comparable to the evaporated Ti-Pd-Ag system.

Campbell, R. B.↗
NASA NTRS1981

The millimeter wave super-Schottky diode detector

The 31 and 92 GHz measurements of the superconductor-Schottky diode extended to millimeter wavelengths by a redesign of the semiconductor interface are reported. Diodes were fabricated by pulse electroplating Pb on 2 x 10 to the 19th/cu cm p-Ga-As etched with HCl; a thin Au overplate is deposited to protect the Pb film from degradation and to improve its lifetime. The noise performance was almost ideal at 31 and 92 GHz; it was concluded that this diode is a quantum-limited-detector at 31 GHz, with excessive parasitic losses at 92 GHz.

Silver, A. H.↗
NASA NTRS1980

Solar cells and modules from dentritic web silicon

Some of the noteworthy features of the processes developed in the fabrication of solar cell modules are the handling of long lengths of web, the use of cost effective dip coating of photoresist and antireflection coatings, selective electroplating of the grid pattern and ultrasonic bonding of the cell interconnect. Data on the cells is obtained by means of dark I-V analysis and deep level transient spectroscopy. A histogram of over 100 dentritic web solar cells fabricated in a number of runs using different web crystals shows an average efficiency of over 13%, with some efficiencies running above 15%. Lower cell efficiency is generally associated with low minority carrier time due to recombination centers sometimes present in the bulk silicon. A cost analysis of the process sequence using a 25 MW production line indicates a selling price of $0.75/peak watt in 1986. It is concluded that the efficiency of dentritic web cells approaches that of float zone silicon cells, reduced somewhat by the lower bulk lifetime of the former.

Campbell, R. B.↗
NASA NTRS1981

Forming electrical interconnections through semiconductor wafers

An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

Anthony, T. R.↗
NASA NTRS1982

The uses of Man-Made diamond in wafering applications

The continuing, rapid growth of the semiconductor industry requires the involvement of several specialized industries in the development of special products geared toward the unique requirements of this new industry. A specialized manufactured diamond to meet various material removal needs was discussed. The area of silicon wafer slicing has presented yet anothr challenge and it is met most effectively. The history, operation, and performance of Man-Made diamond and particularly as applied to silicon wafer slicing is discussed. Product development is underway to come up with a diamond specifically for sawing silicon wafers on an electroplated blade.

Fallon, D. B.↗
NASA NTRS1982

Electro Processing Research

Electroprocessing which is concerned with fluid dynamics of the electroreduction process to determine how it may be modified to improve the quality of the deposit was studied. Experimental techniques are used in this research. These techniques include laser Schlieren photography, laser Doppler velocimetry, and frequency spectrum analysis. Projects involve fluid flow studies of zinc plating in aqueous and molten salt electrolytes, study of cell design for magnesium chlorides electrolysis, digital signal analysis of manganese electrodeposition in molten chlorides, and electroplating of molybdenum from low melting salts. It is anticipated that the use of refractory metals as constructed materials in engineering will increase. Their electrodeposition from molten salt electrolytes is important in the extraction metallurgy of refractory metals.

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NASA NTRS1982

Surface texturing of fluoropolymers

A method is disclosed for improving surface texture for adhesive bonding, metal bonding, substrate plating, decal substrate preparation, and biomedical implant applications. The surface to be bonded is dusted in a controlled fashion to produce a disbursed layer of fine mesh particles which serve as masks. The surface texture is produced by impinging gas ions on the masked surface. The textured surface takes the form of pillars or cones. The bonding material, such as a liquid epoxy, flows between the pillars which results in a bond having increased strength. For bonding metals a thin film of metal is vapor or sputter deposited onto the textured surface. Electroplating or electroless plating is then used to increase the metal thickness in the desired amount.

Banks, B. A.↗
NASA NTRS1984

Plasma-Sprayed Copper Tie-In for Nickel Plating

Foam insulation nickel-plated with one less step. Changing tie-in layer from plasma-sprayed nickel to plasma-sprayed copper eliminates intermediate copper electroplating step previously required.

Lombard, J. W.↗
NASA NTRS1982

Materials for advanced turbine engines. Volume 1: Advanced blade tip seal system

Project 3, the subject of this technical report, was structured toward the successful engine demonstration of an improved-efficiency, long-life, tip-seal system for turbine blades. The advanced tip-seal system was designed to maintain close operating clearances between turbine blade tips and turbine shrouds and, at the same time, be resistant to environmental effects including high-temperature oxidation, hot corrosion, and thermal cycling. The turbine blade tip comprised an environmentally resistant, activated-diffussion-bonded, monocrystal superalloy combined with a thin layer of aluminium oxide abrasive particles entrapped in an electroplated NiCr matrix. The project established the tip design and joint location, characterized the single-crystal tip alloy and abrasive tip treatment, and established the manufacturing and quality-control plans required to fully process the blades. A total of 171 blades were fully manufactured, and 100 were endurance and performance engine-tested.

Zelahy, J. W.↗
NASA NTRS1982

Development of technique for air coating and nickel and copper metalization of solar cells

Solar cells were made with a variety of base metal screen printing inks applied over silicon nitride AR coating and copper electroplated. Fritted and fritless nickel and fritless tin base printing inks were evaluated. Conversion efficiencies as high as 9% were observed with fritted nickel ink contacts, however, curve shapes were generally poor, reflecting high series resistance. Problems encountered in addition to high series reistance included loss of adhesion of the nickel contacts during plating and poor adhesion, oxidation and inferior curve shapes with the tin base contacts.

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