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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Nonlinear Constitutive Relations for High Temperature Application, 1984

Nonlinear constitutive relations for high temperature applications were discussed. The state of the art in nonlinear constitutive modeling of high temperature materials was reviewed and the need for future research and development efforts in this area was identified. Considerable research efforts are urgently needed in the development of nonlinear constitutive relations for high temperature applications prompted by recent advances in high temperature materials technology and new demands on material and component performance. Topics discussed include: constitutive modeling, numerical methods, material testing, and structural applications.

Source record↗
NASA NTRS1982

High temperature deformation of NiAl and CoAl

The high temperature mechanical properties of the aluminides are reviewed with respect to their potential as high temperature structural materials. It is shown that NiAl and CoAl are substantially stronger than the pure metals Ni and Co at high temperatures and approach the strength of some superalloys, particularly when those superalloys are tested in "weak" directions. The factors that limit and control the high temperature strengths of NiAl and CoAl are examined to provide a basis for the development of intermetallic alloys of this type.

Nix, W. D.↗
NASA NTRS1998

High temperature thrust chamber for spacecraft

A high temperature thrust chamber for spacecraft (20) is provided herein. The high temperature thrust chamber comprises a hollow body member (12) having an outer surface and an internal surface (16) defining the high temperature chamber (10). The body member (12) is made substantially of rhenium. An alloy (18) consisting of iridium and at least alloying metal selected of the group consisting of rhodium, platinum and palladium is deposited on at least a portion of the internal surface (16) of the body member (12). The iridium and the alloying metal are electrodeposited onto the body member (12). A HIP cycle is performed upon the body member (12) to cause the coating of iridium and the alloying metal to form the alloy (18) which protects the body member (12) from oxidation.

Chazen, Melvin L.↗
NASA NTRSDate not supplied

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗
NASA NTRSDate not supplied

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗
NASA NTRS2024

Effect of High-Speed Rotation on High-Temperature Superconducting Coils for High Efficiency Megawatt Motor

The use of a superconducting rotor in the High Efficiency Megawatt Motor (HEMM) comes with a number of challenges. The HEMM’s rotor must be designed so that the superconducting coil can tolerate the forces it will encounter during operation. These forces introduce considerable risk to the design of the HEMM. Because this risk cannot be adequately addressed through refined analysis, a set of experiments was deemed necessary to demonstrate that the HEMM’s superconducting coils can survive the stresses imparted by the centrifugal forces acting on the coil during full-speed operation of the machine. These experiments required spin testing a full-scale HEMM coil on a representative rotor structure at room temperature and sequentially higher rotation speeds and measuring the superconductivity response of the coil in liquid nitrogen (LN2) before and after each spin test. Tests were carried out to the full centripetal loading of a recent HEMM design. According to finite element analysis, this load produced stress components in the coil that exceed their design limit by a factor of 1 to 7.4. Although not yet confirmed, the current HEMM design is expected to produce even smaller stresses in the coil due to a 20 percent reduction in the coil’s mass and an increased volume of structural material. The only degradation of the coil that occurred during this testing resulted from a test rig failure and from the voltage taps, which are not part of the final coil design.

Electrified Aircraft Propulsion↗
NASA NTRS1986

High temperature dispersion strengthening of NiAl

A potential high temperature strengthening mechanism for alloys based on the intermetallic compound NiAl was investigated. This study forms part of an overall program at NASA Lewis Research Center for exploring the potential of alloys based on NiAl for high temperature applications. An alloy containing 2.26 at% Nb and produced by hot extrusion of blended powders was examined in detail using optical and electron microscopy. Interdiffusion between the blended Nb and NiAl powders results in the formation of intermediate phases. A fine dispersion of precipitates of a hexagonal, ordered NiAlNb phases in a matrix of NiAl can be produced and this results in strengthening of the alloy by interfering with dislocation motion at high temperature. These precipitates are, however, found to coarsen during the high temperature (1300 K) deformation at slow strain rates and this may impose some limitatioins on the use of this strengthening mechanism.

Sherman, M.↗
NASA NTRS1985

Lewis' enhanced laboratory for research into the fatigue and constitutive behavior of high temperature materials

Lewis Research Center's high temperature fatigue laboratory has undergone significant changes resulting in the addition of several new experimental capabilities. New materials testing systems have been installed enabling research to be conducted in multiaxial fatigue and deformation at high temperature, as well as cumulative creep-fatigue damage wherein the relative failure-life levels are widely separated. A key component of the new high-temperature fatigue and structures laboratory is a local, distributed computer system whose hardware and software architecture emphasizes a high degree of configurability, which in turn, enables the researcher to tailor a solution to the problem at hand.

Mcgaw, Michael A.↗
NASA NTRS2007

Ultra-High Temperature Materials Characterization for Propulsion Applications

Propulsion system efficiency increases as operating temperatures are increased. Some very high-temperature materials are being developed, including refractory metal alloys, carbides, borides, and silicides. System design requires data for materials properties at operating temperatures. Materials property data are not available for many materials of interest at the desired operating temperatures (up to approx. 3000 K). The objective of this work is to provide important physical property data at ultra-high temperatures. The MSFC Electrostatic levitation (ESL) facility can provide measurements of thermophysical properties which include: creep strength, density and thermal expansion for materials being developed for propulsion applications. The ESL facility uses electrostatic fields to position samples between electrodes during processing and characterization studies. Because the samples float between the electrodes during studies, they are free from any contact with a container or test apparatus. This provides a high purity environment for the study of high-temperature, reactive materials. ESL can be used to process a wide variety of materials including metals, alloys, ceramics, glasses and semiconductors. The MSFC ESL has provided non-contact measurements of properties of materials up to 3400 C. Density and thermal expansion are measured by analyzing digital images of the sample at different temperatures. Our novel, non-contact method for measuring creep uses rapid rotation to deform the sample. Digital images of the deformed samples are analyzed to obtain the creep properties, which match those obtained using ASTM Standard E-139 for Nb at 1985 C. Data from selected ESL-based characterization studies will be presented. The ESL technique could support numerous propulsion technologies by advancing the knowledge base and the technology readiness level for ultra-high temperature materials. Applications include non-eroding nozzle materials and lightweight, high-temperature alloys for turbines and structures.

Rogers, Jan↗
NASA NTRS1982

High temperature silicon carbide impregnated insulating fabrics

High temperature insulating articles having improved performance characteristics are described. The articles comprise fabrics of closely woven refractory or heat resistant fibers having particles of silicon carbide dispersed at least partially through the fabric and bonded to the fibers with an emulsifiable polyethylene wax. Such articles exhibit significantly increased high temperature emittance characteristics and an improved retention of integrity and flexibility after prolonged exposure to high temperature.

Schomburg, C.↗
NASA NTRS2007

Ultra-High Temperature Materials Characterization for Space and Missile Applications

Numerous advanced space and missile technologies including propulsion systems require operations at high temperatures. Some very high-temperature materials are being developed to meet these needs, including refractory metal alloys, carbides, borides, and silicides. System design requires data for materials properties at operating temperatures. Materials property data are not available at the desired operating temperatures for many materials of interest. The objective of this work is to provide important physical property data at ultra-high temperatures. The MSFC Electrostatic Levitation (ESL) facility can provide measurements of thermophysical properties which include: creep strength, emissivity, density and thermal expansion. ESL uses electrostatic fields to position samples between electrodes during processing and characterization experiments. Samples float between the electrodes during studies and are free from any contact with a container or test apparatus. This provides a high purity environment for the study of high-temperature, reactive materials. ESL can be used to process a wide variety of materials including metals, alloys, ceramics, glasses and semiconductors. A system for the determination of total hemispherical emissivity is being developed for the MSFC ESL facility by AZ Technology Inc. The instrument has been designed to provide emissivity measurements for samples during ESL experiments over the temperature range 700-3400K. A novel non-contact technique for the determination of high-temperature creep strength has been developed. Data from selected ESL-based characterization studies will be presented. The ESL technique could advance space and missile technologies by advancing the knowledge base and the technology readiness level for ultra-high temperature materials. Applications include non-eroding nozzle materials and lightweight, high-temperature alloys for turbines and structures.

Rogers, Jan↗
NASA NTRS1978

High temperature resistant cermet and ceramic compositions

Cermet compositions having high temperature oxidation resistance, high hardness and high abrasion and wear resistance, and particularly adapted for production of high temperature resistant cermet insulator bodies are presented. The compositions are comprised of a sintered body of particles of a high temperature resistant metal or metal alloy, preferably molybdenum or tungsten particles, dispersed in and bonded to a solid solution formed of aluminum oxide and silicon nitride, and particularly a ternary solid solution formed of a mixture of aluminum oxide, silicon nitride and aluminum nitride. Also disclosed are novel ceramic compositions comprising a sintered solid solution of aluminum oxide, silicon nitride and aluminum nitride.

Phillips, W. M.↗