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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8

Lightweight Battery Charge Regulator Used to Track Solar Array Peak Power

A battery charge regulator based on the series-connected boost regulator (SCBR) technology has been developed for high-voltage spacecraft applications. The SCBR regulates the solar array power during insolation to prevent battery overcharge or undercharge conditions. It can also be used to provide regulated battery output voltage to spacecraft loads if necessary. This technology uses industry-standard dc-dc converters and a unique interconnection to provide size, weight, efficiency, fault tolerance, and modularity benefits over existing systems. The high-voltage SCBR shown in the photograph has demonstrated power densities of over 1000 watts per kilogram (W/kg). Using four 150-W dc-dc converter modules, it can process 2500 W of power at 120 Vdc with a minimum input voltage of 90 Vdc. Efficiency of the SCBR was 94 to 98 percent over the entire operational range. Internally, the unit is made of two separate SCBR s, each with its own analog control circuitry, to demonstrate the modularity of the technology. The analog controllers regulate the output current and incorporate the output voltage limit with active current sharing between the two units. They also include voltage and current telemetry, on/off control, and baseplate temperature sensors. For peak power tracking, the SCBR was connected to a LabView-based data acquisition system for telemetry and control. A digital control algorithm for tracking the peak power point of a solar array was developed using the principle of matching the source impedance with the load impedance for maximum energy transfer. The algorithm was successfully demonstrated in a simulated spacecraft electrical system at the Boeing PhantomWorks High Voltage Test Facility in Seattle, Washington. The system consists of a 42-string, high-voltage solar array simulator, a 77-cell, 80-ampere-hour (A-hr) nickel-hydrogen battery, and a constant power-load module. The SCBR and the LabView control algorithm successfully tracked the solar array peak power point through various load transients, including sunlight discharge transients when the total load exceeded the maximum solar array output power.

Soeder, James F.↗

DSS-13: Using an OSI Process Control Standard for Monitor & Control

The flexibility and robustness of a monitor and control (M&C) system are a direct result of the underlying inter-processor communications architecture. A new architecture for M&C at the Deep Space Communications Complexes (DSCCs) has been developed based on the Manufacturing Message Specification (MMS) process control standard that is part of the Open System Interconnection (OSI) suite of protocols. This architecture has been tested both in a laboratory environment and under operational conditions at the Deep Space Network (DSN) experimental station (DSS-13)...

Stockett, Michael H.↗

Barriers to Balcony Solar and Plug-In Distributed Energy Resources in the United States

Plug-in distributed energy resources (DERs), such as balcony solar, backfeed power to the home through a standard plug. These systems may represent the future of residential solar and storage, particularly as recent net metering policies have reduced the economic appeal of rooftop solar. While plug-in DERs have seen widespread success in Europe, their U.S. market is stagnant. This paper reviews the technical, interconnection, and regulatory barriers hindering the adoption of plug-in DERs. We first discuss the technical barriers, which include touch safety, breaker masking, and bidirectional ground-fault circuit interrupters. We then examine utility perspectives on plug-in DERs and strategies for navigating interconnection challenges. Finally, we discuss regulatory hurdles related to UL standards and the National Electrical Code.

Gerber, Daniel L. (ORCID:0000000219720679)↗

User Guide to the Facility Cybersecurity Framework Internet of Things (IoT) Self-Assessment

The FEMP Facility Cybersecurity Framework (FCF) Internet of Things (IoT) Self-Assessment is a comprehensive tool aimed at illuminating the foggy domains of IoT and Industrial Internet of Things (IIoT) security. The assessment was developed using insights from recognized standards and guidelines to identify, address, and mitigate the challenges posed by the massive surge of interconnected devices. The FCF IoT Self-Assessment was created using the knowledge from established National Institute of Standards and Technology (NIST) publications such as NIST SP 800-53, NIST SP 800-213, and NIST Cybersecurity Framework (CSF). Additionally, integrating NIST SP 800-213A IoT Device Cybersecurity Guidance for the Federal Government ensures federal agencies are equipped with specific IoT security insights. This user guide has been developed to facilitate a thorough understanding of the tool. As users delve into the assessment, the guide offers a clear navigation walkthrough, report generation, and interpretation of the report.

97 MATHEMATICS AND COMPUTING↗

Adaptive Protection and Validated Models to Enable Deployment of High Penetrations of Solar PV (PV-MOD)

The availability and validation of various PV models in commercial tools differ, with some models not yet thoroughly validated for advanced inverter functionalities and reliable performance under weak system conditions. Many existing models do not fully incorporate new inverter control functions, which can affect system stability. The increasing deployment of solar PV and other inverter-based resources (IBRs), including distributed energy resources (DERs), is influencing the reliable operation of protection schemes in distribution systems and microgrids. Emerging adaptive protection schemes (APS) offer new opportunities for protecting these systems during varying configurations and DER operating conditions, though their demonstration and validation remain limited. Adaptive protection schemes face similar challenges, as they are typically designed for specific configurations. There is a growing need for tools and methodologies to streamline the deployment of adaptive protection for safe and reliable DER integration. The project main objective was to develop and validate high-fidelity generic models of solar PV facilities for stability, protection, EMT, and QSTS analyses. This objective was achieved, and these models can now be integrated into commercial software tools, enabling utilities, vendors, and developers to study high-penetration PV systems more confidently. The project also demonstrated advanced applications of these models, including the design and deployment of adaptive protection schemes in high-penetration field applications and microgrids, supporting grid safety and reliability. Several milestones were reached by the end of the project. A sophisticated inverter test plan was developed, and inverters representative of the North American marketplace were selected. EPRI and NREL tested various inverters, conforming to IEEE standards. Improvements were made to existing generic models of IBR units, IBR plants, and aggregated feeders for various analyses. The first generic electromagnetic transient (EMT) model for a solar PV plant was developed, conforming to IEEE Std 2800™-2022 and validated against laboratory measurements of a 2.2 MVA large-scale battery energy storage system (BESS) inverter. That model was then used to produce reference responses illustrating examples of validated and verified IBR plant models that pass or fail tests for technical minimum capability and performance as specified in the IEEE standard. The developed, tested, and validated generic models can be used for transmission planning, stability assessments, expansion planning, and evaluating potential future IBR interconnection requirements. They can also support interconnection screens and conformity assessments of IBR plants, including solar PV. The project significantly contributed to the ongoing standardization and model-based representation and verification of IBR responses. The project further addressed challenges of common distribution protection schemes with increasing deployment of DER by developing, validating, and demonstrating adaptive protection schemes (APS) that can improve the reliable and safe integration of DER into distribution systems. New APS were designed using improved DER models for three common distribution systems: a radial feeder, a meshed network, and a microgrid. Modeling and hardware-in-the-loop (HIL) testing of the APS were conducted, successfully showing their effectiveness and selectivity. Proof-of-concept field demonstration was achieved for two APS, i.e., one on a radial feeder and another one in a microgrid. Field demonstration could not be achieved for the APS on a meshed network, primarily due apprehension of one utility partner and also due to limited access to the protective algorithms in the network protectors. Guidelines developed from the lessons learned in the project lay out the general process followed in the design, installation, and commissioning of APS for various distribution systems. Distribution utility partners’ apprehension about field demonstration of the new APS were addressed—with varying success—by taking a stepped risk-management approach of modeling of a wide range of sensitivities first, performing in-depth proof-of-concept testing in the laboratory including HIL next, and finally deliberately implementing and commissioning the actual protection equipment and algorithms into parts of—or in parallel operation to—the three real distribution systems. Future work should include pilot projects that further show the acceptable performance of the developed APS before these schemes be rolled out more widely. Inclusion of both utility and original equipment manufacturers (OEMs) in future projects could increase chances of successful field demonstration. Despite challenges in achieving the field demonstration goal of the project for all three APS, the research significantly contributed to the innovation of adaptive protection solutions for scalable and reliable DER integration into distribution systems. This project significantly enhances the understanding of the impact of using appropriate inverter models on distribution and transmission (T&D) systems. By addressing the limitations of existing generic models, the project introduces high-fidelity models for stability, protection, electromagnetic transient (EMT), and quasi-static time series (QSTS) analyses. These models, integrated into commercial software tools, enable utilities, vendors, and developers to confidently study high-penetration PV systems. The project also demonstrates advanced applications, including adaptive protection schemes (APS) for distribution systems and microgrids, ensuring grid safety and reliability. The technical effectiveness and economic feasibility of the methods are evident through the development and validation of sophisticated inverter test plans and the selection of representative inverters. Testing by EPRI and NREL on retail, commercial, and utility-scale inverters, conforming to IEEE standards, underscores the robustness of the models. Improvements to existing generic models for various analyses further enhance their validity and applicability. The project also identifies gaps in common distribution protection schemes and designed new APS using improved DER models, demonstrating their effectiveness through modeling and hardware-in-the-loop (HIL) testing. The project’s benefits to the public are manifold. By advancing the standardization and model-based representation of IBR response, it supports transmission planning, stability assessments, and future IBR interconnection requirements. The generic models can facilitate better communication between transmission planners and developers, supporting expected IBR plant capability and performance. Additionally, the development of APS for radial feeders, meshed networks, and microgrids supports the integration of distributed energy resources (DERs) into distribution systems, enhancing grid reliability and safety. The project’s emphasis on thorough testing and simplicity in design ensures practical and scalable solutions for DER integration.

14 SOLAR ENERGY↗

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗

Toward ultrafast, ultra-stable imaging arrays: Superlattice doping to enhance the performance of backside-illuminated 3D-hybridized silicon photodetectors

In this paper, the authors report the latest results on their development of superlattice-doped, thinned, backside-illuminated (BSI), 3D-integrated photodiode detectors—a step toward their ultimate goal of demonstrating ultrafast, ultrastable CMOS imaging arrays. As with most silicon-based photodetectors, backside-illumination and backside surface passivation are keys to achieve the highest performance capability. The two-dimensional (2D) doping technique developed at the Jet Propulsion Laboratory (JPL) has proved to result in a highly efficient, highly stable detector response when combined with a variety of detectors. Here, JPL's 2D-doping has been combined with Sandia's BSI photodetectors hybridized with custom fanout wafer via copper Direct Bond Interconnect (DBI®), a technology that is rapidly becoming industry standard for BSI CMOS imaging arrays. The prototype detectors were packaged and evaluated with respect to their response to low energy electrons. The authors find that the responsivity of 2D-doped BSI detectors is higher than devices prepared using other surface passivation techniques (i.e., ion implantation). The success of the work described herein verifies that the 2D-doping processes previously developed for Sandia's frontside-illuminated photodetectors are generally applicable to BSI detectors and demonstrates for the first time that JPL's 2D-doping process is compatible with the Cu-DBI® technology.

Jewell, April D.↗

Placement technique for semicustom digital LSI circuits

Small lots of special-purpose integrated circuits are fabricated from standard transitor arrays. Folded linear order of cells minimzes interconnection length and puts cell in juxtaposition. Cell-placement technique is carried out via computer program.

Carroll, B.↗

A Model-Based Probabilistic Inversion Framework for Wire Fault Detection Using TDR

Time-domain reflectometry (TDR) is one of the standard methods for diagnosing faults in electrical wiring and interconnect systems, with a long-standing history focused mainly on hardware development of both high-fidelity systems for laboratory use and portable hand-held devices for field deployment. While these devices can easily assess distance to hard faults such as sustained opens or shorts, their ability to assess subtle but important degradation such as chafing remains an open question. This paper presents a unified framework for TDR-based chafing fault detection in lossy coaxial cables by combining an S-parameter based forward modeling approach with a probabilistic (Bayesian) inference algorithm. Results are presented for the estimation of nominal and faulty cable parameters from laboratory data.

Schuet, Stefan R.↗

Manufacture and quality control of interconnecting wire harnesses

Four-volume series of documents has been prepared as standard reference. Each volume may be used separately and covers wire and cable preparation as well as harness fabrication and installation. Series should be useful addition to libraries of manufactures of electrical and electronic equipment.

Source record↗

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗

Media independent interface. Interface control document

A Media Independent Interface (MII) is specified, using current standards in the industry. The MII is described in hierarchical fashion. At the base are IEEE/International Standards Organization (ISO) documents (standards) which describe the functionality of the software modules or layers and their interconnection. These documents describe primitives which are to transcent the MII. The intent of the MII is to provide a universal interface to one or more Media Access Contols (MACs) for the Logical Link Controller and Station Manager. This interface includes both a standardized electrical and mechanical interface and a standardized functional specification which defines the services expected from the MAC.

Source record↗

Goldstone Solar System Radar Waveform Generator

Due to distances and relative motions among the transmitter, target object, and receiver, the time-base between any transmitted and received signal will undergo distortion. Pre-distortion of the transmitted signal to compensate for this time-base distortion allows reception of an undistorted signal. In most radar applications, an arbitrary waveform generator (AWG) would be used to store the pre-calculated waveform and then play back this waveform during transmission. The Goldstone Solar System Radar (GSSR), however, has transmission durations that exceed the available memory storage of such a device. A waveform generator capable of real-time pre-distortion of a radar waveform to a given time-base distortion function is needed. To pre-distort the transmitted signal, both the baseband radar waveform and the RF carrier must be modified. In the GSSR, this occurs at the up-conversion mixing stage to an intermediate frequency (IF). A programmable oscillator (PO) is used to generate the IF along with a time-varying phase component that matches the time-base distortion of the RF carrier. This serves as the IF input to the waveform generator where it is mixed with a baseband radar waveform whose time-base has been distorted to match the given time-base distortion function producing the modulated IF output. An error control feedback loop is used to precisely control the time-base distortion of the baseband waveform, allowing its real-time generation. The waveform generator produces IF modulated radar waveforms whose time-base has been pre-distorted to match a given arbitrary function. The following waveforms are supported: continuous wave (CW), frequency hopped (FH), binary phase code (BPC), and linear frequency modulation (LFM). The waveform generator takes as input an IF with a time varying phase component that matches the time-base distortion of the carrier. The waveform generator supports interconnection with deep-space network (DSN) timing and frequency standards, and is controlled through a 1 Gb/s Ethernet UDP/IP interface. This real-time generation of a timebase distorted radar waveform for continuous transmission in a planetary radar is a unique capability.

Quirk, Kevin J.↗

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗

High-voltage space-plasma interactions measured on the PASP Plus test arrays

The Photovoltaic Array Space Power Plus Diagnostics (PASP Plus) experiment was developed by the Air Force's Phillips Laboratory with support from NASA's Lewis Research Center. It was launched on the Advanced Photovoltaic and Electronics EXperiments (APEX) satellite on August 3, 1994 into a 70 degree inclination, 363 km by 2550 km elliptical orbit. This orbit allows the investigation of space plasma effects on high-voltage operation (leakage current at positive voltages and arcing at negative voltages) in the perigee region. PASP Plus is testing twelve solar arrays. There are four planar Si arrays: an old standard type (used as a reference), the large-cell Space Station Freedom (SSF) array, a thin 'APSA' array, and an amorphous Si array. Next are three GaAs on Ge planar arrays and three new material planar arrays, including InP and two multijunction types. Finally, there are two concentrator arrays: a reflective-focusing Mini-Cassegrainian and a Fresnel-lens focusing Mini-Dome. PASP Plus's diagnostic sensors include: Langmuir probe to measure plasma density, an electrostatic analyzer (ESA) to measure the 30 eV to 30 KeV electron/ion spectra and determine vehicle negative potential during positive biasing, and a transient pulse monitor (TPM) to characterize the arcs that occur during the negative biasing. Through positive biasing of its test arrays, PASP Plus investigated the snapover phenomenon, which took place over the range of +100 to +300 V. It was found that array configurations where the interconnects are shielded from the space plasma (i.e., the concentrators or arrays with 'wrap-through' connectors) have lower leakage current. The concentrators exhibited negligible leakage current over the whole range up to +500 V. In the case of two similar GaAs on Ge arrays, the one with 'wrap-through' connectors had lower leakage current than the one with conventional interconnects. Through negative biasing, PASP Plus investigated the arcing rates of its test arrays. The standard Si array, with its old construction (exposed rough-surface interconnects), arced significantly over a wide voltage and plasma-density range. The other arrays arced at very low rates, mostly at voltages greater than -350 V and plasma densities near or greater than 10(exp 5)/cm(exp -3). AS expected according to theory, arcing was more prevalent when array temperatures were cold (based on biasing in eclipse).

Guidice, Donald A.↗

Energy storage planning for enhanced resilience of power systems against wildfires and heatwaves

Extreme weather events pose significant risks to power grid stability due to their severe consequences and potential for widespread failures. Energy storage systems hold great potential for enhancing grid resilience against such events by providing reliable power during peak demand periods. However, accurately quantifying the size, location, and investment costs of new energy storage assets is a complex task, as energy storage planning decisions depend on the investment choices of other generation technologies and the integration of new transmission projects. Here, this paper presents a novel capacity expansion planning framework that simultaneously optimizes investments in energy storage, generation, and transmission, determining their optimal size, location, and type, while incorporating extreme weather events into long-term planning. More specifically, our stress-event-informed planning framework integrates the impact of heatwaves and wildfires into the planning process, identifying least-cost investment solutions that comply with policy goals and enhance grid resilience. The proposed framework employs machine-learning-based modeling to project heatwave-induced loads and performance-based risk assessment to evaluate wildfire-driven transmission line derates. Using industry-standard datasets to accurately represent the transmission topology of the Western Interconnection (WI) system, the proposed framework is applied to the WI 40-zone system, with investment decisions reported for the years 2030, 2035, and 2040. Simulation results reveal that with just a 10% increase in investment costs, resilience against extreme events can be significantly improved, with investment decisions heavily favoring energy storage, particularly 4-hour energy storage systems.

25 ENERGY STORAGE↗

SpaceVPX Interoperability Assessment

The existing VMEbus (VersaModular Eurocard bus) International Trade Association (VITA)-78 industry standard, also known as SpaceVPX, is an avionics board- and chassis-level standard derived from the OpenVPX standard as defined in VITA-65. While VITA-65 defines backplane and board-level profiles from COTS vendors to ensure interoperability of products used in developing systems and subsystems, the VITA-78 standard defines SpaceVPX to incorporate fault tolerance features that are required by many spaceflight systems. However, VITA-78 allows so much flexibility that interoperability between modules cannot be assured. This assessment provides guidelines on the use of, and extensions to, the VITA-78 standard to enable avionics interoperability for future NASA missions. The assessment team was comprised of subject matter experts (SMEs) from Goddard Space Flight Center (GSFC), the Jet Propulsion Laboratory (JPL), Johnson Space Center (JSC), and Langley Research Center (LaRC). The team included valuable external consulting support from a SME who was a key participant in the development of the VITA-78 standard. The team had extensive collaboration with the NASA Space Technology Mission Directorate (STMD) High Performance Spaceflight Computing (HPSC) project, specifically in the development of SpaceVPX interconnect findings, observations, and NESC recommendations. To provide an understanding of the breadth of implementations that SpaceVPX must accommodate, multiple NASA use cases were analyzed to assess the requirements for SpaceVPX implementations across a wide range of NASA missions (Appendix C). Applications included crewed missions, science missions, and orbital and surface robotic systems. Product surveys were conducted to assess the level of industry support for SpaceVPX, applications, and the variations in their implementations (Appendix D). In-depth analysis was conducted in the areas of: (a) power management and distribution, (b) form factors and daughtercards, (c) interconnect, and (d) fault tolerance. Leveraging the use cases, product surveys, and SMEs from multiple NASA Centers, these areas were analyzed to determine the range of implementations permitted by the VITA-78 standard and potential interoperability issues. Applicable findings and NESC recommendations were provided for each area. During this assessment, there were multiple opportunities to engage with other agencies to learn about their interest in SpaceVPX, their strategies for implementing SpaceVPX-based systems, and their internal development efforts. These engagements also generated findings and NESC recommendations. Based on this assessment analysis, NESC recommendations were made regarding the feature set and module profiles to support NASA SpaceVPX implementations. This feature set includes restrictions on features in VITA-78, and extensions to the standard. Key recommendations in this area include the use of 10 Gigabit Ethernet and Peripheral Component Interconnect Express (PCIe) as high bandwidth interconnect on the backplane, the retention of SpaceWire interconnect for control functions, and support for 3U (unit) and 6U, form factors for NASA systems. Restrictions were proposed on the usage of user-defined signals to promote interoperability, and specific power managements and distribution schemes for 3U systems. Beyond the technical implementation of SpaceVPX, recommendations were made on areas that warrant further investigation. Primary among these is the recommendation for NASA to collaborate with other space-going agencies and industry to incorporate recommendations into a future ‘dot spec’ of VITA-78. This would ensure wide adoption and availability of the modules that comply with the specification. The assessment includes appendices with candidate module profiles that can be considered as a starting point for this activity, and example systems based on the recommendations. Follow-on studies are recommended for architectures beyond SpaceVPX to address potential enhancements including condensed set of interconnect, software required to implement protocol layers on the interconnect (and other features), alternative power architectures, and system-level testability.

SpaceVPX↗

Status Quo in V2G/V2H: Closer Look at CA's Progress

This presentation will guide participants through the progress of V2G interconnection, using California's regulatory development as a case study. The focus will be on utility-side considerations rather than EVs themselves, and as such, EV-EVSE interactions will not be covered. Since V2G DC is already accommodated within the existing grid interconnection process, the majority of the discussion will center on V2G AC, particularly the regulatory and standards development.

24 POWER TRANSMISSION AND DISTRIBUTION↗