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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Dielectrics for Power Electronics Applications

This presentation discusses the role of dielectric materials in power electronic packages. Two dielectric technologies - a dielectric material film-based substrate for insulation and a dielectric coolant - are discussed. The thermal performance benefits of dielectric film-based substrate in comparison with traditional direct-bond-copper substrates are studied through finite element analysis. Also, a novel cooling concept based on dielectric liquids that can contact electrically active surfaces are presented.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2017

Multilayered Film Capacitors for Advanced Power Electronics and Electric Motors for Electric Traction Drives

Biaxially oriented polypropylene (BOPP) film capacitors are the most suitable technology for high voltage, high temperature, and high ripple current power electronic systems in high performance electric vehicles (EVs). These capacitors, however, occupy 1/4th to 1/3rd of the power electronic unit and have a 50% voltage derating above 85 °C due to their drastically deteriorated breakdown strength and lifetime at high temperature. Development of a new dielectric material system for capacitors to increase temperature use and reduce size is critical in many EV related applications. Multilayer dielectric film developed by PolymerPlus and team has demonstrated improved dielectric constant and breakdown strength as compared to BOPP films. In this program, several film formulations were developed and investigated for dielectric performance and further down-selected for production scale up. Because this technology uses commercial polymers, fabrication of film rolls to demonstrate scalability for initial capacitor fabrication trials was successfully achieved. The film production feasibility, metallization and capacitor prototype fabrication was successfully demonstrated in Year 1 of the program. In Year 2 of the program, film production scale-up leading to significantly large film quantities for metallization and capacitor fabrication led to 600 µF size capacitors. Capacitor characterization was also completed during this year.

25 ENERGY STORAGE↗
DOE OSTI2025

Real-time Simulation Model of a Vanadium Redox Flow Battery Energy Storage System with Power Electronics Integration

This paper presents a real-time (RT) model of a 20 kW multi-stack vanadium redox flow battery (VRFB) system including power electronics converters in a single real-time framework. Implemented on a Typhoon HIL 604 device, this model is designed to simulate the operation of the flow battery with system-level controls. To provide a realistic overview of a VRFB system, the model incorporates a closed-loop control system for managing the speeds of two centrifugal pumps and an electro-thermal model of the battery stacks, enabling realtime temperature estimation. Furthermore, a two-stage power electronics topology and associated control solution are presented, operating with distinct strategies for interfacing the battery model with the main grid and a local load. Results from simulations demonstrate that the VRFB model is well suited for RT environment, and system can manage power during both charging and discharging cycles, while a SCADA monitor is used to display critical variables for safe, efficient, and reliable operation of the VRFB systems.

Rezende Da Costa Reis Kimpara, Renata [ORNL] (ORCI↗
DOE OSTI2023

Cooling Strategies for an Electric Motor with Additively Manufactured Hollow Conductors and Distributed Power Electronics Integrated with Heat Pipes

This paper discusses design tradeoffs and thermal modeling explored in cooling strategies for an aircraft propulsion electric motor with additively manufactured coils and distributed power electronics integrated with heat pipes. Design tradeoffs include heat pipe Qmax performance related to inclination, condenser configuration, coolant type, coolant flow path complexity, and ease of access to modular power electronics. Three cooling strategies were selected and realized into CAD models. These models were further evaluated using 3D thermal FEA and optimization tools to explore cooling geometry details that include fin thickness, spacing and count with the objective to minimize fin mass under a set of constraints. Lastly, motorette test data is presented comparing air versus liquid cooling of heat pipes.

additive manufacturing↗
DOE OSTI2014

Air Cooling for High Temperature Power Electronics (Presentation)

Current emphasis on developing high-temperature power electronics, including wide-bandgap materials such as silicon carbide and gallium nitride, increases the opportunity for a completely air-cooled inverter at higher powers. This removes the liquid cooling system for the inverter, saving weight and volume on the liquid-to-air heat exchanger, coolant lines, pumps, and coolant, replacing them with just a fan and air supply ducting. We investigate the potential for an air-cooled heat exchanger from a component and systems-level approach to meet specific power and power density targets. A proposed baseline air-cooled heat exchanger design that does not meet those targets was optimized using a parametric computational fluid dynamics analysis, examining the effects of heat exchanger geometry and device location, fixing the device heat dissipation and maximum junction temperature. The CFD results were extrapolated to a full inverter, including casing, capacitor, bus bar, gate driver, and control board component weights and volumes. Surrogate ducting was tested to understand the pressure drop and subsequent system parasitic load. Geometries that met targets with acceptable loads on the system were down-selected for experimentation. Nine baseline configuration modules dissipated the target heat dissipation, but fell below specific power and power density targets. Six optimized configuration modules dissipated the target heat load, exceeding the specific power and power density targets. By maintaining the same 175 degrees C maximum junction temperature, an optimized heat exchanger design and higher device heat fluxes allowed a reduction in the number of modules required, increasing specific power and power density while still maintaining the inverter power.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2016

High-Power Electron Accelerators for Space (and other) Applications

This is a presentation on high-power electron accelerators for space and other applications. The main points covered are: electron beams for space applications, new designs of RF accelerators, high-power high-electron mobility transistors (HEMT) testing, and Li-ion battery design. In summary, the authors have considered a concept of 1-MeV electron accelerator that can operate up to several seconds. This concept can be extended to higher energy to produce higher beam power. Going to higher beam energy requires adding more cavities and solid-state HEMT RF power devices. The commercial HEMT have been tested for frequency response and RF output power (up to 420 W). Finally, the authors are testing these HEMT into a resonant load and planning for an electron beam test in FY17.

43 PARTICLE ACCELERATORS↗
DOE OSTI2022

Increasing the mobility and power-electronics figure of merit of AlGaN with atomically thin AlN/GaN digital-alloy superlattices

Alloy scattering in random AlGaN alloys drastically reduces the electron mobility and, therefore, the power-electronics figure of merit. As a result, Al compositions greater than 75% are required to obtain even a twofold increase in the Baliga figure of merit compared to GaN. However, beyond approximately 80% Al composition, donors in AlGaN undergo the DX transition, which makes impurity doping increasingly more difficult. Moreover, the contact resistance increases exponentially with the increase in Al content, and integration with dielectrics becomes difficult due to the upward shift of the conduction band. Atomically thin superlattices of AlN and GaN, also known as digital alloys, are known to grow experimentally under appropriate growth conditions. These chemically ordered nanostructures could offer significantly enhanced figure of merit compared to their random alloy counterparts due to the absence of alloy scattering, as well as better integration with contact metals and dielectrics. In this work, we investigate the electronic structure and phonon-limited electron mobility of atomically thin AlN/GaN digital-alloy superlattices using first-principles calculations based on density-functional and many-body perturbation theory. The bandgap of the atomically thin superlattices reaches 4.8 eV, and the in-plane (out-of-plane) mobility is 369 (452) cm 2 V -1 s -1 . Using the modified Baliga figure of merit that accounts for the dopant ionization energy, here we demonstrate that atomically thin AlN/GaN superlattices with a monolayer sublattice periodicity have the highest modified Baliga figure of merit among several technologically relevant ultra-wide bandgap materials, including random AlGaN, β-Ga 2 O 3 , cBN, and diamond.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Power Electronics for Electrolyzer Applications to Enable Grid Services

The Power Electronics for Electrolyzer Applications to Enable Grid Services project aims to develop smart converter for dedicated electrolyzer applications to enable grid services via standardization of control interfaces between hydrogen electrolyzer system low-level controls and power converter controls. The project provides additional revenue source for electrolyzer through participation in grid services and reduces the cost of deployment and controls integration through standardization and risk due to supply-chain issues. It also enables the adoption of green hydrogen via standardizing the integration of energy storage, renewables, and distributed energy resources. Furthermore, the work provides a controlled validation environment to evaluate scalable integration solution for hydrogen production technologies, improves overall reliability and maintainability of the electrolyzer system for grid applications, and directly contributes to DOE HFTO's "Hydrogen Shot" goal.

energy transitions↗
DOE OSTI2018

SiC MOSFET Based Modular Universal Power Electronics Regulator

A modular and scalable SiC MOSFET based universal power electronics regulator (UPER) allows coordinated integration of energy resources and loads, elimination of extra power conversion stages, and allowance of more sources or loads added with a simple plug and play feature. A comprehensive investigation has been conducted in term of the typical distributed generations and loads employed in buildings, in order to outline a detailed specification for UPER. Thus, a common DC bus voltage of 500 V and power rating of 3 kW are dedicatedly selected. The UPER hardware design and implementation are completely illustrated, including the static and dynamic characterization of the employed SiC MOSFET. The dedicated universal power cell and Plug-and-Play gate driver performs reliable continuous operation even exposed to an extreme fast switching speed (> 100 V/ns). The continuous operation of buck mode verified the UPER hardware development at 50 kHz with an overall efficiency of 98.19%. A new voltage polarity reversal phenomenon was also discovered in the verification of the isolated DAB stage with planar transformers.

Zheng, Sheng↗
DOE OSTI2026

Power Electronics Module with Integrated Ceramic Heat Exchanger

NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.

25 ENERGY STORAGE↗
DOE OSTI2022

System, method, and apparatus for integrating high power density power electronics on a mobile application

A motor drive converter includes a cold plate having a first side and a second side, the first side being opposite to the second side. The motor drive converter may further include at least one motor phase power electronics disposed on the first side of the cold plate, and a capacitor array disposed on the second side of the cold plate. The cold plate may include slots therethrough for a conductor to pass through the cold plate. The conductor may be configured to electrically coupling the capacitor array and the at least one motor phase power electronics.

Stoltz, Thomas Joseph↗
DOE OSTI2022

Power Electronics Based Self-Monitoring and Diagnosing for Photovoltaic Systems

Faults in photovoltaic (PV) systems can seriously affect the efficiency, energy yield, cost, safety, and reliability of PV plants. Condition monitoring of PV plants is, therefore, a very important approach to estimating the health condition of PV modules and power electronics in the system. However, additional hardware for PV system monitoring adds cost to the system's operation; delayed maintenance service also causes additional energy production loss. The Center for Power Electronics Systems (CPES) at the Virginia Polytechnic Institute and State University and Siemens Cooperate Research developed the online impedance measurement for a PV panel self-monitoring and diagnosing technology using the DC-DC converter connected to the panel. Small-signal impedances of a monocrystalline silicon PV panel were modeled and simulated to reflect fault conditions such as the short-circuit, hot-spot, and junction box faults. Modeling and simulation results were validated firstly using a test setup consisting of a solar simulator, a network analyzer, small-signal injectors, and a monocrystalline PV panel rated at 300 W.

14 SOLAR ENERGY↗
DOE OSTI2023

Use of Grid-Forming Medium-Voltage Power Electronics Hub in a Microgrid Setting: Preprint

This paper presents the application of a new design of a multiport, modular, medium-voltage power electronics hub (M3PE-HUB) in a microgrid setting. The M3PE-HUB system was modeled in a digital real-time simulator (DRTS) and integrated into the Banshee microgrid test system. This paper presents the preliminary DRTS simulation-based results of the M3PE- HUB system connected in a test microgrid system. Verification and validation of the M3PE-HUB architecture and controls in the test microgrid setting are the primary contributions of this work. The results of the operation during the islanding and resynchronization process indicate the feasibility of the proposed architecture in a microgrid setting. This paper also presents results for a system reconfiguration use case where the M3PE- HUB was used to reconfigure the system under a fault condition.

grid forming↗
DOE OSTI2025

Cybersecurity Challenges in Low-Inertia Power-Electronics-Dominated Grids

Here, the low inertia characteristics of the power electronics dominated grid (PEDG) introduces challenges while restoring voltage and frequency to their nominal values. These stability challenges create new cybersecurity vulnerabilities that are not thoroughly discussed in the literature. Cyber events such as false data injection (FDI), denial of service (DoS), man-in-the-middle attacks, stealthy attacks, and advanced persistent threats target PEDG to disrupt grid stability or gain financial benefits. The low inertia of PEDG (< 2s) compared to traditional grids (~10s) exacerbates these vulnerabilities. In response to stealthy attacks on state variables that supervisory layers cannot detect until significant harm occurs, the low inertia characteristics of PEDG offer substantial stealthy attack surfaces. To counteract such threats, PEDG must be equipped with ultra-fast real-time anomaly detection system and trajectory prediction mechanism to achieve effective cyberattack resiliency.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2017

Extended Pulse-Powered Humidity-Freeze Cycling for Testing Module-Level Power Electronics

An EMI suppression capacitor (polypropylene film type) failed by 'popcorning' due to vapor outgassing in pulse powered humidity-freeze cycles. No shorts or shunts could be detected despite mildly corroded metallization visible in the failed capacitor. Humidity-freeze cycling is optimized to break into moisture barriers. However, further studies will be required on additional module level power electronic (MLPE) devices to optimize the stress testing for condensation to precipitate any weakness to short circuiting and other humidity/bias failure modes.

14 SOLAR ENERGY↗
DOE OSTI2021

Thermal and Mechanical Design of a High-Voltage Power Electronics Package: Preprint

Thermal and mechanical design aspects of a power electronic package with 5-kV GaN devices are presented. Through finite element analyses, the impact of different cooling configurations and device location on the thermal performance and reliability of the package was investigated. It was found that placing the devices closer to the direct-bond-copper substrate as opposed to a centered approach in the proposed double-sided-cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

27 ARPA - Advanced Research Projects Agency-Energy↗
DOE OSTI2021

Thermal and Mechanical Design of a High-Voltage Power Electronics Package

This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal performance and reliability of the package. We found that placing the devices closer to the direct bond copper substrate as opposed to a centered approach in the proposed double-sided cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

electronic packaging↗