Modulation Transfer Function of Active Pixel Focal Plane Arrays
Modulation Transfer Function (MTF) is an important figure of merit in focal plane array sensors, especially for accurate target positions such as star trackers.
SEARCH · Search NASA
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Modulation Transfer Function (MTF) is an important figure of merit in focal plane array sensors, especially for accurate target positions such as star trackers.
Switching and amplifying characteristics of a newly developed two-dimesnional InGaAs Active Pixel Imager Array are presented.
A foveal image sensor integrated circuit comprising a plurality of CMOS active pixel sensors arranged both within and about a central fovea region of the chip. The pixels in the central fovea region have a smaller size than the pixels arranged in peripheral rings about the central region. A new photocharge normalization scheme and associated circuitry normalizes the output signals from the different size pixels in the array. The pixels are assembled into a multi-resolution rectilinear foveal image sensor chip using a novel access scheme to reduce the number of analog RAM cells needed. Localized spatial resolution declines monotonically with offset from the imager's optical axis, analogous to biological foveal vision.
No abstract available
No abstract available
An improved method of mapping the capacitive contribution to cross-talk among pixels in an imaging array of sensors (typically, an imaging photodetector array) has been devised for use in calibrating and/or characterizing such an array. The method involves a sequence of resets of subarrays of pixels to specified voltages and measurement of the voltage responses of neighboring non-reset pixels.
GaAs-based, sub-harmonically pumped Schottky diode mixers offer a number of advantages for array implementation in a heterodyne receiver system. Since the radio frequency (RF) and local oscillator (LO) signals are far apart, system design becomes much simpler. A proprietary planar GaAs Schottky diode process was developed that results in very low parasitic anodes that have cutoff frequencies in the tens of terahertz. This technology enables robust implementation of monolithic mixer and frequency multiplier circuits well into the terahertz frequency range. Using optical and e-beam lithography, and conventional epitaxial layer design with innovative usage of GaAs membranes and metal beam leads, high-performance terahertz circuits can be designed with high fidelity. All of these mixers use metal waveguide structures for housing. Metal machined structures for RF and LO coupling hamper these mixers to be integrated in multi-pixel heterodyne array receivers for spectroscopic and imaging applications. Moreover, the recent developments of terahertz transistors on InP substrate provide an opportunity, for the first time, to have integrated amplifiers followed by Schottky diode mixers in a heterodyne receiver at these frequencies. Since the amplifiers are developed on a planar architecture to facilitate multi-pixel array implementation, it is quite important to find alternative architecture to waveguide-based mixers.
This document presents the outcome of the detector trade-off for the XMS instrument on IXO. This trade-off is part of the Cryogenic instrument Phase-A study as proposed to ESA in the Declaration of Interest SRONXMS-PL-2009-003 dated June 6, 2009. The detector consists of two components: a core array for the highest spectral resolution and an outer array to increase the field of view substantially with modest increase in the number of read-out channels. Degraded resolution of the outer array in comparison with the core array is accepted in order to make this scheme possible. The two detector components may be a single unit or separate units. These arrays comprise pixels and the components that allow them to be arrayed. Each pixel comprises a thermometer, an absorber, and the thermal links between them and to the rest of the array. These links may be interfaces or distinct components. The array infrastructure comprises the mechanical structure of the array, the arrangement of the leads, and features added to improve the integrated thermal properties of the array in the focal-plane assembly.
A high-speed edge-detecting line scan smart camera was developed. The camera is designed to operate as a component in a NASA Glenn Research Center developed inlet shock detection system. The inlet shock is detected by projecting a laser sheet through the airflow. The shock within the airflow is the densest part and refracts the laser sheet the most in its vicinity, leaving a dark spot or shadowgraph. These spots show up as a dip or negative peak within the pixel intensity profile of an image of the projected laser sheet. The smart camera acquires and processes in real-time the linear image containing the shock shadowgraph and outputting the shock location. Previously a high-speed camera and personal computer would perform the image capture and processing to determine the shock location. This innovation consists of a linear image sensor, analog signal processing circuit, and a digital circuit that provides a numerical digital output of the shock or negative edge location. The smart camera is capable of capturing and processing linear images at over 1,000 frames per second. The edges are identified as numeric pixel values within the linear array of pixels, and the edge location information can be sent out from the circuit in a variety of ways, such as by using a microcontroller and onboard or external digital interface to include serial data such as RS-232/485, USB, Ethernet, or CAN BUS; parallel digital data; or an analog signal. The smart camera system can be integrated into a small package with a relatively small number of parts, reducing size and increasing reliability over the previous imaging system..
Monolithic arrays of active-pixel junction field-effect (JFET) devices made from InGaAs proposed for use as imaging sensors sensitive to light in visible and short-wavelength infrared parts of electromagnetic spectrum. Each pixel of such array comprises photodetector monolithically integrated with JFET output-amplifier circuit of source-follower type - structure similar to charge-coupled device (CCD). Sizes of instruments reduced because large cooling systems not needed.
While the pixel size in a standard multianode microchannel array (MAMA) photon-counting detector is determined by the spacing of the anode array, the factor most fundamentally limiting pixel resolution is the spacing of the channels in the microchannel plate. Detector resolution can be improved by means of digitization followed by a centroiding procedure. The decoding hardware and the techniques for enhanced pixel resolution are presently discussed with a view to the factors of speed and complexity. A single-chip CMOS gate-array implementation of the decoder is devised and compared with existing multichip decoders' performance.
We are developing kilopixel arrays of TES microcalorimeters to enable high-resolution x-ray imaging spectrometers for future x-ray observatories and laboratory astrophysics experiments. Our current array design was targeted as a prototype for the X-ray Microcalorimeter Spectrometer proposed for the International X-ray Observatory, which calls for a 40×40-pixel core array of 300 micron devices with 2.5 eV energy resolution (at 6 keV). Here we present device characterization of our 32×32 arrays, including x-ray spectral performance of individual pixels within the array. We present our results in light of the understanding that our Mo/Au TESs act as weak superconducting links, causing the TES critical current (I(sub c)) and transition shape to oscillate with applied magnetic field (B). We show I(sub c)(B) measurements and discuss the uniformity of these measurements across the array, as well as implications regarding the uniformity of device noise and response. In addition, we are working to reduce pixel-to-pixel electrical and thermal crosstalk; we present recent test results from an array that has microstrip wiring and an angle-evaporated copper backside heatsinking layer, which provides copper coverage on the four sidewalls of the silicon wells beneath each pixel.
Comparisons of charge sharing and charge loss measurements between two pixelated Cadmium-Zinc-Telluride (CdZnTe) detectors are discussed. These properties along with the detector geometry help to define the limiting energy resolution and spatial resolution of the detector in question. The first detector consists of a 1-mm-thick piece of CdZnTe sputtered with a 4x4 array of pixels with pixel pitch of 750 microns (inter-pixel gap is 100 microns). Signal readout is via discrete ultra-low-noise preamplifiers, one for each of the 16 pixels. The second detector consists of a 2-mm-thick piece of CdZnTe sputtered with a 16x16 array of pixels with a pixel pitch of 300 microns (inter-pixel gap is 50 microns). This crystal is bonded to a custom-built readout chip (ASIC) providing all front-end electronics to each of the 256 independent pixels. These detectors act as precursors to that which will be used at the focal plane of the High Energy Replicated Optics (HERO) telescope currently being developed at Marshall Space Flight Center. With a telescope focal length of 6 meters, the detector needs to have a spatial resolution of around 200 microns in order to take full advantage of the HERO angular resolution. We discuss to what degree charge sharing will degrade energy resolution but will improve our spatial resolution through position interpolation.
Improved scanners to be incorporated into hyperspectral microscope-based imaging systems have been invented. Heretofore, in microscopic imaging, including spectral imaging, it has been customary to either move the specimen relative to the optical assembly that includes the microscope or else move the entire assembly relative to the specimen. It becomes extremely difficult to control such scanning when submicron translation increments are required, because the high magnification of the microscope enlarges all movements in the specimen image on the focal plane. To overcome this difficulty, in a system based on this invention, no attempt would be made to move either the specimen or the optical assembly. Instead, an objective lens would be moved within the assembly so as to cause translation of the image at the focal plane: the effect would be equivalent to scanning in the focal plane. The upper part of the figure depicts a generic proposed microscope-based hyperspectral imaging system incorporating the invention. The optical assembly of this system would include an objective lens (normally, a microscope objective lens) and a charge-coupled-device (CCD) camera. The objective lens would be mounted on a servomotor-driven translation stage, which would be capable of moving the lens in precisely controlled increments, relative to the camera, parallel to the focal-plane scan axis. The output of the CCD camera would be digitized and fed to a frame grabber in a computer. The computer would store the frame-grabber output for subsequent viewing and/or processing of images. The computer would contain a position-control interface board, through which it would control the servomotor. There are several versions of the invention. An essential feature common to all versions is that the stationary optical subassembly containing the camera would also contain a spatial window, at the focal plane of the objective lens, that would pass only a selected portion of the image. In one version, the window would be a slit, the CCD would contain a one-dimensional array of pixels, and the objective lens would be moved along an axis perpendicular to the slit to spatially scan the image of the specimen in pushbroom fashion. The image built up by scanning in this case would be an ordinary (non-spectral) image. In another version, the optics of which are depicted in the lower part of the figure, the spatial window would be a slit, the CCD would contain a two-dimensional array of pixels, the slit image would be refocused onto the CCD by a relay-lens pair consisting of a collimating and a focusing lens, and a prism-gratingprism optical spectrometer would be placed between the collimating and focusing lenses. Consequently, the image on the CCD would be spatially resolved along the slit axis and spectrally resolved along the axis perpendicular to the slit. As in the first-mentioned version, the objective lens would be moved along an axis perpendicular to the slit to spatially scan the image of the specimen in pushbroom fashion.
Four astrophysics missions are currently being studied by NASA as candidate large missions to be chosen inthe 2020 astrophysics decadal survey.1 One of these missions is the X-Ray Surveyor (XRS), and possibleconfigurations of this mission are currently under study by a science and technology definition team (STDT). Oneof the key instruments under study is an X-ray microcalorimeter, and the requirements for such an instrument arecurrently under discussion. In this paper we review some different detector options that exist for this instrument,and discuss what array formats might be possible. We have developed one design option that utilizes eithertransition-edge sensor (TES) or magnetically coupled calorimeters (MCC) in pixel array-sizes approaching 100kilo-pixels. To reduce the number of sensors read out to a plausible scale, we have assumed detector geometriesin which a thermal sensor such a TES or MCC can read out a sub-array of 20-25 individual 1 pixels. In thispaper we describe the development status of these detectors, and also discuss the different options that exist forreading out the very large number of pixels.
The promise of good energy and spatial resolution coupled with high efficiency and near-room-temperature operation has fuelled a large International effort to develop Cadmium-Zinc-Telluride (CdZnTe) for the hard-x-ray region. We present here preliminary results from our development of small-pixel imaging arrays fabricated on 5x5x1-mm and 5x5x2-mm spectroscopy and discriminator-grade material. Each array has 16 (4x4) 0.65-mm gold readout pads on a 0.75-mm pitch, with each pad connected to a discrete preamplifier via a pulse-welded gold wire. Each array is mounted on a 3-stage Peltier cooler and housed in an ion-pump-evacuated housing which also contains a hybrid micro-assembly for the 16 channels of electronics. We have investigated the energy resolution and approximate photopeak efficiency for each pixel at several energies and have used an ultra-fine beam x-ray generator to probe the performance at the pixel boundaries. Both arrays gave similar results, and at an optimum temperature of -20 C we achieved between 2 and 3% FWHM energy resolution at 60 keV and around 15% at 5.9 keV. We found that all the charge was contained within 1 pixel until very close to the pixels edge, where it would start to be shared with its neighbor. Even between pixels, all the charge would be appropriately shared with no apparently loss of efficiency or resolution. Full details of these measurements will be presented, together with their implications for future imaging-spectroscopy applications.
Consideration is given to the construction and operation of multi-anode microchannel array detector systems having formats as large as 256 x 1024 pixels. Such arrays are being developed for imaging and spectroscopy at soft X-ray, ultraviolet and visible wavelengths from balloons, sounding rockets and space probes. Both discrete-anode and coincidence-anode arrays are described. Two types of photocathode structures are evaluated: an opaque photocathode deposited directly on the curved-channel MCP and an activated cathode deposited on a proximity-focused mesh. Future work will include sensitivity optimization in the different wavelength regions and the development of detector tubes with semitransparent proximity-focused photocathodes.
We have produced a variety of superconducting transition edge sensor array designs for microcalorimetric detection of x-rays. Arrays are characterized with a time division SQUID multiplexer such that greater than 10 devices from an array can be measured in the same cooldown. Designs include kilo pixel scale arrays of relatively small sensors (-75 micron pitch) atop a thick metal heatsinking layer as well as arrays of membrane-isolated devices on 250 micron and up to 600 micron pitch. We discuss fabrication and performance of microstripline wiring at the small scales achieved to date. We also address fabrication issues with reduction of absorber contact area in small devices.