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At least 145 records · Page 8

Applications of high power lasers

The use of computer generated, reflection holograms in conjunction with high power lasers for precision machining of metals and ceramics was investigated. The Reflection holograms which were developed and made to work at both optical wavelength (He-Ne, 6328 A) and infrared (CO2, 10.6) meet the primary practical requirement of ruggedness and are relatively economical and simple to fabricate. The technology is sufficiently advanced now so that reflection holography could indeed be used as a practical manufacturing device in certain applications requiring low power densities. However, the present holograms are energy inefficient and much of the laser power is lost in the zero order spot and higher diffraction orders. Improvements of laser machining over conventional methods are discussed and addition applications are listed. Possible uses in the electronics industry include drilling holes in printed circuit boards making soldered connections, and resistor trimming.

Angus, J. C.↗

Development program on a cold cathode electron gun

During this phase of the cathode development program, SRI improved the multiple electron beam exposure system used to print hole patterns for the cathode arrays, studied anisotropic etch processes, conducted cathode investigations using an emission microscope, reviewed possible alternate materials for cathode fabrication, studied cathode storage techniques, conducted high power operation experiments, and demonstrated high-current-density operation with small arrays of tips.

Spindt, C. A.↗

TAB interconnects for space concentrator solar cell arrays

The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

Avery, J.↗

Laboratory for Atmospheres: 2004 Technical Highlights

The report describes our role in NASA's mission, gives a broad description of our research, and summarizes our scientists' major accomplishments in 2004. The report also contains useful information on human resources, scientific interactions, outreach activities, and the transformation our laboratory has undergone. This report is published in two versions: 1) an abbreviated print version, and 2) an unabridged electronic version at our Laboratory for Atmospheres Web site: http://atmospheres.gsfc.nasa.gov/.

Source record↗

Jake Garn Mission Simulator and Training Facility, Building 5, Historical Documentation

In response to President George W. Bush's announcement in January 2004 that the Space Shuttle Program (SSP) would end in 2010, the National Aeronautics and Space Administration (NASA) completed a nation-wide historical survey and evaluation of NASA-owned facilities and properties (real property assets) at all its Centers and component facilities. The buildings and structures which supported the SSP were inventoried and assessed as per the criteria of eligibility for listing in the National Register of Historic Places (NRHP) in the context of this program. This study was performed in compliance with Section 110 of the National Historic Preservation Act (NHPA) of 1966 (Public Law 89-665), as amended; the National Environmental Policy Act (NEPA) of 1969 (Public Law 91-190); Executive Order (EO) 11593: Protection and Enhancement of the Cultural Environment; EO 13287, Preserve America, and other relevant legislation. As part of this nation-wide study, in September 2006, historical survey and evaluation of NASA-owned and managed facilities at was conducted by NASA's Lyndon B. Johnson Space Center (JSC) in Houston, Texas. The results of this study are presented in a report entitled, "Survey and Evaluation of NASA-owned Historic Facilities and Properties in the Context of the U.S. Space Shuttle Program, Lyndon B. Johnson Space Center, Houston, Texas," prepared in November 2007 by NASA JSC's contractor, Archaeological Consultants, Inc. As a result of this survey, the Jake Gam Mission Simulator and Training Facility (Building 5) was determined eligible for listing in the NRHP, with concurrence by the Texas State Historic Preservation Officer (SHPO). The survey concluded that Building 5 is eligible for the NRHP under Criteria A and C in the context of the U.S. Space Shuttle program (1969-2010). Because it has achieved significance within the past 50 years, Criteria Consideration G applies. At the time of this documentation, Building 5 was still used to support the SSP as an astronaut training facility. This documentation package precedes any undertaking as defined by Section 106 of the NHPA, as amended, and implemented in 36 CFR Part 800, as NASA JSC has decided to proactively pursue efforts to mitigate the potential adverse affects of any future modifications to the facility. It includes a historical summary of the Space Shuttle program; the history of JSC in relation to the SSP; a narrative of the history of Building 5 and how it supported the SSP; and a physical description of the structure. In addition, photographs documenting the construction and historical use of Building 5 in support of the SSP, as well as photographs of the facility documenting the existing conditions, special technological features, and engineering details, are included. A contact sheet printed on archival paper, and an electronic copy of the work product on CD, are also provided.

Slovinac, Trish↗

Avionics Systems Laboratory/Building 16. Historical Documentation

As part of this nation-wide study, in September 2006, historical survey and evaluation of NASA-owned and managed facilities that was conducted by NASA s Lyndon B. Johnson Space Center (JSC) in Houston, Texas. The results of this study are presented in a report entitled, "Survey and Evaluation of NASA-owned Historic Facilities and Properties in the Context of the U.S. Space Shuttle Program, Lyndon B. Johnson Space Center, Houston, Texas," prepared in November 2007 by NASA JSC s contractor, Archaeological Consultants, Inc. As a result of this survey, the Avionics Systems Laboratory (Building 16) was determined eligible for listing in the NRHP, with concurrence by the Texas State Historic Preservation Officer (SHPO). The survey concluded that Building 5 is eligible for the NRHP under Criteria A and C in the context of the U.S. Space Shuttle program (1969-2010). Because it has achieved significance within the past 50 years, Criteria Consideration G applies. At the time of this documentation, Building 16 was still used to support the SSP as an engineering research facility, which is also sometimes used for astronaut training. This documentation package precedes any undertaking as defined by Section 106 of the NHPA, as amended, and implemented in 36 CFR Part 800, as NASA JSC has decided to proactively pursue efforts to mitigate the potential adverse affects of any future modifications to the facility. It includes a historical summary of the Space Shuttle program; the history of JSC in relation to the SSP; a narrative of the history of Building 16 and how it supported the SSP; and a physical description of the structure. In addition, photographs documenting the construction and historical use of Building 16 in support of the SSP, as well as photographs of the facility documenting the existing conditions, special technological features, and engineering details, are included. A contact sheet printed on archival paper, and an electronic copy of the work product on CD, are also provided

Slovinac, Patricia↗

Communications and Tracking Development Laboratory/Building 44. Historical Documentation

As part of this nation-wide study, in September 2006, historical survey and evaluation of NASA-owned and managed facilities was conducted by NASA's Lyndon B. Johnson Space Center (JSC) in Houston, Texas. The results of this study are presented in a report entitled, Survey and Evaluation of NASA-owned Historic Facilities and Properties in the Context of the U.S. Space Shuttle Program, Lyndon B. Johnson Space Center, Houston, Texas, prepared in November 2007 by NASA JSC s contractor, Archaeological Consultants, Inc. As a result of this survey, the Communications and Tracking Development Laboratory (Building 44) was determined eligible for listing in the NRHP, with concurrence by the Texas State Historic Preservation Officer (SHPO). The survey concluded that Building 44 is eligible for the NRHP under Criteria A and C in the context of the U.S. Space Shuttle Program (1969-2010). Because it has achieved significance within the past 50 years, Criteria Consideration G applies. At the time of this documentation, Building 44 was still used to support the SSP as an engineering research facility, which is also sometimes used for astronaut training. This documentation package precedes any undertaking as defined by Section 106 of the NHPA, as amended, and implemented by 36 CFR Part 800, as NASA JSC has decided to proactively pursue efforts to mitigate the potential adverse affects of any future modifications to the facility. It includes a historical summary of the Space Shuttle Program; the history of JSC in relation to the SSP; a narrative of the history of Building 44 and how it supported the SSP; and a physical description of the building. In addition, photographs documenting the construction and historical use of Building 44 in support of the SSP, as well as photographs of the facility documenting the existing conditions, special technological features, and engineering details, are included. A contact sheet printed on archival paper, and an electronic copy of the work product on CD, are also provided.

Slovinac, Patricia↗

Mission Control Center/Building 30. Historical Documentation

As part of this nation-wide study, in September 2006, historical survey and evaluation of NASA-owned and managed facilities was conducted by NASA's Lyndon B. Johnson Space Center (JSC) in Houston, Texas. The results of this study are presented in a report entitled, Survey and Evaluation of NASA-owned Historic Facilities and Properties in the Context of the U.S. Space Shuttle Program, Lyndon B. Johnson Space Center, Houston, Texas, prepared in November 2007 by NASA JSC s contractor, Archaeological Consultants, Inc. As a result of this survey, the Mission Control Center (Building 30) was determined eligible for listing in the NRHP, with concurrence by the Texas State Historic Preservation Officer (SHPO). The survey concluded that Building 30 is eligible for the NRHP under Criteria A and C in the context of the U.S. Space Shuttle Program (1969-2010). Because it has achieved significance within the past 50 years, Criteria Consideration G applies. It should be noted that the Mission Control Center was designated a National Historic Landmark in 1985 for its role in the Apollo 11 Lunar Landing. At the time of this documentation, Building 30 was still used to support the SSP as an engineering research facility, which is also sometimes used for astronaut training. This documentation package precedes any undertaking as defined by Section 106 of the NHPA, as amended, and implemented in 36 CFR Part 800, as NASA JSC has decided to proactively pursue efforts to mitigate the potential adverse affects of any future modifications to the facility. It includes a historical summary of the Space Shuttle program; the history of JSC in relation to the SSP; a narrative of the history of Building 30 and how it supported the SSP; and a physical description of the structure. In addition, photographs documenting the construction and historical use of Building 30 in support of the SSP, as well as photographs of the facility documenting the existing conditions, special technological features, and engineering details, are included. A contact sheet printed on archival paper, and an electronic copy of the work product on CD, are also provided.

Source record↗

Electrical and Thermal Characterization of 3D Printed Thermoplastic Parts with Embedded Wires for High Current-Carrying Applications

Fabrication of parts exhibiting multi-functionality has recently been complemented by hybrid polymer extrusion additive manufacturing in combination with wire embedding technology. While much mechanical characterization has been performed on parts produced with fused deposition modeling, limited characterization has been performed when combined electrical and thermal loads are applied to 3D printed multi-material parts. As such, this work describes the design, fabrication, and testing of 3D printed thermoplastic coupons containing embedded copper wires that carried current. An automated fabrication process was used employing a hybrid additive manufacturing machine that dispensed polycarbonate thermoplastic and embedded bare copper wires. Testing included AC and DC hipot testing as well as thermal testing on as-fabricated and heat treated coupons to determine the effect of porosity in the substrate. The heat-treated parts contained reduced amounts of porosity, as corroborated through scanning electron microscopy, which led to 50 % increased breakdown strength and 30 to 40 % increased heat dissipation capabilities. The results of this research are describing a set of design protocol that can be used as a guideline for 3D printed embedded electronics to predict the electrical and thermal behavior.

Hipot testing↗

Overcoming efficiency and cost barriers for large-area quantum dot photovoltaics through stable ink engineering

The bottom-up construction of electronics from colloidal quantum dots (CQDs) could innovate nanotechnology manufacturing through printing. However, the unstable and expensive semiconductive CQD inks make the scaling up of CQD electronics challenging. Here, in this study, we develop a strategy for engineering the solution chemistry of lead sulfide (PbS) CQD inks prepared from a low-cost direct synthesis method. By creating an iodine-rich environment in weakly coordinating solvents, we convert the iodoplumbates into functional anions, which condense into a robust surface shell. The fully charged electrostatic surface layer prevents aggregation and epitaxial fusion of CQDs, yielding stable inks. By eliminating the fusion-induced inter-band states, we print a compact CQD film with uniformity in three dimensions, flattened energy landscape and improved carrier transport. We achieved a certified efficiency of 13.40% on 0.04 cm 2 cells, with a 300-fold increase in active area, scaling up to a 12.60 cm 2 module with a certified efficiency of 10%.

14 SOLAR ENERGY↗

X-Ray Exposure of Electron-Deposited Photoresist for Conformal Lithography on Corrugated Surfaces

Proximity printing using synchrotron X-ray lithography provides high resolution pattern transfer with large depth of field, low diffraction effects and no reflection from the substrate. Electro-plating of photo-resist allows deposition of thin, uniform films over geometrically complex and topographically diverse, electrically conductive surfaces.

Electron-deposited resist X-ray lithography Deep d↗

Three-dimensional modular electronic interconnection system

A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.

Bolotin, Gary S.↗

Direct Ink Write 3D Printing of Fully Dense and Functionally Graded Liquid Metal Elastomer Foams

Liquid metal (LM) elastomer composites offer promising potential in soft robotics, wearable electronics, and human-machine interfaces. Direct ink write (DIW) 3D printing offers a versatile manufacturing technique capable of precise control over LM microstructures, yet challenges such as interfilament void formation in multilayer structures impact material performance. Here, a DIW strategy is introduced to control both LM microstructure and material architecture. Investigating three key process parameters–nozzle height, extrusion rate, and nondimensionalized nozzle velocity–it is found that nozzle height and velocity predominantly influence filament geometry. The nozzle height primarily dictates the aspect ratio of the filament and the formation of voids. A threshold print height based on filament geometry is identified; below the height, significant surface roughness occurs, and above the ink fractures, which facilitates the creation of porous structures with tunable stiffness and programmable LM microstructure. These porous architectures exhibit reduced density and enhanced thermal conductivity compared to cast samples. When used as a dielectric in a soft capacitive sensor, they display high sensitivity (gauge factor = 9.0), as permittivity increases with compressive strain. These results demonstrate the capability to simultaneously manipulate LM microstructure and geometric architecture in LM elastomer composites through precise control of print parameters, while maintaining geometric fidelity in the printed design.

Spencer Pak↗

3D Printing in Zero G Technology Demonstration Mission: Summary of On-Orbit Operations, Material Testing, and Future Work

Human space exploration to date has been limited to low Earth orbit and the moon. The International Space Station (ISS), an orbiting laboratory 200 miles above the earth, provides a unique and incredible opportunity for researchers to prove out the technologies that will enable humans to safely live and work in space for longer periods of time and venture farther into the solar system. The ability to manufacture parts in-space rather than launch them from earth represents a fundamental shift in the current risk and logistics paradigm for human spaceflight. In particularly, additive manufacturing (or 3D printing) techniques can potentially be deployed in the space environment to enhance crew safety (by providing an on-demand part replacement capability) and decrease launch mass by reducing the number of spare components that must be launched for missions where cargo resupply is not a near-term option. In September 2014, NASA launched the 3D Printing in Zero G technology demonstration mission to the ISS to explore the potential of additive manufacturing for in-space applications and demonstrate the capability to manufacture parts and tools on-orbit. The printer for this mission was designed and operated by the company Made In Space under a NASA SBIR (Small Business Innovation Research) phase III contract. The overarching objectives of the 3D print mission were to use ISS as a testbed to further maturation of enhancing technologies needed for long duration human exploration missions, introduce new materials and methods to fabricate structure in space, enable cost-effective manufacturing for structures and mechanisms made in low-unit production, and enable physical components to be manufactured in space on long duration missions if necessary. The 3D print unit for fused deposition modeling (FDM) of acrylonitrile butadiene styrene (ABS) was integrated into the ISS Microgravity Science Glovebox (MSG) in November 2014 and phase I printing operations took place from November through December of that year. Phase I flight operations yielded 14 unique parts (21 total specimens) that could be directly compared against ground-based prints of identical geometry manufactured using the printer prior to its launch to ISS. The 3DP unit functioned safely and produced specimens necessary to advance the understanding of the critical design and operational parameters for the FDM process as affected by the microgravity environment. From the standpoint of operations, 3DP demonstrated the ability to remove parts from the build-tray on-orbit, teleoperate the printer from the ground, perform critical maintenance functions within defined human factors limits, produce a functional tool that could be evaluated for form/fit/function, and uplink a new part file from the ground and produce it on the printer. The flight parts arrived at NASA Marshall Space Flight Center in Huntsville, Alabama in April 2015, where they underwent months of testing in the materials and processes laboratory. Ground and flight prints completed the following phases of testing: photographic/visual inspection, mass and density evaluation, structured light scanning, XRay and CT, mechanical testing, optical microscopy, scanning electron microscopy, and chemical analysis. This presentation will discuss the results of this testing as well as phase II operations for the printer, which took place in June and July of 2016. Lessons learned from the tech demo and their impacts on the design and development of the second generation 3D printer for ISS, the Additive Manufacturing Facility (AMF) by Made In Space will also be presented. In addition, progress in other elements of NASA's In Space Manufacturing (ISM) initiative such as the on-demand ISM utilization catalog, in-space Recycler ISS Technology Demonstration development, launch packaging recycling, in-space printable electronics, development of higher strength polymeric materials for 3D printing and Additive Construction by Mobile Emplacement (ACME) will also be addressed.

Prater, Tracie↗

Meter-scale van der Waals films manufactured via one-step roll printing

A weak van der Waals (vdW) force in layered materials enables their isolation into thin flakes through mechanical exfoliation while sustaining their intrinsic electronic and optical properties. Here, we introduce a universal roll-printing method capable of producing vdW multilayer films on wafer-to-meter scale. This process uses sequential exfoliation and transfer of layered materials from the powder sources to target substrates through a repeated rolling of a cylindrical metal drum. We achieve uniformly coated films with a library of vdW powders on various mechanically rigid and flexible substrates. The printed films are configured into different devices including light-emitting diodes and photodetectors. The presented technique offers substantial benefits in terms of cost efficiency and a low thermal budget while offering high material quality.

36 MATERIALS SCIENCE↗

Safe venting for electronic components

Vented enclosure is made from lightweight metal. Printed-circuit boards are attached to bottom and end bulkheads and to top cover. Airflow cools components indirectly through walls of inner compartment. Flammability and smoke tests demonstrate safety of enclosure.

Currin, R., Jr.↗

RF Device for Acquiring Images of the Human Body

A safe, non-invasive method for forming images through clothing of large groups of people, in order to search for concealed weapons either made of metal or not, has been developed. A millimeter wavelength scanner designed in a unique, ring-shaped configuration can obtain a full 360 image of the body with a resolution of less than a millimeter in only a few seconds. Millimeter waves readily penetrate normal clothing, but are highly reflected by the human body and concealed objects. Millimeter wave signals are nonionizing and are harmless to human tissues when used at low power levels. The imager (see figure) consists of a thin base that supports a small-diameter vertical post about 7 ft (=2.13 m) tall. Attached to the post is a square-shaped ring 2 in. (=5 cm) wide and 3 ft (=91 cm) on a side. The ring is oriented horizontally, and is supported halfway along one side by a connection to a linear bearing on the vertical post. A planar RF circuit board is mounted to the inside of each side of the ring. Each circuit board contains an array of 30 receivers, one transmitter, and digitization electronics. Each array element has a printed-circuit patch antenna coupled to a pair of mixers by a 90 coupler. The mixers receive a reference local oscillator signal to a subharmonic of the transmitter frequency. A single local oscillator line feeds all 30 receivers on the board. The resulting MHz IF signals are amplified and carried to the edge of the board where they are demodulated and digitized. The transmitted signal is derived from the local oscillator at a frequency offset determined by a crystal oscillator. One antenna centrally located on each side of the square ring provides the source illumination power. The total transmitted power is less than 100 mW, resulting in an exposure level that is completely safe to humans. The output signals from all four circuit boards are fed via serial connection to a data processing computer. The computer processes the approximately 1-MB data set into a three-dimensional image in a matter of seconds. The innovation is to configure the receiver array in a ring topology surrounding the scanned object. The ring is then scanned vertically to cover the necessary two-dimensional surface. This fabrication of the ring is made possible by using planar antenna and circuit technology. A planar circuit board serves as a medium for both antennas and signal processing components. Using this technique, parts counts are kept low, and the cost per element is a small fraction of a waveguide-based system.

Gaier, Todd C.↗

Printed Circuit Board Assembly for Use in Space Missions

An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.

Petrick, David J.↗