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At least 145 records · Page 8

Characterization of Low-Temperature, Co-Fired Ceramic-Manufactured Electrostatic Thruster-Closeout Report

The goal of the project was to evaluate prototypes of an experimental thruster developed by the University of Arkansas (UA), Fayetteville, AR. The design under evaluation is a radio frequency (RF) electrostatic thruster that was fabricated using the low-temperature, co-fired ceramic (LTCC) materials and fabrication process. This materials system is analogous to printed circuit board (PCB) technology with the most significant difference being that the laminate is replaced by a ceramic material and the copper layer is replaced by printed sinterable silver paste. LTCC designs are baked after fabrication and assembled to realize an entirely monolithic structure with internal conductors, vias, and cavities. In this process, the LTCC electrostatic thruster (LTCC-ET) that is the subject of the present work becomes a monolithic ceramic thruster capable of withstanding temperatures in excess of 500 ºC. The UA and NASA Marshall Space Flight Center (MSFC) jointly performed prototype testing on the LTCC-ET under a NASA Cooperative Agreement Notice (CAN) award. The LTCC-ET was tested at MSFC in May 2018 over a 1-week period. There were two goals for the test program: (1) Testing to determine the operating parameters required to create plasma ignition in the test articles. This was explored by setting a propellant flowrate and increasing RF power until plasma ignition was observed. Testing was conducted with both argon and krypton. (2) Investigate the thrust and specific impulse (Isp) performance of the thruster as a function of propellant flowrate and grid voltage. This goal was not met during the project as technical challenges in maintaining stable plasma ignition arose due to stress and heating of the RF power feed. In summary, a prototype thruster design (consisting of three packaged units) was fabricated by UA and tested for the first time under vacuum conditions at MSFC to experimentally determine basic performance metrics and functionality. It was found that the design was not sufficiently optimized or robust enough in its initial iteration to support a significant test campaign or characterization program. It was concluded that the propellant outlet channels must be reduced in size with the flowpaths adjusted to increase propellant residence time in the thruster, and that the RF connector must be replaced with a version capable of handling higher power throughput and heating. However, even in its unoptimized form, a plasma could be produced in the LTCCET, demonstrating the efficacy of the design approach. The design is especially compelling due to its low cost to manufacture and, more importantly, its scalability of size and power throughput. Low cost and scalability are also important in that additional functionalities, such as thrust vectoring and plume charge neutralization, can be integrated into future designs with minimal additional cost. This project has matured the LTCC-ET development Technology Readiness Level (TRL) from 1 to 2. The low-cost RF plasma source portion of the LTCC device was matured from TRL 2 to 4 through the demonstration of RF plasma ignition under vacuum conditions.

Huang, P.-H. A.↗

Development of a highly reliable composite board for printed circuitry for use in space environment

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

Bradbury, E. J.↗

Liquid Droplet Printing

The center has recently invested in a new additive manufacturing technology known as liquid metal jetting or liquid droplet printing. The Additec ElemX machine’s process utilizes wire feedstock fed into a ceramic crucible, where it is melted and ejected by pulsed Lorentz force using an external coil. The team will start with material characterization of various commercially available aluminum alloys to establish process parameters, repeatability, mechanical properties, and microstructure. Future research will consider additional alloys and explore concepts that may potentially adapt the technology for relevance in zero or low gravity environments. The printer has a 12”x12”x4.7” build volume and 0.24mm minimum layer height, with surface finishes comparable to sand castings.

liquid droplet printing↗

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards↗

Progress of Coating Stress Compensation of Silicon Mirrors for Lynx X-ray Telescope Mission Concept Using Thermal Oxide Patterning Method

A thermal oxide patterning method has proven to be effective for correcting coating-stress-induced distortion on flat silicon wafers. We report progress on developing this method for correcting curved silicon mirrors distorted by front-side iridium coatings. Owing to the difference in geometry, a finite element model has been established to calculate the appropriate duty cycle maps in thermal oxide hexagon patterns used for compensation. In addition, a photolithographic process, along with three-dimensional printed equipment, has been developed for creating patterns precisely on the back side of curved mirrors. The developed method has been used to recover the original surface shape of two silicon mirrors which are 100-mm long, 0.5-mm thick, having 312-mm radius of curvature, and 30 deg in azimuthal span (Wolter-I geometry). These mirrors’ front sides are sputter-coated by 20-nm iridium layers with ∼-70 N∕m integrated stress. Measurement results show that the developed method can mitigate coating-induced distortion by a factor of ∼5 in RMS height and ∼4 in RMS slope error, corresponding to ∼0.5 arc sec RMS slope error. Residual errors after correction are dominated by midfrequency ripples created during the annealing process, which will be resolved in the future. The presented method is precise and inexpensive and a potential candidate for resolving the coating stress issue for Lynx optics in the future.

x-ray↗

Additive Manufacturing for Affordable Rocket Engines

Additive manufacturing (also known as 3D printing) technology has the potential to drastically reduce costs and lead times associated with the development of complex liquid rocket engine systems. NASA is using 3D printing to manufacture rocket engine components including augmented spark igniters, injectors, turbopumps, and valves. NASA is advancing the process to certify these components for flight. Success Story: MSFC has been developing rocket 3D-printing technology using the Selective Laser Melting (SLM) process. Over the last several years, NASA has built and tested several injectors and combustion chambers. Recently, MSFC has 3D printed an augmented spark igniter for potential use the RS-25 engines that will be used on the Space Launch System. The new design is expected to reduce the cost of the igniter by a factor of four. MSFC has also 3D printed and tested a liquid hydrogen turbopump for potential use on an Upper Stage Engine. Additive manufacturing of the turbopump resulted in a 45% part count reduction. To understanding how the 3D printed parts perform and to certify them for flight, MSFC built a breadboard liquid rocket engine using additive manufactured components including injectors, turbomachinery, and valves. The liquid rocket engine was tested seven times in 2016 using liquid oxygen and liquid hydrogen. In addition to exposing the hardware to harsh environments, engineers learned to design for the new manufacturing technique, taking advantage of its capabilities and gaining awareness of its limitations. Benefit: The 3D-printing technology promises reduced cost and schedule for rocket engines. Cost is a function of complexity, and the most complicated features provide the largest opportunities for cost reductions. This is especially true where brazes or welds can be eliminated. The drastic reduction in part count achievable with 3D printing creates a waterfall effect that reduces the number of processes and drawings, decreases the amount of touch labor required, and increases reliability. When certification is achieved, NASA missions will be able to realize these benefits.

West, Brian↗

Automated Array Assembly, Phase 2

The large scale production of silicon solar cell array panels is discussed. The cost and performance of three manufacturing sequences designed to convert silicon sheet and wafers into solar panels is analyzed. The production of ion implanted and furnace annealed solar cells made using solar grade n- and p-type wafers is examined. The performance of production size lots is examined with regard to the relationship between the ion implant and furnace anneal parameters and the ability to form consistently good thick film screen printed contacts. The spray on antireflection coating process is evaluated. The performance of several lots of cells before and after coating is measured. The structure and refractive index of the RCA I (TiO2) coating is compared with commercial solutions. Sensitivity of coated, screen printed cells to the post heat treatment required to cure the films is assessed.

Daiello, R. V.↗

Screen-Printed YBa2Cu3O7-x Films On Alumina

Superconducting films made in relatively simple process. Thick films of YBa2Cu3O7-x superconductor deposited on highly-polished alumina substrates by screen printing. In addition to simplicity, screen-printing technique offers advantage that patterns for electronic and microwave circuits and devices printed directly, without additional etching steps.

Bansal, Narottam P.↗

Investigation of proposed process sequence for the array automated assembly task, phases 1 and 2

Progress was made on the process sequence for module fabrication. A shift from bonding with a conformal coating to laminating with ethylene vinyl acetate and a glass superstrate is recommended for further module fabrication. The processes that were retained for the selected process sequence, spin-on diffusion, print and fire aluminum p+ back, clean, print and fire silver front contact and apply tin pad to aluminum back, were evaluated for their cost contribution.

Mardesich, N.↗

Plated Metal Powders for Electrode Pastes

Metal grains to be sintered precoated with frit metal. Coated metal powders used to make ink-like electrode pastes for printing and sintering electrode-fabrication process. Grains of base metal coated with lowmelting-point--, lead or tin-- by electroless deposition.

Bickler, D. B.↗

The two-way time synchronization system via a satellite voice channel

A newly developed two-way time synchronization system is described in this paper. The system uses one voice channel at a SCPC satellite digital communication earth station, whose bandwidth is only 45 kHz, thus saving satellite resources greatly. The system is composed of one master station and one or several, up to sixty-two, secondary stations. The master and secondary stations are equipped with the same equipment, including a set of timing equipment, a synthetic data terminal for time synchronizing, and a interface unit between the data terminal and the satellite earth station. The synthetic data terminal for time synchronization also has an IRIG-B code generator and a translator. The data terminal of master station is the key part of whole system. The system synchronization process is full automatic, which is controlled by the master station. Employing an autoscanning technique and conversational mode, the system accomplishes the following tasks: linking up liaison with each secondary station in turn, establishing a coarse time synchronization, calibrating date (years, months, days) and time of day (hours, minutes, seconds), precisely measuring the time difference between local station and the opposite station, exchanging measurement data, statistically processing the data, rejecting error terms, printing the data, calculating the clock difference and correcting the phase, thus realizing real-time synchronization from one point to multiple points. We also designed an adaptive phase circuit to eliminate the phase ambiguity of the PSK demodulator. The experiments have shown that the time synchronization accuracy is better than 2 mu S. The system has been put into regular operation.

Heng-Qiu, Zheng↗

Design and Application of a Collocated Capacitance Sensor for Magnetic Bearing Spindle

This paper presents a collocated capacitance sensor for magnetic bearings. The main feature of the sensor is that it is made of a specific compact printed circuit board (PCB). The signal processing unit has been also developed. The results of the experimental performance evaluation on the sensitivity, resolution and frequency response of the sensor are presented. Finally, an application example of the sensor to the active control of a magnetic bearing is described.

Shin, Dongwon↗

Archiving of Planetary Ring Data

Stellar occultation data provide our only Earth-based means of probing planetary rings at kilometer spatial resolution. The occultation data archive at MIT contains original data and analysis products of stellar occultations by the ring systems of the planets Jupiter, Saturn, Uranus, and Neptune observed by members of the group (and other groups) from 1977 to the present. During this time period, several media have been used to record and store the original and processed data: (1) chart records; (2) printed output, (3) audio reel tape; (4) audio cassette tape; (5) 7-track, 1/2-inch computer tape; (6) 9-track, 1/2-inch computer tape at 800, 1600, and 6250 bpi; (7) NOVA disk platters (2.5 and 5.0 Mbyte); (8) write once optical disks; (9) punched cards; and (10) read-write optical disks. With the rapid change of computer technology over this time period, some of these media have become not only obsolete, but nearly extinct. In particular, it has become nearly impossible to find any facilities that can still read 800 bpi tapes, which contain the only copies of several important data sets for the ring system of Uranus. In particular, we have an extensive ring data collection that includes data sets for the following Uranian ring occultations: U0, U11, U12, U13, U14, U25, U17, and U36.

Elliot, James L.↗

Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays

Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.

ball grid array area array package semi-aqueous cl↗

Customized Science Carrier Modules and Accessories Developed for Microgravity Simulation Devices

Because the access to the true weightless environment of the ISS and other Low Earth Orbit (LEO) vehicles is limited and cost prohibitive, the need for ground-based microgravity simulation analogs to bridge the gravity continuum gap between 1g gravity and costly space flight studies with true weightlessness was realized. As such, the Microgravity Simulation Support Facility (MSSF) was established at NASA John F. Kennedy Space Center (KSC) to fulfill the need of the scientific community. Our facility provides the US science community with a focal point in the field of gravitational research by granting access to an array of two-dimensional(2D) and three-dimensional (3D)clinostats, and Random Positioning Machine (RPM) platforms developed by teams throughout the world. The availability of these capabilities will allow further understanding the role of altered gravity vectors from “functional weightlessness”, partial gravity conditions (1 x 10-3to 0.9g, and Moon and Mars ‘g vectors), to hypergravity (up to3g) on biological processes. We have designed and 3D printed a variety of specialized attachments(and associated “static control” hardware)to allow researchers to mount their samples onto these microgravity simulation devices to meet their unique science requirements. A summary of each attachment module will be presented below. Note: All software or code information should be requested to the author Ye Zhang, Kennedy Space Center ye.zhang-1@nasa.gov

Ye Zhang↗

Fabrication and Testing of a Novel Ceramic-Based Additively Manufactured Humidity Sensor

A material capable of detecting minute changes in ambient humidity via a change in its electrical properties is critical to enabling the success of vapor-sensitive components on Earth and abroad. Manufacturing of these hydrophilic materials currently follows an extensive process of heat treating focused on removing the solvent and organic vehicle. This research aims to reduce the complexity of manufacturing these novel sensors by eliminating the high-temperature (>850 °C) processing stages. A method based on printing a polymer embedded with hydrophilic nanoparticles is accomplished through selected additively manufactured methods. This research branches into the elimination of physical spare parts with the ability to print highly sensitive in-situ sensors, reducing the environmental footprint in space-critical environments like the International Space Station (ISS).

sensor↗

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Sood, Bhanu↗

The search for CFC alternatives is over?

The Electronics Manufacturing Productivity Facility (EMPF) is a U.S. Navy Center of Excellence tasked to do research in electronics manufacturing. For the past seven years, the EMPF has performed extensive research in various cleaning materials and processes that have recently been made available to printed circuit board assemblers. This paper outlines our research and points out the positive and negative aspects that need to be considered when choosing an alternative process.

Crawford, Tim↗