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At least 145 records · Page 8

LaRC TPI 1500 series polymers

The crystallization behavior and the melt flow properties of two batches of 1500 series LaRC-TPI polymers from Mitsui Toatsu Chemicals (MTC) were investigated. The characterization methods include Differential Scanning Calorimetry, the x ray diffractography and the melt rheology. The as-received materials possess initial crystalline melting peak temperatures of 295 and 305 C, respectively. These materials are less readily recrystallizable at elevated temperatures when compared to other semicrystalline thermoplastics. For the samples annealed at temperatures below 330 C, a semicrystalline polymer can be obtained. On the other hand, a purely amorphous structure is realized in the samples annealed at temperatures above 330 C. Isothermal crystallization kinetics were studied by means of the simple Avrami equation. The viscoelastic properties at elevated temperatures below and above glass transition temperature of the polymers were measured. Information with regard to the molecule sizes and distributions in these polymers were also extracted from melt rheology.

Hou, Tan-Hung↗

Impact Behavior of Composite Fan Blade Leading Edge Subcomponent with Thermoplastic Polyurethane Interleave

Impact damage tolerance and damage resistance is a critical metric for application of polymer matrix composites where failure caused by impact damage could compromise structural performance and safety. As a result, several materials and/or design approaches to improve impact damage tolerance have been investigated over the past several decades. Many composite toughening methodologies impart a trade-off between increased fracture toughness and compromised in-plane strength and modulus. In large part, mechanical tests to evaluate composite damage tolerance include static methods such as Mode I, Mode II, and mixed mode failures. However, ballistic impact damage resistance does not always correlate with static properties. The intent of this paper is to evaluate the influence of a thermoplastic polyurethane veil interleave on the static and dynamic performance of composite test articles. Static coupon tests included tension, compression, double cantilever beam, and end notch flexure. Measurement of the resistance to ballistic impact damage were made to evaluate the composites response to high speed impact. The interlayer material showed a decrease of in-plane performance with only a moderate improvement to Mode I and Mode II fracture toughness. However, significant benefit to impact damage tolerance was observed through ballistic tests.

Damage Tolerance↗

Semi-interpenetrating networks of LARC-TPI

In a previous research project at NASA-Langley, a novel semi-2-interpenetrating polymer network (semi-2-IPN) was prepared from the linear, thermoplastic polyimidesulfone, and the more brittle, crosslinked, acetylene-terminated imidesulfone. Synergistic qualities such as improved thermooxidative stability and better processability were achieved from this combination. The novelty of the system lay in the fact that the structures of the linear and crosslinking components were nearly identical. This similarity in structure eliminates any phase separation problems common to many-IPNs. In a similar way, a semi-2-IPN was prepared from linear, thermoplastic LARC-TPI and acetylene-terminated LARC-TPI (ATLARC-TPI). The preparation and characterization of this system will be discussed as well as adhesive and composite data.

Egli, Annemarie H.↗

High performance addition-type thermoplastics (ATTs) - Evidence for the formation of a Diels-Alder adduct in the reaction of an acetylene-terminated material and a bismaleimide

Recently, the concept and demonstration of a new versatile synthetic reaction for making a large number of high-performance addition-type thermoplastics (ATTs) were reported. The synthesis shows promise for providing polymers having an attractive combination of easy processability, good toughness, respectable high temperature mechanical performance, and excellent thermo-oxidative stability. The new chemistry involves the reaction of an acetylene-terminated material with a bismaleimide or benzoquinone. In order to clarify the reaction mechanism, model compound studies were undertaken in solutions as well as in the solid state. The reaction products were purified by flash chromatography and characterized by conventional analytical techniques including NMR, FT-IR, UV-visible, mass spectroscopy, and high pressure liquid chromatography. The results are presented of the model compound studies which strongly support the formation of a Diels-Alder adduct in the reaction of an acetylene-terminated compound and a bismaleimide or benzoquinone.

Pater, R. H.↗

Micro and macro approaches to tough polymers for composites

The progress to date on the development of techniques to toughen continuous thermoplastic composites is summarized. The work, using the approach of toughening the polycarbonate composite matrix with rubber particles, has focused on determining the differences between Double Cantilever Beam (DCB) samples molded inhouse and those molded by NASA. Specifically, an effort was made to account for the differences in fracture toughness observed between the various specimens. In addition, preliminary results of tensile dilatometry tests are described; these tests suggest that processes leading to increased volume and enhanced shear banding are occurring within the rubber toughened system. The results of the effort using another approach, the preparation of random block copolycarbonates, are presented. The synthetic route to these species was modified so that higher molecular weights of these materials can be obtained. In addition, an attempt is being made to determine the exact block length or the number of functional groups in the oligomers since this procedure also should lead to high molecular weight materials. Dynamic mechanical analysis of the copolymer prepared so far indicates that the scale of cooperative molecular motion of the PBA polycarbonate at sub-Tg temperatures is larger than five monomer units. Efforts to find a suitable rubber-toughener for a thermoset system (bismaleimides) is also discussed. Included is a description of the various tougheners intended for use or currently being used.

Yee, Albert F.↗

Damage induced constitutive response of a thermoplastic related to composites and adhesive bonding

The volume-averaged constitutive behavior of a polymer sustaining void growth under dilational deformation is addressed. Polyvinylacetate is deformed between two aluminum beams in a double cantilever geometry and the deformations, recorded with the aid of optical interferometry, are used to deduce the stress-strain behavior of the material as it passes from small strain behavior, through the voiding process, to near-failure under exclusion of rate-sensitivity considerations.

Parvin, M.↗

Dry Process for Manufacturing Hybridized Boron Fiber/Carbon Fiber Thermoplastic Composite Materials from a Solution Coated Precursor

An apparatus for producing a hybrid boron reinforced polymer matrix composite from precursor tape and a linear array of boron fibers. The boron fibers are applied onto the precursor tapes and the precursor tape processed within a processing component having an impregnation bar assembly. After passing through variable-dimension forming nip-rollers, the precursor tape with the boron fibers becomes a hybrid boron reinforced polymer matrix composite. A driving mechanism is used to pulled the precursor tape through the method and a take-up spool is used to collect the formed hybrid boron reinforced polymer matrix composite.

Harry L Belvin↗

High Strain Rate Deformation Modeling of a Polymer Matrix Composite: Matrix Constitutive Equations - Part 1

Recently applications have exposed polymer matrix composite materials to very high strain rate loading conditions, requiring an ability to understand and predict the material behavior under these extreme conditions. In this first paper of a two part report, background information is presented, along with the constitutive equations which will be used to model the rate dependent nonlinear deformation response of the polymer matrix. Strain rate dependent inelastic constitutive models which were originally developed to model the viscoplastic deformation of metals have been adapted to model the nonlinear viscoelastic deformation of polymers. The modified equations were correlated by analyzing the tensile/ compressive response of both 977-2 toughened epoxy matrix and PEEK thermoplastic matrix over a variety of strain rates. For the cases examined, the modified constitutive equations appear to do an adequate job of modeling the polymer deformation response. A second follow-up paper will describe the implementation of the polymer deformation model into a composite micromechanical model, to allow for the modeling of the nonlinear, rate dependent deformation response of polymer matrix composites.

Goldberg, Robert K.↗

Puncture-Healing Thermoplastic Resin Carbon-Fiber-Reinforced Composites

A composite comprising a combination of a self-healing polymer matrix and a carbon fiber reinforcement is described. In one embodiment, the matrix is a polybutadiene graft copolymer matrix, such as polybutadiene graft copolymer comprising poly(butadiene)-graft-poly(methyl acrylate-co-acrylonitrile). A method of fabricating the composite is also described, comprising the steps of manufacturing a pre-impregnated unidirectional carbon fiber preform by wetting a plurality of carbon fibers with a solution, the solution comprising a self-healing polymer and a solvent, and curing the preform. A method of repairing a structure made from the composite of the invention is described. A novel prepreg material used to manufacture the composite of the invention is described.

Gordon, Keith L.↗

Puncture-Healing Thermoplastic Resin Carbon-Fiber Reinforced Composites

A composite comprising a combination of a self-healing polymer matrix and a carbon fiber reinforcement is described. In one embodiment, the matrix is a polybutadiene graft copolymer matrix, such as polybutadiene graft copolymer comprising poly(butadiene)-graft-poly(methyl acrylate-co-acrylonitrile). A method of fabricating the composite is also described, comprising the steps of manufacturing a pre-impregnated unidirectional carbon fiber preform by wetting a plurality of carbon fibers with a solution, the solution comprising a self-healing polymer and a solvent, and curing the preform. A method of repairing a structure made from the composite of the invention is described. A novel prepreg material used to manufacture the composite of the invention is described.

Gordon, Keith L.↗

Electrical and Thermal Characterization of 3D Printed Thermoplastic Parts with Embedded Wires for High Current-Carrying Applications

Fabrication of parts exhibiting multi-functionality has recently been complemented by hybrid polymer extrusion additive manufacturing in combination with wire embedding technology. While much mechanical characterization has been performed on parts produced with fused deposition modeling, limited characterization has been performed when combined electrical and thermal loads are applied to 3D printed multi-material parts. As such, this work describes the design, fabrication, and testing of 3D printed thermoplastic coupons containing embedded copper wires that carried current. An automated fabrication process was used employing a hybrid additive manufacturing machine that dispensed polycarbonate thermoplastic and embedded bare copper wires. Testing included AC and DC hipot testing as well as thermal testing on as-fabricated and heat treated coupons to determine the effect of porosity in the substrate. The heat-treated parts contained reduced amounts of porosity, as corroborated through scanning electron microscopy, which led to 50 % increased breakdown strength and 30 to 40 % increased heat dissipation capabilities. The results of this research are describing a set of design protocol that can be used as a guideline for 3D printed embedded electronics to predict the electrical and thermal behavior.

Hipot testing↗

Processing polymeric powders

The concept of uniformly and continuously depositing and sinter-fusing nominal 0.1 to 40 microns dimensioned electrostatically charged polymer powder particles onto essentially uniformly spread 5 to 20 micron grounded continuous fiber tow to produce a respoolable thermoplastic composite two-preg was formulated at NASA Langley. The process was reduced to practice under a NASA grant at the University of Akron this spring. The production of tow-preg is called phase 1. The production of ultrafine polymer powders from 5 to 10 percent (wt) polymer solids in solvent is considered. This is phase 0 and is discussed. The production of unitape from multi tow-pregs was also considered. This is phase 2 and is also discussed. And another approach to phase 1, also proposed last summer, was scoped. This is phase 1A and is also discussed.

Throne, James L.↗

Emerging polyheterocyclic films, coatings and resins - Thermoplastic polyquinolines

The processing and performance characteristics of a soluble, thermoplastic polyquinoline suggest its utility in a variety of high performance applications. The polymer is characterized by excellent thermal and oxidative stability, very low moisture absorption, good mechanical properties, very low dielectric constant, and an unusually low thermal expansion coefficient. This polymer, designated PQ-100 (TM), can be cast into strong, transparent, free standing films from common solvents. Coatings of variable thickness can be spin-coated on to silicon and other surfaces. After processing into films, PQ-100 (TM) can be rendered insoluble in a wide range of solvents using a proprietary process. The low CTE contributes to very low residual stress when the polymer is spin-coated onto silicon wafers. PQ-100 (TM) is currently under evaluation for use as an interlayer dielectric substrate in high-density interconnect applications, including multichip modules. Many of the characteristics of the polymer also suggest its utility as a high-performance film and as a matrix resin for specialty composite applications.

Hendricks, Neil H.↗

Predictions for Radiation Shielding Materials

Radiation from galactic cosmic rays (GCR) and solar particle events (SPE) is a serious hazard to humans and electronic instruments during space travel, particularly on prolonged missions outside the Earth s magnetic fields. Galactic cosmic radiation (GCR) is composed of approx. 98% nucleons and approx. 2% electrons and positrons. Although cosmic ray heavy ions are 1-2% of the fluence, these energetic heavy nuclei (HZE) contribute 50% of the long-term dose. These unusually high specific ionizations pose a significant health hazard acting as carcinogens and also causing microelectronics damage inside spacecraft and high-flying aircraft. These HZE ions are of concern for radiation protection and radiation shielding technology, because gross rearrangements and mutations and deletions in DNA are expected. Calculations have shown that HZE particles have a strong preference for interaction with light nuclei. The best shield for this radiation would be liquid hydrogen, which is totally impractical. For this reason, hydrogen-containing polymers make the most effective practical shields. Shielding is required during missions in Earth orbit and possibly for frequent flying at high altitude because of the broad GCR spectrum and during a passage into deep space and LunarMars habitation because of the protracted exposure encountered on a long space mission. An additional hazard comes from solar particle events (SPEs) which are mostly energetic protons that can produce heavy ion secondaries as well as neutrons in materials. These events occur at unpredictable times and can deliver a potentially lethal dose within several hours to an unshielded human. Radiation protection for humans requires safety in short-term missions and maintaining career exposure limits within acceptable levels on future long-term exploration missions. The selection of shield materials can alter the protection of humans by an order of magnitude. If improperly selected, shielding materials can actually increase radiation damage due to penetration properties and nuclear fragmentation. Protecting space-borne microelectronics from single event upsets (SEUs) by transmitted radiation will benefit system reliability and system design cost by using optimal shield materials. Long-term missions on the surface of the Moon or Mars will require the construction of habitats to protect humans during their stay. One approach to the construction is to make structural materials from lunar or Martian regolith using a polymeric material as a binder. The hydrogen-containing polymers are considerably more effective for radiation protection than the regolith, but the combination minimizes the amount of polymer to be transported. We have made composites of simulated lunar regolith with two different polymers, LaRC-SI, a high-performance polyimide thermoset, and polyethylene, a thermoplastic.

Kiefer, Richard L.↗

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗

Laminated thermoplastic composite material from recycled high density polyethylene

The design of a materials-science, educational experiment is presented. The student should understand the fundamentals of polymer processing and mechanical property testing of materials. The ability to use American Society for Testing and Materials (ASTM) standards is also necessary for designing material test specimens and testing procedures. The objectives of the experiment are (1) to understand the concept of laminated composite materials, processing, testing, and quality assurance of thermoplastic composites and (2) to observe an application example of recycled plastics.

Liu, Ping↗

A new synthetic route to a family of non-classical addition-type thermoplastics. I - Concept and demonstration

A synthesis scheme was developed for a host of nonclassical addition-type thermoplastics (ATT) that can be cured by an addition reaction, leading to a linear polymer structure. The synthesis involves the reaction of an acetylene-terminated prepolymer with either a bismaleimide (BMI) or a biscitraconimide. A new polymer, designated LaRC-RP80, synthesized using this scheme, was found to exhibit several significantly improved properties over the commercial BMI, Kerimid 601, including an eight-fold increase in toughness while maintaining a high Tg, a higher (by 167 C) heat stability, and a 50-percent increase in moisture resistance. In addition, LaRC-RP80 has good hot/wet lap shear strength and processes easily at 288 C without voids in the finished product.

Pater, Ruth H.↗