Search NASA⌕ Search

SEARCH · Search NASA

Results for “chip set”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗
NASA NTRS1988

Noise-margin limitations on gallium-arsenide VLSI

Two factors which limit the complexity of GaAs MESFET VLSI circuits are considered. Power dissipation sets an upper complexity limit for a given logic circuit implementation and thermal design. Uniformity of device characteristics and the circuit configuration determines the electrical functional yield. Projection of VLSI complexity based on these factors indicates that logic chips of 15,000 gates are feasible with the most promising static circuits if a maximum power dissipation of 5 W per chip is assumed. While lower power per gate and therefore more gates per chip can be obtained by using a popular E/D FET circuit, yields are shown to be small when practical device parameter tolerances are applied. Further improvements in materials, devices, and circuits wil be needed to extend circuit complexity to the range currently dominated by silicon.

Long, Stephen I.↗
NASA NTRS1991

Analysis of the Intel 386 and i486 microprocessors for the Space Station Freedom Data Management System

The feasibility is analyzed of upgrading the Intel 386 microprocessor, which has been proposed as the baseline processor for the Space Station Freedom (SSF) Data Management System (DMS), to the more advanced i486 microprocessors. The items compared between the two processors include the instruction set architecture, power consumption, the MIL-STD-883C Class S (Space) qualification schedule, and performance. The advantages of the i486 over the 386 are (1) lower power consumption; and (2) higher floating point performance. The i486 on-chip cache does not have parity check or error detection and correction circuitry. The i486 with on-chip cache disabled, however, has lower integer performance than the 386 without cache, which is the current DMS design choice. Adding cache to the 386/386 DX memory hierachy appears to be the most beneficial change to the current DMS design at this time.

Liu, Yuan-Kwei↗
NASA NTRS1991

Analysis of the Intel 386 and i486 microprocessors for the Space Station Freedom Data Management System

The feasibility is analyzed of upgrading the Intel 386 microprocessor, which has been proposed as the baseline processor for the Space Station Freedom (SSF) Data Management System (DMS), to the more advanced i486 microprocessors. The items compared between the two processors include the instruction set architecture, power consumption, the MIL-STD-883C Class S (Space) qualification schedule, and performance. The advantages of the i486 over the 386 are (1) lower power consumption; and (2) higher floating point performance. The i486 on-chip cache does not have parity check or error detection and correction circuitry. The i486 with on-chip cache disabled, however, has lower integer performance than the 386 without cache, which is the current DMS design choice. Adding cache to the 386/387 DX memory hierarchy appears to be the most beneficial change to the current DMS design at this time.

Liu, Yuan-Kwei↗
NASA NTRS2019

NASA's Orbital Debris Optical Program: MCAT Operational on Ascension

The Orbital Debris Program Office at NASA Johnson Space Center has a long history of an optical observational program. The Meter Class Autonomous Telescope, MCAT, was dedicated to Eugene Stansbery (now also known as ES-MCAT) in 2017. MCAT, a 1.3m DFM telescope, has a proven capability for tracking known objects from Low-Earth Orbits (LEO) out to Geosynchronous (GEO) orbits. Monitoring the population of the GEO belt is accomplished through surveys. A GEO survey statistically samples the GEO belt (0 to ~15 deg orbital inclinations) to detect both correlated and uncorrelated targets. A GEO survey, the initial focus for MCAT, will commence in 2019 to map out the current state of the GEO population as input for the ORbital Debris Engineering Model (ORDEM 4.x). If a break-up occurs, surveys of the break-up field can be followed for discovery and investigations of daughter debris fragments from the parent satellite. Discovery can be accomplished by surveying orbits near to and including the parent object’s orbit. Targeted observations of debris can be taken with a suite of broadband filters for characterizing individual objects by rate-tracking their known or calculated orbital elements (Two-Line Element sets, TLEs). These observations can be used in conjunction with NASA’s Standard Satellite Break-up Model (SSBM). In 2018, MCAT’s primary mirror was realuminized with a high-end protected, enhanced silver ZeCoat and the CCD chip was replaced in the Spectral Instruments camera. With these updates completed, MCAT is now well on track to reach Full Operational Capability (FOC) in 2019 for its survey and rate-track capabilities. A full overview of MCAT’s operational state, capabilities, and mission will be discussed.

Orbital Debris Program↗
NASA NTRSDate not supplied

Wireless Sensor Instrumentation for Distributed Sensing in Ground-Test Facilities

Wireless sensors have a number of advantages over wired sensors for flexible or temporary diagnostic deployment in a field or lab setting. Relative to wireless alternatives, traditional wired systems encounter limitations including spatial and weight constraints, maintenance costs, and signal integrity in high-noise environments. Ground-test facilities often face these challenges and cause increase down-time costs and failure of data integrity. This paper describes the development and implementation of flexible wireless sensor boards for applications within ground-test facilities using different network architectures. These boards implement state-of-the- art STM32 microprocessor chips for high-speed data acquisition and computational power. Additionally, the design integrates long-range radio transceivers with power output of +20dBm, easily reaching 2 km range, while maintaining high interference immunity and minimizing current consumption. The wireless sensor boards were implemented to demonstrate performance through benchmark testing and by taking distributed electrically-isolated measurements on a high-voltage lab apparatus while using different network architectures. Although this test case is in a laboratory setting, this network architecture could be easily repurposed for various other forms of monitoring.

Wireless Sensor Network↗
NASA NTRS2008

Electronic Switch Arrays for Managing Microbattery Arrays

Integrated circuits have been invented for managing the charging and discharging of such advanced miniature energy-storage devices as planar arrays of microscopic energy-storage elements [typically, microscopic electrochemical cells (microbatteries) or microcapacitors]. The architecture of these circuits enables implementation of the following energy-management options: dynamic configuration of the elements of an array into a series or parallel combination of banks (subarrarys), each array comprising a series of parallel combination of elements; direct addressing of individual banks for charging/or discharging; and, disconnection of defective elements and corresponding reconfiguration of the rest of the array to utilize the remaining functional elements to obtain the desited voltage and current performance. An integrated circuit according to the invention consists partly of a planar array of field-effect transistors that function as switches for routing electric power among the energy-storage elements, the power source, and the load. To connect the energy-storage elements to the power source for charging, a specific subset of switches is closed; to connect the energy-storage elements to the load for discharging, a different specific set of switches is closed. Also included in the integrated circuit is circuitry for monitoring and controlling charging and discharging. The control and monitoring circuitry, the switching transistors, and interconnecting metal lines are laid out on the integrated-circuit chip in a pattern that registers with the array of energy-storage elements. There is a design option to either (1) fabricate the energy-storage elements in the corresponding locations on, and as an integral part of, this integrated circuit; or (2) following a flip-chip approach, fabricate the array of energy-storage elements on a separate integrated-circuit chip and then align and bond the two chips together.

Mojarradi, Mohammad↗
NASA NTRS1977

A miniature 48-channel pressure sensor module capable of in situ calibration

A new high data rate pressure sensor module with in situ calibration capability has been developed by the Langley Research Center to help reduce energy consumption in wind-tunnel facilities without loss of measurement accuracy. The sensor module allows for nearly a two order of magnitude increase in data rates over conventional electromechanically scanned pressure sampling techniques. This module consists of 16 solid state pressure sensor chips and signal multiplexing electronics integrally mounted to a four position pressure selector switch. One of the four positions of the pressure selector switch allows the in situ calibration of the 16 pressure sensors; the three other positions allow 48 channels (three sets of 16) pressure inputs to be measured by sensors. The small size of the sensor module will allow mounting within many wind-tunnel models, thus eliminating long tube lengths and their corresponding slow pressure response.

Gross, C.↗
NASA NTRS1978

Electronically scanned pressure sensor module with in SITU calibration capability

This high data rate pressure sensor module helps reduce energy consumption in wind tunnel facilities without loss of measurement accuracy. The sensor module allows for nearly a two order of magnitude increase in data rates over conventional electromechanically scanned pressure sampling techniques. The module consists of 16 solid state pressure sensor chips and signal multiplexing electronics integrally mounted to a four position pressure selector switch. One of the four positions of the pressure selector switch allows the in situ calibration of the 16 pressure sensors; the three other positions allow 48 channels (three sets of 16) pressure inputs to be measured by the sensors. The small size of the sensor module will allow mounting within many wind tunnel models, thus eliminating long tube lengths and their corresponding slow pressure response.

Gross, C.↗
NASA NTRS1978

C-MOS array design techniques

The entire complement of standard cells and components, except for the set-reset flip-flop, was completed. Two levels of checking were performed on each device. Logic cells and topological layout are described. All the related computer programs were coded and one level of debugging was completed. The logic for the test chip was modified and updated. This test chip served as the first test vehicle to exercise the standard cell complementary MOS(C-MOS) automatic artwork generation capability.

Feller, A.↗
NASA NTRS1990

Advanced modulation technology development for earth station demodulator applications. Coded modulation system development

A jointly optimized coded modulation system is described which was designed, built, and tested by COMSAT Laboratories for NASA LeRC which provides a bandwidth efficiency of 2 bits/s/Hz at an information rate of 160 Mbit/s. A high speed rate 8/9 encoder with a Viterbi decoder and an Octal PSK modem are used to achieve this. The BER performance is approximately 1 dB from the theoretically calculated value for this system at a BER of 5 E-7 under nominal conditions. The system operates in burst mode for downlink applications and tests have demonstrated very little degradation in performance with frequency and level offset. Unique word miss rate measurements were conducted which demonstrate reliable acquisition at low values of Eb/No. Codec self tests have verified the performance of this subsystem in a stand alone mode. The codec is capable of operation at a 200 Mbit/s information rate as demonstrated using a codec test set which introduces noise digitally. The measured performance is within 0.2 dB of the computer simulated predictions. A gate array implementation of the most time critical element of the high speed Viterbi decoder was completed. This gate array add-compare-select chip significantly reduces the power consumption and improves the manufacturability of the decoder. This chip has general application in the implementation of high speed Viterbi decoders.

Miller, Susan P.↗
NASA NTRS2019

NASA's Orbital Debris Optical Program: ES-MCAT Updated and Upgraded

The 1.3m ES-MCAT telescope (or MCAT for short) now has a proven capability for observing objects from Low- Earth Orbit (LEO) out to Geosynchronous (GEO) orbit, and the ability to run all systems autonomously. A GEO survey, the initial focus for MCAT, will commence in late 2019 to map out the current state of the GEO population as input for the ORbital Debris Engineering Model (ORDEM 4.x). This survey will statistically sample the GEO belt (0 to ~15 deg orbital inclinations) to detect both known and unknown targets. If a break-up occurs, additional surveys of the break-up field can be followed for discovery and investigations of daughter debris fragments from the parent satellite. Discovery can be accomplished by tracking orbits near to and including the parent object’s orbit. Targeted observations of debris can be taken with a suite of broadband filters for characterizing individual objects by ratetracking their known or calculated orbital elements (Two-Line Element sets, TLEs). Several modifications and upgrades have been made to the instrumentation and systems originally installed in 2015 and are reported here. In 2018, MCAT’s primary mirror was recoated with a high-end protected, enhanced silver by the ZeCoat Corporation. The CCD chip was replaced in the Spectral Instruments camera with a broad-band antireflective coated chip. The automated weather systems have been modified from the original system, removing some weather sensors and installing replacements that are better suited to Ascension’s weather and environment. A new 2.5-m ObservaDome replaced the Astrohaven dome on the nearby tower platform that will house an auxiliary 0.4-meter telescope. Finally, in 2019, the Observatory Control System was upgraded to 2.0 which includes additional flexibility for automating data collection and reduction. With these updates completed, MCAT is now well on track to reach Full Operational Capability (FOC) in 2019 for its survey, rate-track, and TLE tracking capabilities.

Lederer, S. M.↗
NASA NTRS1981

Image registration system in the Landsat-D production environment

It is the purpose of the considered system to take pieces of imagery, called control point chips (CPC), whose geodetic location has been previously determined and stored, and locate their position in later imagery of the same area. The registration processes are carried out partially on a DEC VAX 780 computer and partially on a Floating Point Systems Array Processor. Typically sets of 20 control points are processed at a time. To process these as sets, and to optimize the use of both machines, operations are grouped into loops instead of a sequential processing for each point. Attention is given to cloud cover assessment, enhancement, correlation techniques, pixel registration, and subpixel registration.

Kiss, P.↗
NASA NTRS1995

Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

Koester, D. A.↗
NASA NTRS1992

Ka-band active MMIC subarray development

A 4 x 8 array consisting of two adjacent 4 x 4 MMIC subarray modules under development as part of a MMIC insertion program for the ACTS communication experiments is presented. The subarray features a high-density 'tile' configuration integrating 16 MMIC power amplifiers and 16 MMIC phase shifters. The radiating elements are cavity-backed, aperture coupled, linearly polarized microstrip patches arranged on a 4 x 4 square grid. Each module also incorporates a MMIC controller to set the phase shifts and to turn individual amplifiers 'on' or 'off'. The novel module construction technique is expected to establish a benchmark in Ka-band and higher-frequency array architectures. The hybrid integration approach used for the module can be replaced by multifunctional chips and multilayer distribution boards. The higher level of integration is to permit the dense grid spacing required for wide-angle scanning and reduced size, weight, and cost for the array.

Lee, Richard↗
NASA NTRS1992

Fuzzy logic control for camera tracking system

A concept utilizing fuzzy theory has been developed for a camera tracking system to provide support for proximity operations and traffic management around the Space Station Freedom. Fuzzy sets and fuzzy logic based reasoning are used in a control system which utilizes images from a camera and generates required pan and tilt commands to track and maintain a moving target in the camera's field of view. This control system can be implemented on a fuzzy chip to provide an intelligent sensor for autonomous operations. Capabilities of the control system can be expanded to include approach, handover to other sensors, caution and warning messages.

Lea, Robert N.↗
NASA NTRS2001

Electronic Nose: Evaluation of Kamina Prototype Unit

The Kamina, Sam and Cyranose electronic nose systems were evaluated and partially trained. Much work was performed on the Kamina as it has the ability to respond to low (less than 10 ppb) concentrations of hydrazine compounds. We were able to tell the difference between Hydrazine (Hz) and Monomethylhydrazine (MMH) in standard clean humid air. We were able to detect MMH in reduced pressure (1/3 atm) at about 250 ppb, however the training set was to far from the real situation to be useful now. Various engineering and usability aspects of both the noses was noted, especially the software. One serious physical engineering flaw was remedied in the Kamina system. A gas flow manifold was created for the Sam system. Different chips were evaluated for the Kamina system. It is still unclear if they can be exchanged without retraining the software.The Sam Detect commercial unit was evaluated for solvent detection and evaluation. It was able to successfully identify some solvents. The Cyranose, was observed and evaluated for two days. It has the ability to detect gasses in the 100 parts per million level but not the 10 parts per billion level. It is very sensitive to humidity changes; there is software to partially handle this.

Schattke, Nathan↗
NASA NTRS2012

Guidelines for Selection, Screening and Qualification of Low-Voltage Commercial Multilayer Ceramic Capacitors for Space Programs

This document has been developed in the course of NASA Electronic Parts and Packaging (NEPP) program and is not an official endorsement of the insertion of commercial capacitors in space programs or an established set of requirements for their testing. The purpose of this document is to suggest possible ways for selection, screening, and qualification of commercial capacitors for NASA projects and open discussions in the parts engineering community related to the use of COTS ceramic capacitors. This guideline is applicable to commercial surface mount chip, simple parallel plate design, multi-layer ceramic capacitors (MLCCs) rated to voltages of 100V and less. Parts with different design, e.g. low inductance ceramic capacitors (LICA), land grid array (LGA) etc., might need additional testing and tailoring of the requirements described in this document. Although the focus of this document is on commercial MLCCs, many procedures discussed below would be beneficial for military-grade capacitors

Teverovsky, Alexander A.↗