Search NASA⌕ Search

SEARCH · Search NASA

Results for “electronics cooling”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

Failure detection of liquid cooled electronics in sealed packages

The theory and experimental verification of a method of detecting fluid-mass loss, expansion-chamber pressure loss, or excessive vapor build-up in NASA's Airborne Information Management System (AIMS) are presented. The primary purpose of this leak-detection method is to detect the fluid-mass loss before the volume of vapor on the liquid side causes a temperature-critical part to be out of the liquid. The method detects the initial leak after the first 2.5 pct of the liquid mass has been lost, and it can be used for detecting subsequent situations including the leaking of air into the liquid chamber and the subsequent vapor build-up.

Hoadley, A. W.↗
DOE OSTI2013

Integrated three-dimensional module heat exchanger for power electronics cooling

Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.

42 ENGINEERING↗