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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

Qualification Testing of Engineering Camera and Platinum Resistance Thermometer (PRT) Sensors for Mars Science Laboratory (MSL) Project under Extreme Temperatures to Assess Reliability and to Enhance Mission Assurance

Package Qualification and Verification (PQV) of advanced electronic packaging and interconnect technologies and various other types of qualification hardware for the Mars Exploration Rover/Mars Science Laboratory flight projects has been performed to enhance the mission assurance. The qualification of hardware (Engineering Camera and Platinum Resistance Thermometer, PRT) under extreme cold temperatures has been performed with reference to various project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times (3x) the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations and mission phases. Qualification has been performed by subjecting above flight-like qual hardware to the environmental temperature extremes and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experiments of flight like hardware qualification test results have been described in this paper.

package reliability↗
NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗
NASA NTRS2000

NASA Electronic Parts and Packaging Program

NEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.

Kayali, Sammy↗
NASA NTRS2004

Stirling Cooler Designed for Venus Exploration

Venus having an average surface temperature of 460 degrees Celsius (about 860 degrees Fahrenheit) and an atmosphere 150 times denser than the Earth's atmosphere, designing a robot to merely survive on the surface to do planetary exploration is an extremely difficult task. This temperature is hundreds of degrees higher than the maximum operating temperature of currently existing microcontrollers, electronic devices, and circuit boards. To meet the challenge of Venus exploration, researchers at the NASA Glenn Research Center studied methods to keep a pressurized electronics package cooled, so that the operating temperature within the electronics enclosure would be cool enough for electronics to run, to allow a mission to operate on the surface of Venus for extended periods.

Landis, Geoffrey A.↗
NASA NTRS1968

Method of disjoining adhesively bonded electronic cordwood modules

Embedment of resistive heating elements in a cordwood module used for packaging electronic components, facilitates separation of the adhesive bond between the module, and metal heat sink and the potting material without damaging the components. Electrical power applied to the elements causes breakdown of bonding material.

Sacramone, P. J.↗
NASA NTRS2010

Reliability and Qualification of Hardware to Enhance the Mission Assurance of JPL/NASA Projects

Packaging Qualification and Verification (PQV) and life testing of advanced electronic packaging, mechanical assemblies (motors/actuators), and interconnect technologies (flip-chip), platinum temperature thermometer attachment processes, and various other types of hardware for Mars Exploration Rover (MER)/Mars Science Laboratory (MSL), and JUNO flight projects was performed to enhance the mission assurance. The qualification of hardware under extreme cold to hot temperatures was performed with reference to various project requirements. The flight like packages, assemblies, test coupons, and subassemblies were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases. Qualification/life testing was performed by subjecting flight-like qualification hardware to the environmental temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.

PRTs↗
NASA NTRS2007

The NASA Electronic Parts and Packaging (NEPP) Program: Results and Direction

The NASA Electronic Parts and Packaging (NEPP) Program's mission is to provide guidance to NASA for the selection and application of microelectronic technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. This viewgraph presentation reviews the NEPP program's goals and objectives, and reviews many of the missions that the NEPP program has impacted, both in and out of NASA. Also included are examples of the evaluation that the program performed.

LaBel, Kenneth A.↗
NASA NTRS2008

NASA Electronic Parts and Packaging (NEPP) Program

This viewgraph presentation reviews NASA's Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission needs. The NEPP Program focuses on the reliability aspects of electronic devices. Three principal aspects to this reliability: (1) lifetime, (2) effects of space radiation and the space environment, and (3) creation and maintenance of the assurance support infrastructure required for success.

LaBel, Kenneth A.↗
NASA NTRS1995

Neural Networks Analyze Data In Particle-Impact-Noise Tests

Electronic neural networks and computers put to use in analyzing data acquired in particle-impact-noise-detection (PIND) tests of packaged electronic components. PIND tests detect loose particles in packages that cause failures during subsequent operation of packages in presence of accelerations or other effects - for example, loose electrically conductive particles that bounce into positions in which they cause short circuits. Interpretation of test data more objective and accurate. Preliminary results suggest use of neural networks result in significant improvement in quality and reliability and decrease in cost of PIND testing.

Scaglione, Lois J.↗
NASA NTRS1978

A rotor-mounted digital instrumentation system for helicopter blade flight research measurements

A rotor mounted flight instrumentation system developed for helicopter rotor blade research is described. The system utilizes high speed digital techniques to acquire research data from miniature pressure transducers on advanced rotor airfoils which are flight tested on an AH-1G helicopter. The system employs microelectronic pulse code modulation (PCM) multiplexer digitizer stations located remotely on the blade and in a hub mounted metal canister. As many as 25 sensors can be remotely digitized by a 2.5 mm thick electronics package mounted on the blade near the tip to reduce blade wiring. The electronics contained in the canister digitizes up to 16 sensors, formats these data with serial PCM data from the remote stations, and transmits the data from the canister which is above the plane of the rotor. Data are transmitted over an RF link to the ground for real time monitoring and to the helicopter fuselage for tape recording. The complete system is powered by batteries located in the canister and requires no slip rings on the rotor shaft.

Knight, V. H., Jr.↗
NASA NTRS2019

Thermally-resilient image sensor packaging approach for Mars2020 enhanced engineering cameras

We will present the steps taken to derive the thermally-resilient electronics packaging design of the Mars2020 EECAM detector. We will highlight analyses and empirical test results that lead to a wide-temperature-survivable COTS component packaging design. Details of thermal cycle testing, in-process inspections, and final packaging design will be presented.

Howard, Sean↗
NASA NTRS1984

Electronic scanning pressure measuring system and transducer package

An electronic scanning pressure system that includes a plurality of pressure transducers is examined. A means obtains an electrical signal indicative of a pressure measurement from each of the plurality of pressure transducers. A multiplexing means is connected for selectivity supplying inputs from the plurality of pressure transducers to the signal obtaining means. A data bus connects the plurality of pressure transducers to the multiplexing means. A latch circuit is connected to supply control inputs to the multiplexing means. An address bus is connected to supply an address signal of a selected one of the plurality of pressure transducers to the latch circuit. In operation, each of the pressure transducers is successively scanned by the multiplexing means in response to address signals supplied on the address bus to the latch circuit.

Coe, C. F.↗
NASA NTRS2011

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Ramesham, Rajeshuni↗
NASA NTRS1995

A new RF package suitable for aeronautical commercial and DSCS satellite applications

Higher levels of integration through the use of GaAs and silicon MMIC devices, a die-cast housing, and the reduction of the number of subassemblies has enabled a large reduction of the size and weight of the electronics package for commercial and military satellite communications. This paper presents an electronics architecture and hardware that utilizes many new integrated circuits and design techniques, and allows flexibility for future satellite frequency changes and expansion. Key features of the radio are extended C-band, InSat, Defense Satellite Communications System (DSCS), and Ku-band coverage options; 70 (or 140) MHz transponder bandwidth or L-band block bandwidth IFs; integrated RS-232 control through local handheld terminal or remote computer; remote control of crystal reference oscillator for aging and temperature compensation; integrated 2 or 5 watt solid-state power amplifiers (SSPA); optional integrated solid-state booster amplifiers to 40 watts; optional external amplifiers to 100 watts; integral beacon tracking with second integrated downcoverter for antenna positioning; radio, including low-noise block converter (LNB) and SSPA, weighs 8.5 kg and measures 32 x 23 x 16.5 cm; environmentally ruggedized for -40 to +60 C; O-ring sealed for waterproofing; passive (convection) cooling; and simple cabling and installation, with a single cable between radio and LNB, and two cables between radio and IF interface. The small size and light weight of the radio make it ideal for mounting on stabilized antenna platforms (gyroscopic or servo). Several input power options (110 or 220 VAC; +48, +12, or -24 VDC) facilitate operation on multiple platforms.

Hamilton, Robert J., Jr.↗
NASA NTRS2019

NASA Electronic Parts and Packaging (NEPP) Program Focus, Strategic Collaborations, and Our Path to the Future

NASA Electronic Parts and Packaging (NEPP) Program Overview Mission Statement: Provide NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of EEE parts by NASA, in collaboration with other government agencies and industry. The NASA Electronic Parts Assurance Group (NEPAG) is a core portion of NEPP.

NASA Electronic Parts and Packaging (NEPP) Program↗