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At least 145 records · Page 8

Optical interconnections and networks; Proceedings of the Meeting, The Hague, Netherlands, Mar. 14, 15, 1990

The conference presents papers on interconnections, clock distribution, neural networks, and components and materials. Particular attention is given to a comparison of optical and electrical data interconnections at the board and backplane levels, a wafer-level optical interconnection network layout, an analysis and simulation of photonic switch networks, and the integration of picosecond GaAs photoconductive devices with silicon circuits for optical clocking and interconnects. Consideration is also given to the optical implementation of neural networks, invariance in an optoelectronic implementation of neural networks, and the recording of reversible patterns in polymer lightguides.

Bartelt, Hartmut↗

Process Developed for Generating Ceramic Interconnects With Low Sintering Temperatures for Solid Oxide Fuel Cells

Solid oxide fuel cells (SOFCs) have been considered as premium future power generation devices because they have demonstrated high energy-conversion efficiency, high power density, and extremely low pollution, and have the flexibility of using hydrocarbon fuel. The Solid-State Energy Conversion Alliance (SECA) initiative, supported by the U.S. Department of Energy and private industries, is leading the development and commercialization of SOFCs for low-cost stationary and automotive markets. The targeted power density for the initiative is rather low, so that the SECA SOFC can be operated at a relatively low temperature (approx. 700 C) and inexpensive metallic interconnects can be utilized in the SOFC stack. As only NASA can, the agency is investigating SOFCs for aerospace applications. Considerable high power density is required for the applications. As a result, the NASA SOFC will be operated at a high temperature (approx. 900 C) and ceramic interconnects will be employed. Lanthanum chromite-based materials have emerged as a leading candidate for the ceramic interconnects. The interconnects are expected to co-sinter with zirconia electrolyte to mitigate the interface electric resistance and to simplify the processing procedure. Lanthanum chromites made by the traditional method are sintered at 1500 C or above. They react with zirconia electrolytes (which typically sinter between 1300 and 1400 C) at the sintering temperature of lanthanum chromites. It has been envisioned that lanthanum chromites with lower sintering temperatures can be co-fired with zirconia electrolyte. Nonstoichiometric lanthanum chromites can be sintered at lower temperatures, but they are unstable and react with zirconia electrolyte during co-sintering. NASA Glenn Research Center s Ceramics Branch investigated a glycine nitrate process to generate fine powder of the lanthanum-chromite-based materials. By simultaneously doping calcium on the lanthanum site, and cobalt and aluminum on the chromium site, we could sinter the materials below 1400 C. The doping concentrations were adjusted so that the thermal expansion coefficient matched that of the zirconia electrolyte. Also, the investigation was focused on stoichiometric compositions so that the materials would have better stability. Co-sintering and chemical compatibility with zirconia electrolyte were examined by X-ray diffraction, scanning electron microscopy, and energy dispersive spectroscopy (line scanning and dot map). The results showed that the materials bond well, but do not react, with zirconia electrolyte. The electric conductivity of the materials measured at 900 C in air was about 20 S/cm.

Zhong, Zhi-Min↗

Electrode and interconnect for miniature fuel cells using direct methanol feed

An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

Narayanan, Sekharipuram R.↗

Free-Space Optical Interconnect Employing VCSEL Diodes

Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

Simons, Rainee N.↗

Electronic interconnects and devices with topological surface states and methods for fabricating same

An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

36 MATERIALS SCIENCE↗

Toward Interpreting Failure in Sintered-Silver Interconnection Systems

The mechanical strength and subsequent reliability of a sintered-silver interconnection system is a function of numerous independent parameters. That system is still undergoing process development. Most of those parameters (e.g., choice of plating) are arguably and unfortunately taken for granted and are independent of the silver s cohesive strength. To explore such effects, shear strength testing and failure analyses were completed on a simple, mock sintered-silver interconnection system consisting of bonding two DBC ceramic substrates. Silver and gold platings were part of the test matrix, as was pre-drying strategies, and the consideration of stencil-printing vs. screen-printing. Shear strength of sintered-silver interconnect systems was found to be was insensitive to the choice of plating, drying practice, and printing method provided careful and consistent processing of the sintered-silver are practiced. But if the service stress in sintered silver interconnect systems is anticipated to exceed ~ 60 MPa, then the system will likely fail.

Wereszczak, Andrew A↗

Electronic interconnects and devices with topological surface states and methods for fabricating same

An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

36 MATERIALS SCIENCE↗

Photovoltaic sub-cell interconnects

Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

14 SOLAR ENERGY↗

IC layout adjustment method and tool for improving dielectric reliability at interconnects

Method for adjusting a layout used in making an integrated circuit includes one or more interconnects in the layout that are susceptible to dielectric breakdown are selected. One or more selected interconnects are adjusted to increase via to wire spacing with respect to at least one via and one wire of the one or more selected interconnects. Preferably, the selecting analyzes signal patterns of interconnects, and estimates the stress ratio based on state probability of routed signal nets in the layout. An annotated layout is provided that describes distances by which one or more via or wire segment edges are to be shifted. Adjustments can include thinning and shifting of wire segments, and rotation of vias.

42 ENGINEERING↗

Encoding of symbols for a computer interconnect based on frequency of symbol values

Data are serially communicated over an interconnect between an encoder and a decoder. The encoder includes a first training unit to count a frequency of symbol values in symbol blocks of a set of N number of symbol blocks in an epoch. A circular shift unit of the encoder stores a set of most-recently-used (MRU) amplitude values. An XOR unit is coupled to the first training unit and the first circular shift unit as inputs and to the interconnect as output. A transmitter is coupled to the encoder XOR unit and the interconnect and thereby contemporaneously sends symbols and trains on the symbols. In a system, a device includes a receiver and decoder that receive, from the encoder, symbols over the interconnect. The decoder includes its own training unit for decoding the transmitted symbols.

SeyedzadehDelcheh, SeyedMohammad↗

Interconnection-wide hour-ahead scheduling in the presence of intermittent renewables and demand response: A surplus maximizing approach

This study describes a new approach for solving the multi-area electricity resource allocation problem when considering both intermittent renewables and demand response. The method determines the hourly inter-area export/import set that maximizes the interconnection (global) surplus satisfying transmission, generation and load constraints. The optimal inter-area transfer set effectively makes the electricity price uniform over the interconnection apart from constrained areas, which overall increases the consumer surplus more than it decreases the producer surplus. The method is computationally efficient and suitable for use in simulations that depend on optimal scheduling models. The method is demonstrated on a system that represents North America Western Interconnection for the planning year of 2024. Simulation results indicate that effective use of interties reduces the system operation cost substantially. Excluding demand response, both the unconstrained and the constrained scheduling solutions decrease the global production cost (and equivalently increase the global economic surplus) by 12.30B and 10.67B per year, respectively, when compared to the standalone case in which each control area relies only on its local supply resources. This cost saving is equal to 25% and 22% of the annual production cost. Including 5% demand response, the constrained solution decreases the annual production cost by 10.70B, while increases the annual surplus by 9.32B in comparison to the standalone case.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗

Reflow-oven-processing of pressureless sintered-silver interconnects

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significant because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.

36 MATERIALS SCIENCE↗

Foundations for the Future Power System: Inverter-Based Resource Interconnection Standards

As power systems evolve to become reliant on solar, wind, batteries, and other inverter-based resources (IBRs), it is essential that those resources meet certain minimum performance and capability criteria designed to ensure the power system operates stably and reliably. Because those criteria, as enshrined in interconnection standards, take years to develop and are very long lived, they need to account for not only the present state of the power system but also its expected future state over the lifetime of the power plants to which they will apply. In addition, they need to be specific enough to ensure reliability without over specifying and, thereby, impeding innovation. Because power systems are shifting rapidly from a state where IBRs make up a small to medium portion of generation to one where the generation will, at times, come predominantly from IBRs, interconnection standards are especially challenging to develop today. Good interconnection standards can make the power system more reliable and less costly to operate, whereas poorly designed standards can lead to major problems, like the famous German 50.2-Hz problem, which introduced a risk of losing many gigawatts of solar on a frequency excursion and resulted in many IBRs being retrofitted at great cost to mitigate a major system reliability risk. Readying the power system by specifying forward-looking technical minimum functional capabilities for IBRs can be an effective approach to avoid future retrofits.

data models↗

Interconnection of Distributed Energy Resources

This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

14 SOLAR ENERGY↗

Grid Ready: Strategies for Interconnecting Large-Scale PV in New York City

This Grid Ready Solar project is intended to help create transparency for building owners and developers, so they can better understand and more quickly navigate the interconnection process for large-scale photovoltaic (PV) projects on Con Edison's electrical grid in New York City. Phase 1 of the project provided high-level technical screens of grid interconnection requirements in an attempt to streamline the interconnection of large-scale solar PV systems to the New York City grid. In Phase 2 of the Grid Ready project, the focus of this report, Sustainable CUNY worked with NREL to evaluate a range of solutions for improving the economics of large-scale (over 200 kW) PV within the five boroughs of New York City that are in Con Edison's service territory, as identified on the NY Solar Map.

14 SOLAR ENERGY↗

An Overview of Distributed Energy Resource (DER) Interconnection: Current Practices and Emerging Solutions

This guidebook provides an overview of key issues for utilities and utility regulators to consider as deployments of distributed energy resources (DER) increase, including what has been tried in the field and emerging good practices. Topics covered include: Interconnection Applications and Application Processing; Interconnection Standards; Advanced Inverters; Impact Screening and Evaluation; Estimating Future DER deployments; Distribution System Upgrades and Planning in a DER context; Cybersecurity; Storage and Solar plus Storage Interconnection; and Cost Allocation.

24 POWER TRANSMISSION AND DISTRIBUTION↗

The Value of Increased HVDC Capacity Between Eastern and Western U.S. Grids: The Interconnections Seam Study

The Interconnections Seam Study examines the potential economic value of increasing electricity transfer between the Eastern and Western Interconnections using high-voltage direct-current (HVDC) transmission and cost-optimizing both generation and transmission resources across the United States. The study conducted a multi-model analysis that used co-optimized generation and transmission expansion planning and production cost modeling. Four transmission designs under eight scenarios were developed and studied to estimate costs and potential benefits. The results show benefit-to-cost ratios that reach as high as 2.9, indicating significant value to increasing the transmission capacity between the interconnections under the cases considered, realized through sharing generation resources and flexibility across regions.

13 HYDRO ENERGY↗

Interconnection of Distributed Energy Resources in the Indian Context: IEEE 1547-2018 Adaptation for Locally-Appropriate Grid Code Development

The rapid growth of distributed energy resources (DERs) in India and ambitious renewable energy goals set forth by the Indian government have created the need for appropriate distribution interconnection standards to ensure continued system stability, reliability, and resilience. Existing DER interconnection codes in India, at the time of publishing this report, lack many of the critical grid support functionalities for DERs which may protect bulk system stability, such as event ride-through provisions, frequency droop control, or appropriate trip thresholds given the increasing importance of distributed generation. The formal adoption of IEEE 1547-2018 by the Bureau of Indian Standards (BIS) marks a significant step towards achieving appropriate interconnection of DERs, though the implementation of such a standard must be accompanied with careful consideration of the current codes, regulations, and operation of the Indian power system. Studies on the performance of the functionalities within 1547-2018, which properly incorporate local operating conditions, can inform decisions related to the adoption and adaptation of the clauses present in the standard. This report outlines several of these key considerations for stakeholders and provides analyses illustrating the performance of grid support functionalities on typical Indian distribution feeders.

1547↗