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At least 145 records · Page 8

Processing and Prolonged 500 C Testing of 4H-SiC JFET Integrated Circuits with Two Levels of Metal Interconnect

Complex integrated circuit (IC) chips rely on more than one level of interconnect metallization for routing of electrical power and signals. This work reports the processing and testing of 4H-SiC junction field effect transistor (JFET) prototype IC's with two levels of metal interconnect capable of prolonged operation at 500 C. Packaged functional circuits including 3- and 11-stage ring oscillators, a 4-bit digital to analog converter, and a 4-bit address decoder and random access memory cell have been demonstrated at 500 C. A 3-stage oscillator functioned for over 3000 hours at 500 C in air ambient. Improved reproducibility remains to be accomplished.

JFET

Interconnection of Semiconductor Devices in Extreme Environment Microelectronic Integrated Circuit Chips

A process of fabrication and the resulting integrated circuit device is made of patterned metal electrical interconnections between semiconductor devices residing on and forming extremely harsh environment integrated circuit chips. The process enables more complicated wide band gap semiconductor integrated circuits with more than one level of interconnect to function for prolonged time periods (over 1000 hours) at much higher temperatures (500 C).

Spry, David J.

Pt: Ti Diffusion Barrier, Interconnect, and Simultaneous Ohmic Contacts to n- and p-type 4H-SiC

We report the initial results of using co-sputtered Pt:Ti 80:20 at. % composition ratio metallization as a diffusion barrier against gold (Au) and oxygen (O), as an interconnect layer, as well as forming simultaneous ohmic contacts to n-and p-type 4H-SiC. Having a single conductor with such combined multi-functional attributes would appreciably reduce the fabrication costs, processing time and complexity that are inherent in the production of SiC based devices. Auger Electron Spectroscopy, Focused Ion Beam-assisted Field Emission Scanning Electron Microscopy and Energy Dispersive Spectroscopy analyses revealed no Au and O migration to the SiC contact surface and minimal diffusion through the Pt:Ti barrier layer after 15 minutes of exposure at 800 °C in atmosphere, thus offering potential long term stability of the ohmic contacts. Specific contact resistance values of 7 x 10(exp -5) and 7.4 x 10(exp -4) Ω-sq.cm were obtained on the n (N(sub d)=7 x 10(exp 18) per cu.cm and p (N(sub a)=2 x 10(exp 20) per cu. cm) -type 4H-SiC, respectively. The resistivity of 75 μΩ-cm was obtained for the Pt:Ti layer that was sandwiched between two SiO2 layers and annealed in pure O ambient up to 900 °C, which offers promise as a high temperature interconnect metallization.

Simultaneous Ohmic Contact

Synchronized Eruptions on Io: Possible Evidence of Interconnected Subsurface Magma Reservoirs

On 27 December 2024, Juno's JIRAM (Jovian InfraRed Auroral Mapper) instrument observed an unprecedented volcanic event in Io's southern hemisphere, covering a vast region of ∼65,000 km2, near 73°S, 140°E. Within the imaged region, only one hot spot was previously known (Pfd454). This feature was earlier estimated to cover an area of 300 km2 with a total power output of 34 GW. JIRAM results show that the region produces a power output of 140–260 TW, over 1,000 times higher than earlier estimates and likely exceeding the brightest eruption ever recorded on Io, that of Surt in 2001 (∼80 TW). Three adjacent hot spots also exhibited dramatic power increases: P139, PV18, and an unnamed feature south of the main one that surged to ∼1 TW, placing all of them among the top 10 most powerful hot spots observed on Io. A temperature analysis of the features supports the simultaneous onset of these brightenings and suggests a single eruptive event propagating beneath the surface across hundreds of kilometers; this is the first time this has been observed on Io. This in turn would imply a connection among the hotspots' magma reservoirs, while other nearby hotspots that have been known to be active in the recent past, such as Kurdalagon Patera, appear unaffected. The simultaneity supports models of massive, interconnected magma reservoirs. The topology of these regional magma systems may resemble that of a large-scale sponge, in which the massive reservoirs are the pores, interconnected through a largely solid outer shell.

A Mura

Method of additively manufacturing an integrated circuit of an interconnect packaging structure

A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.

Papapolymerou, Ioannis

Statistical Analysis of Inter-Area Oscillations in the U.S. Eastern Interconnection: A 2017-2023 Perspective

Recent advancements and the accumulation of high-resolution, long-term phasor measurement unit (PMU) data have provided detailed insights into inter-area oscillations in power grids. This study conducts a comprehensive statistical analysis of inter-area oscillations within the United States Eastern Interconnection from 2017 to 2023. Utilizing data captured by the advanced wide-area Frequency Monitoring Network (FNET/GridEye), this investigation examines the occurrence patterns, dominant frequencies, damping ratios, and excitation mechanisms of these oscillations. Our analysis sheds light on the evolving statistical behaviors of inter-area oscillations, offering updated and critical information for grid operators and planners. The insights gained from this study can be instrumental in enhancing the operational resilience of the power network and guiding strategic developments in grid infrastructure to accommodate future challenges. Additionally, the study discusses emerging challenges associated with the modernization of the power grid, including increased renewable penetration, dynamic load variability, and cyber-physical vulnerabilities that complicate oscillation monitoring and control.

Inter-area oscillations

Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

Full-tape-thickness feature; LTCC 9K7 interconnect

Interconnect and Packaging Technologies for Terahertz Communication Systems

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.

Micromachining

Key Insights: Interconnecting Behind-the-Meter Microgrids

This technical brief explores the interconnection challenges and evolving standards associated with behind-the-meter (BTM), facility-scale microgrids. It clarifies key functions related to customer microgrids and backup systems while addressing critical questions regarding certification coverage, operational impacts, customer relationships, and testing requirements for BTM microgrid systems. The document emphasizes the need for updated standards and additional witness testing to ensure safe and effective microgrid operation as well as improved grid integration and compliance with power quality standards.

24 POWER TRANSMISSION AND DISTRIBUTION

Magnetic Solitons and Thickness‐Dependent Magnetization Reversal in Interconnected Helical Nanowire Arrays

By expanding magnetic nanostructures into the third dimension, it is possible to introduce new interactions and realize new forms of magnetic textures and emergent phenomena. Consequently, this unlocks new opportunities for applications in data storage, unconventional computing and sensing by utilizing 3D devices with enhanced functionalities. Connected magnetic nanowires offer a unique platform for applications such as neuromorphic computing due to their tunability and the presence of multiple transport pathways. However to realize this promise, it is necessary to further our understanding of how to locally control the magnetization in 3D, nanowire-based geometries. In this work we show the formation of magnetic domain walls, vortices, anti-vortices, and linked vortex-anti-vortex pairs in interconnected helical nanowire arrays. We show how wire diameter and 3D geometric design can control the states that form and reveal the magnetization reversal mechanism. Hence, we demonstrate this to be a highly tunable system, where the magnetization can be readily reconfigured by an external magnetic field.

3D Nanomagnetism

Pathway to High Rate Capability in Interconnected Composite Electrolytes: A Case Study with a Single-Ion-Conducting Polymer

In a three-dimensional interconnected polymer/ceramic composite electrolyte (3D composite), both the polymer and ceramic electrolyte phases are individually connected with a polymer-rich surface layer to provide conformal contact with the electrodes. This work investigates how the transference number of the polymer phase affects the electrochemical properties of the 3D composite. Here, we fabricate a 3D composite using a “single-ion” conducting polymer electrolyte (PE), Li 1+x+y Al x Ti 2–x Si y P 3–y O 12 (LICGC) ceramic, and compare its electrochemical properties with the neat polymer, and with a 3D composite made with a dual-ion-conducting PE (we reported previously). Our results reveal that changing the polymer phase from a dual-ion-conducting PE to a single-ion-conducting PE results in a 9-fold increase in the limiting current density, although the interfacial impedance between the polymer and LICGC ceramic remains high (and contributes significantly to the total impedance of the 3D composite). Further, the limiting current density of the 3D composite is dictated by the PE and minimally affected by the ceramic scaffold. The ceramic scaffold, however, helps to ease the concentration gradient buildup within the PE and moderately improves the overall transference number. The LICGC scaffold does not provide any additional Li dendrite resistance due to its high reactivity with Li.

25 ENERGY STORAGE

Evaluating How Climate Adaptation Measures Affect the Interconnected Water‐Energy Resource Systems of the Western United States

Abstract The Western US faces increasing water stress from the impacts of climate change, making it difficult to meet water demands for the region's cities, agriculture, and hydropower generators. Existing literature suggests that climate adaptation measures such as water conservation, cropland retirement, wastewater recycling, and managed aquifer recharge can alleviate some of these challenges. Few analyses, however, compare the relative efficacy and system‐wide effects of these adaptations under different climate projections across the entire Western United States. Here we use a Western US‐wide water systems model to evaluate, by sector and sub‐region, how the widespread implementation of these adaptive measures impacts water demands, water deliveries, and electricity use related to the water system for three different climate projections. We find that wastewater recycling has greater potential to lower unmet indoor water demands than urban indoor water conservation measures. However, when implemented at scale, indoor water conservation reduces electricity use by an average of 683 Terawatt hours while wastewater recycling increases energy use by an average of 721 Terawatt hours, cumulatively from 2020 to 2070. Cropland retirement and aquifer recharge adaptations increase the ability to meet agricultural water demand, increase groundwater storage, and reduce summertime electricity use. While most of these findings are consistent across different climate projections, the benefits of aquifer recharge are sensitive to spatial variation of precipitation. Given the limitations and tradeoffs of each individually, the results suggest that a portfolio of adaptation measures will be needed for a climate‐resilient water and energy future in the Western US. Plain Language Summary The Western US faces increased water stress from the impacts of climate change, making it difficult to meet demands for cities, agriculture, and hydropower facilities. Adaptation measures like water conservation, retiring agricultural lands, recycling wastewater, and storing water underground can address these challenges. However, there is little modeling to understand the impact of these adaptations if they were implemented across the entire Western US while also considering climate change. We use a Western US‐wide water systems model to evaluate how implementing adaptation measures impacts groundwater levels, the ability to meet water demands, and electricity use related to water in three different possible climate futures. We find that recycling wastewater to drinking water standards does a better job of meeting urban water demands than water conservation measures. However, indoor water conservation reduces energy use for water while recycling wastewater increases energy use for water. Retiring agricultural lands and storing water underground both increase the ability to meet agricultural water demands, increase underground water storage, and reduce summertime energy use. No adaptation measures provides benefits across every metric we track. Therefore, multiple adaptation measures will likely be needed to achieve a climate‐resilient future for energy and water in the Western US. Key Points Water‐related climate change adaptations have different benefits and tradeoffs for interconnected water‐energy systems in the Western U.S. Wastewater recycling most increases urban water coverage, but has a significant tradeoff in the form of greater electricity use Cropland retirement and aquifer recharge benefit water and electricity systems most in the summer when those systems are most stressed

Singhal, A

Developmental assembly of multi-component polymer systems through interconnected synthetic gene networks in vitro

Abstract Living cells regulate the dynamics of developmental events through interconnected signaling systems that activate and deactivate inert precursors. This suggests that similarly, synthetic biomaterials could be designed to develop over time by using chemical reaction networks to regulate the availability of assembling components. Here we demonstrate how the sequential activation or deactivation of distinct DNA building blocks can be modularly coordinated to form distinct populations of self-assembling polymers using a transcriptional signaling cascade of synthetic genes. Our building blocks are DNA tiles that polymerize into nanotubes, and whose assembly can be controlled by RNA molecules produced by synthetic genes that target the tile interaction domains. To achieve different RNA production rates, we use a strategy based on promoter “nicking” and strand displacement. By changing the way the genes are cascaded and the RNA levels, we demonstrate that we can obtain spatially and temporally different outcomes in nanotube assembly, including random DNA polymers, block polymers, and as well as distinct autonomous formation and dissolution of distinct polymer populations. Our work demonstrates a way to construct autonomous supramolecular materials whose properties depend on the timing of molecular instructions for self-assembly, and can be immediately extended to a variety of other nucleic acid circuits and assemblies.

Science & Technology - Other Topics

Fault-tolerant optical interconnects for neutral-atom arrays

We analyze the use of photonic links to enable large-scale fault-tolerant connectivity of locally error-corrected modules based on neutral atom arrays. Our approach makes use of recent theoretical results showing the robustness of surface codes to boundary noise and combines recent experimental advances in atom-array quantum computing with logical qubits with optical quantum networking techniques. We find the conditions for fault tolerance can be achieved with local two-qubit Rydberg gate and nonlocal Bell-pair errors below 1% and 10%, respectively, without requiring distillation or space-time overheads. Realizing the interconnects with a lens, a single optical cavity, or an array of cavities enables—with sufficient multiplexing—a Bell-pair generation rate in the 1–50 MHz range. When directly interfacing logical qubits, this rate translates to error-correction cycles in the 25–2000 kHz range, satisfying all requirements for fault tolerance and in the upper range fast enough for 100 kHz logical clock cycles. Published by the American Physical Society 2025

Sinclair, Josiah (ORCID:0000000215238295)