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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Second work station along solar-array assembly line automatically attaches two interconnect tabs to each silicon solar cell. Machine feeds, forms, and cuts tabs from reel of pretinned metal ribbon, transfers tabs into position, and solders them to cell.
An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.
A flight test was conducted for preliminary evaluation of an aileron-rudder interconnect (ARI) control system for the F-14A airplane in the landing configuration. Two ARI configurations were tested in addition to the standard F-14 flight control system. Results of the flight test showed marked improvement in handling qualities when the ARI systems were used. Sideslip due to adverse yaw was considerably reduced, and airplane turn rate was more responsive to pilot lateral control inputs. Pilot comments substantiated the flight data and indicated that the ARI systems were superior to the standard control system in terms of pilot capability to make lateral offset corrections and heading changes on final approach.
User requirements, guidelines, and standards for interconnecting an Applications Data Service (ADS) program for data sharing are discussed. Methods for effective sharing of information (catalogues, directories, and dictionaries) among member installations are addressed. An ADS Directory/Catalog architectural model is also given.
Requirements for standards and guidelines related to user interfaces for interconnecting an Applications Data Service pilot program are discussed. Key elements considered were: (1) dial up procedures, (2) terminals (minimum, desirable, extended capability), (3) common capabilities, (4) language interfaces (query, command, menu), and (5) display capabilities.
A process sequence is described which utilizes a preformed metal mesh electrostatically bonded to each cell to provide the front contact. Cells of 12 percent AM1 efficiency have been produced using this scheme. This method also permits access to both contacts on the cell from the back side. In addition, low cost cell interconnection is accomplished using a flexible 'printed circuit' sheet which is ultrasonically bonded to the cell contacts. The complete process sequence as well as automated equipment which also uses ion implantation and pulse annealing is described. The total cost for module fabrication is estimated at $0.64 per peak watt for a 30 MW/year plant.
Resistance welds of solar cell interconnect tabs were evaluated. Both copper-silver and silver-silver welds were made with various heat inputs and weld durations. Parallel gap and annular gap weld electrode designs were used. The welds were analyzed by light microscope, electron microprobe and scanning laser acoustic microscope. These analyses showed the size and shape of the weld, the relationship between the acoustic micrographs, the visible electrode footprint, and the effect of electrode misalignment. The effect of weld heat input on weld microstructure was also shown.
A program was conducted to develop technologies for welding interconnects to 50 microns thick, 2 by 2 cm solar cells. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 C to -180 C) were performed on 16 cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48 cell modules (one for each cell type) were assembled with 50 microns thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.
This paper describes the development of an analysis tool for the interactive design of control systems for manipulators and similar electro-mechanical systems amenable to representation as structures in a topological chain. The chain consists of a series of elastic bodies subject to small deformations and arbitrary displacements. The bodies are connected by hinges which permit kinematic constraints, control, or relative motion with six degrees of freedom. The equations of motion for the chain configuration are derived via Kane's method, extended for application to interconnected flexible bodies with time-varying boundary conditions. A corresponding set of modal coordinates has been selected. The motion equations are imbedded within a simulation that transforms the vector-dyadic equations into scalar form for numerical integration. The simulation also includes a linear, time-invariant controler specified in transfer function format and a set of sensors and actuators that interface between the structure and controller. The simulation is driven by an interactive set-up program resulting in an easy-to-use analysis tool.
A program was conducted to develop technologies for welding interconnects to 50-micron thick, 2 by 2 cm solar cells obtained from three suppliers. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 deg to -180 deg C) were performed on 16-cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48-cell modules (one for each cell type) were assembled with 50-micron thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.
Theoretical paper presents set of sufficient conditions for asymptotic and exponential stability with probability 1 for class of stochastic interconnected systems. Theory applicable to complicated, large-scale mechanical or electrical systems, and, for several design problems, it reduces computational difficulty by relating stability criteria to fundamental structural features of system.
The PIX follow-up project NICS is described. The purpose of PIX was access to X.25, the DATEX-P network of the Federal German Post Office. The development and implementation of higher protocols for levels 4-7 in the ISOSINN was the actual problem here. Results of the PIX project are given. NICS (Stuttgart Interconnection Network Project) is presented. International Protocols are reviewed. PAD service is described, which allows terminal access to DATEX-P network of the Federal German Post Office.
Incompatible meshes, i.e., meshes that physically must have a common boundary, but do not necessarily have coincident grid points, can arise in the course of a finite element analysis. For example, two substructures may have been developed at different times for different purposes and it becomes necessary to interconnect the two models. A technique that uses only multipoint constraints, i.e., MPC cards (or MPCS cards in substructuring), is presented. Since the method uses only MPC's, the procedure may apply at any stage in an analysis; no prior planning or special data is necessary.
Solar cell modules with welded and soldered interconnections were constructed using a flexible substrate material. These modules were thermally cycled between approx. 80 deg C at rates 100 cycles/day to demonstrate survivability under simulated low Earth orbit (LEO) temperature conditions. The modules, cycled in an inert atmosphere, show durability for 36,000 cycles.
A passive, unswitched scheme is introduced for directly interconnecting N stations, each of which has C transmitters and receivers. Implementations using fiber optics with spatial multiplexing and optionally wavelength multiplexing are discussed. This scheme utilizes the same resources as standard topologies with C parallel buses but outperforms them in two respects: (1) the aggregate throughput is proportional to C squared rather than to C; and (2) the power of each transmitter need reach only N/C, instead of N, receivers.
The present paper provides a description of a part of NASA's current long range plans, taking into account the development of hierarchal space switching centers and laser intersatellite links which can interconnect the globe. It is pointed out that a special objective involves the development of technology and satellite architecture for reducing the cost of an end-to-end voice message per minute from the present average value of around $.40 now realized by terrestrial telephone systems to less than $.10. The next decade of NASA communications activity (1985-1995) is discussed, giving attention to the Advanced Communications Technology Satellite ACTS (July 1984) which will test the technology of space switchboard and signal processing in space. The environment of the decade 1985-1995 is considered along with the roles of communications satellites, the hierarchies of terrestrial public switched networks, cost comparisons of terrestrial and space point-to-point links, and concomitant technology developments related to supercomputers.
The U.S. 'bent pipe' satellites will be joined in 1989 by the NASA ACTS satellite. The present paper provides a status report on the ACTS satellite program. The ACTS satellite and the mobile satellite systems will conduct flight tests with respect to onboard switching for both wide band and narrow band communications. The ACTS program, with the laser link, and the mobile satellite programs with the large antennas will contribute to the test of four new technologies. Attention is given to the ACTS communication systems, the ACTS spacecraft characteristics, the ACTS modes of operation, RF technologies, interconnectivity technologies, and large antenna technologies.
This paper introduces new applications and design trade-offs anticipated for free-space optical interconnections of VLSI chips. New implementation s of VLSI functions are described that use the capability of making optical inputs at any point on a chip and take advantage of greater flexibility in on-chip signal routing. These include n-port addressable memories, CPU clock phase distribution, hardware multipliers, and dynamic memory refresh, as well as enhanced testability. Fault tolerance and production yields may be improved by reprogramming the optical imaging system to circumvent defective elements. These attributes, as well as those related to performance alone, will affect the design methodology of future VLSI ICs. This paper focuses on identifying the design issues, their possible solutions, and their impact on VLSI design techniques and, finally, presents some preliminary measurements on various system components.