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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Accelerated Aging of Lead-Free Propellant

Following higher than expected 2-NDPA depletion rates in a lead-free doublebase formulation (RPD-422), an accelerated aging study was conducted to verify the depletion rates. A test plan was prepared to compare the aging characteristics of lead-free propellant and NOSIH-AA2. The study was also designed to determine which lead-free ballistic modifiers accelerated 2-NDPA depletion. The increased depletion rate occurred in propellants containing monobasic copper salicylate. Four lead-free propellants were then formulated to improved aging characteristics over previous lead-free propellant formulations. The new formulations reduced or replaced the monobasic copper salicylate. The new formulations had improved aging characteristics. Their burn rates, however, were unacceptable for use in a 2.75 inch rocket. To compare aging characteristics, stabilizer depletion rates of RPD-422, AA2, M28, and RLC 470/6A were measured or taken from the literature. The data were fit to a kinetic model. The model contained first and zero order terms which allowed the stabilizer concentration to go to zero. In the model, only the concentration of the primary stabilizer was considered. Derivatives beyond the first nitrated or nitroso derivative of 2-NPDA were not considered. The rate constants were fit to the Arrhenius equation and extrapolated to lower temperatures. The time to complete stabilizer depletion was estimated using the kinetic model. The four propellants were compared and the RPD-422 depleted faster at 45 C than both A22 and M28. These types of predictions depend on the validity of the model and on confidence in the Arrhenius relationship holding at lower temperatures. At 45 C, the zero order portion of the model dominates the depletion rate.

Furrow, Keith W.↗
NASA NTRS1994

Investigation of a Laminar Flow Leading Edge

The recent resurgence of interest in utilizing laminar flow on aircraft surfaces for reduction in skin friction drag has generated a considerable amount of research in natural laminar flow (NLF) and hybrid laminar flow control (HLFC) on transonic aircraft wings. This research has focused primarily on airfoil design and understanding transition behavior with little concern for the surface imperfections and manufacturing variations inherent to most production aircraft. In order for laminar flow to find wide-spread use on production aircraft, techniques for constructing the wings must be found such that the large surface imperfections present in the leading edge region of current aircraft do not occur. Toward this end, a modification to existing leading edge construction techniques was devised such that the resulting surface did not contain large gaps and steps as are common on current production aircraft of this class. A lowspeed experiment was first conducted on a simulation of the surface that would result from this construction technique. Preston tube measurements of the boundary layer downstream of the simulated joint and flow visualization using sublimation chemicals validated the literature on the effects of steps on a laminar boundary layer. These results also indicated that the construction technique was indeed compatible with laminar flow. In order to fully validate the compatibility of this construction technique with laminar flow, thus proving that it is possible to build wings that are smooth enough to be used on business jets and light transports in a manner compatible with laminar flow, a flight experiment is being conducted. In this experiment Mach number and Reynolds number will be matched in a real flight environment. The experiment is being conducted using the NASA Dryden F-104 Flight Test Fixture (FTF). The FTF is a low aspect ratio ventral fin mounted beneath an F-104G research aircraft. A new nose shape was designed and constructed for this experiment. This nose shape provides an accelerating pressure gradient in the leading edge region. By flying the aircraft at appropriate Mach numbers and altitudes, this nose shape simulates the leading edge region of a laminar flow wing for a business jet or light transport. Manufactured into the nose shape is a spanwise slot located approximately four inches downstream of the leading edge. The slot, which is an inch wide and one-eighth of an inch deep allows the simulation of surface imperfections, such as gaps and steps at skin joints, which will occur on aircraft using this new construction technique. By placing strips of aluminum of various sizes and shapes in the slot, the effect on the boundary layer of different sizes and shapes of steps and gaps will be examined. It is planned to use five different configurations, differing primarily in the size and number of gaps. Downstream of the slot, the state of the boundary layer is determined using hot film gages and Stanton gages. Agreement between these two very different techniques of measuring boundary layer properties is considered important to being able to state with confidence the effects on the boundary layer of the simulated manufacturing imperfections. To date, the aircraft has not flown. First flights of the aircraft are on schedule to begin October 4, 1993. Low-speed, preliminary experiments at matching Reynolds numbers have been completed.

Drake, Aaron↗
NASA NTRS2003

Sharp Refractory Composite Leading Edges on Hypersonic Vehicles

On-going research of advanced sharp refractory composite leading edges for use on hypersonic air-breathing vehicles is presented in this paper. Intense magnitudes of heating and of heating gradients on the leading edge lead to thermal stresses that challenge the survivability of current material systems. A fundamental understanding of the problem is needed to further design development. Methodology for furthering the technology along with the use of advanced fiber architectures to improve the thermal-structural response is explored in the current work. Thermal and structural finite element analyses are conducted for several advanced fiber architectures of interest. A tailored thermal shock parameter for sharp orthotropic leading edges is identified for evaluating composite material systems. The use of the tailored thermal shock parameter has the potential to eliminate the need for detailed thermal-structural finite element analyses for initial screening of material systems being considered for a leading edge component.

Walker, Sandra P.↗
NASA NTRS2005

Science Coordination in Support of the US Weather Research Program Office of the Lead Scientist (OLS) and for Coordination with the World Weather Research (WMO) Program

This document is the final report of the work of the Office of the Lead Scientist (OLS) of the U.S. Weather Research Program (USWRP) and for Coordination of the World Weather Research Program (WWRP). The proposal was for a continuation of the duties and responsibilities described in the proposal of 7 October, 1993 to NSF and NOAA associated with the USWRP Lead Scientist then referred to as the Chief Scientist. The activities of the Office of the Lead Scientist (OLS) ended on January 31, 2005 and this report describes the activities undertaken by the OLS from February 1, 2004 until January 3 1, 2005. The OLS activities were under the cosponsorship of the agencies that are members of the Interagency Working Group (IWG) of the US WRP currently: NOAA, NSF, NASA, and DOD. The scope of the work described includes activities that were necessary to develop, facilitate and implement the research objectives of the USWRP consistent with the overall program goals and specific agency objectives. It included liaison with and promotion of WMO/WWW activities that were consistent with and beneficial to the USWRP programs and objectives. Funds covered several broad categories of activity including meetings convened by the Lead Scientist, OLS travel, partial salary and benefits support, publications, hard-copy dissemination of reports and program announcements and the development and maintenance of the USWRP website. In addition to funding covered by this grant, NCAR program funds provided co-sponsorship of half the salary and benefits resources of the USWRP Lead Scientist (.25 FTE) and the WWRP Chairman/Liaison (.167 FTE). Also covered by the grant were partial salaries for the Science Coordinator for the hurricane portion of the program and partial salary for a THORPEX coordinator.

Gall, Robert↗
NASA NTRS2007

Modeling Creep-Induced Stress Relaxation at the Leading Edge of SiC/SiC Airfoils

Anticipating the implementation of advanced SiC/SiC composites into internally cooled airfoil components within the turbine section of future aero-propulsion engines, the primary objective of this study was to develop physics-based analytical and finite-element modeling tools to predict the effects of composite creep and stress relaxation at the airfoil leading edges, which will generally experience large thermal gradients at high temperatures. A second objective was to examine how some advanced NASA-developed SiC/SiC systems coated with typical EBC materials would behave as leading edge materials in terms of long-term steady-state operating temperatures. Because of the complexities introduced by mechanical stresses inherent in internally cooled airfoils, a simple cylindrical thin-walled tube model subjected to thermal stresses only is employed for the leading edge, thereby obtaining a best-case scenario for the material behavior. In addition, the SiC/SiC composite materials are assumed to behave as isotropic materials with temperature-dependent viscoelastic creep behavior as measured in-plane on thin-walled panels. Key findings include: (1) without mechanical stresses and for typical airfoil geometries, as heat flux is increased through the leading edge, life-limiting tensile crack formation will occur first in the hoop direction on the inside wall of the leading edge; (2) thermal gradients through all current SiC/SiC systems should be kept below approx.300 F at high temperatures to avoid this cracking; (3) at temperatures near the maximum operating temperatures of advanced SiC/SiC systems, thermal stresses induced by the thermal gradients will beneficially relax with time due to creep; (4) although stress relaxation occurs, the maximum gradient should still not exceed 300oF because of residual tensile stress buildup on the airfoil outer wall during cool-down; and (5) without film cooling and mechanical stresses, the NASA-developed N26 SiC/SiC system with thru-thickness Sylramic-iBN fiber reinforcement and a typical EBC coating has the potential of offering a maximum long-term steady-state operating temperature of approx.3100 F at the surface of the EBC.

Lang, Jerry↗
NASA NTRS2007

Metallic Concepts for Repair of Reinforced Carbon-Carbon Space Shuttle Leading Edges

The Columbia accident has focused attention on the critical need for on-orbit repair concepts for wing leading edges in the event that potentially catastrophic damage is incurred during Space Shuttle Orbiter flight. The leading edge of the space shuttle wings consists of a series of eleven panels on each side of the orbiter. These panels are fabricated from reinforced carbon-carbon (RCC) which is a light weight composite with attractive strength at very high temperatures. The damage that was responsible for the loss of the Colombia space shuttle was deemed due to formation of a large hole in one these RCC leading edge panels produced by the impact of a large piece of foam. However, even small cracks in the RCC are considered as potentially catastrophic because of the high temperature re-entry environment. After the Columbia accident, NASA has explored various means to perform on-orbit repairs in the event that damage is sustained in future shuttle flights. Although large areas of damage, such as that which doomed Columbia, are not anticipated to re-occur due to various improvements to the shuttle, especially the foam attachment, NASA has also explored various options for both small and large area repair. This paper reports one large area repair concept referred to as the "metallic over-wrap." Environmental conditions during re-entry of the orbiter impose extreme requirements on the RCC leading edges as well as on any repair concepts. These requirements include temperatures up to 3000 F (1650 C) for up to 15 minutes in the presence of an extremely oxidizing plasma environment. Figure 1 shows the temperature profile across one panel (#9) which is subject to the highest temperatures during re-entry. Although the RCC possesses adequate mechanical strength at these temperatures, it lacks oxidation resistance. Oxidation protection is afforded by converting the outer layers of the RCC to SiC by chemical vapor deposition (CVD). At high temperatures in an oxidizing environment, the SiC layer forms a protective SiO2 scale. However, CVD processing to form the SiC layer can result in the formation of small cracks in the outer surface. Hence, as a final fabrication step, a sodium silicate glass, known as "Type A," is applied as a sealant to fill any surface porosity and/or cracks in the coating and the outer portions of the RCC[1]. At relatively low temperatures, the Type A glass melts and flows into the cracks providing oxidation protection at the higher temperatures. In addition, the Type A coating, provides a "dark" coating with a high emissivity. This high emissivity allows the RCC to transfer heat by radiating outward to space as well as dispersing heat within the leading edge cavity. Lastly, the Type A possesses low catalycity which reduces surface temperatures by limiting oxygen recombination on the surface during re-entry.

Ritzert, Frank↗
NASA NTRS2007

Acoustic Receptivity of Mach 4.5 Boundary Layer with Leading- Edge Bluntness

Boundary layer receptivity to two-dimensional slow and fast acoustic waves is investigated by solving Navier-Stokes equations for Mach 4.5 flow over a flat plate with a finite-thickness leading edge. Higher order spatial and temporal schemes are employed to obtain the solution whereby the flat-plate leading edge region is resolved by providing a sufficiently refined grid. The results show that the instability waves are generated in the leading edge region and that the boundary-layer is much more receptive to slow acoustic waves (by almost a factor of 20) as compared to the fast waves. Hence, this leading-edge receptivity mechanism is expected to be more relevant in the transition process for high Mach number flows where second mode instability is dominant. Computations are performed to investigate the effect of leading-edge thickness and it is found that bluntness tends to stabilize the boundary layer. Furthermore, the relative significance of fast acoustic waves is enhanced in the presence of bluntness. The effect of acoustic wave incidence angle is also studied and it is found that the receptivity of the boundary layer on the windward side (with respect to the acoustic forcing) decreases by more than a factor of 4 when the incidence angle is increased from 0 to 45 deg. However, the receptivity coefficient for the leeward side is found to vary relatively weakly with the incidence angle.

Malik, Mujeeb R.↗
NASA NTRS2010

NASA-DoD Lead-Free Electronics Project: Vibration Test

Vibration testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is a follow-on to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project which was the first group to test the reliability of lead-free solder joints against the requirements of the aerospace/miLItary community. Twenty seven test vehicles were subjected to the vibration test conditions (in two batches). The random vibration Power Spectral Density (PSD) input was increased during the test every 60 minutes in an effort to fail as many components as possible within the time allotted for the test. The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The number of test minutes required to fail a given component attached with SnPb solder was then compared to the number of test minutes required to fail the same component attached with lead-free solder. A complete modal analysis was conducted on one test vehicle using a laser vibrometer system which measured velocities, accelerations, and displacements at one . hundred points. The laser vibrometer data was used to determine the frequencies of the major modes of the test vehicle and the shapes of the modes. In addition, laser vibrometer data collected during the vibration test was used to calculate the strains generated by the first mode (using custom software). After completion of the testing, all of the test vehicles were visually inspected and cross sections were made. Broken component leads and other unwanted failure modes were documented.

Woodrow, Thomas A.↗
NASA NTRS2011

NASA-DoD Lead-Free Electronics Project. DRAFT Joint Test Report

The use of conventional tin-lead (SnPb) in circuit board manufacturing is under ever-increasing political scrutiny due to increasing regulations concerning lead. The "Restriction of Hazardous Substances" (RoHS) directive enacted by the European Union (EU) and a pact between the United States National Electronics Manufacturing Initiative (NEMI), Europe's Soldertec at Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association (JEITA) are just two examples where worldwide legislative actions and partnerships/agreements are affecting the electronics industry. As a result, many global commercial-grade electronic component suppliers are initiating efforts to transition to lead-free (Pb-free) in order to retain their worldwide market. Pb-free components are likely to find their way into the inventory of aerospace or military assembly processes under current government acquisition reform initiatives. Inventories "contaminated" by Pb-free will result in increased risks associated with the manufacturing, product reliability, and subsequent repair of aerospace and military electronic systems. Although electronics for military and aerospace applications are not included in the RoHS legislation, engineers are beginning to find that the commercial industry's move towards RoHS compliance has affected their supply chain and changed their parts. Most parts suppliers plan to phase out their non-compliant, leaded production and many have already done so. As a result, the ability to find leaded components is getting harder and harder. Some buyers are now attempting to acquire the remaining SnPb inventory, if it's not already obsolete. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides more and more parts with Pb-free finishes-some labeled no differently than their Pb counterparts-while at the same time providing the traditional Pb parts. The longer the transition period, the greater the likelihood of Pb-free parts inadvertently being mixed with Pb parts and ending up on what are supposed to be Pb systems. As a result, OEMs, depots, and support contractors need to take action now to either abate the influx of Pb-free parts, or accept it and deal with the likely interim consequences of reduced reliability due to a wide variety of matters, such as Pb contamination, high temperature incompatibility, and tin whiskering. Allowance of Pb-free components produces one of the greatest risks to the reliability of a weapon system. This is due to new and poorly understood failure mechanisms, as well as unknown long-term reliability. If the decision is made to consciously allow Pb-free solder and component finishes into SnPb electronics, additional effort (and cost) will be required to make the significant number of changes to drawings and task order procedures. This project is a follow-on effort to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Pb-free Solder Project which was the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community.

Kessel, Kurt↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Kessel, Kurt↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗
NASA NTRSDate not supplied

Wall-Modeled Large-Eddy Simulations of a Swept Wing with Leading-Edge Ice

The aerodynamic performance of a swept wing derived from the Common Research Model wing with high-fidelity and smooth leading-edge ice shapes is evaluated using wall-modeled large-eddy simulations. Two mesh paradigms are considered within the Launch, Ascent, and Vehicle Aerodynamics framework: structured hybrid curvilinear body-fitted/immersed-boundary and unstructured Voronoi. The curvilinear approach models the effect of the ice on the flow through penalty terms and the Voronoi strategy includes the ice representation directly in the mesh.Aerodynamic loads, surface pressure profiles, and skin-friction streamlines are compared against experimental results collected at the Wichita State University wind tunnel at a Mach number of 0.18 and a Reynolds number per mean aerodynamic chord of 1.6 million. For the curvilinear simulations with high-fidelity ice, results are sensitive to spanwise mesh resolution near the leading edge, where insufficient spanwise resolution leads to a spanwise running vortexaft of the high-fidelity ice, which is partially removed with increasing spanwise resolution. For the Voronoi simulations with high-fidelity ice, refining the mesh led to good convergence towards the experimental results with the best case demonstrating a maximum discrepancy of three lift counts relative to the experiment across a range of angles of attack from about 5 to 24 degrees, validating the shrink-wrapping procedure used for the ice. For the smooth ice, the curvilinear approach consistently under-predicted the upper surface suction leading to an under-prediction in lift, but did not demonstrate the pronounced over-prediction in upper surface suction near the leading edge observed in the Voronoi simulations.

AATT↗
NASA NTRS2002

Hi-rel lead-free printed wiring assemblies

The use of lead in electronics has come under increasing scrutiny. Given the trends in both Japan and Europe, it is highly likely that the U.S. will be driven by commercial interests to phase out of lead in electronics usage. This paper presents data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The first phase of this project dealt with determining the most feasible candidates to replace tin-lead and to determine suitable processing operations in assemblies printed wiring boards.

lead tin-lead wiring-boards solder pastes↗
NASA NTRS2014

NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.

electronics↗
NASA NTRS1972

Effects of increased leading-edge thickness on performance of a transonic rotor blade

A single-stage transonic compressor was tested with two rotor blade leading-edge configurations to investigate the effect of increased leading-edge thickness on the performance of a transonic blade row. The original rotor blade configuration was modified by cutting back the leading edge sufficiently to double the blade leading-edge thickness and thus the blade gap blockage in the tip region. At design speed this modification resulted in a decrease in rotor overall peak efficiency of four points. The major portion of this decrement in rotor overall peak efficienty was attributed to the flow conditions in the outer 30 percent of the blade span. At 70 and 90 percent of design speed, the modification had very little effect on rotor overall performance.

Reid, L.↗
NASA NTRS1974

Effect of spanwise blowing on leading-edge vortex bursting of a highly swept aspect ratio 1.18 delta wing

An investigation was conducted in the Langley 1/8-scale V/STOL model tunnel on a semispan delta wing with a leading-edge sweep of 74 deg, to determine the effectiveness of various locations of upper surface and reflection plane blowing on leading-edge vortex bursting. Constant area nozzles were located on the wing upper surface along a ray swept 79 deg, which was beneath the leading-edge vortex core. The bursting and reformation of the leading-edge vortex was viewed by injecting helium into the vortex core, and employing a schlieren system.

Scantling, W. L.↗
NASA NTRS1973

Design fabrication, testing, and delivery of shuttle heat pipe leading edge test modules. Volume 1: Executive summary

The construction of two test modules is presented for a feasibility demonstration of a concept for reusable space shuttle wing leading edge surfaces. In this leading edge concept high temperature heat pipes were incorporated into the structure to cool the stagnation region, allowing the use of super-alloys in place of refractory metal, ablator protected, or carbon-carbon structures. The program included the analysis and design of the heat pipes, their integration into the test module structure, heat pipe development testing, construction of the test modules and a facility adapter, and formulation of recommended testing conditions. The results of the heat pipe and leading edge module thermal analyses indicate the test modules will meet the design goal; reducing the leading edge temperature at the stagnation line from 1315 C (2400 F) to less than 1010 C (1850 F). The development tests demonstrated that the module assembly could be brazed with active heat pipes, as was borne out by the subsequent successful brazing of both modules with active heat pipes loaded with sodium.

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