Balancing Manufacturability with Performance: Achieving Extrudable, High Thermal Conductivity, and Dielectrically Robust Thermoplastic Composites
Improved thermal management solutions for electrical insulation systems are a priority for increasing efficiency. Although polymeric electrical insulation is ubiquitous, it generally exhibits low thermal conductivities (κ ; 0.1 – 0.3 W/mK). High κ electrical insulation systems are desirable for several reasons including improved heat wicking. Polymer-ceramic composites offer a viable path towards increasing κ of electrical insulation systems. However, processing-induced anisotropic particle orientation can result in prohibitively high concentrations of high κ particles being required to achieve impactful improvements. This work evaluates the effectiveness of a double percolation approach and its impacts on extruded polymer composite insulation κ using polyimide (PI), polyphenylsulfone (PPSU), and hexagonal boron nitride (hBN). Thermoplastic composite blends of PI/PPSU exhibited a 15% improvement in composite κ at comparable loading levels of hBN relative to mono-polymer material systems. On the other hand, PI/PPSU/hBN composites exhibited lower dielectric strengths than either neat polymer/hBN composite. A trade-off between maximizing material κ and resultant processing and dielectric performances may exist when using a double percolation approach for thermoplastic composites.