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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8

Space shuttle main engine controller assembly, phase C-D

System design and system analysis and simulation are slightly behind schedule, while design verification testing has improved. Input/output circuit design has improved, but digital computer unit (DCU) and mechanical design continue to lag. Part procurement was impacted by delays in printed circuit board, assembly drawing releases. These are the result of problems in generating suitable printed circuit artwork for the very complex and high density multilayer boards.

Source record↗

MMIC devices for active phased array antennas

Considerable progress has been made in the calculation and measurement of the scattering parameters of printed circuit discontinuities. These discontinuities occur in a variety of structures, such as transitions between rectangular waveguide and printed circuits, junctions between circuits of different dielectric constants, and filters and impedance matching circuits. Because of the variety of devices in which these discontinuities occur, it is very useful to understand them in as great a detail as possible. Both theoretical and experimental studies of discontinuities were considered. The theoretical studies have focused on finding ways to predict the scattering from discontinuities. The experimental studies have concentrated on developing measurement techniques for determining the scattering parameters of these discontinuities.

Mittra, R.↗

Development of a Test-Bed for Testing and Refining EarthEn’s Supercritical CO 2 Based Energy Storage System

EarthEn’s energy storage concept leverages supercritical carbon dioxide (sCO 2 ) as a working fluid and relies on compact, high-performance components operating at elevated pressures and temperatures. To accelerate component development and reduce technical risk prior to larger-scale demonstrations, Oak Ridge National Laboratory (ORNL) developed a 100 kW-scale sCO 2 test-bed under a Cooperative Research and Development Agreement with EarthEn (CRADA NO. NFE-24-10050). The objective of the work was to design and construct a flexible experimental facility capable of reproducing key thermodynamic state points and heat-transfer conditions relevant to EarthEn’s thermal energy storage (TES) cycle, with particular emphasis on enabling development and evaluation of next-generation heat exchangers and TES concepts. The test-bed consists of a closed-loop sCO 2 circulation system housed within an open-topped enclosure. In its as-installed configuration, dense-phase sCO 2 is recirculated through a printed circuit recuperator, an electrically heated section, a throttling device used to simulate turbine expansion, and a water-cooled printed circuit heat exchanger that rejects heat to the building chilled-water system before returning to the pump. The pump is driven by a variable frequency drive, enabling controlled adjustment of flow and operating point. A comprehensive instrumentation suite was integrated to support both safe operation and high-quality data collection. Installed sensors include Coriolis flow meters for sCO 2 flow rate and density, resistance temperature detectors and thermocouples distributed throughout the loop (including the heated section and key heat exchanger ports), and pressure transducers for absolute and differential pressure measurements. The facility was designed to support high-pressure (19 MPa nominal) and high-temperature (575°C nominal) operation with credited overpressure protection provided by a rupture disk. Nominal operating conditions were selected to support 100 kW-class testing while maintaining flexibility for non-heated and heated shakedown, control development, and future integration of advanced TES test sections. In parallel with facility development, a system-level thermal-hydraulic model was created using Modelica-based tools to support component sizing, anticipate performance over targeted test conditions, and establish a framework for future model calibration against experimental data. At the conclusion of the project performance period, the facility was in final assembly, and the pressure boundary was nearly completed. However, several practical challenges associated with high-pressure/high-temperature systems and specialized component procurement impacted schedule and prevented initial pump-driven operation and full commissioning within the available resources. This report documents the as-built design, operating capabilities, and instrumentation, and it summarizes key lessons learned related to heater fabrication and testing, first-of-a-kind assembly factors, specialty flange supply constraints, and fill pump corrective actions. Finally, it outlines a phased plan for future commissioning and experimental campaigns, including control and instrumentation shakedown, heater characterization, model calibration, and testing at state points representative of EarthEn’s TES cycle.

25 ENERGY STORAGE↗

Advanced sensor systems for biotelemetry

The present invention relates to telemetry-based sensing systems that continuously measures physical, chemical and biological parameters. More specifically, these sensing systems comprise a small, modular, low-power implantable biotelemetry system capable of continuously sensing physiological characteristics using implantable transmitters, a receiver, and a data acquisition system to analyze and record the transmitted signal over several months. The preferred embodiment is a preterm labor and fetal monitoring system. Key features of the invention include Pulse Interval Modulation (PIM) that is used to send temperature and pressure information out of the biological environment. The RF carrier frequency is 174-216 MHz and a pair of RF bursts (pulses) is transmitted at a frequency of about 1-2 Hz. The transmission range is 3 to 10 feet, depending on the position of the transmitter in the body and its biological environment. The entire transmitter is encapsulated in biocompatible silicone rubber. Power is supplied by on-board silver-oxide batteries. The average power consumption of the current design is less than 30 .mu.W., which yields a lifetime of approximately 6-9 months. Chip-on-Board technology (COB) drastically reduces the size of the printed circuit board from 38.times.28 mm to 22.times.8 mm. Unpackaged dies are flip-chip bonded directly onto the printed circuit board, along with surface mount resistors and capacitors. The invention can monitor additional physiological parameters including, but not limited to, ECG, blood gases, glucose, and ions such as calcium, potassium, and sodium.

Hines, John W.↗

Radial/Axial Microwave Power Divider/Combiner

Parts made on printed-circuit boards. Impedance-matching and power-dividing transmission-line strips formed on insulation disks and on board by printed-circuit techniques. Power from input transmission line sent equally through radial output conductors to radial output transmission lines and/or coupled in varying degrees to axial output transmission line.

Vaddiparty, Verriah P.↗

Advanced Sensor Systems for Biotelemetry

The present invention relates to telemetry-based sensing systems that continuously measures physical, chemical and biological parameters. More specifically, these sensing systems comprise a small, modular, low-power implantable biotelemetry system capable of continuously sensing physiological characteristics using implantable transmitters, a receiver, and a data acquisition system to analyze and record the transmitted signal over several months. The preferred embodiment is a preterm labor and fetal monitoring system. Key features of the invention include Pulse Interval Modulation (PIM) that is used to send temperature and pressure information out of the biological environment. The RF carrier frequency is 174-216 MHz and a pair of RF bursts (pulses) is transmitted at a frequency of about 1-2 Hz. The transmission range is 3 to 10 feet, depending on the position of the transmitter in the body and its biological environment. The entire transmitter is encapsulated in biocompatible silicone rubber. Power is supplied by on-board silver-oxide batteries. The average power consumption of the current design is less than 30 microW, which yields a lifetime of approximately 6 - 9 months. Chip-on-Board technology (COB) drastically reduces the size of the printed circuit board from 38 x 28 mm to 22 x 8 mm. Unpackaged dies are flip-chip bonded directly onto the printed circuit board, along with surface mount resistors and capacitors. The invention can monitor additional physiological parameters including, but not limited to, ECG, blood gases, glucose, and ions such as calcium, potassium, and sodium.

Hines, John W.↗

Investigation of the development of cracks in solder joints

Study consisted of an analytical approach, in which a mathematical model of existing printed circuit board component mounting techniques was analyzed, and an empirical investigation was performed to determine the extent of damage caused by temperature cycling of the printed circuit boards.

Moore, R. L.↗

Front-Side Microstrip Line Feeding a Raised Antenna Patch

An improved design concept for a printed-circuit patch antenna and the transmission line that feeds the patch calls for (1) a microstrip transmission line on the front (radiative) side of a printed-circuit board based on a thin, high-permittivity dielectric substrate; (2) using the conductor covering the back side of the circuit board as a common ground plane for both the microstrip line and the antenna patch; (3) supporting the antenna patch in front of the circuit board on a much thicker, lower-permittivity dielectric spacer layer; and (4) connecting the microstrip transmission line to the patch by use of a thin wire or narrow ribbon that extends through the thickness of the spacer and is oriented perpendicularly to the circuit-board plane. The thickness of the substrate is typically chosen so that a microstrip transmission line of practical width has an impedance between 50 and 100 ohms. The advantages of this design concept are best understood in the context of the disadvantages of prior design concepts, as explained

Hodges, Richard↗

Testing Services

Trace Laboratories is an independent testing laboratory specializing in testing printed circuit boards, automotive products and military hardware. Technical information from NASA Tech Briefs and two subsequent JPL Technical Support packages have assisted Trace in testing surface insulation resistance on printed circuit board materials. Testing time was reduced and customer service was improved because of Jet Propulsion Laboratory technical support packages.

Source record↗

User's Guide for Computer Program that Routes Signal Traces

This disk contains both a FORTRAN computer program and the corresponding user's guide that facilitates both its incorporation into your system and its utility. The computer program represents an efficient algorithm that routes signal traces on layers of a printed circuit with both through-pins and surface mounts. The computer program included is an implementation of the ideas presented in the theoretical paper titled "A Formal Algorithm for Routing Signal Traces on a Printed Circuit Board", NASA TP-3639 published in 1996. The computer program in the "connects" file can be read with a FORTRAN compiler and readily integrated into software unique to each particular environment where it might be used.

Hedgley, David R., Jr.↗

Unified conductor to lower the resistance between a planar transformer and one or more inductors

An apparatus is provided including a transformer including a first printed circuit board having one or more conducting layers, the one or more conducting layers forming, at least in part, a transformer coil; at least one inductor; and at least one continuous piece of conducting material external to the printed circuit board, where the at least one continuous piece of conducting material forms a connection between the transformer and the at least one inductor. A method is also provided for assembling a switched-mode power supply.

Coteus, Paul W.↗

Low-Inductance Capacitor For Low Temperatures

Planar capacitor made on epoxy/fiberglass printed-circuit board. Planar design and flat copper plates ensure low inductance and low series resistance. Planar construction minimized effects of thermal contraction, and epoxy/fiberglass substrate ensured high breakdown voltage. Design is simple, and this type of capacitor easy for any printed-circuit-board facility to fabricate. Design suitable for any small-capacitance, high-voltage capacitor, whether operating at low or high temperature.

Rhodes, David B.↗

Comparative Analysis of Heat Exchangers for High Temperature High Pressure Helium Component Testing

Helium gas loops have been designed and built to gain a better understanding of the gas thermohydraulic phenomena that take place in a helium system. Some of these loops are used for validation and testing of components for high temperature gas-cooled reactors (HTGRs). However, most of them operate at lower pressure and temperature than an HTGR. While these loops can provide valuable information about gas-cooled reactor components, the operating envelope of the experiment is constrained by the maximum operating conditions of the helium loop. In response to the lack of an experimental facility that can provide the infrastructure needed to validate and test components at nominal pressures and temperatures of HTGRS, the HElium Component Testing Out-of-pile Research (HECTOR) facility was designed at Idaho National Laboratory with the assistance of University of Idaho and Walsh Engineering. With the capability to test at temperatures up to 800°C and pressures of 8MPa, HECTOR serves as a critical tool for the advancement of HTGR technology. The facility's primary role is to provide a controlled, high-fidelity environment for the assessment of component resilience and efficiency under nominal HTGR conditions. In the quest to enhance the efficiency and performance of HECTOR, a comparative analysis of three distinct types of heat exchangers—shell and tube, offset strip fin, and printed-circuit—was conducted, focusing primarily on two critical metrics: the required surface area and pressure drop characteristics. The shell and tube heat exchanger, renowned for its robust design and widespread industrial application, was evaluated against the offset strip fin and the cuttingedge printed-circuit heat exchangers, both of which are lauded for their compactness and thermal effectiveness. This comparative study aims to provide detailed insights into the thermal management capabilities of each heat exchanger type under the conditions inherent to HECTOR, thereby facilitating an informed selection for systems demanding high operational integrity and efficiency.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

Beam forming network

The network, which is connected to a layer of 134 feed elements that transmit and receive microwaves, consists of a pair of circuit boards parallel to the feed element layer. One of the two boards has 87 dividers that each divide a signal to be transmitted into seven portions, and the other board has 134 combiners that each collect seven transmit signal portions and deliver the sum to one of the feed elements. A similar arrangement is used to handle received signals. The large number of interconnections are made by printed circuit conductors radiating from each of the numerous dividers and combiners, and by providing interconnection pins that interconnect the ends of pairs of conductors lying on the two boards. The printed circuit conductors extend in undulating paths that provide maximum separation of conductors to minimize crosstalk.

Cramer, P. W., Jr.↗

Solar array flight experiment

Emerging satellite designs require increasing amounts of electrical power to operate spacecraft instruments and to provide environments suitable for human habitation. In the past, electrical power was generated by covering rigid honeycomb panels with solar cells. This technology results in unacceptable weight and volume penalties when large amounts of power are required. To fill the need for large-area, lightweight solar arrays, a fabrication technique in which solar cells are attached to a copper printed circuit laminated to a plastic sheet was developed. The result is a flexible solar array with one-tenth the stowed volume and one-third the weight of comparably sized rigid arrays. An automated welding process developed to attack the cells to the printed circuit guarantees repeatable welds that are more tolerant of severe environments than conventional soldered connections. To demonstrate the flight readiness of this technology, the Solar Array Flight Experiment (SAFE) was developed and flown on the space shuttle Discovery in September 1984. The tests showed the modes and frequencies of the array to be very close to preflight predictions. Structural damping, however, was higher than anticipated. Electrical performance of the active solar panel was also tested. The flight performance and postflight data evaluation are described.

Source record↗

REDC Process Instrumentation Modernization Project

Critical electronics used for isotopes production have become outdated and difficult to manufacture. In particular the alpha-particle and neutron detection electronics (commonly referred to as Q2809A-9 and -11) which are used to monitor effluent activity in ORNL Building 7920 were designed and deployed in 1966-67. These electronics are still used but some parts are no longer available for purchase. In addition, the printed circuit boards used in the Count Rate Monitor (CRM) module have no fabrication files or quality assurance documentation. In light of this, a project to modernize the modules for ability to manufacture with modern parts was undertaken. Both the preamplifier and CRM were modernized with new printed circuit boards and parts which are current catalog parts. In addition, QA documentation was generated which allows the manufacturer to assure proper operation prior to delivery.

42 ENGINEERING↗

Resistance of The Flex-Wire Windings

In this paper, an analysis of the flexible printed circuit board (FPCB) windings is performed. A one-dimensional model of the flex-wire winding is introduced and an equation for the FPCB ac winding resistance is derived. Experimental verification of derived equations is performed, i.e., impedance and power loss measurements.

Wojda, Rafal↗