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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

Ion beam sputtering of fluoropolymers

Ion beam sputter processing rates as well as pertinent characteristics of etched targets and films are described. An argon ion beam source was used to sputter etch and deposit the fluoropolymers PTFE, FEP, and CTFE. Ion beam energy, current density, and target temperature were varied to examine effects on etch and deposition rates. The ion etched fluoropolymers yield cone or spire-like surface structures which vary depending upon the type of polymer, ion beam power density, etch time, and target temperature. Sputter target and film characteristics documented by spectral transmittance measurements, X-ray diffraction, ESCA, and SEM photomicrographs are included.

Sovey, J. S.↗
NASA NTRS1977

Microstructural and wear properties of sputtered carbides and silicides

Sputtered Cr3C2, Cr3Si2, and MoSi2 wear-resistant films (0.05 to 3.5 microns thick) were deposited on metal and glass surfaces. Electron transmission, electron diffraction, and scanning electron microscopy were used to determine the microstructural appearance. Strong adherence was obtained with these sputtered films. Internal stresses and defect crystallographic growth structures of various configurations within the film have progressively more undesirable effects for film thicknesses greater than 1.5 microns. Sliding contact and rolling-element bearing tests were also performed with these sputtered films.

Spalvins, T.↗
NASA NTRS1978

Solar-wind sputtering of the Martian atmosphere

The role of solar-wind sputtering in causing atmospheric mass loss from Mars is discussed. The atmospheric mass loss is studied by analogy to models of sputtering of solid surfaces and by use of empirical data for the lunar surface. Results show that Martian atmospheric mass loss, when integrated over the course of 4 times 10 to the ninth power years, amounts to 3.1 times 10 to the 41st power CO2 molecules. Preferential loss of light elements and isotopes by sputtering is also considered.

Haff, P. K.↗
NASA NTRS1977

Gravitational and recoil contributions to surface mass fractionation by solar-wind sputtering

The sputtering of the lunar surface by the solar wind is examined as a possible mechanism of mass fractionation. Two distinct contributions to this mechanism are considered: (1) the tendency for a greater fraction of the heavier sputtered atoms to fall back to the surface under lunar gravity; and (2) mass-dependent kinetic effects that arise in the sputtering process itself. Calculations predict that delta (O-18) is approximately 5.6% while delta (Si-30) is about 3.6% and that oxygen is depleted in the outer regions of grains relative to the bulk composition. The results are in reasonable agreement with experiment, and one must conclude that mass fractionation by solar wind is an important phenomenon on the lunar surface.

Haff, P. K.↗
NASA NTRS1979

Whiskers, cones and pyramids created in sputtering by ion bombardment

A thorough study of the role which foreign atoms play in cone formation during sputtering of metals revealed many experimental facts. Two types of cone formation were distinquished, deposit cones and seed cones. Twenty-six combinations of metals for seed cone formation were tested. The sputtering yield variations with composition for combinations which form seed cones were measured. It was demonstrated that whisker growth becomes a common occurrence when low melting point material is sputter deposited on a hot nonsputtered high melting point electrode.

Wehner, G. K.↗
NASA NTRS1979

Industrial potential, uses, and performance of sputtered and ion plated films

The sputtering and ion plating technology is reviewed in terms of their potential, uses and performance. It offers the greatest flexibility in coating preparation, since coatings can be tailored in any preferred chemical combination, and graded type interfaces (ceramic to metal seals) can be formed. Sputtered and ion plated film characteristics such as the degree of adherence, coherence and morphological growth which contribute to film performance and reliability are described and illustrated as used in practice. It is concluded that the potential future of sputtered and ion plated films for industrial applications will depend primarily upon greater comprehension of materials selection, possible elimination of restrictions for coating/substrate combinations and the awareness of utilizing the proper deposition parameters.

Spalvins, T.↗
NASA NTRS1979

Physical processes in directed ion beam sputtering

The general operation of a discharge chamber for the production of ions is described. A model is presented for the magnetic containment of both primary and secondary or Maxwellian electrons in the discharge plasma. Cross sections were calculated for energy and momentum transfer in binary collisions between like pairs of Ar, Kr, and Xe atoms in the energy range from about 1 eV to 1000 eV. These calculations were made from available pair interaction potentials using a classical model. Experimental data from the literature were fit to a theoretical expression for the Ar resonance charge exchange cross section over the same energy range. A model was developed that describes the processes of conical texturing of a surface due to simultaneous directed ion beam etching and sputter deposition of an impurity material. This model accurately predicts both a minimum temperature for texturing to take place and the variation of cone density with temperature. It also provides the correct order of magnitude of cone separation. It was predicted from the model, and subsequently verified experimentally, that a high sputter yield material could serve as a seed for coning of a lower sputter yield substrate. Seeding geometries and seed deposition rates were studied to obtain an important input to the theoretical texturing model.

Robinson, R. S.↗
NASA NTRS1979

Development of sputtered techniques for thrust chambers

The 0.152 cm thick sputtered and copper deposits were electron beam welded to wrought copper. Tensile specimens were machined from the weld assemblies and tested at room temperature. Tensile strength approached the strength of wrought material. Elongations up to 25% were measured. Sputtered aluminum was used to fill 0.157 cm wide by 0.127 cm deep grooves in thrust chamber spool piece liners. The liners were closed out by sputtering copper from post and hollow cathodes.

Mullaly, J. R.↗
NASA NTRS1978

Ion beam sputtering of fluoropolymers

Etching and deposition of fluoropolymers are of considerable industrial interest for applications dealing with adhesion, chemical inertness, hydrophobicity, and dielectric properties. This paper describes ion beam sputter processing rates as well as pertinent characteristics of etched targets and films. An argon ion beam source was used to sputter etch and deposit the fluoropolymers PTFE, FEP, and CTFE. Ion beam energy, current density, and target temperature were varied to examine effects on etch and deposition rates. The ion etched fluoropolymers yield cone or spire-like surface structures which vary depending upon the type of polymer, ion beam power density, etch time, and target temperature. Also presented are sputter target and film characteristics which were documented by spectral transmittance measurements, X-ray diffraction, ESCA, and SEM photomicrographs.

Sovey, J. S.↗
NASA NTRS1979

Industrial potential, uses, and performance of sputtered and ion plated films

The sputtering and ion plating technology is reviewed in terms of potential, uses, and performance. Sputtering is not regulated by classical thermodynamics and Gibb's phase rule relationships, thus eliminating the restrictions for materials combinations, and consequently making possible tailoring of coatings in any preferred chemical combination. The future of sputtered and ion plated films for industrial applications is expected to depend primarily on greater comprehension of materials selection, and the utilization of the proper deposition parameters.

Spalvins, T.↗
NASA NTRS1978

Sputtering - Its relationship to isotopic fractionation on the lunar surface

Silicon, oxygen, sulfur and, possibly, potassium show systematic enrichment of heavier isotopes with increasing soil maturity, probably as a result of solar-wind sputtering, but such a pattern is not exhibited by solar wind-implanted species. Apparently sputter-erosion is not penetrating to their implantation depth, about 200 A. This suggests that sputtering on the moon is being impeded by deposition of vapor condensate following meteoritic impact. Although neither secular variation in the isotopic composition at the source of regolith carbon, probably the solar wind, nor isotopic fractionation of carbon after implantation in the regolith can be ruled out, carbon isotope systematics currently yield no evidence in support of either process.

Kerridge, J. F.↗
NASA NTRS1980

Possible isotopic fractionation effects in sputtered minerals

A model which makes definite predictions for the fractionation of isotopes in sputtered material is discussed. The fractionation patterns are nonlinear, and the pattern for a particular set of isotopes depends on the chemical matrix within which those isotopes are contained. Calculations are presented for all nonmonoisotopic elements contained in the minerals perovskite, anorthite, ackermanite, enstatite, and troilite. All isotopes are fractionated at the level of approximately 4-6 deg/o per atomic mass unit. Oxygen is always positively fractionated (heavier isotopes sputtered preferentially), and heavier elements are generally negatively fractioned (light isotopes sputtered preferentially). The value of Delta (O-18:O-16) is always less by about 1.8 deg/o than a linear extrapolation based upon the calculated delta (O-17:O-16) value would suggest. The phenomenon of both negative and positive fractionation patterns from a single target mineral are used to make an experimental test of the proposed model.

Haff, P. K.↗
NASA NTRS1981

A sputtered zirconia primer for improved thermal shock resistance of plasma sprayed ceramic turbine seals

The development of plasma-sprayed yttria stabilized zirconia (YSZ) ceramic turbine blade tip seal components is discussed. The YSZ layers are quite thick (0.040 to 0.090 in.). The service potential of seal components with such thick ceramic layers is cyclic thermal shock limited. The most usual failure mode is ceramic layer delamination at or very near the interface between the plasma sprayed YSZ layer and the NiCrAlY bondcoat. Deposition of a thin RF sputtered YSZ primer to the bondcoat prior to deposition of the thick plasma sprayed YSZ layer was found to reduce laminar cracking in cyclic thermal shock testing. The cyclic thermal shock life of one ceramic seal design was increased by a factor of 5 to 6 when the sputtered YSZ primer was incorporated. A model based on thermal response of plasma sprayed YSZ particles impinging on the bondcoat surface with and without the sputtered YSZ primer provides a basis for understanding the function of the primer.

Bill, R. C.↗
NASA NTRS1981

Hydrogenated amorphous silicon deposited by ion-beam sputtering

Hydrogenated amorphous silicon films 1/2 to 1 micron thick were deposited on metal and glass substrates using ion-beam sputtering techniques. The 800 eV, 2 mA/sq cm beam was a mixture of argon and hydrogen ions. The argon sputtered silicon from a pure (7.6 cm) single crystal wafer, while the hydrogen combined with the sputtered material during the deposition. Hydrogen to argon pressure ratios and substrate temperatures were varied to minimize the defect state density in the amorphous silicon. Characterization was done by electrical resistivity, index of refraction and optical absorption of the films.

Lowe, V. E.↗
NASA NTRS1981

Electron reflection and secondary emission characteristics of sputter-textured pyrolytic graphite surfaces

Measurements are presented of secondary electron emission and reflected primary electron characteristics of sputter-textured pyrolitic graphite surfaces with microstructures of various sizes and densities, made with an Auger cylindrical mirror analyzer in a high-vacuum chamber at pressures below 1.33 x 10 to the -7th N/sq m (10 to the -9th torr). A dense, tall, thin, spire-like microstructure, obtained at ion energies of 1000 eV and ion current densities of 5 mA/sq cm, is the most effective. The secondary electron emission from such a surface is lower than that of soot, whose secondary emission is among the lowest of any material. At a primary electron energy of 1000 eV, the secondary electron emission yield of smooth CU is about 350% greater than the lowest value obtained for sputter-textured pyrolitic graphite. The reflected primary electron index of smooth Cu is a factor of 80 greater. If the secondary electron emission yield is reduced to 0.3, which is possible with sputter-textured pyrolitic graphite, the traveling wave tube collector efficiency could be improved by as much as 4% over that for smooth copper.

Wintucky, E. G.↗
NASA NTRS1980

Solar wind sputtering effects in the atmospheres of Mars and Venus

It is found through an investigation, combining Monte Carlo simulations and analytical techniques, of the direct collisional interaction of an energetic particle flux with the neutral components of a planetary atmosphere, that solar wind sputtering could provide an important exospheric mass sink on both Mars and Venus under appropriate conditions. The computed rates of helium loss in the Venusian atmosphere and of carbon, nitrogen and oxygen in the Martian atmosphere imply that sputtering would have a significant effect on the noble gas budget of Venus and dominate the chemical and photochemical loss processes of Mars. Because of diffusive separation of lighter elements and isotopes, and because the gravitational binding energy is proportional to the mass, the erosion process preferentially removes the lighter components of the atmosphere. Solar wind sputtering could therefore compete with other erosion mechanisms in generating substantial fractionation effects.

Watson, C. C.↗
NASA NTRS1984

Effect of Ion Sputtering on Interface Chemistry and Electrical Properties of an Gaas (100) Schottky Contacts

Auger and electron photoelectron spectroscopy were used to measure the extent of As depletion during 1 keV to 5 keV argon sputtering of GaAs surfaces. This depletion was correlated with a general decrease in the barrier height of the rectifying Au contact deposited in situ. However, nondestructive angle resolved XPS measurements showed As was depleted at the outer surface more by 1 keV than 3 keV argon. These effects are explained based on a combined work effective work function model and creation of a donor like surface damage layer. The donor layer was correlated with As depletion by sputtering. Deep level trap formation and annealing of sputtering effects were studied.

Wang, Y. X.↗
NASA NTRS1984

Sputtering as a Technique for Applying Tribological Coatings

Friction and wear induced mechanical failures may be controlled to extend the life of tribological components through the interposition of selected solid materials between contacting surfaces. Thin solid films of soft and hard materials are appropriate to lower friction and enhance the wear resistance of precision tribo-elements. Thin film coating technologies that have been developed may be used to interpose thin solid layers between contacting surfaces to reduce friction or to extend wear life. Film deposition technologies developed include chemical vapor deposition (CVD) and physical vapor deposition (PVD). Sputter coating is a PVD process for thin film deposition. It allows close control of coating thickness and composition and is well-suited for the deposition of tribological coatings. In this paper, the utility of magnetron sputtering for the deposition of tribological coatings is examined. Experimental results obtained when coated bodies are tested under a number of tribological operating conditions are presented. It is shown that when film adhesion problems are resolved, sputtering can be an effective means of depositing tribological coatings.

S Ramalingam↗