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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8

MEMS CLOSED CHAMBER HEAT ENGINE AND ELECTRIC GENERATOR

A heat engine, preferably combined with an electric generator, and advantageously implemented using micro-electromechanical system (MEMS) technologies as an array of one or more individual heat engine/generators. The heat engine is based on a closed chamber containing a motive medium, preferably a gas; means for alternately enabling and disabling transfer of thermal energy from a heat source to the motive medium; and at least one movable side of the chamber that moves in response to thermally-induced expansion and contraction of the motive medium, thereby converting thermal energy to oscillating movement. The electrical generator is combined with the heat engine to utilize movement of the movable side to convert mechanical work to electrical energy, preferably using electrostatic interaction in a generator capacitor. Preferably at least one heat transfer side of the chamber is placed alternately into and out of contact with the heat source by a motion capacitor, thereby alternately enabling and disabling conductive transfer of heat to the motive medium.

Landis, Geoffrey A.↗

MEMS device for spacecraft thermal control applications

A micro-electromechanical device that comprises miniaturized mechanical louvers, referred to as Micro Electro-Mechanical Systems (MEMS) louvers are employed to achieve a thermal control function for spacecraft and instruments. The MEMS louvers are another form of a variable emittance control coating and employ micro-electromechanical technology. In a function similar to traditional, macroscopic thermal louvers, the MEMS louvers of the present invention change the emissivity of a surface. With the MEMS louvers, as with the traditional macroscopic louvers, a mechanical vane or window is opened and closed to allow an alterable radiative view to space.

Swanson, Theordore D.↗

Fully Integrated, Miniature, High-Frequency Flow Probe Utilizing MEMS Leadless SOI Technology

This work focused on developing, fabricating, and fully calibrating a flowangle probe for aeronautics research by utilizing the latest microelectromechanical systems (MEMS), leadless silicon on insulator (SOI) sensor technology. While the concept of angle probes is not new, traditional devices had been relatively large due to fabrication constraints; often too large to resolve flow structures necessary for modern aeropropulsion measurements such as inlet flow distortions and vortices, secondary flows, etc. Mea surements of this kind demanded a new approach to probe design to achieve sizes on the order of 0.1 in. (.3 mm) diameter or smaller, and capable of meeting demanding requirements for accuracy and ruggedness. This approach invoked the use of stateof- the-art processing techniques to install SOI sensor chips directly onto the probe body, thus eliminating redundancy in sensor packaging and probe installation that have historically forced larger probe size. This also facilitated a better thermal match between the chip and its mount, improving stability and accuracy. Further, the leadless sensor technology with which the SOI sensing element is fabricated allows direct mounting and electrical interconnecting of the sensor to the probe body. This leadless technology allowed a rugged wire-out approach that is performed at the sensor length scale, thus achieving substantial sensor size reductions. The technology is inherently capable of high-frequency and high-accuracy performance in high temperatures and harsh environments.

Ned, Alex↗

Pressure-Sensor Assembly Technique

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this underfill material from getting onto the sensor s diaphragms, the circuit board is fabricated with two 25- micrometer-tall polymer rings, sized so that the diaphragms fit inside the rings once the chip is attached.

Pruzan, Daniel A.↗

NASA NDE Applications for Mobile MEMS Devices and Sensors

NASA would like new devices and sensors for performing nondestructive evaluation (NDE) of aerospace vehicles. These devices must be small in size/volume, mass, and power consumption. The devices must be autonomous and mobile so they can access the internal structures of aircraft and spacecraft and adequately monitor the structural health of these craft. The platforms must be mobile in order to transport NDE sensors for evaluating structural integrity and determining whether further investigations will be required. Microelectromechanical systems (MEMS) technology is crucial to the development of the mobile platforms and sensor systems. This paper presents NASA s needs for micro mobile platforms and MEMS sensors that will enable NDE to be performed on aerospace vehicles.

Wilson, William C.↗

GPS/MEMS IMU/Microprocessor Board for Navigation

A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

Gender, Thomas K.↗

Alignment Jig for the Precise Measurement of THz Radiation

A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

Javadi, Hamid H.↗

Modeling the Meteoroid Environment Far from the Ecliptic Plane

NASA's Meteoroid Engineering Model (MEM) is a piece of software that describes the meteoroid environment encountered by spacecraft in the inner solar system. MEM's algorithms take advantage of the fact that the vast majority of spacecraft remain close to the ecliptic plane in order to make several simplifying assumptions. However, this results in a model that cannot describe the environment for spacecraft such as Ulysses that travel far from the ecliptic, and limits the potential to validate the model using impact signatures from asteroids on inclined orbits. We present a new version of the code, numbered 3.1-alpha, that correctly computes the meteoroid flux and directionality far from the ecliptic, and compare our results with zodiacal light data.

Althea Moorhead↗

The MEMS Knudsen Compressor as a Vacuum Pump for Space Exploration Applications

Several lander, probe and rover missions currently under study at the Jet Propulsion Laboratory (JPL) and especially in the Microdevices Laboratory (MDL) Center for Space Microelectronics Technology, focus on utilizing microelectromechanical systems (MEMS) based instruments for science data gathering. These small instruments and NASA's commitment to "faster, better, cheaper" type missions has brought about the need for novel approaches to satisfying mission requirements. Existing in-situ instrument systems clearly lack novel and integrated methods for satisfying their vacuum needs. One attractive candidate for a MEMS vacuum pump is the Knudsen Compressor, which operates based on thermal transpiration. Thermal transpiration describes gas flows induced by temperature differences maintained across orifices, porous membranes or capillary tubes under rarefied conditions. This device has two overwhelmingly attractive features as a MEMS vacuum pump - no moving parts and no fluids. An initial estimate of a Knudsen Compressor's pumping power requirements for a surface atmospheric sampling task on Mars is less than 80 mW, significantly below than alternative pumps. Due to the relatively low energy use for this task and the applicability of the Knudsen Compressor to other applications, the development of a Knudsen Compressor utilizing MEMS fabrication techniques has been initiated. This paper discusses the initial fabrication of a single-stage MEMS Knudsen Compressor vacuum pump, provides performance criteria such as pumping speed, size, energy use and ultimate pressure and details vacuum pump applications in several MDL related in-situ instruments.

Vargo, S. E.↗

Performance Thresholds for Application of MEMS Inertial Sensors in Space

We review types of inertial sensors available and current usage of inertial sensors in space and the performance requirements for these applications. We then assess the performance available from micro-electro-mechanical systems (MEMS) devices, both in the near and far term. Opportunities for the application of these devices are identified. A key point is that although the performance available from MEMS inertial sensors is significantly lower than that achieved by existing macroscopic devices (at least in the near term), the low cost, low size, and power of the MEMS devices opens up a number of applications. In particular, we show that there are substantial benefits to using MEMS devices to provide vibration, and for some missions, attitude sensing. In addition, augmentation for global positioning system (GPS) navigation systems holds much promise.

Smit, Geoffrey N.↗

An Overview of NASA Glenn Research Center's Antenna R&D and Technology Efforts

This viewgraph presentation provides an overview of antenna research and design efforts being performed at NASA's Glenn Research Center. The following type of antenna research projects are discussed: phased array antennas, thin film ferroelectric reflectarray antenna, microelectromechanical systems (MEMs) based antennas and multi-beam antennas. Project overviews, design issues and research problems for each type of antenna system are covered. Additional topics reviewed included: communication systems of the future and a facility description.

Miranda, Felix A.↗

Electrothermal Micromirror Adaptive Illumination

As part of the Cyclotron Road program, Helux Lighting aimed to develop a highly adaptive illumination source based on microelectromechanical system (MEMS) technology and next-generation solid state lighting. Solid state lighting has caused a paradigm shift in the industry. Developing systems that put light only where it is needed can reduce energy consumption and have an impact on the well-being of the population by eliminating glare and wasted light. Full control could also reduce the disruption of sensitive ecosystems caused by light pollution. The most advanced fixtures available today are based on mechanical components that are bulky and expensive. The track light is the only inexpensive lighting system that permits redirection and, in some cases, spot size by motorized optical components. The most advanced light fixtures today are composed of a strategically arranged array of LEDs. More recent developments in the research community include dynamic liquid crystal lenses but fail to realize simultaneous dynamic steering and spot size. In this project, Helux worked on the capability development of their controllable micromirror combined with state-of-the-art solid state lighting to electronically adjusting light position, brightness, and illumination area.

42 ENGINEERING↗

JTEC Panel report on microelectromechanical systems in Japan

This report summarizes recent activities in the development of microelectromechanical systems (MEMS) in Japan. For the purposes of this study, 'MEMS' means batch-fabricated miniature devices that convert physical parameters to or from electrical signals and that depend on mechanical structures or parameters in important ways for their operation. The report covers advanced materials and process technology; sensors and sensing microstructures; microactuators and actuation mechanisms; sensor-circuit integration and system partitioning; advanced packaging, microassembly, and testing technologies; and MEMS design techniques, applications, and infrastructure. The panel found that Japanese industry is emphasizing approaches to MEMS that are similar to those taken by U.S. industry (i.e., approaches based on silicon integrated-circuit technology); these efforts are comparable in their level of development to those in the United States. However, the ten-year, $250 million, MITI-sponsored program in micromachines emphasizes the miniaturization of more traditional (nonlithographic) machining processes, an area in which there is no comparable U.S. effort. Packaging technology and applications for batch-fabricated MEMS devices is considered a major challenge in both countries. The panel concluded that these and other issues will require global leadership and international cooperation to realize the benefits of MEMS in a timely way.

Wise, Kensall D.↗

Variable Emissivity Through MEMS Technology

This paper discusses a new technology for variable emissivity (vari-e) radiator surfaces, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems. All spacecraft rely on radiative surfaces to dissipate waste heat. These radiators have special coatings, typically with a low solar absorptivity and a high infrared-red emissivity, that are intended to optimize performance under the expected heat load and thermal sink environment. The dynamics of the heat loads and thermal environment make it a challenge to properly size the radiator and often require some means of regulating the heat rejection rate of the radiators in order to achieve proper thermal balance. Specialized thermal control coatings, which can passively or actively adjust their emissivity offer an attractive solution to these design challenges. Such systems would allow intelligent control of the rate of heat loss from a radiator in response to heat load and thermal environmental variations. Intelligent thermal control through variable emissivity systems is well suited for nano and pico spacecraft applications where large thermal fluctuations are expected due to the small thermal mass and limited electric resources. Presently there are three different types of vari-e technologies under development: Micro ElectroMechanical Systems (MEMS) louvers, Electrochromic devices, and Electrophoretic devices. This paper will describe several prototypes of micromachined (MEMS) louvers and experimental results for the emissivity variations measured on theses prototypes. It will further discuss possible actuation mechanisms and space reliability aspects for different designs. Finally, for comparison parametric evaluations of the thermal performances of the new vari-e technology and standard thermal control systems are presented in this paper.

Darrin, Ann Garrison↗

Demonstration of a 1-D Submillimeter-Wave Phased Array with MEMS Phase Shifters

At submillimeter-wave frequencies, due to the nonavailability of low-loss phase shifters, electronic antenna beam scanning is difficult to realize. Traditionally, power-hungry and bulky motors are used to mechanically scan the antenna beam. At lower-frequencies, phased array antennas are most commonly used where low-loss phase shifters are used with the array elements to accomplish beam steering. However, development of similar phased array antennas at submillimeter-waves has been challenging. Recently, we have developed a low-loss microelectromechanical systems (MEMS) based phased shifter in the 500-750 GHz band. In this work, we present a submillimeter-wave phased array antenna system with a cavity-backed double slot antenna architecture using the MEMS-based phase shifters. To demonstrate the concept, we developed two arrays: first one is a 8×1 linear antenna array with a fixed waveguide feeding network that achieved ±20◦ beam scanning, 18 dB directivity, and less than 1 dB scan loss over the design frequency of 500–570 GHz. The second one is a 4 × 1 linear antenna array with integrated MEMS-based phase shifters on each array element, achieving 15 dB directivity and capable of dynamic beam scanning over a range of ±9 ◦ . All the plots presented are simulated results since the parts are currently being fabricated. We hope to have access to our assembly and measurement facilities over the next few months and present measured performances at the conference.

Chattopadhyay, G.↗

Printed Antennas Made Reconfigurable by Use of MEMS Switches

A class of reconfigurable microwave antennas now undergoing development comprise fairly conventional printed-circuit feed elements and radiating patches integrated with novel switches containing actuators of the microelectromechanical systems (MEMS) type. In comparison with solid-state electronic control devices incorporated into some prior printed microwave antennas, the MEMS-based switches in these antennas impose lower insertion losses and consume less power. Because the radio-frequency responses of the MEMS switches are more nearly linear, they introduce less signal distortion. In addition, construction and operation are simplified because only a single DC bias line is needed to control each MEMS actuator.

Simons, Rainee N.↗

Advanced RF Front End Technology

The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.

Herman, M. I.↗

MEMS Device Being Developed for Active Cooling and Temperature Control

High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) is currently under development at the NASA Glenn Research Center to meet this need. It uses a thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface. The device can be used strictly in the cooling mode, or it can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly are accomplished by wet etching and wafer bonding techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces and limited failure modes, and minimal induced vibration.

Moran, Matthew E.↗