Development of Surface Grain Relief on Self-Ion Irradiated Copper
The development of surface grain relief has been observed on self-ion irradiated pure polycrystalline copper. However, the mechanistic origin of this feature has yet to be determined. Two possible mechanisms, anisotropic creep relaxation of void swelling induced stresses and crystallographic orientation-dependent sputtering rate differences, are being investigated as the cause of this evolution. This work focuses on characterizing the surface development and investigating the mechanism of orientation-dependent sputtering. Based on the conditions under which these specimens were irradiated, preferential sputtering is not likely to be the cause of the observed grain relief. Surface grain relief can greatly influence the ability to non-destructively detect irradiation-induced effects in polycrystalline metals. Determining the origin of grain relief development is necessary before this surface feature can be used an indicator of irradiation-induced effects in pure copper and other alloys. The development of surface grain relief has been observed on self-ion irradiated pure polycrystalline copper irradiated to 100 dpa. This surface feature was first noted by measuring samples using transient grating spectroscopy and later confirmed using scanning electron microscopy. Calculations of single-crystal sputtering rates show that the difference in sputtering yields between a randomly-oriented solid and a low-index plane is not sufficient to account for the observed height difference. SEM images appear to show a maximum step-height difference of around 100 nm and differential sputtering can only account for differences on the order of 10 nm at most. This determination indicates that anisotropic creep relaxation may be the mechanistic origin of the observed surface features. If this is the case, which will be confirmed by future work, then TG spectroscopy may be an effective tool for the determination of the onset of certain radiation-damage evolution. For example, if the onset of creep relaxation is strongly correlated to a specific level of void swelling and if the surface features present as a result of creep relaxation can be observed using TG spectroscopy, then accurate determinations of particular levels of void swelling may be made. (authors)