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At least 1,531 records · Page 85

Drag reduction of the Space Shuttle

Wind-tunnel and water-tunnel experiments are conducted to determine which factors contribute to the base-pressure drag experienced by the Space Shuttle Orbiter. Testing is conducted on a 4.05-percent scale model in the TAMU Water Tunnel and Low Speed Wind Tunnel with passive near-wake flow-modification devices attached in some of the tests. The devices are evaluated on the basis of effectiveness in terms of increasing the base pressure. Base pressures increase when a base cavity is introduced; a smooth cavity increases pressure by 13 percent, and when v-grooves are introduced into the cavity the pressure increases by 19 percent. When the v-groove base cavity is combined with a fairing plate, the total base pressure reaches 25 percent. The experimental results suggest that the base drag of the Space Shuttle Orbiter can be effectively reduced by the use of a base-cavity mechanism.

Ahmed, Anwar↗

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗

Modification, static testing and delivery of one servoactuator

The development and performance testing of a servoactuator device are discussed. The detailed information includes the following: (1) modification description, (2) test data to include analyses, test procedures, and test data, (3) conclusions, and (4) recommendations. Diagrams of the servoactuator and photographs of the test equipment are presented. Descriptions of optimized system configurations are developed.

Hart, K. E.↗

Test-vehicle cycle programmer

Instrument reduces manpower needed for testing electric powered vehicles. Device has dual scale that allows operator to compare actual speed with preprogrammed test speed. Features include large meter, buzzer, packaging to allow ready interchange of memories with different profiles, small size, minimal current drain, and reverse supply voltage protection.

Lesco, D. J.↗

CCDs and photon counting devices: Applications in space and from the ground

The development of the 2048 by 2048 CCD (Charge Coupled Device) for a second generation space telescope instrument has resulted in devices with very few defects, dark currents of less than 12 electrons/pixel/hour at -80 deg, readout noise levels of less than 4 electrons rms, and excellent charge transfer efficiency at signal levels of less than 10 electrons. A second generation of devices that capitalize on these characteristics have been produced and are currently in test. Faster frame transfer devices that preserve these characteristics have been designed that include tridirectional taps in the serial register. The state of the art in CCD's as photon counting detectors is reviewed.

Delamere, W. A.↗

The Use of Immersion Rigs for High Temperature Hydrogen Exposure Testing Within the Nuclear Thermal Rocket Element Environmental Simulator (NTREES): NTREES-5 Hydrogen Heat Exchanger (N5HHX-01)

The Nuclear Thermal Rocket Element Environmental Simulator (NTREES) facility at NASA’s Marshall Space Flight Center (MSFC) subjects materials and components typically found on nuclear thermal propulsion (NTP) systems to non-nuclear simulations of prototypic NTP reactor thermohydraulic environments. With 1.2 MW of inductive power available, the currently employed methods to simulate nuclear heating in NTREES consist of 1) inductively heating a test specimen, which typically cannot be performed on ceramic materials, or 2) heating gas that envelops the test specimen. The latter of these has provided a basis for developing so-called “immersion rigs” to be used in NTREES. Furthermore, immersion rigs are especially useful in the case of smaller, technically challenging test specimens. One such device, the “NTREES-5 Hydrogen Heat Exchanger” (N5HHX-01), designed and deployed to test small material coupons to ~0.5 g/s of 2800 K, 500 psi Hydrogen, is discussed herein. To achieve this desired delivery temperature level, the most suitable material for the N5HHX’s construction was pure tungsten, which imposed budgetary and manufacturing challenges. Also discussed in this paper is the design of the N5HHX rig’s sample container, which became the first iteration of improving NTREES small material coupon test operations by permitting rapid changeout of different material samples.

Reactor Testing↗

Testing of ROMPS robot mechanical interfaces and compliant device

The Robot Operated Materials Processing System (ROMPS) has been developed at Goddard Space Flight Center (GSFC) under a flight project to investigate commercially promising in-space material processes and to design reflyable robot automated systems to be used in the above processes for low-cost operations. The ROMPS is currently scheduled for flight in 1994 as a Hitchhiker payload in a Get Away Special (GAS) can. An important component of the ROMPS is a three degree-of-freedom (DOF) robot which will be responsible for carrying out the required tasks of in-space processing of selected materials. This report deals with testing of the mating capability of the ROMPS robot fingers with its various mechanical interfaces. In particular, the test plan will focus on studying the capability of a compliance mechanism mounted on the robot fingers in accommodating misalignments between the robot fingers and the interfaces during the mating. The report is organized as follows: Section 2 represents the main components of the ROMPS robot and briefly describes its operations. Section 3 presents the objectives of the test and outlines the test plan. The testbed comprising a Steward Platform-based high precision manipulator and associated data acquisition and control systems is described in Section 4. Section 5 presents results of numerous experiments conducted to study the mating capability of the robot fingers with its various interfaces under misalignments. The report is concluded with observations and recommendations based on the test results.

Nguyen, Charles C.↗

Tandem Photovoltaics Core Program Final Technical Report

The Tandem Photovoltaics Core Program was a multi-year initiative aimed at advancing hybrid tandem solar cell technologies to enhance solar module efficiency beyond the limits of single junction devices. This project focused on the development, testing, and scaling of prototype photovoltaic devices, with the goal of achieving commercial relevance and driving industry adoption. The work was divided into three tasks: 1) Comparative Analysis of Tandem Technologies: This task focused on quantifying energy yield under real-world conditions and assessing economic viability of tandems relative to silicon-based modules. The project's modeling framework incorporated performance data, cost of materials, and manufacturing process impacts to optimize tandem designs 2) Tandem Integration and Prototyping: In this task, we developed innovative tandem designs by combining metal halide perovskite (MHP) top cells and silicon (Si) bottom cells. The project focuses on both mechanical integration and direct deposition techniques to enable compatibility with commercially relevant Si technologies, such as passivated contact or PERC cells. 3) Scale-up and Reliability: This task addressed the challenges of large-area fabrication by developing scalable deposition methods and robust interconnection schemes for tandems. The project looked at different accelerated testing such as thermal cycling, damp heat exposure, and potential induced degradation, to ensure long-term stability of devices in field conditions. Tandem solar cells can greatly increase module efficiency beyond conventional single junction (SJ) devices, which are approaching their theoretical limit. There are many ways to fabricate a tandem cell or module in terms of materials used, configuration, and terminal connection. This SETO core project focused critical factors in enabling tandems to enter the market, including hardware integration, technoeconomic analysis (TEA), and energy yield analysis. We focused on MHP/Si hybrid tandem solar cells and modules as a model system for their versatility in module design comparisons, providing valuable insights for other tandem options. While champion cells with areas <1cm2 are regularly demonstrated by groups around the world, it is significantly more challenging to translate these advances into modules, and fewer institutions and companies are working at the module level. This project addressed questions about module fabrication, testing, and reliability that are hard to answer without actually fabricating prototypes. We also performed analysis and road-mapping activities to understand the potential for a wider variety of tandems, including all-perovskite tandems fabricated in collaboration with the Perovskite PV core program. Detailed technical results from this project are described for each task in Section 7.

14 SOLAR ENERGY↗

Wind-Tunnel Research Comparing Lateral Control Devices Particularly at High Angles of Attack XIII : Auxiliary Airfoils Used as External Ailerons

This is the thirteenth report on a series of systematic tests comparing lateral control devices with particular reference to their effectiveness at high angles of attack. The present wind tunnel tests were made to determine the most feasible locations for lateral control surfaces mounted externally to a rectangular Clark y wing.

Weick, Fred E↗

Impact of time and space evolution of ion tracks in nonvolatile memory cells approaching nanoscale

Swift heavy ions impacting on matter lose energy through the creation of dense tracks of charges. The study of the space and time evolution of energy exchange allows understanding the single event effects behavior in advanced microelectronic devices. In particular, the shrinking of minimum feature size of most advanced memory devices makes them very interesting test vehicles to study these effects since the device and the track dimensions are comparable; hence, measured effects are directly correlated with the time and space evolution of the energy release. In this work we are studying the time and space evolution of ion tracks by using advanced non volatile memories and Monte Carlo simulations. Experimental results are very well explained by the theoretical calculations.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Autoignition test cell with flexible atmosphere control

Spontaneous combustion temperatures are usually found by simply beating material until it bursts into flames. Test cell allows control of test atmosphere and composition. Reusable device permits periodic sampling of decomposition products in test atmosphere. With modifications, cell could be used to determine melting points and reactivites of wide variety of substances.

Evans, D.↗

Pulsed response of a traveling-wave tube

The consequence of frequency-domain multiple access (FDMA) channelization in a satellite communications system is that the ground- and space-based components are often required to operate at reduced output power to prevent the generation of distortions. However, the components of a time-division multiple access (TDMA) satellite system, such as a traveling-wave tube (TWT), can operate at the highest output power because the channelization technique is relatively insensitive to the distortions resulting from saturated operation. A Hughes 30-GHz TWT was tested to determine the suitability of such a device in a TDMA system. Testing was focused on the ability of the TWT to rise up to full power at the leading edge of TDMA bursts, which were simulated by a pulse train. A Wavetek model 8502A peak power meter was used to display and measure the pulsed signal waveform. Measurements of the TWT output signal rise time indicate that the TWT lengthened the rise time by 10 to 20 nsec. Imposing a modulator turn-on time that precedes the data burst by the TWT rise time is a logical approach to coordinating the traveling-wave tube amplifier and modulator specifications.

May, Brian D.↗

Pulsed response of a TWT

The consequence of frequency domain multiple access channelization in a satellite communications system is that the ground- and space-based components often are required to operate in a linear region to prevent the generation of distortion signals. Components of a time division multiple access (TDMA) satellite system, such as a traveling-wave tube (TWT), can operate in the highest output power state because the channelization technique is relatively insensitive to the distortions resulting from saturated operation. A 30 GHz TWT was tested to determine the suitability of such a device in a TDMA system. Testing was focused on the ability of the TWT's output signal to rise up to full power at the leading edge of TDMA bursts, simulated by a pulse train. A peak power meter was used to display and measure the pulsed signal waveform. Measurements on the TWT output pulse rise time indicate that the TWT lengthened the rise time by 10 to 20 ns. Imposing modulator turn on timing that precedes the data burst by the TWT rise time is a logical approach to coordination of the two subsystem specification.

May, Brian D.↗

FY12 End of Year Report for NEPP DDR2 Reliability

This document reports the status of the NEPP Double Data Rate 2 (DDR2) Reliability effort for FY2012. The task expanded the focus of evaluating reliability effects targeted for device examination. FY11 work highlighted the need to test many more parts and to examine more operating conditions, in order to provide useful recommendations for NASA users of these devices. In order to develop these approaches, it is necessary to develop test capability that can identify reliability outliers. To do this we must test many devices to ensure outliers are in the sample, and we must develop characterization capability to measure many different parameters. For FY12 we increased capability for reliability characterization and sample size. We increased sample size by moving from loose devices to DIMMs with an approximate reduction of 20 to 50 times in terms of per DUT cost. By increasing sample size we have improved our ability to characterize devices that may be considered reliability outliers. This report provides an update on the effort to improve DDR2 testing capability. Although focused on DDR2, the methods being used can be extended to DDR and DDR3 with relative ease.

temperature stress↗

Evaluation of crystal oscillators and frequency dividers for high temperature operation

Active and passive components of crystal oscillators and frequency dividers were tested to determine their performance at temperatures from 300 C to 350 C. The properties of GaAs JFETs were determined and their performance compared with that of silicon devices. Techniques for constructing breadboard circuits were assessed for operation in this temperature range. A Pierce oscillator and a multivibrator (Colorado crystal) oscillator were constructed and tested. Device failures are discussed.

Source record↗

Design, Qualification and Integration Testing of the High-Temperature Resistance Temperature Device for Stirling Power System

The Advanced Stirling Radioisotope Generator (ASRG), developed from 2006 to 2013 under the joint sponsorship of the United States Department of Energy (DOE) and National Aeronautics and Space Administration (NASA) to provide a high-efficiency power system for future deep space missions, employed Sunpower Incorporated's Advanced Stirling Convertors (ASCs) with operating temperature up to 840 C. High-temperature operation was made possible by advanced heater head materials developed to increase reliability and thermal-to-mechanical conversion efficiency. During a mission, it is desirable to monitor the Stirling hot-end temperature as a measure of convertor health status and assist in making appropriate operating parameter adjustments to maintain the desired hot-end temperature as the radioisotope fuel decays. To facilitate these operations, a Resistance Temperature Device (RTD) that is capable of high-temperature, continuous long-life service was designed, developed and qualified for use in the ASRG. A thermal bridge was also implemented to reduce the RTD temperature exposure while still allowing an accurate projection of the ASC hot-end temperature. NASA integrated two flight-design RTDs on the ASCs and assembled into the high-fidelity Engineering Unit, the ASRG EU2, at Glenn Research Center (GRC) for extended operation and system characterization. This paper presents the design implementation and qualification of the RTD, and its performance characteristics and calibration in the ASRG EU2 testing.

Deep Space↗

On-PIC Light Source Integration & Micro-dispensing of Solder Paste for Flip Chip Application

To reach the next level benefits of photonic integrated circuits (PICs), the Integrated Photonic Systems Roadmap-International describes the necessity of either heterogeneous or hybrid integration of light sources [1]. A new approach for hybrid integration is Photonic Wire Bonding where 3D nanolithography is used to pattern a polymer waveguide that connects light sources to PIC waveguides. The waveguides resemble electrical wire bonds and essentially do the same as their electrical counterpart for packaging photonic chips together. In order to reap the full benefits of a photonic wire bonds, the light source must be carefully packaged. In this work I seek to expand RIT’s photonic packaging capability by establishing a packaging process to integrate light sources, specifically an Indium Phosphide distributed feedback lasers and a reflective semiconductor optical amplifiers, directly onto a photonic integrated circuits. Another necessary requirement for PIC packaging is densely integrated electrical connectivity. In this thesis I developed a fine pitch flip chip interconnect technique demonstrated using gold stud bumps in conjunction with micro-dispensed solder paste. This work opens the door to high density photonic flip chip applications. The micro-dispensed solder paste dots having diameters 50-125 µm are currently being tested at a pitch of 150 µm . The gold stud bumps are formed with 1mil gold wire creating bumps with a diameter of 40-60 µm depending on specific parameter values. These capabilities will allow RIT to assemble and test novel photonic integrated devices, cutting down on the time and cost associated with third party assembly and tests facilities. Thereby keeping RIT at the forefront of photonic research.

Wongk, Nicole↗