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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Nanofiber electrocatalyst

A nanofibrous catalyst for in the electrolyzer and methods of making the catalyst. The catalysts are composed of highly porous transition metal carbonitrides, metal oxides or perovskites derived from the metal-organic frameworks and integrated into a 3D porous nano-network electrode architecture. The catalysts are low-cost, highly active toward OER, with excellent conductivity yet resistant to the oxidation under high potential operable under both acidic and alkaline environments.

Liu, Di-Jia↗
DOE OSTI2024

Nanofiber electrocatalyst

A nanofibrous catalyst for in the electrolyzer and methods of making the catalyst. The catalysts are composed of highly porous transition metal carbonitrides, metal oxides or perovskites derived from the metal-organic frameworks and integrated into a 3D porous nano-network electrode architecture. The catalysts are low-cost, highly active toward OER, with excellent conductivity yet resistant to the oxidation under high potential operable under both acidic and alkaline environments.

Liu, Di-Jia↗
NASA NTRS2013

Pushing the Limits of Cubesat Attitude Control: A Ground Demonstration

A cubesat attitude control system (ACS) was designed at the NASA Marshall Space Flight Center (MSFC) to provide sub-degree pointing capabilities using low cost, COTS attitude sensors, COTS miniature reaction wheels, and a developmental micro-propulsion system. The ACS sensors and actuators were integrated onto a 3D-printed plastic 3U cubesat breadboard (10 cm x 10 cm x 30 cm) with a custom designed instrument board and typical cubesat COTS hardware for the electrical, power, and data handling and processing systems. In addition to the cubesat development, a low-cost air bearing was designed and 3D printed in order to float the cubesat in the test environment. Systems integration and verification were performed at the MSFC Small Projects Rapid Integration & Test Environment laboratory. Using a combination of both the miniature reaction wheels and the micro-propulsion system, the open and closed loop control capabilities of the ACS were tested in the Flight Robotics Laboratory. The testing demonstrated the desired sub-degree pointing capability of the ACS and also revealed the challenges of creating a relevant environment for development testin

Sanders, Devon S.↗
NASA NTRS1998

Recent Advances in Visualizing 3D Flow with LIC

Line Integral Convolution (LIC), introduced by Cabral and Leedom in 1993, is an elegant and versatile technique for representing directional information via patterns of correlation in a texture. Although most commonly used to depict 2D flow, or flow over a surface in 3D, LIC methods can equivalently be used to portray 3D flow through a volume. However, the popularity of LIC as a device for illustrating 3D flow has historically been limited both by the computational expense of generating and rendering such a 3D texture and by the difficulties inherent in clearly and effectively conveying the directional information embodied in the volumetric output textures that are produced. In an earlier paper, we briefly discussed some of the factors that may underlie the perceptual difficulties that we can encounter with dense 3D displays and outlined several strategies for more effectively visualizing 3D flow with volume LIC. In this article, we review in more detail techniques for selectively emphasizing critical regions of interest in a flow and for facilitating the accurate perception of the 3D depth and orientation of overlapping streamlines, and we demonstrate new methods for efficiently incorporating an indication of orientation into a flow representation and for conveying additional information about related scalar quantities such as temperature or vorticity over a flow via subtle, continuous line width and color variations.

Interrante, Victoria↗
DOE OSTI2023

Correlating viscosity and die swell in 3D printing of polyphenylsulfone: A thermo-mechanical optimization modus operandi

Additive manufacturing (AM) of polyphenylsulfone (PPSU), an amorphous high-performance polymer (HPP), has shown promise in exhibiting structural integrity for many applications. With thermoplastic material extrusion 3D printing, parts consisting of layered melts exhibited voids, where the adhesion quality and void size depend on the processing parameters implemented during printing. However, the structure-process-property (SPP) relationships between the thermal properties and rheological and mechanical behavior of AM PPSU are poorly understood. Here, in this study, a comprehensive analysis of the thermal, thermo-mechanical, and layer-by-layer build-up of PPSU is investigated and correlated with viscosity and extrudate die swell behavior with void fraction volume as confirmed by high-resolution x-ray computed tomography (XCT). Gas chromatography–mass spectrometry (GC–MS) pyrolysis confirmed PPSU composition and degradation at 480 °C, consistent with thermo-gravimetric analysis TGA. A 141% difference in viscosity was observed when processing temperatures increased from 350 °C to 400 °C. Likewise, extrudate die swell decreased with increasing temperatures, resulting in a 17% difference. Tensile and compressive properties confirmed that higher extruding temperatures resulted in lower porosity and higher mechanical strength. In general, higher extruding temperatures lower the viscosity to allow for stronger cohesion between layers; however, increasing the temperature too high results in a below unity extrudate die swell, reducing mechanical properties. Therefore, to optimize the mechanical integrity of 3D printed amorphous PPSU parts, an increase in the viscosity, near unity of the extrudate die swell, and tempered extrusion temperature are needed.

36 MATERIALS SCIENCE↗
NASA NTRSDate not supplied

Celestial Mapping System and Digital Lunar Library Initiative

We are preparing to create an interactive, global 3D lunar environment with integrated dataset and AI/ML tools to provide unique value to mission planners, scientists and the entire lunar community. This lunar environment will be based on NASA Ames Celestial Mapping System (CMS) [1] and Digital Lunar Library (DLL) Initiative. CMS provides a 3D virtual Lunar Globe with extensive user friendly tool sets, that include high resolution terrain visualization, elevation profiles, measurement kits, slope analysis, path optimization, line of sight analysis, equipment planning and placement tools and many other functionalities [1]. It has a thick client with less overhead to access hardware resources. This allows features such as terrain profiling and distance calculations to be performed on the client and on the fly. The application is developed to provide situational and domain awareness on the Lunar surface, planning capabilities for equipment placements and traverse path optimization. As data becomes available, CMS has the capabilities to integrate data sets that change dynamically in real-time, which will be useful for monitoring satellites and remotely-sensed data on the Lunar surface. CMS supports importing synthetic features in a variety of 3D, 2D, vector and raster formats. In the future, these capabilities will be enhanced by incorporating AI/ML tools and a plug-in architecture to enable customization by the user groups. With the help of DLL we will be able to : 1) Amplify the value of lunar information with AI-powered data enhancements 2) Acquire and integrate lunar data with AI-assisted georectification and homogenization 3) Analyze lunar data with advanced 3D visualization, intelligent search-by-example 4) Apply lunar data insights to specific use cases with an open plug-in architecture. The CMS-DLL initiative will have several potential use cases for NASA and the lunar community in general, including subsurface lava tube visualization and analysis, soil analysis, in-situ lunar resource visualization and representation on 3D globe, and data analytics for utilization. REFERENCES: [1] https://celestial.arc.nasa.gov/

3D Globe↗
NASA NTRS2015

3D Printing Multi-Functionality: Embedded RF Antennas and Components

Significant research and press has recently focused on the fabrication freedom of Additive Manufacturing (AM) to create both conceptual models and final end-use products. This flexibility allows design modifications to be immediately reflected in 3D printed structures, creating new paradigms within the manufacturing process. 3D printed products will inevitably be fabricated locally, with unit-level customization, optimized to unique mission requirements. However, for the technology to be universally adopted, the processes must be enhanced to incorporate additional technologies; such as electronics, actuation, and electromagnetics. Recently, a novel 3D printing platform, Multi3D manufacturing, was funded by the presidential initiative for revitalizing manufacturing in the USA using 3D printing (America Makes - also known as the National Additive Manufacturing Innovation Institute). The Multi3D system specifically targets 3D printed electronics in arbitrary form; and building upon the potential of this system, this paper describes RF antennas and components fabricated through the integration of material extrusion 3D printing with embedded wire, mesh, and RF elements.

antennas↗
DOE OSTI2023

Direct Ink-Write Printing of Ceramic Clay with an Embedded Wireless Temperature and Relative Humidity Sensor

This research presents a simple method to additively manufacture Cone 5 porcelain clay ceramics by using the direct ink-write (DIW) printing technique. DIW has allowed the application of extruding highly viscous ceramic materials with relatively high-quality and good mechanical properties, which additionally allows a freedom of design and the capability of manufacturing complex geometrical shapes. Clay particles were mixed with deionized (DI) water at different ratios, where the most suitable composition for 3D printing was observed at a 1:5 w/c ratio (16.2 wt.%. of DI water). Differential geometrical designs were printed to demonstrate the printing capabilities of the paste. In addition, a clay structure was fabricated with an embedded wireless temperature and relative humidity (RH) sensor during the 3D printing process. The embedded sensor read up to 65% RH and temperatures of up to 85 °F from a maximum distance of 141.7 m. The structural integrity of the selected 3D printed geometries was confirmed through the compressive strength of fired and non-fired clay samples, with strengths of 70 MPa and 90 MPa, respectively. This research demonstrates the feasibility of using the DIW printing of porcelain clay with embedded sensors, with fully functional temperature- and humidity-sensing capabilities.

42 ENGINEERING↗
NASA NTRS2010

Fabrication of Single, Vertically Aligned Carbon Nanotubes in 3D Nanoscale Architectures

Plasma-enhanced chemical vapor deposition (PECVD) and high-throughput manufacturing techniques for integrating single, aligned carbon nanotubes (CNTs) into novel 3D nanoscale architectures have been developed. First, the PECVD growth technique ensures excellent alignment of the tubes, since the tubes align in the direction of the electric field in the plasma as they are growing. Second, the tubes generated with this technique are all metallic, so their chirality is predetermined, which is important for electronic applications. Third, a wafer-scale manufacturing process was developed that is high-throughput and low-cost, and yet enables the integration of just single, aligned tubes with nanoscale 3D architectures with unprecedented placement accuracy and does not rely on e-beam lithography. Such techniques should lend themselves to the integration of PECVD grown tubes for applications ranging from interconnects, nanoelectromechanical systems (NEMS), sensors, bioprobes, or other 3D electronic devices. Chemically amplified polyhydroxystyrene-resin-based deep UV resists were used in conjunction with excimer laser-based (lambda = 248 nm) step-and-repeat lithography to form Ni catalyst dots = 300 nm in diameter that nucleated single, vertically aligned tubes with high yield using dc PECVD growth. This is the first time such chemically amplified resists have been used, resulting in the nucleation of single, vertically aligned tubes. In addition, novel 3D nanoscale architectures have been created using topdown techniques that integrate single, vertically aligned tubes. These were enabled by implementing techniques that use deep-UV chemically amplified resists for small-feature-size resolution; optical lithography units that allow unprecedented control over layer-to-layer registration; and ICP (inductively coupled plasma) etching techniques that result in near-vertical, high-aspect-ratio, 3D nanoscale architectures, in conjunction with the use of materials that are structurally and chemically compatible with the high-temperature synthesis of the PECVD-grown tubes. The techniques offer a wafer-scale process solution for integrating single PECVD-grown nanotubes into novel architectures that should accelerate their integration in 3D electronics in general. NASA can directly benefit from this technology for its extreme-environment planetary missions. Current Si transistors are inherently more susceptible to high radiation, and do not tolerate extremes in temperature. These novel 3D nanoscale architectures can form the basis for NEMS switches that are inherently less susceptible to radiation or to thermal extremes.

Kaul, Anupama B.↗
DOE OSTI2023

System and method for integrated absorber intercooling via rich solvent stream using 3D-printed active packings

The present disclosure relates to an absorber column apparatus for removing a selected component of a gas. The apparatus may have a first zone, a second zone and a third zone, wherein the first and third zones form a first domain through which a first fluid laden with a select gaseous component to be removed therefrom flows along concurrently with a second fluid. The second fluid at least substantially removes the select gaseous component from the first fluid to create a third fluid. The first fluid leaves the absorber column as a fourth fluid with the select gaseous component at least substantially removed therefrom. The second zone forms an active packing zone including a structure which forms an independent second domain in thermal communication with the first domain. The second receives a quantity of the third fluid and channels it through the second zone to help cool at least one of the first and second fluids.

Moore, Thomas Charles Reading↗
NASA NTRS2005

Computational Simulation of Damage Propagation in Three-Dimensional Woven Composites

Three dimensional (3D) woven composites have demonstrated multi-directional properties and improved transverse strength, impact resistance, and shear characteristics. The objective of this research is to develop a new model for predicting the elastic constants, hygrothermal effects, thermomechanical response, and stress limits of 3D woven composites; and to develop a computational tool to facilitate the evaluation of 3D woven composite structures with regard to damage tolerance and durability. Fiber orientations of weave and braid patterns are defined with reference to composite structural coordinates. Orthotropic ply properties and stress limits computed via micromechanics are transformed to composite structural coordinates and integrated to obtain the 3D properties. The various stages of degradation, from damage initiation to collapse of structures, in the 3D woven structures are simulated for the first time. Three dimensional woven composite specimens with various woven patterns under different loading conditions, such as tension, compression, bending, and shear are simulated in the validation process of this research. Damage initiation, growth, accumulation, and propagation to fracture are included in these simulations.

Huang, Dade↗
DOE OSTI2024

High Precision, High Frequency Printed Antennas

An emerging trend in advanced manufacturing is printed electronics and sensors. The ability to print customized electronics and sensors integrated into functional packages is a growing need within a variety of growing markets such as smart manufacturing, internet of things (IoT), and the small satellite industry. Both Oak Ridge National Laboratory (ORNL) and the MITRE Corporation have seedling research efforts evaluating the potential for future printed electronic systems. High frequency, wide-bandwidth phased array antennas (i.e. >45 GHz) open the door to new applications. However, such sensors require currently prohibitively small feature sizes for commercial 3D printing technologies along with increasing challenges with connecting the driving electronics to such features. An additional finding with related advanced manufacturing challenges is the rapid production of 3D additive connectors for integration with commercial printed circuit boards (PCBs), primarily for advanced in-circuit inspection techniques. This work is developing additive manufacturing processes for producing connected and conductive fine scale 3D features. The primary focus was on aerosol-jet printing (AJP), which has a small minimum resolution (<50 µm) but is traditionally printed flat with small height/width aspect ratios <<1, and developing controls to enable fully 3D, high aspect ratio, and unsupported features. In Phase 1 of this effort, baselines of process performance were characterized, and test coupons produced for both ultra-high frequency antennas and microstructures to support reverse engineering of PCBs. In Phase 2, these efforts will be extended for system demonstration of ultra-high frequency antenna arrays, as well as reverse engineering circuitry for dense PCBs.

42 ENGINEERING↗
NASA NTRS2012

A Large-Scale Design Integration Approach Developed in Conjunction with the Ares Launch Vehicle Program

This paper presents a method for performing large-scale design integration, taking a classical 2D drawing envelope and interface approach and applying it to modern three dimensional computer aided design (3D CAD) systems. Today, the paradigm often used when performing design integration with 3D models involves a digital mockup of an overall vehicle, in the form of a massive, fully detailed, CAD assembly; therefore, adding unnecessary burden and overhead to design and product data management processes. While fully detailed data may yield a broad depth of design detail, pertinent integration features are often obscured under the excessive amounts of information, making them difficult to discern. In contrast, the envelope and interface method results in a reduction in both the amount and complexity of information necessary for design integration while yielding significant savings in time and effort when applied to today's complex design integration projects. This approach, combining classical and modern methods, proved advantageous during the complex design integration activities of the Ares I vehicle. Downstream processes, benefiting from this approach by reducing development and design cycle time, include: Creation of analysis models for the Aerodynamic discipline; Vehicle to ground interface development; Documentation development for the vehicle assembly.

Redmon, John W.↗
DOE OSTI2024

Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing

Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling losses must be low in deployed systems. Previously, we developed the subsurface controllable refractive index via beam exposure (SCRIBE) technique to write accurate 3D gradient refractive index (GRIN) profiles within a mesoporous silica scaffold. Here, we apply SCRIBE to fabricate low loss, broadband, polarization insensitive, fiber-coupled, single-mode volumetric interconnects that include waveguides traversing arbitrary 3D paths. By seamlessly integrating mode-matching subsurface lenses and GRIN waveguide tapers, calibrating for positional writing errors, implementing multipass exposure, automating alignment, and switching to antireflection coated fibers, we reduced the insertion loss for a fiber-PIC-fiber interconnect from 50 to 2.14 dB, or 1.47 dB, excluding the fiber array’s loss. Further, we establish an upper bound of 0.45 dB loss per coupler. We report quality factors of 27,000 and 77,000 and bending losses of 6 and 3 dB/cm for 15 and 30 µm radii microrings, respectively. We also demonstrate Bézier escalators, polarization-rotating and polarization-splitting interconnects, and a seven-channel 25 µm pitch volumetric interconnect. The SCRIBE platform presents a clear path toward realizing 3D PICs with unique functionality.

Optics↗
DOE OSTI2021

Engineered Silicon Carbide Three-Dimensional Frameworks through DNA-Prescribed Assembly

The ability to create nanoengineered silicon carbide (SiC) architectures is important for the diversity of optical, electronic, and mechanical applications. Here, we report a fabrication of periodic three-dimensional (3D) SiC nanoscale architectures using a self-assembled and designed 3D DNA-based framework. The assembly is followed by the templating into silica and subsequent conversion into SiC using a lower temperature pathway (<700 °C) via magnesium reduction. The formed SiC framework lattice has a unit size of about 50 nm and domains over 5 μm, and it preserves the integrity of the original 3D DNA lattice. The spectroscopic and electron microscopy characterizations reveal SiC crystalline morphology of 3D nanoarchitectured lattices, whereas electrical probing shows 2 orders of magnitude enhancements of electrical conductivity over the precursor silica framework. The reported approach offers a versatile methodology toward creating highly structured and spatially prescribed SiC nanoarchitectures through the DNA-programmable assembly and the combination of templating processes.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
NASA NTRS2003

13RC and and 3DRT Working Group of IRC: Status and Plans

We summarize recent activities of the International Intercomparison of 3D Radiation Codes (DRC), including development of an open source code, approximation methods for use in cloud dynamical models, and cloud reconstructions from multiple satellite platforms such as MODIS, MISR and ICESat. We also discuss the charter of the newly formed 3DRT Working Group of the International Radiation Commission, which hopes to coordinate and integrate efforts in various 3D application areas, including clouds, sea ice, and vegetation. Finally we describe plans for a special 3D session at the next International Radiation Symposium in Busan Korea, during 23-30 August 2004.

Cahalan, Robert↗
DOE OSTI2020

Understanding and mitigating process drift in aerosol jet printing

Aerosol jet printing offers a versatile, high-resolution prototyping capability for flexible and hybrid electronics. Despite its rapid growth in recent years, persistent problems such as process drift hinder the adoption of this technology in production environments. Here we explore underlying causes of process drift during aerosol jet printing and introduce an engineered solution to improve deposition stability. In this work it is shown that the ink level within the cartridge is a critical factor in determining atomization efficiency, such that the reduction in ink volume resulting from printing itself can induce significant and systematic process drift. By integrating a custom 3D-printed cartridge with an ink recirculation system, ink composition and level within the cartridge are better maintained. This strategy allows extended duration printing with improved stability, as evidenced by 30 h of printing over 5 production runs. This provides an important tool for extending the duration and improving reliability for aerosol jet printing, a key factor for integration in practical manufacturing operations.

36 MATERIALS SCIENCE↗