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At least 163 records · Page 9

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure.

Perkins, K. L.↗

Adhesion between polymers and evaporated gold and nickel films

To obtain information on the adhesion between metal films and polymeric solids, the adhesion force was measured by means of a tensile pull test. It was found that the adhesion strengths between polymeric solids and gold films evaporated on polymer substrates were (1.11 + or - 0.53) multiplied by 10(6) N/M(2) on PTFE, about 5.49 multiplied by 10(6) N/m(2) on UHMWPE, and 6.54x10(6) on 6/6 nylon. The adhesion strengths for nickel films evaporated on PTFE, UHMWPE, and 6/6 nylon were found to be a factor of 1.7 higher than those for the gold coated PTFE, UHMWPE, and 6/6 nylon. To confirm quantitatively the effect of electron irradiation on the adhesion strength between a PTFE solid and metal films, a tensile pull test was performed on the irradiated PTFE specimens, which were prepared by evaporating nickel or gold on PTFE surfaces irradiated by 2-keV electrons for various times. After irradiation, the adhesion strength increased to (4.92 + or - 0.92)x10(6) N/m(2) for nickel coated PTFE and (1.82 + or - 0.48)x10(6) N/m(2) for gold coated PTFE. The improvement in adhesion for nickel is higher than that for gold.

Yamada, Y.↗

Evaluation of high temperature structural adhesives for extended service, phase 5

The evaluation of 3 experimental polymers from NASA-Langley and a commercially produced polymer from Mitsui Toatsu Chemicals as high temperature structural adhesives is presented. A polyphenylquinoxaline (PPQ), polyimide (STPI/LaRC-2), and a polyarylene ether (PAE-SO2) were evaluated as metal-to-metal adhesives. Lap shear, crack extension, and climbing drum peel specimens were fabricated from all three polymers and tested after thermal, combined thermal/humidity, and stressed hydraulic fluid (Skydrol) exposure. The fourth polymer, LARC-TPI was evaluated as an adhesive for titanium honeycomb sandwich structure. All three experimental polymers performed well as metal-to-metal adhesives from 219 K (-65 F) to 505 K (450 F), including humidity exposure. Structural adhesive strength was also maintained at 505 K for a minimum of 3000 hours. LaRC-TPI was evaluated as a high temperature (505 K) adhesive for titanium honeycomb sandwich structure. The LaRC-TPI bonding process development concentrated on improving the honeycomb core-to-skin bond. The most promising approach of those evaluated combined a LaRC-TPI polymer solution with a semi-crystalline LaRC-TPI powder for adhesive film fabrication and fillet formation.

Hendricks, C. L.↗

Development of a torsion balance for adhesion measurements

A new torsion balance for study of adhesion in ceramics is discussed. A torsion wire and a linear variable differential transformer are used to monitor load and to measure pull-off force (adhesion force). The investigation suggests that this torsion balance is valuable in studying the interfacial properties of ceramics in controlled environments such as in ultrahigh vacuum. The pull-off forces measured in dry, moist, and saturated nitrogen atmosphere demonstrate that the adhesion of silicon nitride contacts remains low at humidities below 80 percent but rises rapidly above that. The adhesion at saturation is 10 times or more greater than that below 80 percent relative humidity. The adhesion in a saturated atmosphere arises primarily from the surface tension effects of a thin film of water adsorbed on the surface. The surface tension of the water film was 58 x 10 to the minus 5 to 65 x 10 to the minus 5 power. The accepted value for water is 72.7 x 10 to the minus 5 power N/cm. Adhesion characteristics of silicon nitride in contact with metals, like the friction characteristics of silicon carbide to metal contacts, can be related to the relative chemical activity of metals in ultrahigh vacuum. The more active the metal, the higher the adhesion.

Miyoshi, Kazuhisa↗

Adhesion in ceramics and magnetic media

When a ceramic is brought into contact with a metal or a polymeric material such as a magnetic medium, strong bonds form between the materials. For ceramic-to-metal contacts, adhesion and friction are strongly dependent on the ductility of the metals. Hardness of metals plays a much more important role in adhesion and friction than does the surface energy of metals. Adhesion, friction, surface energy, and hardness of a metal are all related to its Young's modulus and shear modulus, which have a marked dependence on the electron configuration of the metal. An increase in shear modulus results in a decrease in area of contact that is greater than the corresponding increase in surface energy (the fond energy) with shear modulus. Consequently, the adhesion and friction decrease with increasing shear modulus. For ceramics in contact with polymeric magnetic tapes, environment is extremely important. For example, a nitrogen environment reduces adhesion and friction when ferrite contacts polymeric tape, whereas a vacuum environment strengthens the ferrite-to-tape adhesion and increases friction. Adhesion and friction are strongly dependent on the particle loading of the tape. An increase in magnetic particle concentration increases the complex modulus of the tape, and a lower real area of contact and lower friction result.

Miyoshi, Kazuhisa↗

Universal aspects of brittle fracture, adhesion, and atomic force microscopy

This universal relation between binding energy and interatomic separation was originally discovered for adhesion at bimetallic interfaces involving the simple metals Al, Zn, Mg, and Na. It is shown here that the same universal relation extends to adhesion at transition-metal interfaces. Adhesive energies have been computed for the low-index interfaces of Al, Ni, Cu, Ag, Fe, and W, using the equivalent-crystal theory (ECT) and keeping the atoms in each semiinfinite slab fixed rigidly in their equilibrium positions. These adhesive energy curves can be scaled onto each other and onto the universal adhesion curve. The effect of tip shape on the adhesive forces in the atomic-force microscope (AFM) is studied by computing energies and forces using the ECT. While the details of the energy-distance and force-distance curves are sensitive to tip shape, all of these curves can be scaled onto the universal adhesion curve.

Banerjea, Amitava↗

The Evaluation of High Temperature Adhesive Bonding Processes for Rocket Engine Combustion Chamber Applications

NASA Glenn Research Center is currently evaluating the possibility of using high- temperature polymer matrix composites to reinforce the combustion chamber of a rocket engine. One potential design utilizes a honeycomb structure composed of a PMR-II- 50/M40J 4HS composite facesheet and titanium honeycomb core to reinforce a stainless steel shell. In order to properly fabricate this structure, adhesive bond PMR-II-50 composite. Proper prebond surface preparation is critical in order to obtain an acceptable adhesive bond. Improperly treated surfaces will exhibit decreased bond strength and durability, especially in metallic bonds where interface are susceptible to degradation due to heat and moisture. Most treatments for titanium and stainless steel alloys require the use of strong chemicals to etch and clean the surface. This processes are difficult to perform due to limited processing facilities as well as safety and environmental risks and they do not consistently yield optimum bond durability. Boeing Phantom Works previously developed sol-gel surface preparations for titanium alloys using a PETI-5 based polyimide adhesive. In support of part of NASA Glenn Research Center, UDRI and Boeing Phantom Works evaluated variations of this high temperature sol-gel surface preparation, primer type, and primer cure conditions on the adhesion performance of titanium and stainless steel using Cytec FM 680-1 polyimide adhesive. It was also found that a modified cure cycle of the FM 680-1 adhesive, i.e., 4 hrs at 370 F in vacuum + post cure, significantly increased the adhesion strength compared to the manufacturer's suggested cure cycle. In addition, the surface preparation of the PMR-II-50 composite was evaluated in terms of surface cleanness and roughness. This presentation will discuss the results of strength and durability testing conducted on titanium, stainless steel, and PMR-II-50 composite adherends to evaluate possible bonding processes.

McCray, Daniel↗

Molecular Dynamics Simulations of Adhesion at Epoxy Interfaces

The effect of moisture on adhesives used in aerospace applications can be modeled with chemically specific techniques such as molecular dynamics simulation. In the present study, the surface energy and work of adhesion are calculated for epoxy surfaces and interfaces, respectively, by using molecular dynamics simulation. Modifications are made to current theory to calculate the work of adhesion at the epoxy-epoxy interface with and without water. Quantitative agreement with experimental values is obtained for the surface energy and work of adhesion at the interface without water. The work of adhesion agrees qualitatively with the experimental values for the interface with water: the magnitude is reduced 15% with respect to the value for the interface without water. A variation of 26% in the magnitude is observed depending on the water configuration at a concentration of 1.6 wt%. The methods and modifications to the method that are employed to obtain these values are expected to be applicable for other epoxy adhesives to determine the effects of moisture uptake on their work of adhesion.

Frankland, Sarah-Jane V.↗

Adhesion Between Volcanic Glass and Spacecraft Materials in an Airless Body Environment

The successful exploration of airless bodies, such as the Earth s moon, many smaller moons of the outer planets (including those of Mars) and asteroids, will depend on the development and implementation of effective dust mitigation strategies. The ultrahigh vacuum environment (UHV) on the surfaces of these bodies, coupled with constant ion and photon bombardment from the Sun and micrometeorite impacts (space weathering), makes dust adhesion to critical spacecraft systems a severe problem. As a result, the performance of thermal control surfaces, photovoltaics and mechanical systems can be seriously degraded even to the point of failure. The severe dust adhesion experienced in these environments is thought to be primarily due to two physical mechanisms, electrostatic attraction and high surface energies, but the dominant of these has yet to be determined. The experiments presented here aim to address which of these two mechanisms is dominant by quantifying the adhesion between common spacecraft materials (polycarbonate, FEP and PTFE Teflon, (DuPont) Ti-6-4) and a synthetic noritic volcanic glass, as a function of surface cleanliness and triboelectric charge transfer in a UHV environment. Adhesion force has been measured between pins of spacecraft materials and a plate of synthetic volcanic glass by determining the pull-off force with a torsion balance. Although no significant adhesion is observed directly as a result of high surface energies, the adhesion due to induced electrostatic charge is observed to increase with spacecraft material cleanliness, in some cases by over a factor of 10, although the increase is dependent on the particular material pair. The knowledge gained by these studies is envisioned to aid the development of new dust mitigation strategies and improve existing strategies by helping to identify and characterize mechanisms of glass to spacecraft adhesion for norite volcanic glass particles. Furthermore, the experience of the Apollo missions revealed that dust mitigation strategies must be subjected to high fidelity tests. To facilitate the effectiveness of ground-based testing of mitigation strategies, the issue of a pressure limit for high fidelity tests will be addressed.

Berkebile, Stephen↗

Reversible adhesive compositions and related methods

The disclosure relates to reversible bonded structural joints using active adhesive compositions that can allow for dis-assembly, repair, and re-assembly. The disclosure is particularly directed to the adhesive composition material, irrespective of the type of the substrate(s) being joined. The adhesive composition can include any thermoplastic adhesive material that can be remotely activated for targeted heating of just the adhesive composition (e.g., and not the surrounding substrates being joined) via the inclusion of electromagnetically excitable particles in the adhesive composition. The substrates can be any metal material, any composite material, any hybrid material, or otherwise. The disclosed adhesive compositions allow for recyclability of parts at the end of their lifetime and repair/replacement of parts during their lifetime.

36 MATERIALS SCIENCE↗

In situ mechanical characterization of a single cell-cell adhesion interface under large strain

A method of measuring a stress-strain curve in a cell-cell adhesion interface, the method including: providing a structure including a first movable island supported by a first beam, a second movable island supported by a second beam, and a gap therebetween connected by a pair of cells forming a junction, the pair of cells comprising a cell-cell adhesion interface having an initial length defined by a distance between nuclei of the pair of cells; moving the second movable island with a defined displacement; determining a displacement of the first movable island based on moving the second movable island; calculating a difference between the displacement of the first movable island and the defined displacement of the second movable island based on moving the second movable island; determining an applied strain in the cell-cell adhesion interface between the pair of cells based on the difference divided by the initial length of the cell-cell adhesion interface; calculating a force between the cell-cell adhesion interface of the pair of cells based on the displacement of the first movable island; calculating a stress in the cell-cell adhesion interface between the pair of cells based on the force; and determining the stress-strain curve of the cell-cell adhesion interface between the pair of cells by plotting the calculated stress against the applied strain.

Yang, Ruiguo↗

RF cured nanocomposite adhesives for multi-material joining applications

A method for fabricating, and curing, nanocomposite adhesives including introducing nanoheater elements into a heat-curing adhesive to fabricate a nanocomposite adhesive, and providing a radio-frequency (RF) electromagnetic wave to the nanocomposite adhesive to heat, and cure the nanocomposite adhesive. The nanocomposite adhesive is physically applied to first and second materials to bond the first and second materials upon curing of the nanocomposite adhesive, and the RF electromagnetic wave has a frequency in the radio-frequency range, having energy that is transferred to the nanoheater elements by electromagnetic wave interactions with permanent and induced dipoles, intrinsic photon-phonon interaction, or interactions with nanoheater defects and grain structures.

Zhang, Yuepeng↗

Erybraedin A is a potential Src inhibitor that blocks the adhesion and viability of non-small-cell lung cancer cells

Highlights: • Erybraedin A inhibited the adhesion of lung cancer cells to fibronectin. • Erybraedin A suppressed the activation of Src and its downstream targets. • Erybraedin A inhibited the interaction between integrin β1 or integrin β3 and Src. • Erybraedin A interacted with the ATP-binding pocket and the regulatory site of Src. • Erybraedin A inhibited the viability of lung cancer cells by inducing apoptosis. The adhesion of cancer cells to the extracellular matrix (ECM) is crucial for cell proliferation, survival, and metastasis. Thus, it is necessary to inhibit cell-ECM adhesion by blocking the activation of the associated signaling to control cancer. Here, we identify erybraedin A (EBA) as a potential Src inhibitor that blocks cell adhesion and viability in non-small-cell lung cancer (NSCLC). EBA significantly inhibited the adhesion of NSCLC cells to fibronectin. EBA also markedly inhibited the activation of Src and its downstream targets, including FAK and Akt. The interaction between integrin β1 or integrin β3 and Src was inhibited by EBA treatment. A docking study revealed the bindings of EBA to the ATP-binding pocket and the allosteric regulatory site of the Src kinase. Additionally, EBA markedly inhibited the viability and the colony formation of NSCLC cells and induced apoptotic cell death. These results describe novel biological properties of EBA, which can block the Src-mediated adhesion and survival of NSCLC cells, suggesting the potential of EBA as an anticancer Src inhibitor that warrants further development in advanced preclinical and clinical settings.

60 APPLIED LIFE SCIENCES↗

Decoupling the effects of substrate hardness and roughness upon particle adhesion in cold spray

There are two stages of particle adhesion relevant to cold spray: adhesion of the first layer to the substrate, followed by inter-particle adhesion during subsequent deposition. In this work we study the second of these, in which particles strike a previously-deposited layer that is roughened and hardened by prior particle impacts. Specifically, we decouple the effects of surface roughness and hardness on particle adhesion for copper-on-copper impacts. We measure changes to the critical velocity, V cr , in single particle impacts produced by the Laser Induced Particle Impact Test on several surfaces including a cold sprayed surface and a polished version of that surface. We find that increases in both substrate roughness and hardness suppress particle adhesion to higher velocities, indeed in rather equal proportion by ∼10–15% each. This suggests that there is a higher V cr associated with coating build-up (particle-particle bonding) that is overall ∼30% higher than V cr for particle-substrate adhesion.

36 MATERIALS SCIENCE↗

Robust Self-Healing Adhesives Based on Dynamic Urethane Exchange Reactions

Thermoset polyurethanes (PUs) have been successfully reprocessed as covalent adaptable networks (CANs) by catalyzing carbamate exchange. Here we extend bond exchange beyond the internal network cross-links to create a dynamic urethane adhesive. Interfacing PU CANs to substrates with nucleophilic functional groups creates adhesives capable of reversible transcarbamoylation with the substrate, which has not been demonstrated previously by CAN adhesives. Two types of thermoset PU films were synthesized, one containing the green carbamate exchange catalyst Zr(tmhd)4 and the other containing no catalyst. Although otherwise identical in chemical and network properties, as indicated by FT-IR spectroscopy and dynamic mechanical thermal analysis (DMTA), the film containing catalyst showed dynamic bond exchange behavior through stress relaxation analysis. When evaluated as an adhesive, the CAN film exhibited self-healing properties and retained its adhesive strength for five cycles, which is attributed to reversible covalent bonding to the glass substrate. Furthermore, this work expands industrially relevant CANs to structural adhesives and demonstrates their potential value in an application that presently employs PUs as single-use materials.

adhesive↗

Adhesion Energies of Solvent Films to Pt(111) and Ni(111) Surfaces by Adsorption Calorimetry

Solvent/metal adhesion energies are vital to understanding solvent effects on adsorption energies, which are, in turn, central to understanding liquid-phase catalysis, electrocatalysis, and many other technologies such as adsorption-based separations and chemical sensors. Differences in reactant adsorption energies in different solvents are dominated by differences in their solvent/metal adhesion energies. Here, the adhesion energies of five liquid solvents to clean Pt(111) and Ni(111) surfaces have been estimated using ultrahigh vacuum calorimetric measurements of heats of adsorption versus coverage integrated from zero coverage up to thick (bulk-like) multilayer solid films. The adhesion energies are found to vary from 0.15 to 0.60 J/m 2 , increasing in the trend CH 3 OH < HCOOH < H 2 O < benzene ≈ phenol. This trend suggests that solvents with higher heats of adsorption per unit area in the first adsorbed layer have higher adhesion energies to a given metal surface. The adhesion energies to Ni(111) are generally larger than to Pt(111) (on average by 0.09 J/m 2 ). This is due to the 24% higher number of metal atoms per unit area on Ni(111) than on Pt(111) and, with oxygen-containing solvents, the greater oxophilicity of Ni compared to that of Pt.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

The Role of Water on the Interfacial Adhesion in Si Solar Modules

Delamination of solar module interfaces often occurs in field-tested solar modules after decades of service due to environmental stressors such as humidity. As water diffuses into the module, failure mechanisms like corrosion and delamination are significantly affected. In the presence of water, the interfaces between EVA and the cell, glass, and backsheet all experience losses of adhesion exposing the module to accelerated degradation. Understanding the relation between interfacial adhesion and water content inside PV modules can help mitigate detrimental power losses. Water content measurements via short wave infrared reflectometry combined with 180 degrees peel tests were used to study and quantify the effect of water ingress and egress on adhesion. Changes in adhesion strength for different module interfaces are quantified, correlating spatial distribution of water content to adhesion for damp heat and dry heat exposed samples. After 1000 hours of damp heat exposure, decreases in adhesion strength of approximately 1 N/mm were noted for all interfaces.

adhesion↗

Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon

The scratch test method is widely used for adhesion evaluation of thin films and coatings. Usual critical load criteria designed for scratch testing of coatings were not applicable to thin atomic layer deposition (ALD) films on silicon wafers. Thus, the bases for critical load evaluation were established and the critical loads suitable for ALD coating adhesion evaluation on silicon wafers were determined in this paper as L{sub CSi1}, L{sub CSi2}, L{sub CALD1}, and L{sub CALD2}, representing the failure points of the silicon substrate and the coating delamination points of the ALD coating. The adhesion performance of the ALD Al{sub 2}O{sub 3}, TiO{sub 2}, TiN, and TaCN+Ru coatings with a thickness range between 20 and 600 nm and deposition temperature between 30 and 410 °C on silicon wafers was investigated. In addition, the impact of the annealing process after deposition on adhesion was evaluated for selected cases. The tests carried out using scratch and Scotch tape test showed that the coating deposition and annealing temperature, thickness of the coating, and surface pretreatments of the Si wafer had an impact on the adhesion performance of the ALD coatings on the silicon wafer. There was also an improved load carrying capacity due to Al{sub 2}O{sub 3}, the magnitude of which depended on the coating thickness and the deposition temperature. The tape tests were carried out for selected coatings as a comparison. The results show that the scratch test is a useful and applicable tool for adhesion evaluation of ALD coatings, even when carried out for thin (20 nm thick) coatings.

36 MATERIALS SCIENCE↗